CN103220896A - Heat dissipation structure and electronic device with same - Google Patents
Heat dissipation structure and electronic device with same Download PDFInfo
- Publication number
- CN103220896A CN103220896A CN2012100243076A CN201210024307A CN103220896A CN 103220896 A CN103220896 A CN 103220896A CN 2012100243076 A CN2012100243076 A CN 2012100243076A CN 201210024307 A CN201210024307 A CN 201210024307A CN 103220896 A CN103220896 A CN 103220896A
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- insulating heat
- metal level
- radiator structure
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Provided are a heat dissipation structure and an electronic device with the same. The electronic device comprises a circuit board, a plurality of electronic elements, the heat dissipation structure and a shell. The electronic elements are electrically arranged on the circuit board, and the heat dissipation structure comprises a first insulation heat-conductive layer and a metal layer. The first insulation heat-conductive layer wraps the circuit board or/and the electronic elements. The coefficient of thermal conduction of the first insulation heat-conductive layer is larger than 0.5W/m.K, and the metal layer is combined and heat-contacted with the first insulation heat-conductive layer. An accommodating space is arranged in the shell, and the circuit board, the electronic elements and the heat dissipation structure are accommodated in the accommodating space. Moreover, the metal layer is arranged between the shell and the first insulation heat-conductive layer.
Description
Technical field
The present invention relates to a kind of radiator structure, particularly a kind of have and can and make the radiator structure of inner high thermoelectric elements fast cooling and have the electronic installation of this radiator structure Temperature Distribution (temperature distribution) homogenizing on the surface of electronic installation.
Background technology
Indispensable electronic installation when power-supply adapter (adapter) and power supply unit (power supply) are various electric equipment runnings.These electronic installations all have many electronic components on its inner circuit board, wherein these electronic components comprise that not only high heating power element (for example transformer, metal oxide semiconductor field effect transistor, diode, inductance etc.) also comprises low heating power element (for example capacitor or resistor).When electronic installation operated, if the heat that these electronic components produce can't be removed the external world effectively, then heat just can accumulate in the electronic installation and then make these temperature of electronic component rise.If these temperature of electronic component are too high, just electronic component can break down even burn.
With the power-supply adapter is example.Power-supply adapter is the employed voltage of electric equipment in order to the voltage transitions with external power source, and wherein this electric equipment for example is a portable computer.Yet, integrated along with electronic component, the volume of power-supply adapter also dwindles synchronously, follow and give birth to be because of the heat dissipation problem that its volume-diminished the is derived shape of healing serious.
For example, the material of the housing of traditional power-supply adapter is a plastic cement.Because plastic cement material is unfavorable for the diffusion of heat, therefore when the heat that electronic component produced on the circuit board is passed to housing, the temperature corresponding to the zone of high heating power element of housing tends to be higher than other regional temperature of housing.Yet this high temperature that is present in the specific region of housing but may cause user's discomfort, even scalds the user.In addition, this because heat concentrates on the radiating efficiency that the phenomenon of the specific region of housing also can reduce housing.
Moreover, along with the trend of the miniaturization of electronic installation, all suitable narrow and small in the inner space of electronic installation.Under such narrow space, after the shared space of the electronic component of deduction electronic installation inside, the space that can be used for of electronic installation disposed radiator structure remains little.So the difficulty of designer on the design radiator structure also can be caused in the inner space of narrow and small electronic installation.
Based on above-mentioned, how to provide a kind of each regional temperature of the surface of shell of electronic installation of impelling to reach unanimity and the quick unlikely again inside usage space that occupies too many electronic installation of radiator structure the real problem that presses for solution for the correlative technology field person at present rapidly with high thermoelectric elements cooling.
Summary of the invention
Too high problem of temperature of electronic component and inner usage space limited in the unequal and electronic installation for the Temperature Distribution of the housing that solves above-mentioned electronic installation, the present invention proposes radiator structure that a kind of efficiently radiates heat and visual radiating requirements elasticity flexible design use and the electronic installation with this radiator structure.
In one embodiment, above-mentioned radiator structure comprises one first an insulating heat-conductive layer and a metal level.The coefficient of heat conduction of the first insulating heat-conductive layer is greater than 0.5W/mK.Metal level combines with thermo-contact with the first insulating heat-conductive layer.Metal level combines with the first insulating heat-conductive stratification bond.In addition, in another embodiment, radiator structure can also comprise one second insulating heat-conductive layer.This insulating heat-conductive layer combines with thermo-contact with metal level, and makes metal level between the first insulating heat-conductive layer and the second insulating heat-conductive layer, and wherein the coefficient of heat conduction of this insulating heat-conductive layer is greater than 0.5W/mK.
In one embodiment, above-mentioned electronic installation is that above-mentioned radiator structure is packed in the housing of electronic installation, with a circuit board that removes electronic installation and the heat that a plurality of electronic installation was produced that electrically connects with circuit board, and then the radiating efficiency of increase electronic installation.In this electronic installation, the metal level of radiator structure is between the housing and the first insulating heat-conductive layer, and first insulating heat-conductive layer coating circuit plate or these electronic components.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the constitutional diagram according to the electronic installation of first embodiment of the invention;
Fig. 2 is the exploded view of the electronic installation of Fig. 1;
The cutaway view that Fig. 3 is drawn for the hatching 3-3 along Fig. 1;
Fig. 4 for the housing hot(test)-spot temperature of the electronic installation that uses existing radiator structure and the electronic installation of present embodiment (its be for one and the difference temperature of ambient temperature) curve chart;
Fig. 5 is the electronic installation of existing radiator structure and each interior temperature of electronic component curve chart of electronic installation of present embodiment;
The cross-sectional schematic of the electronic installation of the variation aspect that Fig. 6 derives for the first embodiment of the present invention;
Fig. 7 is the cross-sectional schematic of the electronic installation of second embodiment of the invention;
The decomposing schematic representation of the electronic installation of another variation aspect that Fig. 8 derives for first embodiment of the invention;
Fig. 9 is the cross-sectional schematic of the electronic installation of Fig. 8;
Figure 10 is the cross-sectional schematic of the electronic installation of third embodiment of the invention;
Figure 11 is the cross-sectional schematic of the electronic installation of fourth embodiment of the invention;
The cross-sectional schematic of the electronic installation of another variation aspect that Figure 12 derives for first embodiment of the invention;
Figure 13 is the cross-sectional schematic of the electronic installation of fifth embodiment of the invention;
Figure 14 is the cross-sectional schematic of the electronic installation of sixth embodiment of the invention.
Wherein, Reference numeral
100 electronic installations
101 electronic installations
102 electronic installations
103 electronic installations
104 electronic installations
105 electronic installations
106 electronic installations
110 circuit boards
112 voltage input sides
114 voltage outlet sides
115 electronic components
116 bodies
118 ground contacts
120 first insulating heat-conductive layers
120 ' the first insulating heat-conductive layer
122 firsts
124 second portions
The 129a projection
The 129b projection
122 firsts
124 second portions
126 surfaces
128 openings
130 metal levels
130 ' metal level
132 surfaces
134 projections
136 holes
140 housings
The 140a upper surface
The 140b lower surface
The right surface of 140c
The 140d left surface
140e primary side surface
140f secondary side surface
140 ' housing
142 first housings
142 ' first housing
144 second housings
144 ' second housing
146 outer surfaces
The 148a protuberance
The 148b protuberance
The 150a electronic component
The 150b electronic component
160 first concatenators
170 second insulating heat-conductive layers
180 second concatenators
190 the 3rd concatenators
195 the 4th concatenators
200 radiator structures
201 radiator structures
202 radiator structures
203 radiator structures
204 radiator structures
205 radiator structures
300 leads
400 insulation fasteners
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
This specification described " thermo-contact " is meant the combination between the two articles, its can make heat in heat conducting mode from an object transfer to another object.
In addition, this specification described " coating " is meant that a coating is local or all is surrounded on around the object that is coated, and this coating can contact or not contact the object that is coated.
Fig. 1 is the constitutional diagram according to the electronic installation of first embodiment of the invention; Fig. 2 is the exploded view of the electronic installation of Fig. 1; The cutaway view that Fig. 3 is drawn for the hatching 3-3 along Fig. 1.Please jointly referring to figs. 1 through Fig. 3, for the convenience on illustrating, the electronic installation 100 of first embodiment is with power-supply adapter (adapter) explanation as an example.Yet present embodiment is not to attempt the kind of electronic installation 100 is defined as power-supply adapter.In other embodiment, electronic installation 100 also can be power supply unit (power supply) or the electronic product of other kinds, for example USB digital television stick.Electronic installation 100 comprises that a circuit board 110, a plurality of electronic component 115 are (wherein because succinct cause, only draw an electronic component as representative explanation), a radiator structure 200 and a housing 140, wherein radiator structure 200 comprises one first an insulating heat-conductive layer 120 and a metal level 130, and the first insulating heat-conductive layer 120 and metal level 130 is through suitable processing and in conjunction with to constitute radiator structure 200.
These electronic components 115 electrically are arranged at circuit board 110.In other words, these electronic components 115 are to be electrically connected at circuit board 110, and can be arranged on above or below the circuit board 110.Electronic component 115 for example is metal oxide semiconductor field effect transistor, diode, inductance, capacitor, resistor or other electronic components.In present embodiment and other embodiment of the present invention, power supply input element 150a and power supply output element 150b can be respectively plug, socket and power line etc. one of them.For ease of explanation, following a plurality of embodiment are to be socket (meaning is that socket can an external power-line plug be imported civil power) with power supply input element 150a, and electronic component 150b is power line (meaning promptly can be electrically connected to an electronic equipment, for example portable computer by power line) explanation as an example.In addition, position based on power supply input element 150a and power supply output element 150b, circuit board 110 can be distinguished a voltage input side (or being called primary side) 112 and one voltage outlet side (or being called secondary side) 114, wherein voltage input side 112 is meant a side that is electrically connected at power supply input element 150a of circuit board 110, and voltage outlet side 114 is meant the opposite side that is electrically connected at power supply output element 150b of circuit board 110.
The first insulating heat-conductive layer, 120 coating circuit plate 110 or these electronic components 115 of radiator structure 200.In other embodiment of present embodiment and part, the first insulating heat-conductive layer 120 comprises a first 122 and a second portion 124.These electronic components 115 on first 122 and second portion 124 common coating circuit plates 110 and the circuit board 110.In more detail, first 122 and second portion 124 common formation one hexahedron structures, and in the both ends open place of this structure, first 122 and second portion 124 only expose power supply input element 150a and power supply output element 150b.In other words, the first insulating heat-conductive layer 120 that constituted of first 122 and second portion second portion 124 has covered the voltage input side 112 of part and the voltage outlet side 114 of part.Yet, as of the definition of this specification for " coating " this speech, present embodiment is not in order to limit the mode of the first insulating heat-conductive layer, 120 coating circuit plate 110 of the present invention and electronic component 115, in other embodiment of part, the first insulating heat-conductive layer 120 is the regional area of coating circuit plate 110 only, or the electronic component 115 of covered section, the perhaps electronic component 115 of the regional area of coating circuit plate 110 and part.Moreover in other embodiments, the first insulating heat-conductive layer 120 can also coat circuit board 110 or these electronic components 115 fully.
The coefficient of heat conduction of the first insulating heat-conductive layer 120 is greater than 0.5W/mK, and is preferably flexible material, and in the present embodiment, the material of the first insulating heat-conductive layer 120 is for example heat conductive silica gel or heat conductive rubber, and other materials that are suitable for also can.In addition, so-called " insulation " is meant a kind of character of object, because the electronic installation 100 of present embodiment is to illustrate with power-supply adapter, so this technical field its in Hi-Pot test, after continuing one section official hour under 4242 volts direct voltages or the input of 3000 volt AC voltages, as long as the situation of naked collapse takes place, then this object is insulation.In addition, when the present invention was used in the different technical fields, " insulation " had different definition.
The material of metal level 130 can be aluminium, iron, copper or other metal.On technology, an enforcement aspect wherein is can be earlier with the demand moulding of metal level 130 according to heat radiation or hull shape etc., put metal level 130 then in a mould, again the first insulating heat-conductive layer 120 is gone out radiator structure 200 according to shape and the metal level 130 be combined into types that metal level 130 shapes or institute's desire coat.
In other embodiment of present embodiment and part, the first insulating heat-conductive layer 120 is to combine with metal level 130 via chemical treatment, is preferably the mode with the chemical bonded refractory combination especially, to form the radiator structure 200 of single type, can be used as an independently part.About above-mentioned chemical bonded refractory combination, radiator structure 200 more comprises one first concatenator 160, the first insulating heat-conductive layer 120 is to combine with metal level 130 via for example applying first concatenator 160, wherein first concatenator 160 respectively with the first insulating heat-conductive layer 120 and with metal level 130 chemical bonded refractories, wherein the mode of chemical bonded refractory can be reactive modes such as for example crosslinked (crosslink) or sulfuration, and first concatenator 160 can be a kind of coupling agent (coupling agent), for example silane coupling agent (Silane coupling agent), titanate esters etc.For example, the first insulating heat-conductive layer 120 is heat conductive silica gels, and metal level 130 is an aluminium, and this first concatenator 160 is silane coupling agents.
Housing 140 has an accommodation space P.In the present embodiment, housing 140 comprises one first housing 142 and one second housing 144.Circuit board 110 is disposed on first housing 142.Second housing 144 covers on first housing 142, so that circuit board 110, these electronic components 115 and radiator structure 200 are contained within the accommodation space P that first housing 142 and second housing 144 constituted, wherein radiator structure 200 coating circuit plates 110 and these electronic components 115.Housing 140 comprises a upper surface 140a, a lower surface 140b, a right surperficial 140c, a left surface 140d, power supply input side surface 140e and power supply outlet side surface 140f.Power supply input side surface 140e is with respect to the surperficial 140f of power supply outlet side, and upper surface 140a, lower surface 140b, right surperficial 140c and left surface 140d connect a plurality of lateral margins of power supply input side surface 140e and power supply outlet side surface 140f to form accommodation space P.And the inner surface with respect to upper surface 140a, lower surface 140b, right surperficial 140c and left surface 140d, power supply input side surface 140e and power supply outlet side surface 140f of the first insulating heat-conductive layer, 120 covering shell 140, to form a hexahedral structure.And, the voltage outlet side 114 of the voltage input side 112 of the first insulating heat-conductive layer, 120 shaded portions and part.The material of housing 140 is for example to be plastic cement in the present embodiment, but the housing of other electronic installations can be the material that other are suitable for.In addition, can fit together via friction tight mode between radiator structure 200 and the housing 140.Thus, when assembling electronic device, the operator only needs radiator structure 200 is filled in the medial surface of housing, can finish the assembling between radiator structure 200 and the housing 140.So this structure that fits together via friction tight mode can increase the packaging efficiency of electronic installation, and then shorten the time of making electronic installation.
The first insulating heat-conductive layer 120 of radiator structure 200 can contact or not have contact circuit plate 110 or these electronic components 115.
Below will at length introduce the cooling mechanism of electronic installation 100.
When electronic installation 100 was in operating state, the heat that circuit board 110 or electronic component 115 are produced can be passed to the first insulating heat-conductive layer 120 via thermal convection or heat conducting mode.Afterwards, be passed in the process of metal level 130 from the first insulating heat-conductive layer 120 in heat, heat can spread so that the temperature of the each several part of radiator structure 200 reaches unanimity at the first insulating heat-conductive layer 120 and metal level 130.
Afterwards, be passed in the process of housing 140 by metal level 130 in heat, because the coefficient of heat conduction of metal level 130 is greater than the coefficient of heat conduction of the first insulating heat-conductive layer 120, the speed of heat diffusion in metal level 130 is higher than the speed in 120 diffusion of the first insulating heat-conductive layer.Therefore, compared to the Temperature Distribution on the surface 126 of the first insulating heat-conductive layer 120, the temperature of the various piece on the surface 136 of metal level 130 reaches unanimity more.
Then, heat dissipates to external environment by the outer surface 146 of housing 140.
The heat that is produced at circuit board 110 and electronic component 115 is passed in the process of housing 140, because heat evenly spread at the first insulating heat-conductive layer 120 and metal level 130 earlier before being passed to housing 140, so compared to the radiator structure (metal fin adds that insulating trip is seated in the housing) of prior art, the temperature distribution uniform unanimity of the various piece of the outer surface 146 of the housing 140 of present embodiment.Therefore, the radiator structure 200 of present embodiment can reduce the temperature of the outer surface 146 generation focuses (hot spot) of housing 140 significantly, makes the electronic installation 100 of present embodiment have preferable radiating efficiency.
Fig. 4 for the housing hot(test)-spot temperature of the electronic installation that uses existing radiator structure and the electronic installation 100 of present embodiment (its be for one and the difference temperature of ambient temperature) curve chart.Fig. 5 is each interior temperature of electronic component curve chart of the electronic installation 100 of the electronic installation of existing radiator structure and present embodiment.The pairing conditional parameter of Fig. 4 and Fig. 5 is that the thickness of metal level 130 is 0.3mm, and the thickness of insulating heat-conductive layer 120 is 0.45mm.As shown in Figure 4, temperature at the hottest point of the housing of the electronic installation that uses existing radiator structure is 44 degree Celsius, and the temperature of the hottest point of the housing 140 of the electronic installation 100 of present embodiment (at upper surface 140a) only is 37.9 degree Celsius, and both differ 6.1 degree.And in the hot(test)-spot temperature of the lower surface 140b of the housing 140 of electronic installation 100 also than low 5 degree Celsius of hot(test)-spot temperature of the lower surface of the housing of existing electronic installation, these two places that the surface person of being to use often touches easily are so the reduction of its hot(test)-spot temperature is very important.Moreover, even if with the above-mentioned prior radiating structure multiple-level stack of metal sheet (0.5mm at least) or improve case temperature in the inboard mode that attaches copper aluminium foil (0.5mm below) that increases of housing in addition again, the maximum range of decrease of its case temperature only can only reach and be about 3 ℃ degree and also essential extra increase cost.This shows that the electronic installation 100 of present embodiment can be more effectively and reduced the temperature of the focus on the housing economically.
In addition, be assembled in the integral thickness of electronic installation 100 compared to above-mentioned prior radiating structure, the radiator structure 200 of present embodiment has thin thickness, and therefore under the situation that the dimensions of electronic installation is fixed, it is available that the inside of electronic installation 100 has bigger accommodation space.
As shown in Figure 5, each temperature of electronic component in the electronic installation 100 of present embodiment is all come lowly than each temperature of electronic component in the electronic installation that uses existing radiator structure, represents that each electronic component self-temperature all reduces.Wherein, with regard to the hottest electronic component (numbering D052), the temperature range of decrease is 7 ℃, and the temperature range of decrease of the electronic component of inferior heat (numbering D050) more can be up to 12 ℃.Hence one can see that, and compared to existing electronic installation, the electronic installation 100 of present embodiment can reduce its inner temperature of electronic component really effectively.
Moreover, when the material of the first insulating heat-conductive layer 120 of radiator structure 200 is soft materials such as heat conductive silica gel or heat conductive rubber, because metal level 130 can provide enough rigidity, so radiator structure 200 can be kept fixed shape.So before assembling electronic device 100, the producer can make and lay in the radiator structure 200 of single type in advance.In the process of assembling electronic device 100, it is spare part that the producer can be used as the radiator structure 200 of this single type, gets final product and utilize manpower or mechanized equipment that radiator structure 200 is put in housing 140.So the radiator structure 200 of present embodiment can effectively reduce operation, assembling man-hour and reduce operator number (about 10%).
The cross-sectional schematic of the electronic installation of the variation aspect that Fig. 6 derives for the first embodiment of the present invention.Please refer to Fig. 6, wherein identical the or similar element of the element of label same as the previously described embodiments representative.The electronic installation 101 of present embodiment is with the embodiment difference of Fig. 1, the metal level 130 of radiator structure 201 electrically connects with circuit board 110, so that circuit board 110 ground connection, so that the electromagnetic interference of control electronic component (Electromagnetic Interference, EMI).In more detail, the first insulating heat-conductive layer 120 ' has an opening 128, and its split shed 128 exposes the metal level 130 of the part of radiator structure 201.Circuit board 110 ' comprises a body 116 and a ground contact 118.Body 116 comprises a ground plane, and the ground plane of ground contact 118 and body 116 electrically connects.Ground contact 118 is to electrically connect with the metal level 130 that opening 128 is exposed to the open air via a for example rubber-like conducting strip 300.
Fig. 7 is the cross-sectional schematic of the electronic installation of second embodiment of the invention.Please refer to Fig. 7, wherein identical the or similar element of the element of label same as the previously described embodiments representative.The electronic installation 102 of present embodiment is that with the embodiment difference of Fig. 1 radiator structure 202 also comprises one second insulating heat-conductive layer 170 except comprising the first insulating heat-conductive layer 120 and metal level 130.Preferable, the second insulating heat-conductive layer 170 and the first insulating heat-conductive layer, 120 common covered with metal layer 130 can be avoided the safety problem.In other words, metal level 130 is between the first insulating heat-conductive layer 120 and the second insulating heat-conductive layer 170.The coefficient of heat conduction of the second insulating heat-conductive layer 170 is greater than 0.5W/mK, and its material can for example be heat conductive rubber or heat conductive silica gel.Owing to the second insulating heat-conductive layer 170 of present embodiment is that flexible material has plasticity, be with metal level 130 compared to the embodiment of Fig. 1, the second insulating heat-conductive layer 170 is preferable with the contact of housing 140, the heat that electronic component 115 is produced can be passed to housing 140 surfaces more apace, makes the temperature of electronic component 115 can quicker reduction.In other words, the radiator structure of present embodiment can be handled with the high thermoelectric elements 115 of cooling at needing to transfer heat to housing 140 surfaces fast in the electronic installation 100.
The second insulating heat-conductive layer 170 also is that preferable mode via the chemical bonded refractory combination combines with metal level 130, and preferable and common covered with metal layer 130 fully of the first insulating heat-conductive layer 120 are to form the radiator structure 202 of single type.About above-mentioned chemical bonded refractory combination, radiator structure 202 comprises one second concatenator 180.The second insulating heat-conductive layer 170 is to combine and thermo-contact with metal level 130 via second concatenator 180, wherein second concatenator 180 and the second insulating heat-conductive layer 170 and with the mode of metal level 130 chemical bonded refractories be similar to first concatenator 160 of first embodiment and the first insulating heat-conductive layer 120 and with the bond mode of metal level 130, just repeat no more at this.
The decomposing schematic representation of the electronic installation of another variation aspect that Fig. 8 derives for first embodiment of the invention.Fig. 9 is the cross-sectional schematic of the electronic installation of Fig. 8.Please refer to Fig. 8 and Fig. 9, wherein identical the or similar element of the element of label same as the previously described embodiments representative.The radiator structure 203 of electronic installation 103 also comprises a projection 129a.Projection 129a extends to accommodation space P from the first insulating heat-conductive layer 120, and with at least one electronic component 115 thermo-contacts, wherein the coefficient of heat conduction of projection 129a is greater than 0.5W/mK.Therefore, the heat that produced of electronic component 115 more can transfer heat to projection 129a via heat conducting mode.Then projection 129a conducts heat to the first insulating heat-conductive layer 120 again.Thus, compared to the embodiment of Fig. 1, the heat energy that the electronic component 150 of electronic installation 103 is produced is passed to the first insulating heat-conductive layer 120 enough more quickly.The material of projection 129a can be same or different from the material of the first insulating heat-conductive layer 120, and preferably projection 129a is formed on the first insulating heat-conductive layer 120 via integrally formed mode.Projection 129a is assembled on the first insulating heat-conductive layer 120 via the mode of assembling.
In the present embodiment, radiator structure 203 can also comprise a projection 129b except comprising projection 129a.Projection 129b extends to accommodation space P from the first insulating heat-conductive layer 120, and with circuit board 110 thermo-contacts, wherein the coefficient of heat conduction of projection 129b, all be similar to projection 129a with the connected mode and the function of circuit board 110, repeat no more.In addition, projection 129b also can be used as supporter (supporter), and supporting or locating circuit board 110, it can be a heat-conducting not, and with first the insulating heat-conductive layer is integrally formed makes.The position of projection 129a and projection 129b, the different radiating requirements of visible electronic device 100 are done suitably configuration.
Figure 10 is the cross-sectional schematic of the electronic installation of third embodiment of the invention.Please refer to Figure 10, wherein identical the or similar element of the element of label same as the previously described embodiments representative.The embodiment difference that present embodiment and Fig. 7 illustrated is, in the present embodiment, the second insulating heat-conductive layer 170 is to combine with housing 140 via one the 3rd concatenator 190, wherein the 3rd concatenator 190 respectively with the second insulating heat-conductive layer 170 and with housing 140 chemical bonded refractories.The mode of above-mentioned chemical bonded refractory be similar to first concatenator 160 of first embodiment and the first insulating heat-conductive layer 120 and with the bond mode of metal level 130, just repeat no more at this.
Figure 11 is the cross-sectional schematic of the electronic installation of fourth embodiment of the invention.Please refer to Figure 11, wherein identical the or similar element of the element of label same as the previously described embodiments representative.The embodiment difference that present embodiment and Fig. 3 illustrated is, in the present embodiment, radiator structure 204 also comprises one the 4th concatenator, and metal level 130 is to combine with housing 140 via the 4th concatenator 195, wherein the 4th concatenator 195 respectively with metal level 130 and with housing 140 chemical bonded refractories.The mode of above-mentioned chemical bonded refractory be similar to first concatenator 160 of first embodiment and the first insulating heat-conductive layer 120 and with the bond mode of metal level 130, just repeat no more at this.
The cross-sectional schematic of the electronic installation of another variation aspect that Figure 12 derives for first embodiment of the invention.Please refer to Figure 12, wherein identical the or similar element of the element of label same as the previously described embodiments representative.The embodiment difference that electronic installation 106 and Fig. 3 of present embodiment are illustrated is, housing 140 ' also comprises at least one projection 148 that is positioned at second housing 144 ' and first housing 142 ', preferable can be by the inboard injection molding of housing, make to produce the part between radiator structure 200 and the housing 140 ' and contact.In more detail, in the present embodiment, projection 148 is given prominence to and is contacted with the metal level 130 of radiator structure 200 towards the accommodation space P of housing, so that have a gap between radiator structure 200 and the housing 140 '.The gap increases the thermal resistance between radiator structure 200 and the housing 140 ' by this, be directly conducted to the speed that is passed to housing 140 ' surface from radiator structure 200 to slow down heat, it is more even diffusely that heat energy is conducted in radiator structure, so can further reduce the temperature of the focus (hot spot) of surface of shell.In addition, also can make metal level 130 have at least one projection 134.Projection 134 for example impact style produces and is outstanding towards housing 140 ' from metal level 130.Projection 134 is replaced housing 140 ' so that have a gap between housing 140 ' and the radiator structure 200.The position of projection 148 and projection 134, the different radiating requirements of visible electronic device 100 are done suitably configuration.In addition, these projections 148 and projection 134 also can be applicable among second embodiment of Fig. 7, promptly in housing 140 inboard or the second insulating heat-conductive layer 170 or metal level 130 generation projections, so that have a gap between radiator structure 202 and the housing 140.
The first insulating heat-conductive layer 120 of relevant radiator structure 200 and the combination of metal level 130, except above-mentioned chemical bonded refractory method, also can utilize for example superimposed or other adhesion promoters of the mode of other chemistry or physical bond etc., make the first insulating heat-conductive layer 120 and metal level 130 thermo-contacts.In addition, it is as follows to enumerate other specific embodiment.
Please refer to Figure 13, be the cross-sectional schematic of the electronic installation of fifth embodiment of the invention, its element framework with first embodiment is that example illustrates.The first insulating heat-conductive layer 120 in the electronic installation 107 " can also have a joint portion 122.Joint portion 122 is from the first insulating heat-conductive layer 120 " outstanding towards housing 140.The opposite side that passes through the hole 136 on the metal level 130 ' and protrude in metal level 130 ' is worn in joint portion 122 from a side of metal level 130 '.And the joint portion 122 of the opposite side that protrudes in metal level 130 ' of joint portion 122 is extended outside hole and is formed for example protruded object, so that the first insulating heat-conductive layer 120 is fixed in metal level 130 ' combination ", the radiator structure 205 of formation single type.When making radiator structure 205, the producer for example can carry out punching with a sheet metal earlier, to form hole 136.Afterwards, the insulating heat-conductive sheet is positioned on the sheet metal.Utilize mould that sheet metal and insulating heat-conductive sheet are heated and carry out pressing again,, and then form the first insulating heat-conductive layer 120 with joint portion 122 so that the insulating heat-conductive sheet of part passes hole 136 " and metal level 130 '.
Please refer to Figure 14, be the cross-sectional schematic of the electronic installation of sixth embodiment of the invention, it is that the element framework with first embodiment is that example illustrates.The first insulating heat-conductive layer 120 in the electronic installation 108 also can be by an insulation fastener 400, and for example, a pair of PLASTIC SCREWS 402 and plastic nuts 404 combine and thermo-contact with metal level 130.
Moreover, in the present invention, because the first insulating heat-conductive layer or the second insulating heat-conductive layer can be the soft materials of heat conductive rubber for example or heat conductive silica gel, so, when the first insulating heat-conductive layer or the second insulating heat-conductive layer combine with metal level, the first insulating heat-conductive layer or the second insulating heat-conductive layer can effectively absorb between the first insulating heat-conductive layer or the second insulating heat-conductive layer and the metal level because of the different structure variations that produce of thermal coefficient of expansion each other, for example warpage or embrittlement etc., same situation also are useful in because of the different structure variations that produce of thermal coefficient of expansion between insulating heat-conductive layer and metal level and the housing.Therefore, make of the test of the electronic installation of utilization radiator structure of the present invention by high low temperature thermal shock (Thermal Shock Test).In addition, the first soft insulating heat-conductive layer or the second insulating heat-conductive layer can also effectively absorb electronic installation and produce the noise that vibrations are produced because of inner member, therefore, make the test of the electronic installation of utilization radiator structure of the present invention by (NoiseTest).
By the explanation of the various embodiments described above and the various variation aspects of deriving as can be known, radiator structure of the present invention is used in electronic installation, not only can make temperature distribution uniform and effective temperature that reduces the surperficial focus of housing on the surface of housing compared to prior art, and in the technology assembling, reduce operation, assembling man-hour and operator number effectively, reach the advantage that reduces cost and improve the production yield.Simultaneously, not only can meet the safety insulation requirements, also meet various mechanisms test request.Moreover radiator structure of the present invention can provide the utilization that has Flexible Design, i.e. the various different radiating requirements of visual electronic installation at the temperature or the inner high thermoelectric elements cooling of the surperficial focus of housing, are carried out the matching design on housing and the radiator structure.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (16)
1. an electronic installation is characterized in that, comprising:
One circuit board;
A plurality of electronic components electrically are arranged at this circuit board;
One radiator structure comprises:
One first insulating heat-conductive layer coats this circuit board or those electronic components, and the coefficient of heat conduction of this first insulating heat-conductive layer is greater than 0.5W/mK; And
One metal level combines with thermo-contact with this first insulating heat-conductive layer; And
One housing has an accommodation space, and this circuit board, those electronic components and this radiator structure are housed inside in this accommodation space, and this metal level is between this housing and this first insulating heat-conductive layer.
2. electronic installation according to claim 1, it is characterized in that, this first insulating heat-conductive layer combines with chemical bonded refractory with this metal level and forms this radiator structure of single type, this radiator structure also comprises one first concatenator, between this first insulating heat-conductive layer and this metal level, and this first concatenator respectively with this first insulating heat-conductive layer and this metal level chemical bonded refractory.
3. electronic installation according to claim 1, it is characterized in that, this radiator structure also comprises one second insulating heat-conductive layer, with this metal level thermo-contact and its coefficient of heat conduction greater than 0.5W/mK, and this metal level is between this first insulating heat-conductive layer and this second insulating heat-conductive layer.
4. electronic installation according to claim 3, it is characterized in that, this second insulating heat-conductive layer combines with chemical bonded refractory with this metal level, and form this radiator structure of single type jointly with this metal level and this first insulating heat-conductive layer, this second insulating heat-conductive layer and this first insulating heat-conductive layer coat this metal level jointly fully, and this radiator structure also comprises one second concatenator, between this second insulating heat-conductive layer and this metal level, and this second concatenator respectively with this second insulating heat-conductive layer and this metal level chemical bonded refractory.
5. electronic installation according to claim 4, it is characterized in that, also comprise one the 3rd concatenator, between this second insulating heat-conductive layer and this housing, and the 3rd concatenator respectively with this second insulating heat-conductive layer and this housing chemical bonded refractory, make this radiator structure be fixed on this housing.
6. electronic installation according to claim 5 is characterized in that this radiator structure also comprises a projection, and this accommodation space of this first insulating heat-conductive course extends certainly, and this projection contacts with one of them of those electronic components or with this circuit board.
7. electronic installation according to claim 2, it is characterized in that this radiator structure also comprises one the 4th concatenator, between this metal level and this housing, and the 4th concatenator respectively with this metal level and this housing chemical bonded refractory, make this radiator structure be fixed on this housing.
8. electronic installation according to claim 1, it is characterized in that, this first insulating heat-conductive layer also comprises a joint portion, this metal level comprises a hole, this joint portion is run through this hole and is protruded in the opposite side of this metal level from a side of this metal level, and extend outside this hole the joint portion of the opposite side that protrudes in this metal level of this joint portion, this metal level is formed this radiator structure of single type in conjunction with being fixed in this first insulating heat-conductive layer.
9. electronic installation according to claim 1 is characterized in that, this radiator structure also comprises an insulation fastener, this first insulating heat-conductive layer combined with this metal level and forms this radiator structure of single type.
10. electronic installation according to claim 1, it is characterized in that, this electronic installation is a power-supply adapter, this housing has a upper surface, a lower surface, one left surface, one right surface, an one power supply input side surface and a power supply outlet side surface, this power supply input side surface is with respect to this power supply outlet side surface, and this upper surface, this lower surface, this left surface and should the right side surface connect a plurality of lateral margins on this power supply input side surface and this power supply outlet side surface to form this accommodation space, this circuit board comprises a voltage input side and a voltage outlet side, this voltage input side is adjacent to this power supply input side surface, contiguous this power supply outlet side surface of this voltage outlet side, this first insulating heat-conductive layer coat this housing to should upper surface, this lower surface, this left surface, this surface, right side, the inner surface on this power supply input side surface and this power supply outlet side surface, and this voltage outlet side of this voltage input side of this first insulating heat-conductive layer shaded portions and part.
11., it is characterized in that this housing comprises that also this projection is replaced this radiator structure so that have a gap between this housing and this radiator structure towards the outstanding projection of this radiator structure according to claim 1 or 3 described electronic installations.
12. electronic installation according to claim 1 is characterized in that, this metal level has a projection, and this projection is outstanding towards this housing from this metal level, and this projection is replaced this housing so that have a gap between this housing and this radiator structure.
13. a radiator structure is characterized in that, comprising:
One first insulating heat-conductive layer, the coefficient of heat conduction of this first insulating heat-conductive layer is greater than 0.5W/mK; And
One metal level with this first insulating heat-conductive layer thermo-contact, and combines with this first insulating heat-conductive stratification bond.
14. radiator structure according to claim 13 is characterized in that, also comprises one first concatenator, between this first insulating heat-conductive layer and this metal level, and this first concatenator respectively with this first insulating heat-conductive layer and this metal level chemical bonded refractory.
15. radiator structure according to claim 13, it is characterized in that, also comprise one second insulating heat-conductive layer, the coefficient of heat conduction is greater than 0.5W/mK, with this metal level thermo-contact, and combine with this metal level chemical bonded refractory, this metal level is between this first insulating heat-conductive layer and this second insulating heat-conductive layer, and this second insulating heat-conductive layer and this metal level and this first insulating heat-conductive layer form this radiator structure of single type jointly.
16. radiator structure according to claim 15, it is characterized in that, this second insulating heat-conductive layer and this first insulating heat-conductive layer coat this metal level jointly fully, this radiator structure also comprises one second concatenator, this second insulating heat-conductive layer is linked between this metal level, this second concatenator respectively with this second insulating heat-conductive layer and this metal level chemical bonded refractory.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210024307.6A CN103220896B (en) | 2012-01-20 | 2012-01-20 | Radiator structure and the electronic installation with this radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210024307.6A CN103220896B (en) | 2012-01-20 | 2012-01-20 | Radiator structure and the electronic installation with this radiator structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103220896A true CN103220896A (en) | 2013-07-24 |
| CN103220896B CN103220896B (en) | 2015-11-25 |
Family
ID=48818181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210024307.6A Active CN103220896B (en) | 2012-01-20 | 2012-01-20 | Radiator structure and the electronic installation with this radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103220896B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640414A (en) * | 2013-11-11 | 2015-05-20 | 富泰华精密电子（郑州）有限公司 | Mobile terminal |
| CN105323605A (en) * | 2014-06-04 | 2016-02-10 | 安徽省磊鑫科技有限公司 | Television stick |
| CN108345368A (en) * | 2017-01-25 | 2018-07-31 | 联昌电子企业股份有限公司 | Power supply unit radiator structure and its heat dissipating method |
| CN108882502A (en) * | 2017-05-11 | 2018-11-23 | 裕晨科技股份有限公司 | Circuit board with heat conduction and heat dissipation functions |
| JP7555256B2 (en) | 2020-12-10 | 2024-09-24 | シャープ株式会社 | Electronic device and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030161132A1 (en) * | 2002-02-05 | 2003-08-28 | Mitsubishi Denki Kabushiki Kaisha | Communication device |
| CN201349384Y (en) * | 2008-12-24 | 2009-11-18 | 彭泰企业有限公司 | High conduction and heat dissipation aluminum coated metal substrate structure |
| CN201804859U (en) * | 2010-08-19 | 2011-04-20 | 欣兴电子股份有限公司 | Circuit board |
-
2012
- 2012-01-20 CN CN201210024307.6A patent/CN103220896B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030161132A1 (en) * | 2002-02-05 | 2003-08-28 | Mitsubishi Denki Kabushiki Kaisha | Communication device |
| CN201349384Y (en) * | 2008-12-24 | 2009-11-18 | 彭泰企业有限公司 | High conduction and heat dissipation aluminum coated metal substrate structure |
| CN201804859U (en) * | 2010-08-19 | 2011-04-20 | 欣兴电子股份有限公司 | Circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640414A (en) * | 2013-11-11 | 2015-05-20 | 富泰华精密电子（郑州）有限公司 | Mobile terminal |
| US9552026B2 (en) | 2013-11-11 | 2017-01-24 | Hon Hai Precision Industry Co., Ltd. | Mobile terminal |
| CN105323605A (en) * | 2014-06-04 | 2016-02-10 | 安徽省磊鑫科技有限公司 | Television stick |
| CN108345368A (en) * | 2017-01-25 | 2018-07-31 | 联昌电子企业股份有限公司 | Power supply unit radiator structure and its heat dissipating method |
| CN108882502A (en) * | 2017-05-11 | 2018-11-23 | 裕晨科技股份有限公司 | Circuit board with heat conduction and heat dissipation functions |
| JP7555256B2 (en) | 2020-12-10 | 2024-09-24 | シャープ株式会社 | Electronic device and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103220896B (en) | 2015-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103547111B (en) | Planar heat radiation structure and electronic installation | |
| TWI484897B (en) | Heat dissipation structure and electronic device having the same | |
| CN104813760B (en) | A kind of radiating subassembly and electronic equipment | |
| CN103220896A (en) | Heat dissipation structure and electronic device with same | |
| CN103796484B (en) | Electronic installation | |
| CN107006136A (en) | Cooling mechanism and electron speed regulator, electronic installation with the cooling mechanism | |
| CN103200805A (en) | Heat radiation structure of electronic devices in sealed shell | |
| CN202488907U (en) | Radiating structure and electronic device therewith | |
| CN203840687U (en) | Heat radiator, circuit board heat radiation structure, and electronic device | |
| US8169781B2 (en) | Power supply and heat dissipation module thereof | |
| CN201726633U (en) | Hollow laminar type cooling plate unit structure | |
| CN105658040A (en) | Power module heat-radiating structure with power-type components | |
| TW202013852A (en) | Wireless charging device with heat dissipation function | |
| CN106231836B (en) | Enclosed display device and method of assembling the same | |
| CN105722371B (en) | Heat transfer assembly and heat abstractor | |
| CN208637314U (en) | Support Capacitor radiator structure and drive motor controller | |
| CN207978167U (en) | A kind of circuit board and electronic device | |
| TWM471126U (en) | Electro-thermal plate heat conducted to chip heating stack structure | |
| CN205902262U (en) | Closed display device | |
| CN101389201A (en) | Elastic heat conducting and radiating device | |
| TWI492702B (en) | Planar heat dissipation structureand electronic device | |
| CN219437462U (en) | Adapter and electronic equipment with same | |
| CN220422316U (en) | Heat abstractor and consumer | |
| CN215121681U (en) | Liquid cooling board and electronic equipment | |
| JP2014003059A (en) | Radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170313 Address after: Wujin, Changzhou province high tech Industrial Development Zone, 88 Yang Lake Road, No. Patentee after: Lite on Technology (Changzhou) Co., Ltd. Patentee after: Lite-On Technology Corporation Address before: Ruiguang road Taiwan Taipei City Neihu district China No. 392 22 floor Patentee before: Lite-On Technology Corporation |
|
| TR01 | Transfer of patent right |