CN202496170U - Shielding structure and mobile terminal - Google Patents
Shielding structure and mobile terminal Download PDFInfo
- Publication number
- CN202496170U CN202496170U CN2011204714163U CN201120471416U CN202496170U CN 202496170 U CN202496170 U CN 202496170U CN 2011204714163 U CN2011204714163 U CN 2011204714163U CN 201120471416 U CN201120471416 U CN 201120471416U CN 202496170 U CN202496170 U CN 202496170U
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- chip
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- construction spare
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- groove
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Abstract
The utility model provides a shielding structure. A shielding structure is arranged on a main board with a chip and covers the chip. The shielding structure comprises a shielding cover stent and a cover cooperated with the shielding cover stent, a groove is arranged on the position of the cover corresponding to the chip, a first thermal conduction body is arranged between the chip and the groove, and a second heat conduction body is arranged in the groove. The thermal radiation performance of the chip is improved. The utility model also provides a mobile terminal applying the shielding structure.
Description
Technical field
The utility model relates to electronic technology field, relates in particular to a kind of shielding construction spare and uses the portable terminal of this shielding construction spare.
Background technology
Along with science and technology development; Electronic product is very universal; But one of electromagnetic interference problem that to be electronic product common, circuit all can generate electromagnetic waves in application usually, and this electromagnetic wave can have influence on the electrical property of other chips in the electronic product; Generally can metallic shield be set around the chip and shield interference signal for reducing this kind interference, perhaps externally not produce interference signal.But chip can produce heat in running.Can rise by chip temperature if the heat of chip can not well conduct, that power consumption becomes is big, the complete machine temperature also thereupon degree raise even the safe handling of equipment all proposed challenge.
Along with the user to terminal equipment; Like mobile phone, PDA etc. higher requirement is proposed; As require the CPU speed of service come sooner to handle fast personal mobile communication business, display screen size can better improve more greatly user's visual effect, also require that the size of complete machine does more approach the aesthetic pursuit that satisfies the terminal use; So when carrying out structure just must with mainboard do littler thinner; Device is pursued microminiaturized, integrated, and it is nearer apart from what place with chip and chip when the motherboard design device layout, to have to.These factors propose a difficult problem to the heat radiation of chip.
The utility model content
The utility model technical problem to be solved is the bad technical problem of existing shielding case structure heat dispersion, thereby provides a kind of heat dispersion better shielding construction spare.
For achieving the above object, the technical scheme of the utility model specifically is achieved in that
A kind of shielding construction spare that is used for circuit board; It is arranged on the mainboard that is provided with chip and covers said chip; Said shielding construction spare comprises radome support and the lid that cooperates with said radome support; The position corresponding with chip is provided with a groove on the said lid, is provided with first heat carrier between said chip and the groove, is provided with second heat carrier in the said groove.
Further, said first heat carrier is heat conduction silicon chip or heat conduction carbon plate.
Further, said second heat carrier is heat conduction silicon chip or heat conduction carbon plate.
Further, the thickness of said first heat carrier is 0.1mm.
Further, the thickness of said second heat carrier is the degree of depth of said groove.
Further, the height of said radome support is 1.7mm.
Further, the thickness of said lid is 0.1mm.
Further, the sidewall of said radome support is provided with stuck point, and said covered body wall is provided with the bayonet socket that can match with said stuck point.
The utility model also provides a kind of portable terminal with shielding construction spare, comprises the mainboard and the above-mentioned shielding construction spare that are provided with chip.
Visible by technique scheme; Compared to prior art; The shielding construction spare that the utility model adopts is provided with a groove through position corresponding with chip on lid; First heat carrier is set between said chip and groove, second heat carrier is set in said groove conducts heat, thus the heat dispersion of raising chip.
Description of drawings
Fig. 1 is the generalized section of the shielding construction spare of the utility model embodiment.
Fig. 2 is the decomposing schematic representation of the shielding construction spare of the utility model embodiment.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, to the utility model further explain.
Need to prove that the term descriptions such as " first, second " in the utility model is described only is the description of the utility model for ease, and can not be interpreted as the restriction to the utility model.
As depicted in figs. 1 and 2; The shielding construction spare structural representation that is used for circuit board for the utility model; A kind of shielding construction spare 1 that is used for circuit board; It is arranged on the mainboard 10 that is provided with chip 2 and covers said chip 2, and said shielding construction spare 1 comprises radome support 11 and the lid 12 that cooperates with said radome support 11, is provided with a groove 121 with chip 2 corresponding positions on the said lid 12; Be provided with first heat carrier 13 between said chip 2 and the groove 121, be provided with second heat carrier 14 in the said groove 121.Said first heat carrier 13 is heat conduction silicon chip or heat conduction carbon plate.Said second heat carrier 14 is heat conduction silicon chip or heat conduction carbon plate.The heat conduction silicon chip has the advantage that cost is low, heat-conducting effect is good, and the heat conductivility of heat conduction carbon plate is more superior, but corresponding cost is higher, and in the application of reality, the user can select different Heat Conduction Materials for use according to actual conditions.First heat carrier 13 is located between chip 2 and the groove 121; At first can avoid lid 12 directly to be pressed onto on the chip 2; Avoid chip 2 to damage by pressure, even if lid 12 receives the effect of external force, first heat carrier 13 can play cushioning effect; Chip 2 is protected, and first heat carrier 13 can directly export to the heat that chip 2 produces on the lid 12 in addition.Preferably, the thickness of said first heat carrier 13 is 0.1mm.It not only can carry out heat conduction, the material cost of also further saving first heat carrier 13 preferably.The thickness of said second heat carrier 14 is the degree of depth of said groove 121.Second heat carrier 14 is further with the heat of chip 2 conduction, conducts through lid 12 and the radome support 11 that matches with lid 12.Its with lid 12 maintain an equal level can make things convenient for mainboard 10 on other structural members such as screen mount contact well, realization with heat transferred to screen mount.Heat on the screen mount then can dispel the heat through screen and shell.
For shielding construction spare is taken up room still less, the height of said radome support 11 is preferably 1.7mm, and the thickness of said lid 12 is 0.1mm.
In order to make radome support 11 and lid 12 easy accessibility, the sidewall of said radome support 11 is provided with stuck point 111, and said lid 12 sidewalls are provided with the bayonet socket 121 that can match with said stuck point 111.The position of said stuck point 111 on radome support 11 do not fixed; Specifically look operating position or processing request and decide; In the utility model embodiment; The position of stuck point 111 is to guarantee that the stuck point 111 on the radome support 11 can match with bayonet socket 121, thereby makes lid 12 to cooperate with radome support 11 well when using this shielding construction part 1.Said stuck point 111 obtains through impact style with bayonet socket 121.
In order further to improve heat dispersion, under the situation that guarantees shield effectiveness, can be provided with louvre on the lid 12, promote air in shielding construction spare 1, to flow, the heat that produces when further reducing chip 2 work.
The lid 12 of the utility model embodiment can adopt beryllium copper through being processed to form.Beryllium copper is a performance high-grade elastic material preferably in the copper alloy; Have little, anti-corrosion, wear-resisting, cold-resistant, the high conduction of very high intensity, elasticity, hardness, fatigue strength, elastic hysteresis, nonmagnetic, impact a series of good physics, chemistry and mechanical properties such as not producing spark and excellent radiation performance.Radome support 11 can adopt copper or stainless steel to process.
The utility model also provides a kind of portable terminal that comprises above-mentioned shielding construction spare 1, and this portable terminal can be mobile phone, panel computer, PDA etc.Said portable terminal comprises mainboard 10 and the above-mentioned shielding construction spare 1 that is provided with chip 2.Said shielding construction spare 1 comprises radome support 11 and the lid 12 that cooperates with said radome support 11; Be provided with a groove 121 with chip 2 corresponding positions on the said lid 12; Be provided with first heat carrier 13 between said chip 2 and the groove 121, be provided with second heat carrier 14 in the said groove 121.
Compare with existing shielding construction spare; The utlity model has following advantage: the shielding construction spare that the utility model adopts is provided with a groove through position corresponding with chip on lid; Be provided with first heat carrier between said chip and the groove, in said groove, be provided with the heat that second heat carrier is used for conducting the chip generation, and then improving the heat dispersion of chip.
The preferred embodiment that the above is merely the utility model is not the protection range that is used to limit the utility model.All within the spirit and principle of the utility model, any modification of being done, be equal to replacement and improvement etc., all should be included within the protection range of the utility model.
Claims (9)
1. shielding construction spare; It is arranged on the mainboard that is provided with chip and covers said chip; Said shielding construction spare comprises radome support and the lid that cooperates with said radome support, it is characterized in that the position corresponding with chip is provided with a groove on the said lid; Be provided with first heat carrier between said chip and the groove, be provided with second heat carrier in the said groove.
2. shielding construction spare according to claim 1 is characterized in that, said first heat carrier is heat conduction silicon chip or heat conduction carbon plate.
3. shielding construction spare according to claim 1 is characterized in that, said second heat carrier is heat conduction silicon chip or heat conduction carbon plate.
4. shielding construction spare according to claim 1 is characterized in that, the thickness of said first heat carrier is 0.1mm.
5. shielding construction spare according to claim 1 is characterized in that, the thickness of said second heat carrier is the degree of depth of said groove.
6. shielding construction spare according to claim 1 is characterized in that, the height of said radome support is 1.7mm.
7. shielding construction spare according to claim 1 is characterized in that, the thickness of said lid is 0.1mm.
8. shielding construction spare according to claim 1 is characterized in that, the sidewall of said radome support is provided with stuck point, and said covered body wall is provided with the bayonet socket that can match with said stuck point.
9. the portable terminal with shielding construction spare is characterized in that, comprises the mainboard that is provided with chip and like any described shielding construction spare of claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204714163U CN202496170U (en) | 2011-11-24 | 2011-11-24 | Shielding structure and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204714163U CN202496170U (en) | 2011-11-24 | 2011-11-24 | Shielding structure and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202496170U true CN202496170U (en) | 2012-10-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204714163U Expired - Lifetime CN202496170U (en) | 2011-11-24 | 2011-11-24 | Shielding structure and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202496170U (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103401958A (en) * | 2013-07-03 | 2013-11-20 | 惠州Tcl移动通信有限公司 | Mobile phone chip shielding structure and mobile phone |
| CN104486935A (en) * | 2014-12-18 | 2015-04-01 | 江苏天安智联科技股份有限公司 | Electromagnetic shielding and heat dissipation device for on-board host computer |
| CN104640414A (en) * | 2013-11-11 | 2015-05-20 | 富泰华精密电子（郑州）有限公司 | Mobile terminal |
| CN105323996A (en) * | 2015-12-09 | 2016-02-10 | 江苏天安智联科技股份有限公司 | Car-mounted enclosure with heat radiation function |
| CN105592677A (en) * | 2014-11-14 | 2016-05-18 | 奇鋐科技股份有限公司 | Shielding structure for preventing electronic component from electromagnetic interference |
| CN105744822A (en) * | 2016-04-29 | 2016-07-06 | 广东欧珀移动通信有限公司 | Shielding cover, circuit board and mobile terminal |
| CN105916351A (en) * | 2016-04-29 | 2016-08-31 | 广东欧珀移动通信有限公司 | Shielding case and mobile terminal |
| CN106486435A (en) * | 2016-09-29 | 2017-03-08 | 努比亚技术有限公司 | A kind of encapsulating method of conducting-heat elements |
| CN108476605A (en) * | 2015-12-14 | 2018-08-31 | A.K.冲压有限公司 | Multi-piece type shield |
| EP3307036A4 (en) * | 2015-06-04 | 2018-09-12 | Huawei Technologies Co. Ltd. | Mobile terminal and heat dissipation shielding structure |
| CN108601299A (en) * | 2018-04-26 | 2018-09-28 | 上海移远通信技术股份有限公司 | Shielding case and shield assemblies comprising it |
| CN108882662A (en) * | 2018-06-28 | 2018-11-23 | 四川斐讯信息技术有限公司 | A kind of shielding radiator structure and pcb board |
| CN109025503A (en) * | 2017-06-09 | 2018-12-18 | 天津华讯通信器材有限公司 | A kind of locking device of high frequency cabinet door |
| CN109256363A (en) * | 2018-11-07 | 2019-01-22 | 珠海格力电器股份有限公司 | A kind of chip and mobile terminal |
-
2011
- 2011-11-24 CN CN2011204714163U patent/CN202496170U/en not_active Expired - Lifetime
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103401958A (en) * | 2013-07-03 | 2013-11-20 | 惠州Tcl移动通信有限公司 | Mobile phone chip shielding structure and mobile phone |
| CN104640414A (en) * | 2013-11-11 | 2015-05-20 | 富泰华精密电子（郑州）有限公司 | Mobile terminal |
| US9552026B2 (en) | 2013-11-11 | 2017-01-24 | Hon Hai Precision Industry Co., Ltd. | Mobile terminal |
| CN105592677A (en) * | 2014-11-14 | 2016-05-18 | 奇鋐科技股份有限公司 | Shielding structure for preventing electronic component from electromagnetic interference |
| CN104486935A (en) * | 2014-12-18 | 2015-04-01 | 江苏天安智联科技股份有限公司 | Electromagnetic shielding and heat dissipation device for on-board host computer |
| US10602603B2 (en) | 2015-06-04 | 2020-03-24 | Huawei Technologies Co., Ltd. | Mobile terminal and heat dissipation and shielding structure |
| US11051393B2 (en) | 2015-06-04 | 2021-06-29 | Huawei Technologies Co., Ltd. | Mobile terminal and heat dissipation and shielding structure |
| EP3307036A4 (en) * | 2015-06-04 | 2018-09-12 | Huawei Technologies Co. Ltd. | Mobile terminal and heat dissipation shielding structure |
| CN105323996A (en) * | 2015-12-09 | 2016-02-10 | 江苏天安智联科技股份有限公司 | Car-mounted enclosure with heat radiation function |
| CN108476605B (en) * | 2015-12-14 | 2021-03-09 | A.K.冲压有限公司 | Multi-piece shield |
| CN108476605A (en) * | 2015-12-14 | 2018-08-31 | A.K.冲压有限公司 | Multi-piece type shield |
| CN105744822A (en) * | 2016-04-29 | 2016-07-06 | 广东欧珀移动通信有限公司 | Shielding cover, circuit board and mobile terminal |
| CN105744822B (en) * | 2016-04-29 | 2019-06-14 | Oppo广东移动通信有限公司 | Shielding case, circuit board and mobile terminal |
| CN105916351A (en) * | 2016-04-29 | 2016-08-31 | 广东欧珀移动通信有限公司 | Shielding case and mobile terminal |
| CN106486435B (en) * | 2016-09-29 | 2019-02-15 | 努比亚技术有限公司 | A kind of encapsulating method of conducting-heat elements |
| CN106486435A (en) * | 2016-09-29 | 2017-03-08 | 努比亚技术有限公司 | A kind of encapsulating method of conducting-heat elements |
| CN109025503A (en) * | 2017-06-09 | 2018-12-18 | 天津华讯通信器材有限公司 | A kind of locking device of high frequency cabinet door |
| CN109025503B (en) * | 2017-06-09 | 2023-12-29 | 天津华讯通信器材有限公司 | Locking device of high-frequency cabinet door |
| CN108601299A (en) * | 2018-04-26 | 2018-09-28 | 上海移远通信技术股份有限公司 | Shielding case and shield assemblies comprising it |
| CN108601299B (en) * | 2018-04-26 | 2020-08-21 | 上海移远通信技术股份有限公司 | Shielding case and shielding case assembly comprising same |
| CN108882662A (en) * | 2018-06-28 | 2018-11-23 | 四川斐讯信息技术有限公司 | A kind of shielding radiator structure and pcb board |
| CN109256363A (en) * | 2018-11-07 | 2019-01-22 | 珠海格力电器股份有限公司 | A kind of chip and mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121017 |