CN103974533B - A kind of folded double-layered printed circuit board (PCB) - Google Patents
A kind of folded double-layered printed circuit board (PCB) Download PDFInfo
- Publication number
- CN103974533B CN103974533B CN201410181458.1A CN201410181458A CN103974533B CN 103974533 B CN103974533 B CN 103974533B CN 201410181458 A CN201410181458 A CN 201410181458A CN 103974533 B CN103974533 B CN 103974533B
- Authority
- CN
- China
- Prior art keywords
- tellite
- hasp
- printed circuit
- pcb
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The invention discloses a kind of folded double-layered printed circuit board (PCB), including the first tellite and the second tellite, first tellite is round-shaped with the second tellite, first tellite is with the second tellite by being connected bearing pin flexible connection, first tellite is provided with the first hasp, second tellite is provided with the second hasp, first hasp and the second hasp connection, first tellite is provided with some first location holes, second tellite is provided with some second location holes, first location hole is docked with the second location hole.The present invention is convenient to radiate, and substantially increases tellite and uses space.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), and in particular to a kind of folded double-layered printed circuit board (PCB).
Background technology
In prior art, such as patent ZL201010239356.2 discloses a kind of printed circuit board (PCB), including a circuit substrate,
Circuit substrate has a first line structure；An at least build-up circuit structure, is arranged at the first line structure of the circuit substrate
On；One top insulating barrier, is arranged in an at least build-up circuit structure；One conductive blind hole, is arranged in the top insulating barrier；And one
Metal coupling, is arranged on the conductive blind hole in the top insulating barrier, and wherein the metal coupling has different from the conductive blind hole
Shape or size.The present invention forms multiple conductive blind holes in another embodiment in the insulating barrier of top, and blind in above-mentioned multiple conductions
A metal pad, wherein size of the size of metal pad more than above-mentioned conductive blind hole is formed on hole, and blind via above-mentioned conduction
Hole is electrically connected with the electric connection pad of an at least build-up circuit structure.The printed circuit board (PCB) does not have folder function, and radiates
Inconvenience, takes up room big.
Content of the invention
In view of the shortcomings of the prior art, the invention provides a kind of convenient radiating, substantially increases printed circuit base
Folded double-layered printed circuit board (PCB) of the plate using space.
To achieve these goals, the present invention is by the following technical solutions realizing：
A kind of folded double-layered printed circuit board (PCB), including the first tellite and the second tellite, first
Tellite is round-shaped, first tellite and the second printed circuit with the second tellite
Substrate is flexibly connected by connecting bearing pin, and the first tellite is provided with the first hasp, sets on the second tellite
There are the second hasp, the first hasp and the second hasp connection, the first tellite to be provided with some first location holes, the second print
Brush circuit substrate is provided with some second location holes, and the first location hole is docked with the second location hole.
Further, first tellite is provided with cushion block.
Further, the cushion block is disposed adjacent to the marginal position of the first tellite.
Further, the surface of the cushion block is provided with layer of silica gel.
Further, first tellite is identical with the shape size of the second tellite.
Further, first location hole is round-shaped with the second location hole.
Beneficial effects of the present invention：As first tellite and the second tellite pass through connecting pin
Axle is flexibly connected, and the first tellite is provided with the first hasp, and the second tellite is provided with the second hasp, and first
Hasp and the second hasp connection, the first tellite are provided with some first location holes, set on the second tellite
There are some second location holes, the first location hole to dock with the second location hole；So by connecting bearing pin, the first hasp and second
Hasp can be such that the first tellite is connected with the coincidence of the second tellite, and the first tellite and second
Gap is left between tellite, and convenient radiating substantially increases the use space of tellite.
Description of the drawings
Fig. 1 is the structural representation of folded double-layered printed circuit board (PCB) of the present invention.
Specific embodiment
For being easy to understand technological means, creation characteristic, reached purpose and effect of present invention realization, with reference to
Specific embodiment, is expanded on further the present invention.
As shown in figure 1, a kind of folded double-layered printed circuit board (PCB), including the first tellite 1 and the second printing electricity
Base board 2, the first tellite 1 be with the second tellite 2 round-shaped, the first tellite 1 with
Second tellite 2 is flexibly connected by connecting bearing pin 3, and the first tellite 1 is provided with the first hasp 4, and second
Tellite 2 is provided with the second hasp 5, and the first hasp 4 is connected with the second hasp 5, and the first tellite 1 is provided with
Some first location holes 6, the second tellite 2 are provided with some second location holes 7, the first location hole 6 and the second positioning
Dock in hole 7.
First tellite 1 is provided with cushion block 8, and cushion block 8 is disposed adjacent to the margin location of the first tellite 1
Put, the surface of cushion block 8 is provided with layer of silica gel, and the first tellite 1 is identical with the shape size of the second tellite 2,
First location hole 6 is round-shaped, the table of the first tellite 1 and the second tellite 2 with the second location hole 7
Face is equipped with Waterproof glue line, and Waterproof glue line is provided with rag.
The ultimate principle and principal character and advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel it should be appreciated that the present invention is not restricted to the described embodiments, simply explanation described in above-described embodiment and description this
The principle of invention, without departing from the spirit and scope of the present invention, the present invention also has various changes and modifications, these changes
Change and improvement is both fallen within scope of the claimed invention.The claimed scope of the invention by appending claims and its
Equivalent thereof.
Claims (1)
1. a kind of folded double-layered printed circuit board (PCB), including the first tellite and the second tellite, the first print
Brush circuit substrate is round-shaped with the second tellite, it is characterised in that：First tellite and
Two tellites are flexibly connected by connecting bearing pin, and the first tellite is provided with the first hasp, the second printing electricity
Base board is provided with the second hasp, the first hasp and the second hasp connection, and it is fixed that the first tellite is provided with some first
Position hole, the second tellite are provided with some second location holes, and the first location hole is docked with the second location hole, and described first
Tellite is provided with cushion block, and the cushion block is disposed adjacent to the marginal position of the first tellite；The cushion block
Surface be provided with layer of silica gel, first tellite is identical with the shape size of the second tellite, described
One location hole is round-shaped with the second location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410181458.1A CN103974533B (en) | 2014-04-30 | 2014-04-30 | A kind of folded double-layered printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410181458.1A CN103974533B (en) | 2014-04-30 | 2014-04-30 | A kind of folded double-layered printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103974533A CN103974533A (en) | 2014-08-06 |
| CN103974533B true CN103974533B (en) | 2017-03-15 |
Family
ID=51243415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410181458.1A Expired - Fee Related CN103974533B (en) | 2014-04-30 | 2014-04-30 | A kind of folded double-layered printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103974533B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4643497A (en) * | 1984-09-28 | 1987-02-17 | Preh Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co. | Device and method for connecting a printed circuit film |
| CN1348677A (en) * | 1999-04-22 | 2002-05-08 | 罗姆股份有限公司 | Circuit board, battery pack, and method of manufacturing circuit board |
| CN1537408A (en) * | 2001-07-31 | 2004-10-13 | ��ʿͨ��ʽ���� | Portable apparatus |
| CN1681374A (en) * | 2004-02-20 | 2005-10-12 | 松下电器产业株式会社 | Three-dimensional mounting structure and method for producing the same |
| CN2768318Y (en) * | 2004-10-01 | 2006-03-29 | 黄志海 | Pen radio |
| CN1878446A (en) * | 2005-06-07 | 2006-12-13 | 三星电子株式会社 | Flexible printed circuit board for electronic device |
| CN101483974A (en) * | 2008-01-08 | 2009-07-15 | 富士通株式会社 | Printed board unit and fixing parts thereof |
| CN201937946U (en) * | 2011-01-17 | 2011-08-17 | 浪新微电子系统（上海）有限公司 | Printed circuit board |
| CN102438393A (en) * | 2010-09-16 | 2012-05-02 | 日本电气株式会社 | Printed board fixing apparatus |
| CN203912334U (en) * | 2014-04-30 | 2014-10-29 | 苏州倍辰莱电子科技有限公司 | Collapsible-type double-layer printed circuit board |
-
2014
- 2014-04-30 CN CN201410181458.1A patent/CN103974533B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4643497A (en) * | 1984-09-28 | 1987-02-17 | Preh Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co. | Device and method for connecting a printed circuit film |
| CN1348677A (en) * | 1999-04-22 | 2002-05-08 | 罗姆股份有限公司 | Circuit board, battery pack, and method of manufacturing circuit board |
| CN1537408A (en) * | 2001-07-31 | 2004-10-13 | ��ʿͨ��ʽ���� | Portable apparatus |
| CN1681374A (en) * | 2004-02-20 | 2005-10-12 | 松下电器产业株式会社 | Three-dimensional mounting structure and method for producing the same |
| CN2768318Y (en) * | 2004-10-01 | 2006-03-29 | 黄志海 | Pen radio |
| CN1878446A (en) * | 2005-06-07 | 2006-12-13 | 三星电子株式会社 | Flexible printed circuit board for electronic device |
| CN101483974A (en) * | 2008-01-08 | 2009-07-15 | 富士通株式会社 | Printed board unit and fixing parts thereof |
| CN102438393A (en) * | 2010-09-16 | 2012-05-02 | 日本电气株式会社 | Printed board fixing apparatus |
| CN201937946U (en) * | 2011-01-17 | 2011-08-17 | 浪新微电子系统（上海）有限公司 | Printed circuit board |
| CN203912334U (en) * | 2014-04-30 | 2014-10-29 | 苏州倍辰莱电子科技有限公司 | Collapsible-type double-layer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103974533A (en) | 2014-08-06 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170315 Termination date: 20180430 |