CN108770310B - Heat dissipation type driving bottom plate combined mechanism - Google Patents
Heat dissipation type driving bottom plate combined mechanism Download PDFInfo
- Publication number
- CN108770310B CN108770310B CN201810687616.9A CN201810687616A CN108770310B CN 108770310 B CN108770310 B CN 108770310B CN 201810687616 A CN201810687616 A CN 201810687616A CN 108770310 B CN108770310 B CN 108770310B
- Authority
- CN
- China
- Prior art keywords
- plate
- heat dissipation
- heat
- pcb
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation type driving bottom plate combination mechanism which comprises a bottom plate, a horizontal plate, a heat dissipation plate, an installation fixing plate and a PCB (printed Circuit Board), wherein the peripheral edge of the top end of the bottom plate is fixedly connected with a vertical connecting plate, the heat dissipation plate is provided with a plurality of heat dissipation holes, a symmetrical corner of the installation fixing plate is fixedly connected with an air blower, the installation fixing plate is fixedly connected with the PCB through threads, and the bottom end of the heat conduction plate is fixedly connected with heat dissipation fins. The radiating structure is novel, can realize the radiating of electronic elements on the PCB, and can also realize the radiating of welding circuits on the PCB so as to ensure the radiating efficiency of the PCB; the invention utilizes two heat dissipation ways to improve the heat dissipation effect of the device, and firstly, the heat exchange is realized by the air convection between the hot air in the heat dissipation cavity and the outside air; and secondly, transferring and radiating by utilizing the heat conducting plate and the radiating fins.
Description
Technical Field
The invention relates to the technical field of driving bottom plate combination mechanisms, in particular to a heat dissipation type driving bottom plate combination mechanism.
Background
The driving bottom plate is the backup pad for fixed PCB board, and the heat dissipation of PCB board need be considered in the installation of current PCB board, and current PCB board heat abstractor is either for heat dissipation electronic component, or for the welded end of heat dissipation PCB board, consequently can not guarantee the whole radiating effect of PCB board at to a great extent, and then influences the life of PCB board, and is inconvenient to the installation of PCB board, dismantlement, influences the maintenance efficiency of PCB board.
Disclosure of Invention
The invention aims to solve the defects of poor heat dissipation effect, one-sided heat dissipation, inconvenience in dismounting and mounting a PCB (printed Circuit Board) and the like in the prior art, and provides a heat dissipation type driving bottom plate combination mechanism.
In order to achieve the purpose, the invention adopts the following technical scheme:
a heat dissipation type driving bottom plate combination mechanism comprises a bottom plate, a horizontal plate, a heat dissipation plate, an installation fixing plate and a PCB plate, wherein the peripheral edge of the top end of the bottom plate is fixedly connected with a vertical connecting plate, the inner side wall of the connecting plate is fixedly connected with the horizontal plate, the bottom end of the horizontal plate is fixedly connected with the vertical heat dissipation plate, the heat dissipation plate is provided with a plurality of heat dissipation holes, the lower end of the side wall of the heat dissipation plate is fixedly connected with the horizontal installation fixing plate, a symmetrical corner of the installation fixing plate is fixedly connected with an air blower, the installation fixing plate is provided with a threaded groove, the installation fixing plate is fixedly connected with the PCB plate through threads, a symmetrical corner of the PCB plate is provided with a threaded through hole, a bolt is inserted in the threaded through hole, the other symmetrical corner of the PCB plate is provided with an, constitute the heat dissipation cavity between bottom plate, connecting plate, horizontal plate, heating panel, installation fixed plate and the PCB board, air-blower intercommunication heat dissipation cavity, fixed the inlaying has the heat-conducting plate in the middle of the bottom of bottom plate, the inside wall and the heat dissipation cavity intercommunication of heat-conducting plate, the bottom fixedly connected with heat radiation fins of heat-conducting plate.
Preferably, the bottom plate, the connecting plate and the horizontal plate are of an integrally formed structure, the heat dissipation plate is respectively welded with the horizontal plate and the installation fixing plate in a seamless mode, and the horizontal plate, the heat dissipation plate and the installation fixing plate form a Z-shaped structure.
Preferably, the radiating holes are linearly arranged on the radiating plates, and the number of the radiating hole rows on each radiating plate is not less than two.
Preferably, the number of the thread groove and the thread through hole is not less than two, the number of the thread groove and the number of the thread through hole are the same, and the groove diameter of the thread groove is the same as the hole diameter of the thread through hole.
Preferably, the size of the L-shaped clamping groove is larger than the size of the shell of the blower.
Preferably, the size of the heat-conducting plate is larger than that of the PCB plate, the heat-conducting plate is seamlessly embedded in the middle of the bottom plate, and the heat-radiating fins on the heat-conducting plate are communicated with the external air.
Preferably, a sealing gasket is fixedly laid at the top end of the mounting and fixing plate.
The invention provides a heat dissipation type driving bottom plate combination mechanism, which has the beneficial effects that: the radiating structure is novel, can realize the radiating of electronic elements on the PCB, and can also realize the radiating of welding circuits on the PCB so as to ensure the radiating efficiency of the PCB; the heat dissipation plate and the heat dissipation holes are utilized to realize air convection between the heat dissipation cavity and the outside, so that the electronic element is blown by air in the heat dissipation cavity when the air comes out, and partial heat on the electronic element can be taken away; the PCB is conveniently installed on the installation fixing plate by utilizing the threaded through hole and the threaded groove, so that the device is convenient to use; the PCB is convenient to disassemble by using the bolt; by utilizing the heat conduction plate and the radiating fins, after the convection of the gas in the radiating cavity can be realized, the heat can be ensured to be transferred from the heat conduction plate to the radiating fins, and further, the radiating fins can dissipate part of the heat; and a blower is utilized to provide conditions for the gas generation convection in the heat dissipation chamber.
The device utilizes two heat dissipation ways to improve the heat dissipation effect of the device, and firstly, the hot air in the heat dissipation cavity and the external air generate air convection to carry out heat exchange; and secondly, transferring and radiating by utilizing the heat conducting plate and the radiating fins.
Drawings
Fig. 1 is a schematic sectional structure of the present invention.
Fig. 2 is a schematic top view of the PCB board of the present invention.
FIG. 3 is a schematic top view of the PCB of the present invention.
In the figure: 1-bottom plate, 2-horizontal plate, 3-heat dissipation plate, 30-heat dissipation hole, 4-installation fixing plate, 40-thread groove, 5-PCB plate, 50-thread through hole, 51-L-shaped clamping groove, 6-bolt, 7-sealing pad, 8-heat dissipation chamber, 9-air blower, 10-connecting plate, 11-heat conduction plate and 12-heat dissipation fin.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-3, a heat dissipation type driving bottom plate combined mechanism, including bottom plate 1, horizontal plate 2, heating panel 3, installation fixed plate 4 and PCB 5, the equal fixedly connected with vertically connecting plate 10 of top edge all around of bottom plate 1, fixedly connected with horizontal plate 2 on the inside wall of connecting plate 10, bottom plate 1, connecting plate 10 and horizontal plate 2 are the integrated into one piece structure, heating panel 3 is seamless welding horizontal plate 2 and installation fixed plate 4 respectively, and horizontal plate 2, heating panel 3 and installation fixed plate 4 three constitute the Z font structure.
The bottom fixedly connected with vertically heating panel 3 of horizontal plate 2, a plurality of louvre 30 has been seted up on heating panel 3, louvre 30 is linear arrangement at heating panel 3, and two rows are no less than to every louvre 30 row number on heating panel 3, utilize heating panel 3 and louvre 30, realize that heat dissipation cavity 8 carries out the air convection with the external world, and then guarantee that the gas in the heat dissipation cavity 8 blows electronic component when coming out, also can take away the partial heat on the electronic component.
Lateral wall lower extreme fixed connection of heating panel 3 has horizontally installation fixed plate 4, the fixed sealed pad 7 of having laid in top of installation fixed plate 4, a symmetrical corner fixedly connected with air-blower 9 of installation fixed plate 4, thread groove 40 has been seted up on the installation fixed plate 4, thread fixedly connected with PCB board 5 on the installation fixed plate 4, thread through-hole 50 has been seted up to a symmetrical corner of PCB board 5, and threaded through-hole 50 alternates there is bolt 6, utilize bolt 6, convenient dismantlement to PCB board 5, the quantity of thread groove 40 and thread through-hole 50 is all less than two, and thread groove 40 and thread through-hole 50's quantity is the same, the groove diameter of thread groove 40 is the same with thread through-hole 50's hole diameter, utilize thread through-hole 50 and thread groove 40, conveniently install PCB board 5 on installation fixed plate 4, and then make things convenient for the use of this device.
An L-shaped clamping groove 51 is formed in the other symmetrical corner of the PCB 5, a blower 9 is clamped in the L-shaped clamping groove 51, the blower 9 is utilized to provide conditions for convection of gas in the heat dissipation chamber 8, the size of the L-shaped clamping groove 51 is larger than that of the shell of the blower 9, the bottom plate 1, the connecting plate 10, the horizontal plate 2, the heat dissipation plate 3, the mounting fixing plate 4 and the PCB 5 form the heat dissipation chamber 8, the blower 9 is communicated with the heat dissipation chamber 8, a heat conduction plate 11 is fixedly embedded in the middle of the bottom end of the bottom plate 1, the inner side wall of the heat conduction plate 11 is communicated with the heat dissipation chamber 8, heat dissipation fins 12 are fixedly connected to the bottom end of the heat conduction plate 11, the size of the heat conduction plate 11 is larger than that of the PCB 5, the heat conduction plate 11 is seamlessly embedded in the middle of the bottom plate 1, the heat dissipation fins 12 on the, the heat can be transferred from the heat conducting plate 11 to the heat radiating fins 12, and partial heat can be further dissipated by the heat radiating fins 12.
The radiating structure is novel in structure, can realize the radiating of electronic elements on the PCB 5, and can also realize the radiating of welding circuits on the PCB 5 so as to ensure the radiating efficiency of the PCB 5.
The device utilizes two heat dissipation ways to improve the heat dissipation effect of the device, and firstly, the hot air in the heat dissipation chamber 8 and the outside air generate air convection to carry out heat exchange; the second is transmission heat dissipation, which is performed by using the heat conducting plate 11 and the heat dissipating fins 12.
The working principle is as follows: when the device is used, the PCB 5 is placed on the installation fixing plate 4, the L-shaped clamping groove 51 is clamped on the shell of the air blower 9, then the PCB 5 is fixed on the installation fixing plate 4 through the bolt 6, the bolt 6 is inserted into the thread groove 40 and the thread through hole 50, the air blower 9 is started, the air blower 9 blows air into the heat dissipation chamber 8, then cold and hot air carries out heat exchange in the heat dissipation chamber 8, then partial air is discharged from the heat dissipation hole 30 to blow off part of heat on an electronic element, at the moment, when the heat contacts the heat conduction plate 11, the heat conduction plate 11 transfers the heat to the heat dissipation fins 12, finally, the heat dissipation fins 12 dissipate part of heat, when the PCB 5 needs to be disassembled, the bolt 6 is screwed to disassemble the PCB 5.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. The utility model provides a heat dissipation type drive bottom plate combined mechanism, includes bottom plate (1), horizontal plate (2), heating panel (3), installation fixed plate (4) and PCB board (5), its characterized in that: the edge of the periphery of the top end of the bottom plate (1) is fixedly connected with a vertical connecting plate (10), the inner side wall of the connecting plate (10) is fixedly connected with a horizontal plate (2), the bottom end of the horizontal plate (2) is fixedly connected with a vertical heat dissipation plate (3), the heat dissipation plate (3) is provided with a plurality of heat dissipation holes (30), the lower end of the side wall of the heat dissipation plate (3) is fixedly connected with a horizontal installation fixing plate (4), a symmetrical corner of the installation fixing plate (4) is fixedly connected with an air blower (9), a threaded groove (40) is formed in the installation fixing plate (4), a PCB (5) is fixedly connected with threads on the installation fixing plate (4), a threaded through hole (50) is formed in a symmetrical corner of the PCB (5), a bolt (6) is inserted in the threaded through hole (50), and an L-shaped clamping groove (51) is formed in the other symmetrical corner of, air-blower (9) have been connect to the joint in L type draw-in groove (51), constitute heat dissipation cavity (8) between bottom plate (1), connecting plate (10), horizontal plate (2), heating panel (3), installation fixed plate (4) and PCB board (5), air-blower (9) intercommunication heat dissipation cavity (8), fixed the inlaying in the middle of the bottom of bottom plate (1) has heat-conducting plate (11), the inside wall and heat dissipation cavity (8) intercommunication of heat-conducting plate (11), the bottom fixedly connected with heat radiation fins (12) of heat-conducting plate (11).
2. The heat dissipation type driving chassis assembly according to claim 1, wherein: bottom plate (1), connecting plate (10) and horizontal plate (2) are the integrated into one piece structure, heating panel (3) seamless welding horizontal plate (2) and installation fixed plate (4) respectively, and horizontal plate (2), heating panel (3) and installation fixed plate (4) three constitute Z style of calligraphy structure.
3. The heat dissipation type driving chassis assembly according to claim 1, wherein: the radiating holes (30) are linearly arranged on the radiating plates (3), and the number of the rows of the radiating holes (30) on each radiating plate (3) is not less than two.
4. The heat dissipation type driving chassis assembly according to claim 1, wherein: the number of the thread groove (40) and the number of the thread through holes (50) are not less than two, the number of the thread groove (40) and the number of the thread through holes (50) are the same, and the groove diameter of the thread groove (40) is the same as the hole diameter of the thread through hole (50).
5. The heat dissipation type driving chassis assembly according to claim 1, wherein: the size of the L-shaped clamping groove (51) is larger than the size of the shell of the blower (9).
6. The heat dissipation type driving chassis assembly according to claim 1, wherein: the size of the heat conducting plate (11) is larger than that of the PCB (5), the heat conducting plate (11) is seamlessly embedded in the middle of the bottom plate (1), and the heat radiating fins (12) on the heat conducting plate (11) are communicated with the outside air.
7. The heat dissipation type driving chassis assembly according to claim 1, wherein: and a sealing gasket (7) is fixedly laid at the top end of the mounting and fixing plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810687616.9A CN108770310B (en) | 2018-06-28 | 2018-06-28 | Heat dissipation type driving bottom plate combined mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810687616.9A CN108770310B (en) | 2018-06-28 | 2018-06-28 | Heat dissipation type driving bottom plate combined mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108770310A CN108770310A (en) | 2018-11-06 |
| CN108770310B true CN108770310B (en) | 2020-02-21 |
Family
ID=63974437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810687616.9A Active CN108770310B (en) | 2018-06-28 | 2018-06-28 | Heat dissipation type driving bottom plate combined mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108770310B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110809362A (en) * | 2019-12-10 | 2020-02-18 | 苏州市惠利华电子有限公司 | High-heat-dissipation printed circuit board and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146429A (en) * | 2006-09-15 | 2008-03-19 | 刘胜 | Radiator of electronic device |
| CN203628590U (en) * | 2013-12-24 | 2014-06-04 | 广州市德晟照明实业有限公司 | LED lamp heat dissipation structure |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201252711Y (en) * | 2008-07-02 | 2009-06-03 | 研华股份有限公司 | Shell structure capable of being combined with radiator |
| CN203193780U (en) * | 2013-05-06 | 2013-09-11 | 深圳市锐吉电子科技有限公司 | Large-power waterproof television with heat-radiation function |
| CN203368984U (en) * | 2013-07-10 | 2013-12-25 | 天津滨海新区微乐科技有限公司 | Wireless router of enterprise brand presentation |
| CN104640414A (en) * | 2013-11-11 | 2015-05-20 | 富泰华精密电子（郑州）有限公司 | Mobile terminal |
| CN106325444A (en) * | 2015-07-01 | 2017-01-11 | 技嘉科技股份有限公司 | Fan-free computer system and motherboard |
| CN206398435U (en) * | 2017-01-18 | 2017-08-11 | 中山市景程五金制品有限公司 | LED lamp base with heat dissipation structure |
| CN206890279U (en) * | 2017-07-20 | 2018-01-16 | 四川省建名电光源科技有限公司 | LED street lamp high-efficiency heat radiation structure |
| CN207037570U (en) * | 2017-08-15 | 2018-02-23 | 深圳荣奥通网络信息技术有限公司 | A kind of high-efficient heat-dissipating computer host box |
-
2018
- 2018-06-28 CN CN201810687616.9A patent/CN108770310B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146429A (en) * | 2006-09-15 | 2008-03-19 | 刘胜 | Radiator of electronic device |
| CN203628590U (en) * | 2013-12-24 | 2014-06-04 | 广州市德晟照明实业有限公司 | LED lamp heat dissipation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108770310A (en) | 2018-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207604129U (en) | A kind of PCB circuit board cabinet cooling device | |
| CN108770310B (en) | Heat dissipation type driving bottom plate combined mechanism | |
| CN209402925U (en) | A kind of two-side radiation device of pcb board | |
| CN207588548U (en) | A photovoltaic power generation controller with cooling function | |
| CN214189343U (en) | Heat radiation structure for charging pile | |
| CN202351767U (en) | Fanless compact peripheral component interconnect (CPCI) industrial computer | |
| CN107366889B (en) | LED light source driving heat dissipation module | |
| CN214901176U (en) | Embedded network switch | |
| CN209928876U (en) | High heat dissipation computer display screen structure | |
| CN207264708U (en) | A kind of LED display | |
| CN210864552U (en) | CPU chip and display card integrated heat dissipation module | |
| CN101329057A (en) | LED luminous module with heat radiation structure | |
| CN221504915U (en) | LED lamp circuit board with protective structure | |
| CN220873208U (en) | High-brightness display with stable heat dissipation performance | |
| CN221634043U (en) | Movement assembly | |
| CN219228279U (en) | High-efficient heat dissipation type ultrathin LED die-casting aluminum sleeve | |
| CN215867705U (en) | Digital twin application terminal carrier based on digital city | |
| CN218525266U (en) | LED display screen capable of eliminating corrugated deformation | |
| CN216744266U (en) | Heat radiation structure and circuit board used by LED lamp | |
| CN218788458U (en) | A mounting structure for a battery module shell | |
| CN216291931U (en) | High-efficiency heat dissipation device with heat dissipation air plate | |
| CN219876571U (en) | Industrial control power supply circuit board | |
| CN212786022U (en) | A waterproof construction for PCB board | |
| CN220068129U (en) | Power IC heat radiation structure | |
| CN220341985U (en) | Heat dissipation formula bus duct |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |