CN103220896A - Heat radiation structure and electronic device with the same - Google Patents

Abstract

A heat dissipation structure and an electronic device with the heat dissipation structure are provided. The electronic elements are electrically arranged on the circuit board. The heat dissipation structure includes a first insulating and heat conducting layer and a metal layer. The first insulating heat conduction layer covers the circuit board or/and the electronic elements. The heat conduction coefficient of the first insulating heat conduction layer is larger than 0.5W/m.K. The metal layer is bonded to the first insulating and heat conducting layer for thermal contact. The shell is provided with an accommodating space. The circuit board, the electronic elements and the heat dissipation structure are accommodated in the accommodating space, and the metal layer is arranged between the shell and the first insulating heat conduction layer.

Description

Heat dissipation structure and electronic device with the heat dissipation structure

technical field

The present invention relates to a heat dissipation structure, in particular to a heat dissipation structure capable of uniforming the temperature distribution on the surface of an electronic device and rapidly reducing the temperature of internal high-heat electronic components, and an electronic device with the heat dissipation structure.

Background technique

Power adapters and power supplies are indispensable electronic devices for the operation of various electrical equipment. These electronic devices have many electronic components on their internal circuit boards, and these electronic components include not only high heating power components (such as transformers, metal oxide semiconductor field effect transistors, diodes, inductors, etc.) but also low heating power components (such as capacitor or resistor). When the electronic device is in operation, if the heat generated by these electronic components cannot be effectively removed from the outside, the heat will be accumulated in the electronic device and the temperature of these electronic components will rise. If the temperature of these electronic components is too high, the electronic components will malfunction or even burn out.

Take the power adapter as an example. The power adapter is used to convert the voltage of the external power supply to the voltage used by the electrical equipment, where the electrical equipment is, for example, a portable computer. However, with the integration of electronic components, the size of the power adapter is also reduced simultaneously, and the heat dissipation problem caused by the smaller size becomes more and more serious.

For example, the casing of the conventional power adapter is made of plastic. Since the plastic material is not conducive to the diffusion of heat, when the heat generated by the electronic components on the circuit board is transferred to the housing, the temperature of the area corresponding to the high heating power components of the housing is often higher than other areas of the housing temperature. However, the high temperature existing in a specific area of the casing may cause discomfort to the user, or even burn the user. In addition, the phenomenon that the heat is concentrated in a specific area of the housing will also reduce the heat dissipation efficiency of the housing.

Furthermore, with the trend of miniaturization of electronic devices, the internal space of electronic devices is quite narrow. In such a narrow space, after deducting the space occupied by the electronic components inside the electronic device, there is very little space left for disposing the heat dissipation structure of the electronic device. Therefore, the narrow internal space of the electronic device will also make it difficult for the designer to design the heat dissipation structure.

Based on the above, how to provide a heat dissipation structure that can promote the temperature of each area of the housing surface of the electronic device to quickly converge and quickly cool down the high-heat electronic components without occupying too much internal use space of the electronic device is really relevant. It is an urgent problem that people in the technical field need to solve at present.

Contents of the invention

In order to solve the above problems of uneven temperature distribution of the housing of the electronic device, excessively high temperature of the electronic components in the electronic device, and limited internal space, the present invention proposes an effective heat dissipation device that can be flexibly designed and used depending on the heat dissipation requirements. A heat dissipation structure and an electronic device with the heat dissipation structure.

In one embodiment, the above-mentioned heat dissipation structure includes a first insulating and heat-conducting layer and a metal layer. The thermal conductivity of the first insulating and heat-conducting layer is greater than 0.5 W/m·K. The metal layer is bonded to the first insulating and thermally conductive layer in thermal contact. The metal layer is chemically bonded with the first insulating and heat-conducting layer. In addition, in another embodiment, the heat dissipation structure may further include a second insulating and heat-conducting layer. The thermally insulating layer is combined with the metal layer for thermal contact, and the metal layer is interposed between the first thermally insulating layer and the second thermally insulating layer, wherein the thermal conductivity of the thermally insulating layer is greater than 0.5 W/m·K.

In one embodiment, the above-mentioned electronic device is produced by packing the above-mentioned heat dissipation structure into a casing of the electronic device to remove a circuit board of the electronic device and a plurality of electronic devices electrically connected to the circuit board Heat, thereby increasing the heat dissipation efficiency of electronic devices. In the electronic device, the metal layer of the heat dissipation structure is interposed between the casing and the first insulating and heat-conducting layer, and the first insulating and heat-conducting layer covers the circuit board or/and these electronic components.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

FIG. 1 is a combined diagram of an electronic device according to a first embodiment of the present invention;

FIG. 2 is an exploded view of the electronic device of FIG. 1;

Fig. 3 is a sectional view drawn along section line 3-3 of Fig. 1;

4 is a graph of the hot spot temperature (which is the temperature difference between one and the ambient temperature) of the housing of the electronic device using the existing heat dissipation structure and the electronic device of the present embodiment;

5 is a temperature curve diagram of the electronic device with the existing heat dissipation structure and the electronic components in the electronic device of this embodiment;

6 is a schematic cross-sectional view of an electronic device in a modified form derived from the first embodiment of the present invention;

7 is a schematic cross-sectional view of an electronic device according to a second embodiment of the present invention;

FIG. 8 is an exploded schematic view of another electronic device derived from the first embodiment of the present invention;

9 is a schematic cross-sectional view of the electronic device of FIG. 8;

10 is a schematic cross-sectional view of an electronic device according to a third embodiment of the present invention;

11 is a schematic cross-sectional view of an electronic device according to a fourth embodiment of the present invention;

12 is a schematic cross-sectional view of another electronic device derived from the first embodiment of the present invention;

13 is a schematic cross-sectional view of an electronic device according to a fifth embodiment of the present invention;

FIG. 14 is a schematic cross-sectional view of an electronic device according to a sixth embodiment of the present invention.

Among them, reference signs

100 electronic devices

101 electronic devices

102 electronic devices

103 electronic devices

104 electronic devices

105 electronic devices

106 electronic devices

110 circuit board

112 Voltage input side

114 Voltage output side

115 electronic components

116 body

118 Ground contact

120 The first insulation and heat conduction layer

120' first insulation and heat conduction layer

122 Part 1

124 Part Two

129a bump

129b bump

122 Part 1

124 Part Two

126 surface

128 openings

130 metal layers

130’ metal layer

132 surface

134 protrusions

136 holes

140 shell

140a upper surface

140b lower surface

140c right surface

140d left surface

140e primary side surface

140f Secondary side surface

140’ Shell

142 The first shell

142’ first shell

144 Second housing

144’ second shell

146 External surface

148a Protrusion

148b Protrusion

150a electronic components

150b Electronic components

160 The first link

170 Second insulation and heat conduction layer

180 Second link

190 The third link

195 The fourth link

200 heat dissipation structure

201 heat dissipation structure

202 heat dissipation structure

203 heat dissipation structure

204 heat dissipation structure

205 heat dissipation structure

300 wire

400 insulation buckle

Detailed ways

Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

The "thermal contact" mentioned in this specification refers to the bonding method between two objects, which can make heat transfer from one object to another object in the form of heat conduction.

In addition, the "covering" mentioned in this specification means that a covering partially or completely surrounds the object to be covered, and the covering may or may not touch the object to be covered.

1 is an assembly diagram of an electronic device according to a first embodiment of the present invention; FIG. 2 is an exploded view of the electronic device in FIG. 1 ; Please refer to FIG. 1 to FIG. 3 together. For the convenience of description, the electronic device 100 of the first embodiment is illustrated by taking a power adapter (adapter) as an example. However, this embodiment does not attempt to limit the type of the electronic device 100 to the power adapter. In other embodiments, the electronic device 100 may also be a power supply or other types of electronic products, such as a USB digital TV stick. The electronic device 100 includes a circuit board 110, a plurality of electronic components 115 (for the sake of brevity, only one electronic component is drawn as a representative illustration), a heat dissipation structure 200 and a housing 140, wherein the heat dissipation structure 200 includes a first insulating The heat conduction layer 120 and a metal layer 130 , and the first insulating heat conduction layer 120 and the metal layer 130 are properly processed and combined to form the heat dissipation structure 200 .

The electronic components 115 are electrically disposed on the circuit board 110 . In other words, the electronic components 115 are electrically connected to the circuit board 110 and can be disposed above or below the circuit board 110 . The electronic component 115 is, for example, a MOSFET, a diode, an inductor, a capacitor, a resistor, or other electronic components. In this embodiment and other embodiments of the present invention, the power input element 150a and the power output element 150b can be one of a plug, a socket, and a power cord, respectively. For ease of description, the following multiple embodiments use the power input element 150a as a socket (that is, the socket can be externally connected with a power cord plug to input commercial power), and the electronic component 150b is a power cord (that is, through the power cord can be electrically connected to an electronic device, such as a portable computer) as an example. In addition, based on the positions of the power input element 150a and the power output element 150b, the circuit board 110 can distinguish a voltage input side (or called a primary side) 112 and a voltage output side (or called a secondary side) 114, wherein the voltage The input side 112 refers to one side of the circuit board 110 electrically connected to the power input element 150a, and the voltage output side 114 refers to the other side of the circuit board 110 electrically connected to the power output element 150b.

The first insulating and heat-conducting layer 120 of the heat dissipation structure 200 covers the circuit board 110 or the electronic components 115 . In this embodiment and some other embodiments, the first insulating and heat-conducting layer 120 includes a first portion 122 and a second portion 124 . The first portion 122 and the second portion 124 jointly cover the circuit board 110 and the electronic components 115 on the circuit board 110 . More specifically, the first part 122 and the second part 124 together form a hexahedron structure, and at the openings at both ends of the structure, the first part 122 and the second part 124 only expose the power input element 150a and the power output element 150b. In other words, the first insulating and heat-conducting layer 120 formed by the first portion 122 and the second portion 124 shields part of the voltage input side 112 and part of the voltage output side 114 . However, like the definition of the word "wrapping" in this specification, this embodiment is not intended to limit the way that the first insulating and heat-conducting layer 120 of the present invention covers the circuit board 110 and the electronic components 115. In some other embodiments The first insulating and heat-conducting layer 120 can also only cover a partial area of the circuit board 110 , or cover part of the electronic components 115 , or cover a partial area of the circuit board 110 and part of the electronic components 115 . Moreover, in other embodiments, the first insulating and heat-conducting layer 120 can also completely cover the circuit board 110 and/or these electronic components 115 .

The thermal conductivity of the first insulating and heat-conducting layer 120 is greater than 0.5W/m·K, and is preferably a soft material. In this embodiment, the material of the first insulating and heat-conducting layer 120 is, for example, heat-conducting silica gel or heat-conducting rubber, other applicable Materials are also available. In addition, the so-called "insulation" refers to the property of an object. Since the electronic device 100 of this embodiment is illustrated by a power adapter, in the Hi-Pot test in this technical field, it is at 4242 volts. The object is insulated as long as there is no breakdown of the insulation after the input of DC voltage or 3000 volts of AC voltage for a specified period of time. In addition, when the present invention is applied in different technical fields, "insulation" will have different definitions.

The metal layer 130 is in thermal contact with the first insulating and heat-conducting layer 120 , and the metal layer 130 is interposed between the first insulating and heat-conducting layer 120 and the casing 140 . The area and position of the metal layer 130 combined with the first insulating and heat-conducting layer 120 can be appropriately adjusted depending on the heat dissipation requirements of the electronic device 100 or safety regulations. In other words, the coverage area of the first insulating and heat-conducting layer 120 and the metal layer 130 is not necessarily the same. equivalent. As shown in FIG. 1 and FIG. 3 , due to the safety requirements of the power adapter, the metal layer 130 needs to shrink a distance along its periphery. Alternatively, the metal layer 130 may be used only in localized areas.

The material of the metal layer 130 can be aluminum, iron, copper or other metals. In terms of technology, one of the implementation aspects is to first shape the metal layer 130 according to the requirements of heat dissipation or housing shape, and then place the metal layer 130 in a mold, and then place the first insulating and heat-conducting layer 120 according to the metal layer The shape 130 or the shape to be covered is combined with the metal layer 130 to form the heat dissipation structure 200 .

In this embodiment and some other embodiments, the first insulating and heat-conducting layer 120 is combined with the metal layer 130 through chemical treatment, especially preferably by chemical bonding, to form a one-piece heat dissipation structure 200, which can as an independent part. Regarding the above-mentioned chemical bonding, the heat dissipation structure 200 further includes a first connector 160, and the first insulating and heat-conducting layer 120 is combined with the metal layer 130 by, for example, coating the first connector 160, wherein the first connector 160 is respectively connected to the metal layer 130. The first insulating and heat-conducting layer 120 is chemically bonded to the metal layer 130, wherein the chemical bonding method can be a reaction method such as crosslinking (crosslink) or vulcanization, and the first linker 160 can be a coupling agent (coupling agent), For example, silane coupling agent (Silane coupling agent), titanate, etc. For example, the first insulating and heat-conducting layer 120 is heat-conducting silica gel, the metal layer 130 is aluminum, and the first connecting material 160 is a silane coupling agent.

The housing 140 has an accommodating space P. In this embodiment, the housing 140 includes a first housing 142 and a second housing 144 . The circuit board 110 is disposed on the first casing 142 . The second housing 144 covers the first housing 142 so as to accommodate the circuit board 110 , these electronic components 115 and the heat dissipation structure 200 in the accommodating space P formed by the first housing 142 and the second housing 144 , wherein the heat dissipation structure 200 covers the circuit board 110 and the electronic components 115 . The casing 140 includes an upper surface 140a, a lower surface 140b, a right surface 140c, a left surface 140d, a power input side surface 140e, and a power output side surface 140f. The power input side surface 140e is opposite to the power output side surface 140f, and the upper surface 140a, the lower surface 140b, the right surface 140c, and the left surface 140d are connected to multiple side edges of the power input side surface 140e and the power output side surface 140f to form an accommodating Space P. The first insulating and heat-conducting layer 120 covers the inner surface of the housing 140 relative to the upper surface 140a, the lower surface 140b, the right surface 140c and the left surface 140d, the power input side surface 140e and the power output side surface 140f, to form a hexahedron structure. Moreover, the first insulating and heat-conducting layer 120 shields part of the voltage input side 112 and part of the voltage output side 114 . The material of the casing 140 is, for example, plastic in this embodiment, but casings of other electronic devices may be made of other suitable materials. In addition, the heat dissipation structure 200 and the housing 140 can be assembled together through a tight fit. In this way, when assembling the electronic device, the operator only needs to insert the heat dissipation structure 200 into the inner surface of the casing to complete the assembly between the heat dissipation structure 200 and the casing 140 . Therefore, this tight-fitting assembled structure can increase the assembly efficiency of the electronic device, thereby shortening the time for manufacturing the electronic device.

The first insulating and heat-conducting layer 120 of the heat dissipation structure 200 may or may not be in contact with the circuit board 110 or/and these electronic components 115 .

The heat dissipation mechanism of the electronic device 100 will be introduced in detail below.

When the electronic device 100 is in operation, the heat generated by the circuit board 110 or the electronic components 115 can be transferred to the first insulating and heat-conducting layer 120 through heat convection or heat conduction. Afterwards, during the process of heat transfer from the first insulating and heat-conducting layer 120 to the metal layer 130 , the heat will diffuse in the first insulating and heat-conducting layer 120 and the metal layer 130 so that the temperature of each part of the heat dissipation structure 200 tends to be consistent.

Afterwards, in the process of transferring heat from the metal layer 130 to the housing 140, since the thermal conductivity of the metal layer 130 is greater than that of the first insulating and heat-conducting layer 120, the speed of heat diffusion in the metal layer 130 is higher than that of the first insulating and heat-conducting layer 120. The speed at which the insulating and thermally conductive layer 120 diffuses. Therefore, compared with the temperature distribution of the surface 126 of the first insulating and heat-conducting layer 120 , the temperature of each part of the surface 136 of the metal layer 130 tends to be more consistent.

The heat is then dissipated from the outer surface 146 of the housing 140 to the ambient environment.

When the heat generated by the circuit board 110 and the electronic components 115 is transferred to the housing 140, since the heat has been uniformly diffused in the first insulating and heat-conducting layer 120 and the metal layer 130 before being transferred to the housing 140, it is relatively Compared with the heat dissipation structure in the prior art (the metal heat sink and the insulating sheet are placed in the casing), the temperature distribution of each part of the outer surface 146 of the casing 140 in this embodiment is more uniform. Therefore, the heat dissipation structure 200 of this embodiment can greatly reduce the temperature of hot spots generated on the outer surface 146 of the housing 140 , so that the electronic device 100 of this embodiment has better heat dissipation efficiency.

FIG. 4 is a graph of the hot spot temperature (which is the temperature difference between one and the ambient temperature) of the housing of the electronic device using the conventional heat dissipation structure and the electronic device 100 of the present embodiment. FIG. 5 is a graph showing the temperature curves of the electronic device with the conventional heat dissipation structure and the electronic components in the electronic device 100 of this embodiment. The condition parameters corresponding to FIG. 4 and FIG. 5 are that the thickness of the metal layer 130 is 0.3 mm, and the thickness of the insulating and heat-conducting layer 120 is 0.45 mm. It can be seen from FIG. 4 that the temperature at the hottest point of the housing of the electronic device using the existing heat dissipation structure is 44 degrees Celsius, while the temperature at the hottest point of the housing 140 of the electronic device 100 of the present embodiment (on the upper surface 140a) Only 37.9 degrees Celsius, the difference between the two is 6.1 degrees. The temperature of the hot spot on the lower surface 140b of the casing 140 of the electronic device 100 is also 5 degrees Celsius lower than the temperature of the hot spot on the lower surface of the casing of the existing electronic device. These two surfaces are places that users often touch easily. Therefore, the reduction of the hot spot temperature is very important. Furthermore, even if the above-mentioned existing heat dissipation structure is added to the multi-layer stack of metal thick sheets (at least 0.5mm) or the way of adding copper and aluminum foil (below 0.5mm) to the inside of the casing is used to improve the temperature of the casing, the The maximum decrease in housing temperature is only to the extent of approximately 3° C. and additional costs are necessary. It can be seen that the electronic device 100 of this embodiment can reduce the temperature of the hot spot on the casing more effectively and economically.

In addition, compared with the overall thickness of the electronic device 100 assembled with the above-mentioned existing heat dissipation structure, the heat dissipation structure 200 of this embodiment has a thinner thickness, so when the size specification of the electronic device is fixed, the electronic device 100 The interior has a larger accommodation space available for use.

It can be seen from FIG. 5 that the temperature of each electronic component in the electronic device 100 of this embodiment is lower than the temperature of each electronic component in the electronic device using the conventional heat dissipation structure, which means that the temperature of each electronic component itself is lowered. Among them, as far as the hottest electronic component (Code D052) is concerned, the temperature drop is 7°C, and the temperature drop of the second hottest electronic component (Code D050) can be as high as 12°C. It can be seen that, compared with the existing electronic devices, the electronic device 100 of this embodiment can indeed effectively reduce the temperature of the electronic components inside it.

Moreover, when the material of the first insulating and heat-conducting layer 120 of the heat dissipation structure 200 is a soft material such as heat-conducting silica gel or heat-conducting rubber, since the metal layer 130 can provide sufficient rigidity, the heat dissipation structure 200 can maintain a fixed shape. Therefore, before assembling the electronic device 100 , the manufacturer can manufacture and reserve the one-piece heat dissipation structure 200 in advance. In the process of assembling the electronic device 100 , the manufacturer can regard the one-piece heat dissipation structure 200 as a component, and put the heat dissipation structure 200 into the casing 140 by manpower or mechanized equipment. Therefore, the heat dissipating structure 200 of this embodiment can effectively reduce the process and assembly man-hours and reduce the number of workers (about 10%).

FIG. 6 is a schematic cross-sectional view of a modified electronic device derived from the first embodiment of the present invention. Please refer to FIG. 6 , where elements with the same numbers as those in the above embodiments represent the same or similar elements. The difference between the electronic device 101 of this embodiment and the embodiment of FIG. 1 is that the metal layer 130 of the heat dissipation structure 201 is electrically connected to the circuit board 110, so that the circuit board 110 is grounded, so as to prevent electromagnetic interference (Electromagnetic Interference) of electronic parts. , EMI). More specifically, the first insulating and heat-conducting layer 120' has an opening 128, wherein the opening 128 exposes a portion of the metal layer 130 of the heat dissipation structure 201. The circuit board 110' includes a body 116 and a ground contact 118. The body 116 includes a ground layer, and the ground contact 118 is electrically connected to the ground layer of the body 116 . The ground contact 118 is electrically connected to the metal layer 130 exposed by the opening 128 via, for example, an elastic conductive sheet 300 .

FIG. 7 is a schematic cross-sectional view of an electronic device according to a second embodiment of the present invention. Please refer to FIG. 7 , where elements with the same numbers as those in the above embodiments represent the same or similar elements. The difference between the electronic device 102 of this embodiment and the embodiment of FIG. 1 is that the heat dissipation structure 202 includes a second insulating and heat-conducting layer 170 in addition to the first insulating and heat-conducting layer 120 and the metal layer 130 . Preferably, the second insulating and heat-conducting layer 170 and the first insulating and heat-conducting layer 120 cover the metal layer 130 together, which can avoid safety issues. In other words, the metal layer 130 is interposed between the first insulating and heat-conducting layer 120 and the second insulating and heat-conducting layer 170 . The thermal conductivity of the second insulating and heat-conducting layer 170 is greater than 0.5 W/m·K, and its material can be, for example, heat-conducting rubber or heat-conducting silicone. Since the second insulating and heat-conducting layer 170 of this embodiment is a soft material and has plasticity, compared with the metal layer 130 of the embodiment of FIG. 1 , the contact between the second insulating and heat-conducting layer 170 and the housing 140 is better. The heat generated by the electronic component 115 can be transferred to the surface of the housing 140 more quickly, so that the temperature of the electronic component 115 can be lowered more quickly. In other words, the heat dissipating structure of this embodiment can deal with the high heat electronic components 115 in the electronic device 100 that need to quickly transfer heat to the surface of the casing 140 to cool down.

The second insulating and heat-conducting layer 170 is preferably combined with the metal layer 130 through chemical bonding, and preferably together with the first insulating and heat-conducting layer 120 completely covers the metal layer 130 to form a one-piece heat dissipation structure 202 . Regarding the aforementioned chemical bonding, the heat dissipation structure 202 includes a second linker 180 . The second insulating and heat-conducting layer 170 is in thermal contact with the metal layer 130 through the second bonding material 180 , wherein the chemical bonding method of the second connecting material 180 with the second insulating and heat-conducting layer 170 and with the metal layer 130 is similar to that of the first embodiment. The example of how the first connecting object 160 is bonded to the first insulating and heat-conducting layer 120 and to the metal layer 130 will not be repeated here.

FIG. 8 is an exploded schematic diagram of another electronic device derived from the first embodiment of the present invention. FIG. 9 is a schematic cross-sectional view of the electronic device of FIG. 8 . Please refer to FIG. 8 and FIG. 9 , wherein elements with the same reference numerals as in the above embodiments represent the same or similar elements. The heat dissipation structure 203 of the electronic device 103 further includes a bump 129a. The bump 129 a extends from the first insulating and heat-conducting layer 120 to the accommodating space P, and is in thermal contact with at least one electronic component 115 , wherein the thermal conductivity of the bump 129 a is greater than 0.5 W/m·K. Therefore, the heat generated by the electronic component 115 can be transferred to the bump 129 a through heat conduction. Then the bump 129 a conducts heat to the first insulating and heat-conducting layer 120 . In this way, compared with the embodiment of FIG. 1 , the heat generated by the electronic component 150 of the electronic device 103 can be transferred to the first insulating and heat-conducting layer 120 more quickly. The material of the bump 129 a can be the same as or different from that of the first insulating and heat-conducting layer 120 , and preferably, the bump 129 a is formed on the first insulating and heat-conducting layer 120 through integral molding. The bump 129a can also be assembled on the first insulating and heat-conducting layer 120 by means of assembly.

In this embodiment, the heat dissipation structure 203 may also include a bump 129b in addition to the bump 129a. The bump 129b extends from the first insulating and heat-conducting layer 120 to the accommodating space P, and is in thermal contact with the circuit board 110, wherein the thermal conductivity of the bump 129b, its connection with the circuit board 110, and its function are similar to those of the bump 129a. Let me repeat. In addition, the bump 129 b can also be used as a supporter to support or position the circuit board 110 , which can be made of a non-thermal conductive material and integrally formed with the first insulating and heat-conducting layer. The positions of the bumps 129 a and 129 b can be appropriately configured according to different heat dissipation requirements of the electronic device 100 .

FIG. 10 is a schematic cross-sectional view of an electronic device according to a third embodiment of the present invention. Please refer to FIG. 10 , where elements with the same numbers as those in the above embodiments represent the same or similar elements. The difference between this embodiment and the embodiment shown in FIG. 7 is that in this embodiment, the second insulating and heat-conducting layer 170 is combined with the casing 140 through a third connecting object 190, wherein the third connecting object 190 They are respectively chemically bonded to the second insulating and heat-conducting layer 170 and to the casing 140 . The above-mentioned chemical bonding method is similar to the bonding method between the first connecting object 160 and the first insulating and heat-conducting layer 120 and the metal layer 130 in the first embodiment, and will not be repeated here.

FIG. 11 is a schematic cross-sectional view of an electronic device according to a fourth embodiment of the present invention. Please refer to FIG. 11 , where elements with the same numbers as those in the above embodiments represent the same or similar elements. The difference between this embodiment and the embodiment shown in FIG. 3 is that in this embodiment, the heat dissipation structure 204 further includes a fourth connecting object, and the metal layer 130 is connected to the casing 140 through the fourth connecting object 195. combination, wherein the fourth linker 195 is chemically bonded to the metal layer 130 and the shell 140 respectively. The above-mentioned chemical bonding method is similar to the bonding method between the first connecting object 160 and the first insulating and heat-conducting layer 120 and the metal layer 130 in the first embodiment, and will not be repeated here.

FIG. 12 is a schematic cross-sectional view of another variation of the electronic device derived from the first embodiment of the present invention. Please refer to FIG. 12 , where elements with the same numbers as those in the above embodiments represent the same or similar elements. The difference between the electronic device 106 of this embodiment and the embodiment shown in FIG. 3 is that the housing 140' further includes at least one protrusion 148 located at the second housing 144' and the first housing 142', preferably by The inner side of the housing is injection molded to make local contact between the heat dissipation structure 200 and the housing 140 ′. More specifically, in this embodiment, the protrusion 148 protrudes toward the accommodating space P of the casing and contacts the metal layer 130 of the heat dissipation structure 200, so that there is a gap between the heat dissipation structure 200 and the casing 140'. The gap increases the thermal resistance between the heat dissipation structure 200 and the housing 140', so as to slow down the rate at which heat is directly transferred from the heat dissipation structure 200 to the surface of the housing 140', so that the heat energy can be conducted and diffused more uniformly in the heat dissipation structure. This further reduces the temperature of hot spots on the housing surface. In addition, the metal layer 130 can also have at least one protrusion 134 . The protrusion 134 can be produced, for example, by stamping and protrudes from the metal layer 130 toward the housing 140'. The protrusion 134 abuts against the casing 140' so that there is a gap between the casing 140' and the heat dissipation structure 200. The positions of the protrusions 148 and the protrusions 134 can be properly configured according to different heat dissipation requirements of the electronic device 100 . In addition, these protrusions 148 and protrusions 134 can also be applied to the second embodiment of FIG. There is a gap between them.

Regarding the combination of the first insulating and thermally conductive layer 120 and the metal layer 130 of the heat dissipation structure 200, in addition to the above-mentioned chemical bonding method, other chemical or physical bonding methods such as lamination or other adhesion promoters can also be used to make the first The insulating heat conducting layer 120 is in thermal contact with the metal layer 130 . In addition, other specific examples are listed below.

Please refer to FIG. 13 , which is a schematic cross-sectional view of an electronic device according to a fifth embodiment of the present invention, which uses the component structure of the first embodiment as an example for illustration. The first insulating and heat-conducting layer 120 ″ in the electronic device 107 may also have a joint portion 122 . The joint portion 122 protrudes from the first insulating and heat-conducting layer 120 ″ toward the casing 140 . The bonding portion 122 passes through a hole 136 in the metal layer 130' from one side of the metal layer 130' and protrudes from the other side of the metal layer 130'. And the joint part 122 of the joint part 122 protruding from the other side of the metal layer 130' extends toward the outside of the hole to form, for example, a protrusion, so as to combine and fix the metal layer 130' to the first insulating and heat-conducting layer 120", forming a one-piece The heat dissipation structure 205. When making the heat dissipation structure 205, the manufacturer, for example, can first punch a metal sheet to form the hole 136. After that, the insulating heat conducting sheet is placed on the metal sheet. Then use the mold to conduct heat on the metal sheet and the insulation The sheet is heated and pressed, so that part of the insulating and heat-conducting sheet passes through the hole 136 to form the first insulating and heat-conducting layer 120 ″ having the bonding portion 122 and the metal layer 130 ′.

Please refer to FIG. 14 , which is a schematic cross-sectional view of an electronic device according to a sixth embodiment of the present invention, which is illustrated by taking the component structure of the first embodiment as an example. The first insulating and heat-conducting layer 120 in the electronic device 108 can also be thermally contacted with the metal layer 130 through an insulating fastener 400 , such as a pair of plastic screws 402 and a plastic nut 404 .

Furthermore, in the present invention, since the first insulating and heat-conducting layer or/and the second insulating and heat-conducting layer can be soft materials such as heat-conducting rubber or heat-conducting silica gel, when the first insulating and heat-conducting layer or/and the second insulating and heat-conducting layer When the layer is combined with the metal layer, the first insulating and heat-conducting layer or/and the second insulating and heat-conducting layer can effectively absorb the heat generated between the first insulating and heat-conducting layer or/and the second insulating and heat-conducting layer and the metal layer due to the difference in thermal expansion coefficient between each other. Structural variation, such as warping or brittle cracking, etc., the same situation also applies to the structural variation caused by the difference in thermal expansion coefficient between the insulating heat-conducting layer and the metal layer and the shell. Therefore, the electronic device using the heat dissipation structure of the present invention can pass the test of high and low temperature thermal shock (Thermal Shock Test). In addition, the soft first insulating and heat-conducting layer or/and the second insulating and heat-conducting layer can also effectively absorb the noise generated by the vibration of the internal components of the electronic device. test.

It can be seen from the descriptions of the above-mentioned embodiments and various derived variations that the application of the heat dissipation structure of the present invention to electronic devices can not only make the temperature distribution on the surface of the casing more uniform and effectively reduce the temperature of the casing compared to the prior art. The temperature of the hot spot on the surface of the body, and effectively reduce the process, assembly man-hours and the number of operators in the process assembly, so as to achieve the advantages of reducing costs and improving production yield. At the same time, it not only meets the insulation requirements of safety regulations, but also meets the testing requirements of various agencies. Furthermore, the heat dissipation structure of the present invention can provide extremely flexible design applications, that is, depending on the various heat dissipation requirements of the electronic device, the temperature of the surface hot spots of the casing or the temperature of the internal high-heat electronic components can be adjusted to optimize the casing and heat dissipation structure. matching design.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (16)

1. An electronic device, characterized in that, comprising: a circuit board; A plurality of electronic components are electrically arranged on the circuit board; A heat dissipation structure, comprising: A first insulating and heat-conducting layer covering the circuit board or/and the electronic components, and the thermal conductivity of the first insulating and heat-conducting layer is greater than 0.5W/m·K; and a metal layer bonded to the first insulating and thermally conductive layer in thermal contact; and A casing has an accommodating space, the circuit board, the electronic components and the heat dissipation structure are accommodated in the accommodating space, and the metal layer is interposed between the casing and the first insulating and heat-conducting layer. 2. The electronic device according to claim 1, wherein the first insulating and heat-conducting layer and the metal layer are chemically bonded to form the one-piece heat dissipation structure, and the heat dissipation structure further includes a first connecting object , located between the first insulating and heat-conducting layer and the metal layer, and the first linker is chemically bonded to the first insulating and heat-conducting layer and the metal layer respectively. 3. The electronic device according to claim 1, wherein the heat dissipation structure further comprises a second insulating and heat-conducting layer, which is in thermal contact with the metal layer and has a thermal conductivity greater than 0.5W/m·K, and the metal layer between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer. 4. The electronic device according to claim 3, wherein the second insulating and heat-conducting layer is chemically bonded to the metal layer, and together with the metal layer and the first insulating and heat-conducting layer form a one-piece In a heat dissipation structure, the second insulation and heat conduction layer and the first insulation and heat conduction layer together completely cover the metal layer, and the heat dissipation structure further includes a second connector located between the second insulation and heat conduction layer and the metal layer, And the second connecting material is chemically bonded to the second insulating and heat-conducting layer and the metal layer respectively. 5. The electronic device according to claim 4, further comprising a third connection, located between the second insulating and heat-conducting layer and the housing, and the third connection is respectively connected to the second insulating layer. The heat conduction layer and the shell are chemically bonded to fix the heat dissipation structure on the shell. 6 . The electronic device according to claim 5 , wherein the heat dissipation structure further comprises a bump extending from the first insulating and heat-conducting layer to the accommodating space, and the bump is connected to one of the electronic components. one of or contacts the circuit board. 7. The electronic device according to claim 2, wherein the heat dissipation structure further comprises a fourth connection, located between the metal layer and the housing, and the fourth connection is respectively connected to the metal layer and the metal layer. The shell is chemically bonded to fix the heat dissipation structure on the shell. 8. The electronic device according to claim 1, wherein the first insulating and heat-conducting layer further comprises a bonding portion, the metal layer includes a hole, and the bonding portion penetrates the hole from one side of the metal layer and protrudes On the other side of the metal layer, and the joint part of the joint protruding from the other side of the metal layer extends toward the outside of the hole, so that the metal layer is combined and fixed on the first insulating and heat-conducting layer to form a The heat dissipation structure of the formula. 9 . The electronic device according to claim 1 , wherein the heat dissipation structure further comprises an insulating clip, and the first insulating and heat-conducting layer is combined with the metal layer to form the one-piece heat dissipation structure. 10. The electronic device according to claim 1, wherein the electronic device is a power adapter, and the housing has an upper surface, a lower surface, a left surface, a right surface, and a power input side surface And a power output side surface, the power input side surface is opposite to the power output side surface, and the upper surface, the lower surface, the left surface and the right surface connect the power input side surface and the power output side surface. a side edge to form the accommodating space, the circuit board includes a voltage input side and a voltage output side, the voltage input side is adjacent to the surface of the power input side, the voltage output side is adjacent to the surface of the power output side, the first The insulating and heat-conducting layer covers the inner surface corresponding to the upper surface, the lower surface, the left surface, the right surface, the power input side surface and the power output side surface of the housing, and the first insulating and heat-conducting layer shields part The voltage input side and part of the voltage output side. 11. The electronic device according to claim 1 or 3, wherein the casing further comprises a protrusion protruding toward the heat dissipation structure, and the protrusion abuts against the heat dissipation structure so that there is a gap between the casing and the heat dissipation structure. has a gap. 12. The electronic device according to claim 1, wherein the metal layer has a protrusion, the protrusion protrudes from the metal layer toward the housing, and the protrusion abuts against the housing so that the housing and the heat dissipation There is a gap between the structures. 13. A heat dissipation structure, characterized in that it comprises: A first insulating and heat-conducting layer, the thermal conductivity of the first insulating and heat-conducting layer is greater than 0.5W/m·K; and A metal layer is in thermal contact with the first insulating and heat-conducting layer, and chemically bonded with the first insulating and heat-conducting layer. 14. The heat dissipating structure according to claim 13, further comprising a first connector located between the first insulating heat-conducting layer and the metal layer, and the first connector is respectively connected to the first insulating layer. The thermally conductive layer and the metal layer are chemically bonded. 15. The heat dissipation structure according to claim 13, further comprising a second insulating and heat-conducting layer with a thermal conductivity greater than 0.5 W/m·K, in thermal contact with the metal layer, and chemically bonded with the metal layer The metal layer is interposed between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, and the second insulating and heat-conducting layer together with the metal layer and the first insulating and heat-conducting layer form a one-piece heat dissipation structure. 16. The heat dissipation structure according to claim 15, wherein the second insulating and heat-conducting layer together with the first insulating and heat-conducting layer completely cover the metal layer, and the heat dissipation structure further comprises a second connecting object, the The second insulating and heat-conducting layer is connected between the metal layers, and the second connecting material is chemically bonded to the second insulating and heat-conducting layer and the metal layer respectively.

Images