CN108361563A - A kind of encapsulation LED light emission device - Google Patents
A kind of encapsulation LED light emission device Download PDFInfo
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- CN108361563A CN108361563A CN201810155786.2A CN201810155786A CN108361563A CN 108361563 A CN108361563 A CN 108361563A CN 201810155786 A CN201810155786 A CN 201810155786A CN 108361563 A CN108361563 A CN 108361563A
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- parts
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- silicon rubber
- heating column
- rubber cushion
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 110
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 90
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000741 silica gel Substances 0.000 claims abstract description 13
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims description 116
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 26
- 239000004917 carbon fiber Substances 0.000 claims description 26
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 229910021389 graphene Inorganic materials 0.000 claims description 14
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 14
- 229910017083 AlN Inorganic materials 0.000 claims description 13
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 210000002421 cell wall Anatomy 0.000 claims description 13
- 239000004519 grease Substances 0.000 claims description 13
- 238000005498 polishing Methods 0.000 claims description 13
- 229910052684 Cerium Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 12
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 12
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 claims description 12
- 229920002530 polyetherether ketone Polymers 0.000 claims description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 12
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 11
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 6
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 claims description 2
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 claims description 2
- RGPUVZXXZFNFBF-UHFFFAOYSA-K diphosphonooxyalumanyl dihydrogen phosphate Chemical compound [Al+3].OP(O)([O-])=O.OP(O)([O-])=O.OP(O)([O-])=O RGPUVZXXZFNFBF-UHFFFAOYSA-K 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims 1
- 230000000694 effects Effects 0.000 description 23
- 229960001866 silicon dioxide Drugs 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 9
- 238000001035 drying Methods 0.000 description 8
- 239000011812 mixed powder Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 238000005245 sintering Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 4
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000001513 hot isostatic pressing Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 230000004224 protection Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012767 functional filler Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 241001484259 Lacuna Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 150000001573 beryllium compounds Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000012377 drug delivery Methods 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/34—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing cold phosphate binders
- C04B28/344—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing cold phosphate binders the phosphate binder being present in the starting composition solely as one or more phosphates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/04—Resilient mountings, e.g. shock absorbers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of encapsulation LED light emission device,Including lens,LED chip,Pin,Radiator and outer enclosure body,The LED chip is electrically connected with pin,The lens,Pin,Radiator is fixedly connected with outer enclosure body,It is arranged above the radiator fluted,Thermal conductive silicon rubber cushion is provided in the groove and to pushing up waveform spring,Described pair of top waveform spring is between thermal conductive silicon rubber cushion and the slot bottom of groove,The LED chip is embedded in the setting of thermal conductive silicon rubber cushion,The slot bottom of the groove is bonded with to top waveform spring,Described pair of top waveform spring is embedded in the setting of thermal conductive silicon rubber cushion,The side of the LED chip is bonded with thermal conductive silicon rubber cushion,It is wound with heat conductive filament on described pair of top waveform spring,Heat conductive silica gel acting as a cushion face is provided with heating column,The blind hole to match with heating column is provided on the radiator,The blind hole is connected with groove；The encapsulation LED light emission device has good anti-seismic performance.
Description
Technical field
The present invention relates to a kind of encapsulation LED light emission devices.
Background technology
LED encapsulation refers to the encapsulation of luminescence chip, has relatively big difference compared to integrated antenna package.The encapsulation of LED can be protected
Protect wick, in general, the function of encapsulation is to provide chip enough protections, prevent chip in air for a long time exposure or machine
Tool is damaged and is failed, and to improve the stability of chip, current packaged LED lamp is generally by lens, LED chip, pin, heat dissipation
Several part compositions such as device and outer enclosure body, the chip of existing packaged LED lamp are typically mounted on radiator, shock resistance
It can be general, it is hard to the needs of meeting in the market.
Invention content
The technical problem to be solved in the present invention is to provide a kind of encapsulation LED light emission devices with good anti-seismic performance.
To solve the above problems, the present invention adopts the following technical scheme that：
A kind of encapsulation LED light emission device, including lens, LED chip, pin, radiator and outer enclosure body, the LED chip
It is electrically connected with pin, the lens, pin, radiator are fixedly connected with outer enclosure body, are arranged above the radiator
It is fluted, it is provided with thermal conductive silicon rubber cushion in the groove and to pushing up waveform spring, described pair of top waveform spring is located at heat conductive silica gel
Between pad and the slot bottom of groove, the slot bottom and thermal conductive silicon rubber cushion of the groove fix company with to the both ends for pushing up waveform spring respectively
It connects, the LED chip is embedded in the setting of thermal conductive silicon rubber cushion, and with to top waveform spring bonding, described pair is pushed up the slot bottom of the groove
Waveform spring is embedded in the setting of thermal conductive silicon rubber cushion, and side and the thermal conductive silicon rubber cushion of the LED chip bond, described pair of top waveform bullet
Heat conductive filament is wound on spring, heat conductive silica gel acting as a cushion face is provided with heating column, is provided on the radiator and heating column phase
The blind hole of pairing, the blind hole are connected with groove, and the heating column is inserted into blind hole, and spiral bullet is provided in the blind hole
Spring；
The heating column is by 25-32 parts of 8-15 parts of graphene powder, the aluminium nitride powder, the beryllium oxide powder that match in parts by weight
2-6 parts last, 6-9 parts of iridium powder, 1-3 parts of cerium powder, 55-57 parts of copper powders, 8-10 parts of green silicon carbide powder, titanium carbide powder
48-60 parts, 2-4 parts of erucyl amide powder, 7-12 parts of tin powder, 5-7 parts of biphosphate aluminium powder, 6-10 parts of polyether-ether-ketone powder
With 18-22 parts of compositions of carbon fiber wire.
Preferably, described pair of top waveform spring and helical spring outer surface are silver-plated setting, the heat conductive filament both ends
With can be with by using silver-plated design to top waveform spring and helical spring outer surface to top waveform spring welding
The effective heat conductivility and corrosion resistance promoted to pushing up waveform spring and helical spring, and heat conductive filament with to pushing up waveform spring
Stable connection is reliable.
Preferably, the helical spring both ends respectively with the bottom hole of heating column and blind hole bond, the heating column with it is blind
Interporal lacuna coordinates, and the heating column is inserted into in the waveform spring of top, the helical spring both ends bottom hole with heating column and blind hole respectively
Stable connection, heating column activity are flexible and not easily to fall off.
Preferably, the slot bottom bonding of one end and groove of described pair of top waveform spring, described pair is pushed up the another of waveform spring
One end is embedded in the setting of thermal conductive silicon rubber cushion, connects by using Embedded mode with thermal conductive silicon rubber cushion to top waveform spring
It connects, connection structure is stablized, and has larger area of heat transfer to top waveform spring and thermal conductive silicon rubber cushion.
Preferably, the bottom hole and heating column of the blind hole are bonded with helical spring, tenon is provided on the heating column
Head, heat conductive silica gel acting as a cushion face are provided with the mortise to match with tenon, and the heating column and thermal conductive silicon rubber cushion pass through tenon
It is connected with mortise.
Preferably, the helical spring is drop centre type helical spring, it is arranged between the heating column and the hole wall of blind hole
There is thermal grease layer, by being provided with thermal grease layer between heating column and the hole wall of blind hole, can effectively promote heat conduction
Heat transfer speed between column and radiator, and the activity of heating column is influenced less.
Preferably, thermal conductive silicon rubber cushion side is polishing setting, the cell wall of the thermal conductive silicon rubber cushion and groove is tight
Patch, thermal conductive silicon rubber cushion side can effectively reduce the friction between the cell wall of groove by using the design of polishing, can
Effectively to promote the mobility of thermal conductive silicon rubber cushion.
Preferably, the heating column by match in parts by weight 28 parts of 12 parts of graphene powder, aluminium nitride powder, one
4 parts of yttrium oxide powder, 8 parts of iridium powder, 2 parts of cerium powder, 56 parts of copper powders, 9 parts of green silicon carbide powder, 54 parts of titanium carbide powder,
20 parts of 3 parts of erucyl amide powder, 10 parts of tin powder, 6 parts of biphosphate aluminium powder, 8 parts of polyether-ether-ketone powder and carbon fiber wire groups
At.
The present invention also provides a kind of preparation methods of heating column, include the following steps：
1）By 8-15 parts of graphene powder, 25-32 parts of aluminium nitride powder, 2-6 parts of a yttrium oxide powder, 6-9 parts of iridium powder, cerium powder
1-3 parts last, 55-57 parts of copper powders, 8-10 parts of green silicon carbide powder, 48-60 parts of titanium carbide powder, 2-4 parts of erucyl amide powder,
6-10 parts of 7-12 parts of tin powder, 5-7 parts of biphosphate aluminium powder and polyether-ether-ketone powder be poured into together in vacuum furnace into
Row is dried, and drying temperature is 70-90 DEG C, vacuum degree 5-7Pa, drying time 20-30min, and dried powder is made, standby
With；
2）By step 1）Dried powder obtained, which is poured into ball mill mixing machine, carries out mixing treatment, and mixed-powder is made, spare；
3）Carbon fiber wire is woven into carbon fiber webmaster for 18-22 parts, carbon fiber webmaster is made, it is spare；
4）By step 3）In carbon fiber webmaster obtained be put into the middle part of mold, be then poured slowly into step 2）Mixed powder obtained
End recycles hot isostatic pressing method to be sintered, wherein sintering time is 2-4 hours, sintering temperature 350-400
DEG C, pressure pressure is 24-29MPa, cooling, is demoulded to get heating column.
The characteristics of being the raw material of heating column below or effect:
Graphene powder:Graphene has excellent optics, electricity, mechanical characteristic, in materialogy, micro-nano technology, the energy, life
Object medicine and drug delivery etc. are with important application prospects, it is considered to be a kind of future revolutionary material.Graphene
With extraordinary heat-conductive characteristic.
Aluminium nitride powder:Thermal conductivity is good, and coefficient of thermal expansion is small, is good heat shock resistance material.Aluminium nitride or electricity are absolutely
Edge body, dielectric properties are good.
One yttrium oxide powder:Beryllium oxide is a kind of crystalloid oxide, it can be directly from burning beryllium compound or beryllium
It obtains.It is all good fireproof meterial as aluminium oxide, and the beryllium oxide through oversintering is very hard, there is the spy of ceramics
Property.Beryllium oxide is highly stable, has outstanding heat conductivility.
Iridium powder:It is white as platinum that iridium belongs to platinum metal, separately with a little yellow.Iridium is hard frangible, fusing point
It is very high, it is one of strongest metal of corrosion resistance, as functional filler.
Cerium powder:It is dimmed to meet air for greyish white non-ferrous metal, glossy crystal.Cubic system has ductility.
Copper powders:Ductility is good, and thermal conductivity and electric conductivity are high.It is widely used in powder metallurgy, electrical carbon product, electronics material
The electromechanical components such as material, metallic paint, chemical catalyst, filter, heat-dissipating pipe and electronic flight field.
Green silicon carbide powder:Hardness is big, it may have preferable thermal conductivity and characteristic of semiconductor, as functional filler.
Titanium carbide powder:High fusing point, boiling point and hardness, hardness are only second to diamond, there is good heat conduction and conduction
Property, even show superconductivity when temperature is extremely low.
Erucyl amide powder:Important derivatives of the erucyl amide as erucic acid are a kind of excellent essences having wide range of applications
Refine chemical product.Since it has higher fusing point and good thermal stability, thus be mainly used as various plastics, resin it is anti-
Stick and slipping agent can increase wearability, scratch resistance and the smoothness of the surface of product.
Tin powder:Tin is argenteous soft metal, and the chemical property of tin is very stable, is not easy to be oxidized by oxygen at normal temperatures,
As binder.
Biphosphate aluminium powder:White powder, it is soluble easily in water.Adhesive as refractory material.
Polyether-ether-ketone powder:It is that a kind of hypocrystalline is high with physical and chemical performances such as high temperature resistant, chemical resistance corrosions
Molecular material, can with carbon fiber is compound prepares reinforcing material.
Carbon fiber wire:It is high intensity, the new fiber materials of high modulus fibre of a kind of phosphorus content 95% or more.Carbon fiber
The axial strength and modulus of dimension are high, and density is low, higher than performance, no creep, and superhigh temperature resistant under non-oxidizing atmosphere, fatigue durability is good,
Between nonmetallic between metal, coefficient of thermal expansion is small and has anisotropy, good corrosion resistance, X-ray for specific heat and electric conductivity
Permeability is good.Good electrical and thermal conductivity performance, electromagnetic wave shielding.
Beneficial effects of the present invention are：By being provided with thermal conductive silicon rubber cushion in the groove of radiator and to pushing up waveform bullet
Spring, and LED chip is embedded in the effect of the design cooperation helical spring of thermal conductive silicon rubber cushion, it is good anti-so as to play
Shake effect, in addition, be silver-plated setting to top waveform spring and helical spring outer surface, heat conductive filament both ends with to pushing up waveform bullet
Spring welds, and by using silver-plated design to top waveform spring and helical spring outer surface, can effectively be promoted to top
The heat conductivility and corrosion resistance of waveform spring and helical spring, and heat conductive filament with to top waveform spring stable connection it is reliable.
Helical spring both ends are bonded with the bottom hole of heating column and blind hole respectively, and heating column and blind hole clearance fit, heating column are inserted into top
In waveform spring, the helical spring both ends bottom hole stable connection with heating column and blind hole respectively, heating column activity is flexibly and not
It is easy to fall off.It is bonded to pushing up one end of waveform spring and the slot bottom of groove, the other end to pushing up waveform spring is embedded in heat conductive silica gel
Pad setting is attached top waveform spring with thermal conductive silicon rubber cushion by using Embedded mode, and connection structure is stablized, and
And there is larger area of heat transfer to top waveform spring and thermal conductive silicon rubber cushion.The bottom hole and heating column of blind hole are and helical spring
It bonds, tenon is provided on heating column, heat conductive silica gel acting as a cushion face is provided with the mortise to match with tenon, heating column and thermal conductive silicon
Rubber cushion is connected by tenon with mortise.Helical spring is drop centre type helical spring, is provided between heating column and the hole wall of blind hole
Thermal grease layer can effectively promote heating column by being provided with thermal grease layer between heating column and the hole wall of blind hole
Heat transfer speed between radiator, and the activity of heating column is influenced less.Thermal conductive silicon rubber cushion side is that polishing is set
It sets, thermal conductive silicon rubber cushion is close to the cell wall of groove, and thermal conductive silicon rubber cushion side can effectively be dropped by using the design of polishing
The low friction between the cell wall of groove can effectively promote the mobility of thermal conductive silicon rubber cushion.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is a kind of sectional view of encapsulation LED light emission device of the present invention.
Fig. 2 is a kind of stereogram to pushing up waveform spring of encapsulation LED light emission device of the present invention.
Fig. 3 is a kind of sectional view of the radiator of encapsulation LED light emission device of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Embodiment 1
As shown in Figs. 1-3, a kind of encapsulation LED light emission device, including lens 1, LED chip 2, pin 3, radiator 4 and external envelope
Body 5 is filled, the LED chip 2 is electrically connected with pin 3, and the lens 1, pin 3, radiator 4 are fixed with outer enclosure body 5
Connection, the radiator 4 above be arranged fluted 6, be provided in the groove 6 thermal conductive silicon rubber cushion 7 and to push up waveform spring 8,
Described pair of top waveform spring 8 is between thermal conductive silicon rubber cushion 7 and the slot bottom of groove 6, the slot bottom and thermal conductive silicon rubber cushion of the groove 6
7 are fixedly connected with to the both ends for pushing up waveform spring 8 respectively, and the LED chip 2 is embedded in the setting of thermal conductive silicon rubber cushion 7, the groove
6 slot bottom is bonded with to top waveform spring 8, and described pair of top waveform spring 8 is embedded in the setting of thermal conductive silicon rubber cushion 7, the LED chip
2 side is bonded with thermal conductive silicon rubber cushion 7, and heat conductive filament 9,7 back side of thermal conductive silicon rubber cushion are wound on described pair of top waveform spring 8
It is provided with heating column 10, the blind hole 11 to match with heating column 10, the blind hole 11 and groove 6 are provided on the radiator 4
It is connected, the heating column 10 is inserted into blind hole 11, and helical spring 12 is provided in the blind hole 11；
The heating column by match in parts by weight 25 parts of 8 parts of graphene powder, aluminium nitride powder, 2 parts of a yttrium oxide powder,
6 parts of iridium powder, 1 part of cerium powder, 55 parts of copper powders, 8 parts of green silicon carbide powder, 48 parts of titanium carbide powder, erucyl amide powder 2
Part, 7 parts of tin powder, 5 parts of biphosphate aluminium powder, 6 parts of polyether-ether-ketone powder and 18 parts of compositions of carbon fiber wire.
Described pair of top waveform spring 8 and 12 outer surface of helical spring are silver-plated setting, 9 both ends of the heat conductive filament with it is right
It pushes up waveform spring 8 to weld, by using silver-plated design, Ke Yiyou to top waveform spring 8 and 12 outer surface of helical spring
The promotion of effect to push up waveform spring 8 and helical spring 12 heat conductivility and corrosion resistance, and heat conductive filament 9 with to push up waveform bullet
8 stable connection of spring is reliable.
12 both ends of the helical spring are bonded with the bottom hole of heating column 10 and blind hole 11 respectively, the heating column 10 and blind hole
11 clearance fits, the heating column 10 be inserted into top waveform spring 8 in, 12 both ends of helical spring respectively with heating column 10 and blind hole
11 bottom hole stable connection, 10 activity of heating column are flexible and not easily to fall off.
One end of described pair of top waveform spring 8 is bonded with the slot bottom of groove 6, and the other end of described pair of top waveform spring 8 is embedding
Enter the setting of thermal conductive silicon rubber cushion 7, top waveform spring 8 be attached with thermal conductive silicon rubber cushion 7 by using Embedded mode,
Connection structure is stablized, and has larger area of heat transfer to top waveform spring 8 and thermal conductive silicon rubber cushion 7.
The bottom hole and heating column 10 of the blind hole 11 are bonded with helical spring 12, and tenon is provided on the heating column 10
13,7 back side of thermal conductive silicon rubber cushion is provided with the mortise to match with tenon 13, and the heating column 10 and thermal conductive silicon rubber cushion 7 are logical
Tenon 13 is crossed to connect with mortise.
The helical spring 12 is drop centre type helical spring, is provided with and leads between the heating column 10 and the hole wall of blind hole 11
Hot silicone grease layer 14 can be promoted effectively by being provided with thermal grease layer 14 between heating column 10 and the hole wall of blind hole 11
Heat transfer speed between heating column 10 and radiator 4, and the activity of heating column 10 is influenced less.
7 side of thermal conductive silicon rubber cushion is polishing setting, and the thermal conductive silicon rubber cushion 7 is close to the cell wall of groove 6, heat conduction
7 side of silicagel pad can effectively reduce the friction between the cell wall of groove 6, Ke Yiyou by using the design of polishing
The mobility for promoting thermal conductive silicon rubber cushion 7 of effect.
The preparation method of heating column, includes the following steps：
1）By 8 parts of graphene powder, 25 parts of aluminium nitride powder, 2 parts of a yttrium oxide powder, 6 parts of iridium powder, 1 part of cerium powder, copper powder
55 parts of end, 8 parts of green silicon carbide powder, 48 parts of titanium carbide powder, 2 parts of erucyl amide powder, 7 parts of tin powder, biphosphate aluminium powder
6 parts of 5 parts of end and polyether-ether-ketone powder, which are poured into together in vacuum furnace, is dried processing, and drying temperature is 70 DEG C, vacuum
Degree is 5Pa, drying time 20min, and dried powder is made, spare；
2）By step 1）Dried powder obtained, which is poured into ball mill mixing machine, carries out mixing treatment, and mixed-powder is made, spare；
3）Carbon fiber wire is woven into carbon fiber webmaster for 18 parts, carbon fiber webmaster is made, it is spare；
4）By step 3）In carbon fiber webmaster obtained be put into the middle part of mold, be then poured slowly into step 2）Mixed powder obtained
End recycles hot isostatic pressing method to be sintered, wherein sintering time is 2 hours, and sintering temperature is 350 DEG C, pressure pressure
It is 24MPa by force, it is cooling, it demoulds to get heating column.
Embodiment 2
As shown in Figs. 1-3, a kind of encapsulation LED light emission device, including lens 1, LED chip 2, pin 3, radiator 4 and external envelope
Body 5 is filled, the LED chip 2 is electrically connected with pin 3, and the lens 1, pin 3, radiator 4 are fixed with outer enclosure body 5
Connection, the radiator 4 above be arranged fluted 6, be provided in the groove 6 thermal conductive silicon rubber cushion 7 and to push up waveform spring 8,
Described pair of top waveform spring 8 is between thermal conductive silicon rubber cushion 7 and the slot bottom of groove 6, the slot bottom and thermal conductive silicon rubber cushion of the groove 6
7 are fixedly connected with to the both ends for pushing up waveform spring 8 respectively, and the LED chip 2 is embedded in the setting of thermal conductive silicon rubber cushion 7, the groove
6 slot bottom is bonded with to top waveform spring 8, and described pair of top waveform spring 8 is embedded in the setting of thermal conductive silicon rubber cushion 7, the LED chip
2 side is bonded with thermal conductive silicon rubber cushion 7, and heat conductive filament 9,7 back side of thermal conductive silicon rubber cushion are wound on described pair of top waveform spring 8
It is provided with heating column 10, the blind hole 11 to match with heating column 10, the blind hole 11 and groove 6 are provided on the radiator 4
It is connected, the heating column 10 is inserted into blind hole 11, and helical spring 12 is provided in the blind hole 11；
The heating column by match in parts by weight 32 parts of 15 parts of graphene powder, aluminium nitride powder, a yttrium oxide powder 6
Part, 9 parts of iridium powder, 3 parts of cerium powder, 57 parts of copper powders, 10 parts of green silicon carbide powder, 60 parts of titanium carbide powder, erucyl amide powder
22 parts of 4 parts of end, 12 parts of tin powder, 7 parts of biphosphate aluminium powder, 10 parts of polyether-ether-ketone powder and carbon fiber wire compositions.
Described pair of top waveform spring 8 and 12 outer surface of helical spring are silver-plated setting, 9 both ends of the heat conductive filament with it is right
It pushes up waveform spring 8 to weld, by using silver-plated design, Ke Yiyou to top waveform spring 8 and 12 outer surface of helical spring
The promotion of effect to push up waveform spring 8 and helical spring 12 heat conductivility and corrosion resistance, and heat conductive filament 9 with to push up waveform bullet
8 stable connection of spring is reliable.
12 both ends of the helical spring are bonded with the bottom hole of heating column 10 and blind hole 11 respectively, the heating column 10 and blind hole
11 clearance fits, the heating column 10 be inserted into top waveform spring 8 in, 12 both ends of helical spring respectively with heating column 10 and blind hole
11 bottom hole stable connection, 10 activity of heating column are flexible and not easily to fall off.
One end of described pair of top waveform spring 8 is bonded with the slot bottom of groove 6, and the other end of described pair of top waveform spring 8 is embedding
Enter the setting of thermal conductive silicon rubber cushion 7, top waveform spring 8 be attached with thermal conductive silicon rubber cushion 7 by using Embedded mode,
Connection structure is stablized, and has larger area of heat transfer to top waveform spring 8 and thermal conductive silicon rubber cushion 7.
The bottom hole and heating column 10 of the blind hole 11 are bonded with helical spring 12, and tenon is provided on the heating column 10
13,7 back side of thermal conductive silicon rubber cushion is provided with the mortise to match with tenon 13, and the heating column 10 and thermal conductive silicon rubber cushion 7 are logical
Tenon 13 is crossed to connect with mortise.
The helical spring 12 is drop centre type helical spring, is provided with and leads between the heating column 10 and the hole wall of blind hole 11
Hot silicone grease layer 14 can be promoted effectively by being provided with thermal grease layer 14 between heating column 10 and the hole wall of blind hole 11
Heat transfer speed between heating column 10 and radiator 4, and the activity of heating column 10 is influenced less.
7 side of thermal conductive silicon rubber cushion is polishing setting, and the thermal conductive silicon rubber cushion 7 is close to the cell wall of groove 6, heat conduction
7 side of silicagel pad can effectively reduce the friction between the cell wall of groove 6, Ke Yiyou by using the design of polishing
The mobility for promoting thermal conductive silicon rubber cushion 7 of effect.
The preparation method of heating column, includes the following steps：
1）By 15 parts of graphene powder, 32 parts of aluminium nitride powder, 6 parts of a yttrium oxide powder, 9 parts of iridium powder, 3 parts of cerium powder, copper
57 parts of powder, 10 parts of green silicon carbide powder, 60 parts of titanium carbide powder, 4 parts of erucyl amide powder, 12 parts of tin powder, biphosphate
10 parts of 7 parts of aluminium powder and polyether-ether-ketone powder, which are poured into together in vacuum furnace, is dried processing, and drying temperature is 90 DEG C,
Vacuum degree is 7Pa, drying time 30min, and dried powder is made, spare；
2）By step 1）Dried powder obtained, which is poured into ball mill mixing machine, carries out mixing treatment, and mixed-powder is made, spare；
3）Carbon fiber wire is woven into carbon fiber webmaster for 22 parts, carbon fiber webmaster is made, it is spare；
4）By step 3）In carbon fiber webmaster obtained be put into the middle part of mold, be then poured slowly into step 2）Mixed powder obtained
End recycles hot isostatic pressing method to be sintered, wherein sintering time is 4 hours, and sintering temperature is 400 DEG C, pressure
Pressure is 29MPa, cooling, is demoulded to get heating column.
Embodiment 3
As shown in Figs. 1-3, a kind of encapsulation LED light emission device, including lens 1, LED chip 2, pin 3, radiator 4 and external envelope
Body 5 is filled, the LED chip 2 is electrically connected with pin 3, and the lens 1, pin 3, radiator 4 are fixed with outer enclosure body 5
Connection, the radiator 4 above be arranged fluted 6, be provided in the groove 6 thermal conductive silicon rubber cushion 7 and to push up waveform spring 8,
Described pair of top waveform spring 8 is between thermal conductive silicon rubber cushion 7 and the slot bottom of groove 6, the slot bottom and thermal conductive silicon rubber cushion of the groove 6
7 are fixedly connected with to the both ends for pushing up waveform spring 8 respectively, and the LED chip 2 is embedded in the setting of thermal conductive silicon rubber cushion 7, the groove
6 slot bottom is bonded with to top waveform spring 8, and described pair of top waveform spring 8 is embedded in the setting of thermal conductive silicon rubber cushion 7, the LED chip
2 side is bonded with thermal conductive silicon rubber cushion 7, and heat conductive filament 9,7 back side of thermal conductive silicon rubber cushion are wound on described pair of top waveform spring 8
It is provided with heating column 10, the blind hole 11 to match with heating column 10, the blind hole 11 and groove 6 are provided on the radiator 4
It is connected, the heating column 10 is inserted into blind hole 11, and helical spring 12 is provided in the blind hole 11；
The heating column by match in parts by weight 28 parts of 12 parts of graphene powder, aluminium nitride powder, a yttrium oxide powder 4
Part, 8 parts of iridium powder, 2 parts of cerium powder, 56 parts of copper powders, 9 parts of green silicon carbide powder, 54 parts of titanium carbide powder, erucyl amide powder
20 parts of 3 parts, 10 parts of tin powder, 6 parts of biphosphate aluminium powder, 8 parts of polyether-ether-ketone powder and carbon fiber wire form.
Described pair of top waveform spring 8 and 12 outer surface of helical spring are silver-plated setting, 9 both ends of the heat conductive filament with it is right
It pushes up waveform spring 8 to weld, by using silver-plated design, Ke Yiyou to top waveform spring 8 and 12 outer surface of helical spring
The promotion of effect to push up waveform spring 8 and helical spring 12 heat conductivility and corrosion resistance, and heat conductive filament 9 with to push up waveform bullet
8 stable connection of spring is reliable.
12 both ends of the helical spring are bonded with the bottom hole of heating column 10 and blind hole 11 respectively, the heating column 10 and blind hole
11 clearance fits, the heating column 10 be inserted into top waveform spring 8 in, 12 both ends of helical spring respectively with heating column 10 and blind hole
11 bottom hole stable connection, 10 activity of heating column are flexible and not easily to fall off.
One end of described pair of top waveform spring 8 is bonded with the slot bottom of groove 6, and the other end of described pair of top waveform spring 8 is embedding
Enter the setting of thermal conductive silicon rubber cushion 7, top waveform spring 8 be attached with thermal conductive silicon rubber cushion 7 by using Embedded mode,
Connection structure is stablized, and has larger area of heat transfer to top waveform spring 8 and thermal conductive silicon rubber cushion 7.
The bottom hole and heating column 10 of the blind hole 11 are bonded with helical spring 12, and tenon is provided on the heating column 10
13,7 back side of thermal conductive silicon rubber cushion is provided with the mortise to match with tenon 13, and the heating column 10 and thermal conductive silicon rubber cushion 7 are logical
Tenon 13 is crossed to connect with mortise.
The helical spring 12 is drop centre type helical spring, is provided with and leads between the heating column 10 and the hole wall of blind hole 11
Hot silicone grease layer 14 can be promoted effectively by being provided with thermal grease layer 14 between heating column 10 and the hole wall of blind hole 11
Heat transfer speed between heating column 10 and radiator 4, and the activity of heating column 10 is influenced less.
7 side of thermal conductive silicon rubber cushion is polishing setting, and the thermal conductive silicon rubber cushion 7 is close to the cell wall of groove 6, heat conduction
7 side of silicagel pad can effectively reduce the friction between the cell wall of groove 6, Ke Yiyou by using the design of polishing
The mobility for promoting thermal conductive silicon rubber cushion 7 of effect.
The preparation method of heating column, includes the following steps：
1）By 12 parts of graphene powder, 28 parts of aluminium nitride powder, 4 parts of a yttrium oxide powder, 8 parts of iridium powder, 2 parts of cerium powder, copper
56 parts of powder, 9 parts of green silicon carbide powder, 54 parts of titanium carbide powder, 3 parts of erucyl amide powder, 10 parts of tin powder, aluminium dihydrogen phosphate
8 parts of 6 parts of powder and polyether-ether-ketone powder, which are poured into together in vacuum furnace, is dried processing, and drying temperature is 80 DEG C, very
Reciprocal of duty cycle is 6Pa, drying time 25min, and dried powder is made, spare；
2）By step 1）Dried powder obtained, which is poured into ball mill mixing machine, carries out mixing treatment, and mixed-powder is made, spare；
3）Carbon fiber wire is woven into carbon fiber webmaster for 20 parts, carbon fiber webmaster is made, it is spare；
4）By step 3）In carbon fiber webmaster obtained be put into the middle part of mold, be then poured slowly into step 2）Mixed powder obtained
End recycles hot isostatic pressing method to be sintered, wherein sintering time is 3 hours, and sintering temperature is 370 DEG C, pressure pressure
It is 26MPa by force, it is cooling, it demoulds to get heating column.
Beneficial effects of the present invention are：By being provided with thermal conductive silicon rubber cushion in the groove of radiator and to pushing up waveform bullet
Spring, and LED chip is embedded in the effect of the design cooperation helical spring of thermal conductive silicon rubber cushion, it is good anti-so as to play
Shake effect, in addition, be silver-plated setting to top waveform spring and helical spring outer surface, heat conductive filament both ends with to pushing up waveform bullet
Spring welds, and by using silver-plated design to top waveform spring and helical spring outer surface, can effectively be promoted to top
The heat conductivility and corrosion resistance of waveform spring and helical spring, and heat conductive filament with to top waveform spring stable connection it is reliable.
Helical spring both ends are bonded with the bottom hole of heating column and blind hole respectively, and heating column and blind hole clearance fit, heating column are inserted into top
In waveform spring, the helical spring both ends bottom hole stable connection with heating column and blind hole respectively, heating column activity is flexibly and not
It is easy to fall off.It is bonded to pushing up one end of waveform spring and the slot bottom of groove, the other end to pushing up waveform spring is embedded in heat conductive silica gel
Pad setting is attached top waveform spring with thermal conductive silicon rubber cushion by using Embedded mode, and connection structure is stablized, and
And there is larger area of heat transfer to top waveform spring and thermal conductive silicon rubber cushion.The bottom hole and heating column of blind hole are and helical spring
It bonds, tenon is provided on heating column, heat conductive silica gel acting as a cushion face is provided with the mortise to match with tenon, heating column and thermal conductive silicon
Rubber cushion is connected by tenon with mortise.Helical spring is drop centre type helical spring, is provided between heating column and the hole wall of blind hole
Thermal grease layer can effectively promote heating column by being provided with thermal grease layer between heating column and the hole wall of blind hole
Heat transfer speed between radiator, and the activity of heating column is influenced less.Thermal conductive silicon rubber cushion side is that polishing is set
It sets, thermal conductive silicon rubber cushion is close to the cell wall of groove, and thermal conductive silicon rubber cushion side can effectively be dropped by using the design of polishing
The low friction between the cell wall of groove can effectively promote the mobility of thermal conductive silicon rubber cushion.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
The change or replacement expected without creative work, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of encapsulation LED light emission device, it is characterised in that：Including lens, LED chip, pin, radiator and outer enclosure
Body, the LED chip are electrically connected with pin, and the lens, pin, radiator are fixedly connected with outer enclosure body, described
Be arranged above radiator it is fluted, be provided in the groove thermal conductive silicon rubber cushion and to push up waveform spring, described pair top waveform bullet
For spring between thermal conductive silicon rubber cushion and the slot bottom of groove, the LED chip is embedded in the setting of thermal conductive silicon rubber cushion, the slot of the groove
Bottom with to top waveform spring bonding, described pair top waveform spring be embedded in thermal conductive silicon rubber cushion setting, the side of the LED chip with
Thermal conductive silicon rubber cushion bonds, and heat conductive filament is wound on described pair of top waveform spring, and heat conductive silica gel acting as a cushion face is provided with heating column,
The blind hole to match with heating column is provided on the radiator, the blind hole is connected with groove, and the heating column is inserted into blind
In hole, helical spring is provided in the blind hole, the helical spring is between heating column and the bottom hole of blind hole, the heat conduction
Column is by 25-32 parts of 8-15 parts of graphene powder, the aluminium nitride powder, 2-6 parts of a yttrium oxide powder, the iridium powder that match in parts by weight
6-9 parts last, 1-3 parts of cerium powder, 55-57 parts of copper powders, 8-10 parts of green silicon carbide powder, 48-60 parts of titanium carbide powder, erucic acid acyl
2-4 parts of amine powder, 7-12 parts of tin powder, 5-7 parts of biphosphate aluminium powder, 6-10 parts of polyether-ether-ketone powder and carbon fiber wire 18-
22 parts of compositions.
2. a kind of encapsulation LED light emission device according to claim 1, it is characterised in that：Described pair of top waveform spring and spiral shell
It is silver-plated setting to revolve spring outer surface, and the heat conductive filament both ends are welded with to top waveform spring.
3. a kind of encapsulation LED light emission device according to claim 2, it is characterised in that：The helical spring both ends difference
It is bonded with the bottom hole of heating column and blind hole, the heating column and blind hole clearance fit, the heating column are inserted into pushing up waveform spring
It is interior.
4. a kind of encapsulation LED light emission device according to claim 3, it is characterised in that：The one of described pair of top waveform spring
End and the slot bottom of groove bond, and the other end of described pair of top waveform spring is embedded in the setting of thermal conductive silicon rubber cushion.
5. a kind of encapsulation LED light emission device according to claim 4, it is characterised in that：The bottom hole of the blind hole and heat conduction
Column is bonded with helical spring, and tenon is provided on the heating column, and heat conductive silica gel acting as a cushion face is provided with to match with tenon
To mortise, the heating column connected by tenon with mortise with thermal conductive silicon rubber cushion.
6. a kind of encapsulation LED light emission device according to claim 5, it is characterised in that：The helical spring is drop centre type
Helical spring is provided with thermal grease layer between the heating column and the hole wall of blind hole.
7. a kind of encapsulation LED light emission device according to claim 6, it is characterised in that：Thermal conductive silicon rubber cushion side is equal
It is arranged for polishing, the thermal conductive silicon rubber cushion is close to the cell wall of groove.
8. a kind of encapsulation LED light emission device according to claim 7, it is characterised in that：The heating column is by by weight
12 parts of graphene powder, 28 parts of aluminium nitride powder, 4 parts of a yttrium oxide powder, 8 parts of iridium powder, 2 parts of cerium powder, the copper of number proportioning
56 parts of powder, 9 parts of green silicon carbide powder, 54 parts of titanium carbide powder, 3 parts of erucyl amide powder, 10 parts of tin powder, aluminium dihydrogen phosphate
20 parts of 6 parts of powder, 8 parts of polyether-ether-ketone powder and carbon fiber wire compositions.
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| CN201810155786.2A CN108361563A (en) | 2018-02-23 | 2018-02-23 | A kind of encapsulation LED light emission device |
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| CN201810155786.2A CN108361563A (en) | 2018-02-23 | 2018-02-23 | A kind of encapsulation LED light emission device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110706393A (en) * | 2019-10-31 | 2020-01-17 | 芜湖利远电子技术有限公司 | Security protection terminal based on face identification |
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Application publication date: 20180803 |