CN102223769B - Anti-floating and anti-tilt tool in circuit board wave soldering process - Google Patents
Anti-floating and anti-tilt tool in circuit board wave soldering process Download PDFInfo
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- CN102223769B CN102223769B CN 201110143896 CN201110143896A CN102223769B CN 102223769 B CN102223769 B CN 102223769B CN 201110143896 CN201110143896 CN 201110143896 CN 201110143896 A CN201110143896 A CN 201110143896A CN 102223769 B CN102223769 B CN 102223769B
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- press strip
- fixed mount
- wave soldering
- wave
- press
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Abstract
The invention relates to an anti-floating and anti-tilt tool in a circuit board wave soldering process. The anti-floating and anti-tilt tool comprises a wave soldering tool supporter used for placing PCB (Printed circuit board). The invention is characterized in that the wave soldering tool supporter is provided with a press apparatus used for pressing DIP components, the press apparatus comprises a fixed mount arranged in the wave soldering tool supporter, a press strip and a plurality of press mechanisms arranged on the press strip, and the two ends of the press strip is fixed on the fixed mount through a clamp mechanism. When the DIP components pass across a furnace, each DIP component is pressed by the press mechanisms to prevent the problems of skew of components and high floating of the DIP components caused by that tin blocks fall off by the vibration of the wave soldering tool supporter in a wave soldering track in the transmission process. The anti-floating and anti-tilt tool in circuit board wave soldering process provided in the invention has the advantages of saving manpower, raising production efficiency and stabilizing the DIP components. Thus the enterprise production cost is reduced.
Description
Technical field
What the present invention relates to is a kind of tool, and what be specifically related to is anti-floating high, the Anti-inclining tool of a kind of circuit board wave-soldering process.
Background technology
In wave-soldering process, to the floating high problem of pcb board DIP part, the casting die mode that adopts in the market is uses the block tin casting die, as shown in Figure 1, wave-soldering carries places pcb board 2 on the tool 1, push down DIP part 4 by block tin 3 on pcb board 2, because there is high risk in this kind casting die mode:
1. block tin 3 is crossed stove at DIP part 4, without any fixed form, fixes by own wt and frictional force fully.And wave-soldering carries tool 1 in the transmission course vibrations are arranged on the wave-soldering track, and block tin 3 is easy to drop, and not only causes DIP part 4 floating high, and block tin 3 drops and also can cause the crooked of other part.
2. if the DIP part 4 that need to press is more, 3 needs of block tin are with a lot, and waste tin is wasted man-hour, increases production cost and labour intensity.
Summary of the invention
For the deficiency that exists on the prior art, the present invention seeks to be to solve the floating high problem of DIP part; And a kind of saving manpower and man-hour are provided, raise the efficiency, the DIP part presses the anti-floating high Anti-inclining tool of stable circuit board wave-soldering process.
To achieve these goals, the present invention realizes by the following technical solutions:
The anti-floating high Anti-inclining tool of circuit board wave-soldering process, it comprises that the wave-soldering for the placement pcb board carries fixture body, it is characterized in that, carrying fixture body at described wave-soldering is provided be used to the press device of pressing the DIP part, described press device comprises that being arranged on wave-soldering carries fixed mount on the fixture body, is arranged on the fixed mount ceiling molding and is arranged on a plurality of casting die mechanism on the press strip, the both ends of described press strip are fixed on the fixed mount by a snap fastener, are convenient to the dismounting of press strip.
The anti-floating high Anti-inclining tool of above-mentioned circuit board wave-soldering process, wherein, described casting die mechanism comprises the moving screw that is arranged on the press strip and is fixed on pressure bar on the moving screw, described pressure bar is arranged on the press strip by moving screw, between described pressure bar and press strip, be provided with spring, described spring is arranged on the moving screw, makes pressure bar realize free elastic telescopic.
The anti-floating high Anti-inclining tool of above-mentioned circuit board wave-soldering process, wherein, above-mentioned snap fastener comprises the draw-in groove that is arranged on the movable chuck on the fixed mount and is arranged on the fixed mount upper end, the first end of this active card is installed on the fixed mount by pivot pin, its other end is provided with the dop spare adaptive with draw-in groove, the end of described press strip place with draw-in groove in, and be fixed in the draw-in groove by the dop spare of movable chuck, reach the fixedly purpose of press strip, be convenient to simultaneously the dismounting of press strip.
The present invention is carried the casting die mechanism that fixture body increases press device and press device by wave-soldering, according to DIP part height design pressure bar, position of centre of gravity at each DIP part is designed to the pressure bar center, pressure bar is fixed with moving screw, add spring to increase pressure, the DIP part is pressed stable, solved existing wave-soldering and carried tool and on the wave-soldering track, have vibrations block tin 3 to drop in the transmission course and cause the floating high problem of the crooked of other part and DIP part; It has saves manpower and man-hour, enhances productivity, the DIP part presses stable advantage, saved the consumption of tin, reduced the production cost of enterprise.
Description of drawings
Describe the present invention in detail below in conjunction with the drawings and specific embodiments;
Fig. 1 had wave-soldering now to carry the structural representation that tool is pressed the DIP part;
Fig. 2 is the structural representation when pressing the DIP part of the present invention;
Fig. 3 is a partial enlarged drawing of the present invention.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect is easy to understand, below in conjunction with embodiment, further set forth the present invention.
Referring to Fig. 2, the anti-floating high Anti-inclining tool of circuit board wave-soldering process of the present invention, it comprises that wave-soldering carries fixture body 10, carry fixture body 10 interior placement pcb boards 40 at wave-soldering, this wave-soldering carries fixture body 10 and is equipped be used to the press device of pressing the DIP part, this press device comprises that being fixed on wave-soldering carries fixed mount 11 on the fixture body 10, is arranged on fixed mount 11 ceiling moldings 12 and is arranged on a plurality of casting die mechanism 20 on the press strip 12, the casting die mechanism 20 of the present embodiment is provided with 6, and the quantity of casting die mechanism 20 is set according to the number of the DIP part of pcb board 40.
Referring to Fig. 3, for ease of the dismounting of press strip 12, the both ends of above-mentioned press strip 12 are fixed on the fixed mount 11 by a snap fastener 30.This snap fastener 30 comprises the movable chuck 31 that is arranged on the fixed mount 11 and the draw-in groove 32 that is arranged on fixed mount 11 upper ends, these movable chuck 31 1 ends are installed on the fixed mount 11 by pivot pin, its other end is provided with the dop spare adaptive with draw-in groove 32, in the end placement and draw-in groove 32 of press strip 12, dop spare by movable chuck 31 fastens with draw-in groove 32 it is fixed in the draw-in groove 32, reached the fixedly purpose of press strip 12, simultaneously press strip 12 for convenience detach.
In the present embodiment, casting die mechanism 20 comprises the moving screw 21 that is arranged on the press strip 12 and the pressure bar 23 that is fixed on the moving screw 21.These pressure bar 23 usefulness moving screws 21 are fixing, and are arranged on the press strip 12 by moving screw 21; Be provided with spring 22 between pressure bar 23 and press strip 12, described spring 22 is sleeved on the moving screw 21, makes pressure bar 23 realize free elastic telescopic, to increase the pressure of pressure bar 23
During use, according to DIP part height different designs pressure bar 23 height, make spring 22 Flexible changes identical, identical to guarantee the pressure that each DIP part is subject to.Be designed to pressure bar 23 centers on the position of centre of gravity of each DIP part, press stable to guarantee the DIP part.
When the DIP part is crossed stove, press each DIP part by casting die mechanism 20, thereby prevented that existing wave-soldering carries fixture body 10 and has vibrations block tin 3 to drop in the transmission course and cause the floating high problem of the crooked of other part and DIP part on the wave-soldering track; It has the saving manpower, enhances productivity, the DIP part presses stable advantage, reduced the production cost of enterprise.
Above demonstration and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that describes in above-described embodiment and the specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof
Claims (1)
1. circuit board wave-soldering process is prevented floating high Anti-inclining tool, it comprises that the wave-soldering for the placement pcb board carries fixture body, carrying fixture body at described wave-soldering is provided be used to the press device of pressing the DIP part, described press device comprises that being arranged on wave-soldering carries fixed mount on the fixture body, be arranged on the fixed mount ceiling molding and be arranged on a plurality of casting die mechanism on the press strip, it is characterized in that, casting die mechanism (20) is provided with 6, the both ends of described press strip are fixed on the fixed mount by a snap fastener, described casting die mechanism comprises the moving screw that is arranged on the press strip and is fixed on pressure bar on the moving screw, described pressure bar is arranged on the press strip by moving screw, between described pressure bar and press strip, be provided with spring, described spring is arranged on the moving screw, described snap fastener comprises the draw-in groove that is arranged on the movable chuck on the fixed mount and is arranged on the fixed mount upper end, the first end of this active card is installed on the fixed mount by pivot pin, its other end is provided with the dop spare adaptive with draw-in groove, the end of described press strip place with draw-in groove in, and be fixed in the draw-in groove by the dop spare of movable chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110143896 CN102223769B (en) | 2011-05-31 | 2011-05-31 | Anti-floating and anti-tilt tool in circuit board wave soldering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110143896 CN102223769B (en) | 2011-05-31 | 2011-05-31 | Anti-floating and anti-tilt tool in circuit board wave soldering process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102223769A CN102223769A (en) | 2011-10-19 |
| CN102223769B true CN102223769B (en) | 2013-01-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110143896 Expired - Fee Related CN102223769B (en) | 2011-05-31 | 2011-05-31 | Anti-floating and anti-tilt tool in circuit board wave soldering process |
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| Country | Link |
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| CN (1) | CN102223769B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104219889A (en) * | 2014-08-27 | 2014-12-17 | 昆山元崧电子科技有限公司 | Bearing fixture used for assisting in PCB (printed-circuit board) processing |
| CN106112178B (en) * | 2016-08-19 | 2019-05-24 | 潍坊歌尔电子有限公司 | A kind of wave soldering carrier |
| CN110774203B (en) * | 2019-11-13 | 2021-05-25 | 亚杰科技（江苏）有限公司 | Rigidity locator |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202103964U (en) * | 2011-05-31 | 2012-01-04 | 昆山元崧电子科技有限公司 | Floating-prevention and inclination-prevention jig for circuit board wave-soldering process |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6237832B1 (en) * | 1999-10-18 | 2001-05-29 | Henry Chung | Wave soldering fixture |
| CN201244721Y (en) * | 2008-06-12 | 2009-05-27 | 中国航空工业第一集团公司第六一三研究所 | Anti-deforming combined clamp for wave soldering of printed board with heat radiation board |
| CN201609011U (en) * | 2010-03-23 | 2010-10-13 | 伟创力电子科技（上海）有限公司 | Anti-neglecting member checking device for wave soldering |
| CN201718121U (en) * | 2010-07-09 | 2011-01-19 | 上海松下电工自动化控制有限公司 | PCB wave-soldering bracket |
| CN201969977U (en) * | 2010-12-23 | 2011-09-14 | 北京德尔福万源发动机管理系统有限公司 | Wave crest welding device |
-
2011
- 2011-05-31 CN CN 201110143896 patent/CN102223769B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202103964U (en) * | 2011-05-31 | 2012-01-04 | 昆山元崧电子科技有限公司 | Floating-prevention and inclination-prevention jig for circuit board wave-soldering process |
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| Publication number | Publication date |
|---|---|
| CN102223769A (en) | 2011-10-19 |
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Granted publication date: 20130116 Termination date: 20150531 |
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