CN110494012B - Buried resistor PCB - Google Patents
Buried resistor PCB Download PDFInfo
- Publication number
- CN110494012B CN110494012B CN201910688675.2A CN201910688675A CN110494012B CN 110494012 B CN110494012 B CN 110494012B CN 201910688675 A CN201910688675 A CN 201910688675A CN 110494012 B CN110494012 B CN 110494012B
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- CN
- China
- Prior art keywords
- printed circuit
- cover plate
- fixing piece
- fixing
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention relates to a buried resistor PCB board, which relates to the technical field of printed circuit boards, wherein a mounting cavity is formed in a substrate, the end of a first printed circuit is penetrated on the side wall of the mounting cavity, a fixing sheet is embedded in the mounting cavity, a second printed circuit is fixedly arranged on the fixing sheet, the end of the second printed circuit is penetrated on the side wall of the fixing sheet, a contact is penetrated on a cover plate, the contact is abutted on the fixing sheet, and a radiating fin is penetrated on the cover plate; the circuit board is connected with the outside through the contacts, and the heat dissipation plate embedded on the cover plate can ensure that heat accumulated on the printed circuit due to the cover plate can perform good heat exchange with the outside.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a buried resistor PCB.
Background
The PCB board relates to electronics, automatically controlled field, and it is through etching printed circuit on the base plate, with control circuit integrated on the base plate, has reduced the volume of electronic component under the same control effect's the condition, and then has reduced the volume of whole equipment, improves the performance of equipment.
The PCB board is connected with external lead through the solder joint in the use, and then is connected with controlgear, and to the great PCB board of density, if the operation is improper when being connected through the solder joint, the solder joint touches with other circuits on the base plate easily and is connected, finally leads to the circuit board to burn when circular telegram, needs the improvement.
Disclosure of Invention
The invention aims to overcome the defects and shortcomings of the prior art and provide a buried resistor PCB which is reasonable in design and convenient to use, wherein a cover plate is covered on a substrate, a contact circuit is connected with a printed circuit through a fixing plate on the substrate, a contact point is fixed on the cover plate and is connected with the contact circuit on the fixing plate through the contact point, the circuit board can be connected with the outside through the contact point, and a heat dissipation plate embedded on the cover plate can ensure that heat accumulated on the printed circuit due to the cover plate can perform good heat exchange with the outside.
In order to achieve the above purpose, the invention adopts the following technical scheme: the circuit board comprises a substrate and a cover plate, wherein a first printed circuit is fixedly arranged on the substrate, and the cover plate is covered on the substrate; the mounting cavity is formed in the base plate, the end of the first printed circuit is arranged on the side wall of the mounting cavity in a penetrating mode, the fixing piece is embedded in the mounting cavity, the second printed circuit is fixedly arranged on the fixing piece, the end of the second printed circuit is arranged on the side wall of the fixing piece in a penetrating mode, the end of the second printed circuit is in contact with the end of the first printed circuit, the cover plate is provided with a contact in a penetrating mode, the contact is abutted to the fixing piece, the contact is in contact with the second printed circuit, the cover plate is provided with a radiating fin in a penetrating mode, and the radiating fin is abutted to the base plate.
Further, the side of stationary blade on fixedly be provided with the conducting strip, no. two printed circuit and conducting strip contact setting, no. one printed circuit and conducting strip contact setting.
Further, the radiating fin is formed by sintering beryllium oxide.
Furthermore, the cover plate is made of a fusible polymer material, and the melting point of the cover plate is 300-400 ℃.
Further, the upper surface of the radiating fin is flush with the upper surface of the cover plate.
Further, the side of base plate on fixedly be provided with the fixed plate No. one, the side of apron is last fixedly be provided with No. two fixed plates, no. two fixed plates are fixed to be set up on the fixed plate No. one.
The manufacturing steps of the invention are as follows:
printing a first printed circuit on a substrate by using an electroless plating method, and forming a mounting cavity at a node of the first printed circuit in a milling mode; printing a second printed circuit on the fixing sheet by using an electroless plating method, and cutting the fixing sheet with a large area to enable the shape of the fixing sheet to be matched with the shape of the mounting cavity; extruding the copper sheet to form a copper foil-shaped conductive sheet, and cutting the conductive sheet to enable the shape of the conductive sheet to be matched with that of the fixing sheet;
step two, embedding the fixing piece into the mounting cavity, in the process, folding the conductive piece into a 90-degree shape, laying one edge of the conductive piece on the lower surface of the fixing piece, enabling the other edge of the conductive piece to prop against the side edge of the fixing piece, through which the second printed circuit is arranged, pressing the fixing piece into the mounting cavity, clamping one edge of the conductive piece, propping against the side edge of the fixing piece, between the side edge of the fixing piece and the side wall of the mounting cavity, and conducting and connecting the first printed circuit with the second printed circuit;
step three, firing beryllium oxide radiating fins; arranging and fixing the processed cooling fins in a mold, heating the fusible polymer material to be in a molten state, pouring the fusible polymer material in the mold, demolding after cooling, polishing four sides of a cover plate, and polishing the upper surface of the cover plate until the cooling fins are exposed; punching holes on the cover plate, wherein the punching holes are positioned to ensure that after the cover plate and the base plate are stacked, the punching holes are overlapped with the fixing plate, and the contacts are penetrated into the punching holes and fixed;
and step four, covering the cover plate on the substrate, enabling the contact to be in abutting contact with the second printed circuit on the fixing piece, compacting the cover plate, fixing the cover plate and the substrate, and finishing installation.
After the structure is adopted, the invention has the beneficial effects that: the embedded resistor PCB is characterized in that a cover plate is covered on a substrate, a contact circuit is connected with a printed circuit through a fixing plate on the substrate, a contact point is fixed on the cover plate and is connected with the contact circuit on the fixing plate through the contact point, the circuit board can be connected with the outside through the contact point, and a heat dissipation plate embedded on the cover plate can ensure that heat accumulated on the printed circuit due to the cover plate can be well exchanged with the outside.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic structural view of a substrate in the present invention.
Fig. 3 is a schematic structural view of the cover plate in the present invention.
Fig. 4 is a schematic diagram of a connection structure between a substrate and a cover plate in the present invention.
Reference numerals illustrate:
the heat dissipation device comprises a base plate 1, a cover plate 2, a mounting cavity 3, a fixing plate 4, a first printed circuit 5, a second printed circuit 6, contacts 7, heat dissipation fins 8, conductive sheets 9, a first fixing plate 10 and a second fixing plate 11.
Description of the embodiments
The invention is further described below with reference to the accompanying drawings.
Referring to fig. 1-4, the embodiment comprises a substrate 1 and a cover plate 2, wherein a first printed circuit 5 is fixedly arranged on the substrate 1, and the cover plate 2 is arranged on the substrate 1 in a covering manner; the substrate 1 is provided with a mounting cavity 3, the end of a first printed circuit 5 is arranged on the side wall of the mounting cavity 3 in a penetrating mode, a fixing piece 4 is embedded in the mounting cavity 3, a second printed circuit 6 is fixedly arranged on the fixing piece 4, the end of the second printed circuit 6 is arranged on the side wall of the fixing piece 4 in a penetrating mode, the end of the second printed circuit 6 is in contact with the end of the first printed circuit 5, a contact 7 is arranged on the cover plate 2 in a penetrating mode, the contact 7 is arranged on the fixing piece 4 in a propping mode, the contact 7 is in contact with the second printed circuit 6 in a contacting mode, a radiating fin 8 is arranged on the cover plate 2 in a penetrating mode, the radiating fin 8 is propped on the substrate 1, the radiating fin 8 is formed by sintering beryllium oxide, the cover plate 2 is made of a fusible polymer material with a melting point of 350 ℃, the length of the radiating fin 8 is smaller than the length of the cover plate 2, and the width of the radiating fin 8 is smaller than the distance between the contacts 7.
Further, the side of the fixing piece 4 is fixedly provided with a conducting plate 9, the second printed circuit 6 is in contact with the conducting plate 9, the first printed circuit 5 is in contact with the conducting plate 9, and the conducting plate 9 is made of copper foil by pressing copper sheets.
Further, the side of the base plate 1 is integrally provided with a first fixing plate 10, the side of the cover plate 2 is integrally provided with a second fixing plate 11, the second fixing plate 11 is glued and fixed on the first fixing plate 10, the first fixing plate 10 and the second fixing plate 11 are convenient for gluing and fixing the base plate 1 and the cover plate 2, and the first printed circuit 5 on the clamping plate 1 is prevented from being glued and fixed.
The manufacturing steps of the specific embodiment are as follows:
printing a first printed circuit 5 on a substrate 1 by using an electroless plating method, and forming a mounting cavity 3 at a node of the first printed circuit 5 by using a milling mode; printing a second printed circuit 6 on the fixing piece 4 by using an electroless plating method, and cutting the fixing piece 4 with a large area to enable the shape of the fixing piece 4 to be matched with the shape of the mounting cavity 3; extruding with copper sheet to form copper foil-like conductive sheet 9, cutting conductive sheet 9 to match the shape of fixing sheet 4;
step two, embedding the fixing piece 4 into the mounting cavity 3, in the process, folding the conductive piece 9 into a 90-degree shape, laying one edge of the conductive piece on the lower surface of the fixing piece 4, enabling the other edge of the conductive piece to prop against the side edge of the fixing piece 4, where the second printed circuit 6 is penetrated, pressing the fixing piece 4 into the mounting cavity 3, at the moment, clamping one edge of the conductive piece 9 propping against the side edge of the fixing piece 4 between the side edge of the fixing piece 4 and the side wall of the mounting cavity 3, and conducting and connecting the first printed circuit 5 with the second printed circuit 6;
firing beryllium oxide cooling fins 8; arranging and fixing the processed cooling fins 8 in a mould, heating the fusible polymer material to be in a molten state, pouring the fusible polymer material in the mould, cooling, demoulding to form a cover plate 2, polishing four sides of the cover plate 2, polishing the upper surface of the cover plate 2 until the cooling fins 8 are exposed, and adding a polishing agent in the polishing process; punching holes on the cover plate 2, wherein the punching holes are positioned to ensure that after the cover plate 2 is stacked with the base plate 1, the punching holes overlap with the position of the fixing piece 4, and the contacts 7 are penetrated into the punching holes and fixed;
and step four, covering the cover plate 2 on the base plate 1, enabling the contact 7 to be in abutting contact with the second printed circuit 6 on the fixing piece 4, compacting the cover plate 2, fixing the cover plate 2 and the base plate 1, and finishing installation.
After adopting above-mentioned structure, this concrete implementation mode beneficial effect does: according to the embedded resistor PCB, the cover plate is covered on the substrate, the contact circuit is connected with the printed circuit through the fixing plate on the substrate, the contact point is fixed on the cover plate and is connected with the contact circuit on the fixing plate through the contact point, the circuit board is connected with the outside through the contact point, and the heat dissipation plate embedded on the cover plate can ensure that heat accumulated on the printed circuit due to the cover plate can be well exchanged with the outside.
The foregoing is merely illustrative of the present invention and not restrictive, and other modifications and equivalents thereof may occur to those skilled in the art without departing from the spirit and scope of the present invention.
Claims (1)
1. The utility model provides a bury embedded resistance PCB board which characterized in that: the circuit comprises a substrate (1) and a cover plate (2), wherein a first printed circuit (5) is fixedly arranged on the substrate (1), and the cover plate (2) is arranged on the substrate (1) in a covering manner; the substrate (1) is provided with a mounting cavity (3), the end of the first printed circuit (5) is arranged on the side wall of the mounting cavity (3) in a penetrating way, a fixing piece (4) is embedded in the mounting cavity (3), a second printed circuit (6) is fixedly arranged on the fixing piece (4), the end of the second printed circuit (6) is arranged on the side wall of the fixing piece (4) in a penetrating way, the end of the second printed circuit (6) is arranged in a contact way with the end of the first printed circuit (5), a contact (7) is arranged on the cover plate (2) in a penetrating way, the contact (7) is arranged on the fixing piece (4) in a contact way, the contact (7) is arranged in a contact way with the second printed circuit (6), a radiating fin (8) is arranged on the cover plate (2) in a penetrating way, and the radiating fin (8) is arranged on the substrate (1);
the side of the fixing piece (4) is fixedly provided with a conducting strip (9), the second printed circuit (6) is in contact with the conducting strip (9), and the first printed circuit (5) is in contact with the conducting strip (9);
the radiating fin (8) is formed by sintering beryllium oxide;
the cover plate (2) is made of a fusible polymer material, and the melting point of the cover plate is 300-400 ℃;
the upper surface of the radiating fin (8) is arranged flush with the upper surface of the cover plate (2);
a first fixing plate (10) is fixedly arranged on the side edge of the base plate (1), a second fixing plate (11) is fixedly arranged on the side edge of the cover plate (2), and the second fixing plate (11) is fixedly arranged on the first fixing plate (10);
the manufacturing steps are as follows:
printing a first printed circuit (5) on a substrate (1) by using an electroless plating method, and forming a mounting cavity (3) at a node of the first printed circuit (5) by using a milling mode; printing a second printed circuit (6) on the fixing piece (4) by using an electroless plating method, and cutting the fixing piece (4) with a large area to enable the shape of the fixing piece (4) to be matched with the shape of the mounting cavity (3); extruding by using a copper sheet to form a copper foil-shaped conductive sheet (9), and cutting the conductive sheet (9) to enable the shape of the conductive sheet to be matched with that of the fixing sheet (4);
step two, embedding the fixing piece (4) into the mounting cavity (3), in the process, folding the conductive piece (9) into a 90-degree shape, laying one edge of the conductive piece on the lower surface of the fixing piece (4), enabling the other edge of the conductive piece to prop against the side edge of the fixing piece (4) where the second printed circuit (6) is penetrated, pressing the fixing piece (4) into the mounting cavity (3), clamping one edge of the conductive piece (9) propping against the side edge of the fixing piece (4) between the side edge of the fixing piece (4) and the side wall of the mounting cavity (3), and conducting and connecting the first printed circuit (5) with the second printed circuit (6);
step three, firing beryllium oxide radiating fins (8); arranging and fixing the processed cooling fins (8) in a mould, heating the fusible polymer material to be in a molten state, pouring the fusible polymer material in the mould, demoulding after cooling, polishing the four sides of the cover plate (2), and polishing the upper surface of the cover plate (2) until the cooling fins (8) are exposed; punching holes on the cover plate (2), wherein the punching holes are positioned to ensure that after the cover plate (2) is overlapped with the base plate (1), the punching holes are overlapped with the fixing piece (4), and the contacts (7) are penetrated into the punching holes and fixed;
and step four, covering the cover plate (2) on the base plate (1) to enable the contact (7) to be in abutting contact with the second printed circuit (6) on the fixing piece (4), compressing the cover plate (2), fixing the cover plate (2) and the base plate (1), and finishing installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910688675.2A CN110494012B (en) | 2019-07-29 | 2019-07-29 | Buried resistor PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910688675.2A CN110494012B (en) | 2019-07-29 | 2019-07-29 | Buried resistor PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110494012A CN110494012A (en) | 2019-11-22 |
| CN110494012B true CN110494012B (en) | 2023-08-04 |
Family
ID=68548689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910688675.2A Active CN110494012B (en) | 2019-07-29 | 2019-07-29 | Buried resistor PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110494012B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204906846U (en) * | 2015-08-27 | 2015-12-23 | 深圳市吉瑞达电路科技有限公司 | Dustproof heat dissipation type PCB circuit plate structure |
| CN109195315A (en) * | 2018-09-28 | 2019-01-11 | 电子科技大学 | A kind of radiator structure, potting/attachment printed circuit board and production method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8021930B2 (en) * | 2009-08-12 | 2011-09-20 | Stats Chippac, Ltd. | Semiconductor device and method of forming dam material around periphery of die to reduce warpage |
| US8034661B2 (en) * | 2009-11-25 | 2011-10-11 | Stats Chippac, Ltd. | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP |
-
2019
- 2019-07-29 CN CN201910688675.2A patent/CN110494012B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204906846U (en) * | 2015-08-27 | 2015-12-23 | 深圳市吉瑞达电路科技有限公司 | Dustproof heat dissipation type PCB circuit plate structure |
| CN109195315A (en) * | 2018-09-28 | 2019-01-11 | 电子科技大学 | A kind of radiator structure, potting/attachment printed circuit board and production method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110494012A (en) | 2019-11-22 |
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