CN207854398U - Has the radiator of EMI suppression masking structure - Google Patents
Has the radiator of EMI suppression masking structure Download PDFInfo
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- CN207854398U CN207854398U CN201820300526.5U CN201820300526U CN207854398U CN 207854398 U CN207854398 U CN 207854398U CN 201820300526 U CN201820300526 U CN 201820300526U CN 207854398 U CN207854398 U CN 207854398U
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- heat generating
- generating component
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Abstract
A kind of radiator of tool EMI suppression masking structure, including a heat generating component, a temperature-uniforming plate and a shielding framework.Heat generating component includes a circuit board and the heat generating component for being electrically coupled to circuit board.One surface of temperature-uniforming plate is corresponding to amplexiform heat generating component.Shielding framework includes the plural barricade for the masking heat generating component surrounding being arranged, and each barricade surrounds corresponding two opening jointly, and temperature-uniforming plate and circuit board correspond to each opening and abut each barricade respectively, to form a shielding space.Thereby, reach reduction height, while reaching the radiator of electromagnetic shielding and heat dissipation effect.
Description
Technical field
The utility model is related to a kind of radiator, espespecially a kind of heat dissipation with EMI suppression masking structure reducing height
Device.
Background technology
Existing electronic equipment is all installed such as mobile phone, tablet computer, laptop or other radiators
There are many electronic building bricks.When electronic equipment operate or operate when, these electronic building bricks just will produce a degree of electromagnetic field and
Heat just will produce between electromagnetic field caused by such electronic building brick and interfere with each other, obstruct, and then influences electronic equipment just
Often running, this phenomenon are referred to as Electromagnetic Interference (Electro Magnetic Interference；EMI).At present to
Prevent the mode of EMI mostly with the electromagnetic shielding cover generating component at a U-shaped metalwork material to shield electromagnetic wave, and by
It is relatively low and meet current environmental regulation in the method cost of metalwork masking, therefore be most often used.Above-mentioned integrally formed U
Plural number support (side) plate that type cover body or lid have a top plate and extend from top plate edge perpendicular.It would generally be applied on top plate
Cloth heat dissipation material is connect with radiator again, so that the waste heat for generating generating component is conducted via cover of meter hood to radiator.So
And above-mentioned top plate can increase the whole height of electronic equipment with the heat conduction material being coated with thereon, can not be useful in and tend to frivolous and palpus
In the electronic equipment of heat dissipation.In view of this, how effectively to solve the above problems, and take into account the EMI suppression and heat dissipation effect of electronic equipment
Fruit has become the project that related dealer wants solution in fact.
Invention content
One of the utility model aim be to provide it is a kind of effectively reaching reduction height, simultaneously with electromagnetic shielding and dissipate
The radiator of the tool EMI suppression masking structure of thermal effect.
In order to achieve the above object, the utility model provides a kind of radiator of tool EMI suppression masking structure, including a fever group
Part, a temperature-uniforming plate and a shielding framework.Heat generating component includes a circuit board and the heat generating component for being electrically coupled to circuit board.
One surface of warm plate is corresponding to amplexiform heat generating component.Shielding framework includes the plural number shielding for the masking heat generating component surrounding being arranged
Plate, each barricade surround corresponding two opening jointly, and temperature-uniforming plate and circuit board correspond to each opening and abut each barricade respectively, with
Form a shielding space.
Preferably, above-mentioned each barricade is respectively provided with the first end for abutting foregoing circuit plate and abuts above-mentioned samming
One the second end of plate.
Preferably, the first end of above-mentioned each barricade or the second end also have spaced plural first clamping
Portion, above-mentioned temperature-uniforming plate correspond to above-mentioned each first clamping portion and are then provided with plural second clamping portion.
Preferably, above-mentioned each first clamping portion and each second clamping portion optionally hole or lug each other, makes each
One clamping portion and the mutual snapping in each second clamping portion or riveted.
Preferably, what above-mentioned shielding framework was integrally formed is made or is assembled respectively with above-mentioned each barricade, with
Form above-mentioned shielding space.
Preferably, the utility model also include be configured at a Heat Conduction Material between above-mentioned temperature-uniforming plate and heat generating component and
It is set to the plurality of radiating fins on another surface of the temperature-uniforming plate.
Preferably, above-mentioned temperature-uniforming plate also has towards and abuts a bending part of above-mentioned heat generating component and be set to the folding
A Heat Conduction Material between turn of bilge and the heat generating component.
Preferably, the material of above-mentioned each barricade is aluminium, copper, iron or its alloy.
In order to achieve the above object, the utility model also provides a kind of radiator of tool EMI suppression masking structure, including a fever
Component, a temperature-uniforming plate and a shielding framework.Heat generating component includes a circuit board and plural heat generating component, and each heat generating component is each other
It is spaced and is electrically coupled to circuit board.One surface of temperature-uniforming plate is corresponding to amplexiform each heat generating component.Shielding framework includes to be arranged
The plural heat generating component of masking four barricades, each barricade surrounds corresponding two opening jointly.Temperature-uniforming plate and circuit board
Each opening is corresponded to respectively and abuts each barricade, wherein an intermediate plate is each configured between appointing two adjacent heat generating components, in each
Between plate and each barricade form plural shielding space.
Preferably, two ends of above-mentioned each intermediate plate are separately connected above-mentioned each barricade, and each intermediate plate and each barricade
It is highly identical.
In one embodiment, each barricade is respectively provided with the first end for abutting circuit board and abuts temperature-uniforming plate
A second end, be made or assembled respectively with each barricade wherein shielding framework system is integrally formed, to form screen
Space is covered, that is, shields framework, circuit board and the common shield heating component of temperature-uniforming plate, to effectively prevent electromagnetic interference (EMI).
In one embodiment, the first end of each shielding framework or the second end also have spaced plural number
First clamping portion, temperature-uniforming plate correspond to each first clamping portion and are then provided with plural second clamping portion, so that each barricade can
It leans on and that stablizes is fastened between temperature-uniforming plate and circuit board.
In one embodiment, it is further provided with a Heat Conduction Material between heat generating component and temperature-uniforming plate and is set to
The plurality of radiating fins on another surface of the temperature-uniforming plate.Heat Conduction Material generated waste heat when can effectively operate heat generating component
Quickly in conduction to temperature-uniforming plate, and the external world is conducted heat to so that radiating efficiency is substantially improved through each radiating fin.In addition, samming
The opening of the directly corresponding masking framework of plate is amplexiformed, and also can effectively reduce the height of radiator entirety, and then keep this practicality new
Type radiator can be applied in light and short electronic product.
Description of the drawings
Fig. 1 is the exploded view for being painted the first preferred embodiment of the utility model.
Fig. 2 is the exploded view of the temperature-uniforming plate and each barricade that are painted the first preferred embodiment of the utility model.
Fig. 3 is the sectional view for being painted the first preferred embodiment of the utility model.
Fig. 4 is another sectional view for being painted the first preferred embodiment of the utility model.
Fig. 5 is the sectional view for being painted the second preferred embodiment of the utility model.
【Critical piece symbol description】
10 radiator, 1 heat generating component, 11 circuit board, 12 heat generating component, 2 temperature-uniforming plate, 21 surface, 22 second clamping portion, 23 bending
Portion 3 shields 31 barricade of framework, 311 first end, 312 the second end, 313 first clamping portion 32 and is open among 33 shielding spaces 34
4 Heat Conduction Material of plate, 5 radiating fin.
Specific implementation mode
The detailed description of related the utility model and technology contents, cooperation description of the drawings is as follows, however appended attached drawing only carries
For reference with illustrate to use, not be used for the scope of protection of the utility model is limited.
Shown in please referring to Fig.1 to Fig.3, the utility model provides a kind of radiator 10 of tool EMI suppression masking structure, including
One heat generating component 1, a temperature-uniforming plate 2 and one shield framework 3.Heat generating component 1 includes a circuit board 11 and is electrically coupled to circuit board
11 heat generating component 12.Signified circuit board 11 is preferably a printed circuit board herein；Heat generating component 12 then includes but unlimited
In a chip (chip).
In this first specific embodiment, the 21 corresponding heating surface for amplexiforming heat generating component 11 of a surface of temperature-uniforming plate 2 is (not
Mark).The temperature-uniforming plate 2 of the present embodiment is for example by solid copper coin or by hollow copper coin and the aqueous being stored in copper coin institute structure
At evaporation and condensation through aqueous achieve the effect that quick conductive.To increase heat conducting effect, the present embodiment also includes to match
The plural number heat dissipation on the Heat Conduction Material 4 that is placed between temperature-uniforming plate 2 and heat generating component 12 and another surface for being set to temperature-uniforming plate 2
Fin 5 (as shown in Figure 4).Heat Conduction Material 4 reduces the impedance that heat is transmitted, and then improve heat dissipation to plug the gap or hole
Property.Signified Heat Conduction Material (Thermal Interface Material herein；TIM) 4 be, for example, heat-conducting glue, heat conduction sealing,
Heat-conducting cream, heat-conducting glue band or other suitable materials etc..
Shielding framework 3 includes the plural barricade 31 for masking 12 surrounding of heat generating component being arranged, and each barricade 31 is common
Corresponding two opening 32 is surrounded, so that temperature-uniforming plate 21 and circuit board 11 is corresponded to each opening 32 respectively and abuts each barricade 31, to be formed
One shielding space 33.Each barricade 31 is respectively provided with the first end 311 for abutting circuit board 11 and abuts 2 surface of temperature-uniforming plate
21 the second end 312, wherein shielding framework 3 be it is integrally formed be made or assembled respectively with each barricade 31,
To form above-mentioned shielding space 33, that is, framework 3,2 common shield heating component 12 of circuit board 11 and temperature-uniforming plate are shielded, to have
Effect prevents electromagnetic interference (EMI).
In embodiment as shown in Figure 1 to Figure 3, the shape of shielding space 33 preferably corresponds to the shape of heat generating component 12 and is
One rectangle, and the quantity of each barricade 31 is four.It 33 also can be with however in other different embodiments, between mask frame
Heat generating component 12 of different shapes surrounds such as triangle, circle or other suitable shapes, does not limit.
In embodiment as shown in Figure 1 to Figure 3, the first end 311 or the second end 312 of each barricade 31 also have
There are spaced plural first clamping portion 313, temperature-uniforming plate 2 to correspond to each first clamping portion 313 and be then provided with the second clamping of plural number
Portion 22.Each first clamping portion 313 and each second clamping portion 22 optionally hole or lug each other, make each first clamping portion
313 with 22 mutual snapping of each second clamping portion or riveted.It is preferably a perforation in the hole of the present embodiment；However in other differences
Embodiment in, hole also can be a blind hole.In addition, each first clamping portion 313 and each second clamping portion 22 are preferably respectively with riveting
The mode stationary positioned of conjunction.
Also have one to amplexiform piece (figure omits) however in other different embodiments, between each first clamping portion 313, it is each to paste
What contact pin can be bent amplexiforms in the surface of temperature-uniforming plate 2 21.Therefore when each first clamping portion 313 is inserted in respectively second clamping portion
When 22, the surface 21 of piece while the abutting temperature-uniforming plate 2 of bending is respectively amplexiformed, to increase the effect for preventing EMI.
Shown in Fig. 4, temperature-uniforming plate 2 also has towards and abuts a bending part 23 of heat generating component 12 and set
The Heat Conduction Material 4 being placed between bending part 23 and heat generating component 12, to be applied to for example reduce height or other different demands
Mechanism design electronic device (figure omit) in.
It should be noted that the opening 32 of the directly corresponding masking framework 3 of temperature-uniforming plate 2 is amplexiformed or grafting, radiated with effective reduction
The whole height of device 10, and then the utility model radiator is enable to apply in light and short electronic product.
Shown in Fig. 5, to be painted the sectional view of the utility model the second preferred embodiment figure.This implementation
Example with first embodiment major difference is that, heat generating component 1 includes plural heat generating component 12, and each heat generating component 12 is to each other
Every and be electrically coupled to circuit board 11.Shielding framework 3 includes four barricades for covering above-mentioned each heat generating component 12 being arranged
31, wherein an intermediate plate 34 is each configured between appointing two adjacent heat generating components 12, each intermediate plate 34 and 31 shape of each barricade
Pluralize shielding space 33.
Each barricade 31 of connection that two ends of each intermediate plate 34 abut respectively, and the knot of each intermediate plate 34 and each barricade 31
Structure, material and height all same, make each heat generating component 12 can effectively by shielding framework 3, intermediate plate 34, temperature-uniforming plate 2 and
Circuit board 11 covers, and prevents electromagnetic interference.Remaining structure and linking relationship of the present embodiment, please join described in previous embodiment,
Details are not described herein.
In conclusion should be considered as illustrating the utility model in this revealed embodiment herein, rather than to limit
The utility model processed.The scope of protection of the utility model should be defined by the right applied for a patent, and cover its conjunction
Method equipollent, however it is not limited to previous description.
Claims (10)
1. a kind of radiator of tool EMI suppression masking structure, it is characterised in that including：
One heat generating component a, including circuit board and being electrically coupled to a heat generating component of the circuit board；
One temperature-uniforming plate, a surface of the temperature-uniforming plate is corresponding to amplexiform the heat generating component；And
One shielding framework, including what is be arranged covers the plural barricade of the heat generating component surrounding, each barricade surrounds jointly
Corresponding respectively opening abuts the respectively barricade respectively for corresponding two opening, the temperature-uniforming plate and the circuit board, empty to form a shielding
Between.
2. the radiator of tool EMI suppression masking structure as described in claim 1, it is characterised in that above-mentioned each barricade difference
A second end with the first end and the above-mentioned temperature-uniforming plate of abutting that abut foregoing circuit plate.
3. the radiator of tool EMI suppression masking structure as claimed in claim 2, it is characterised in that the of above-mentioned each barricade
Also there is spaced plural first clamping portion, above-mentioned temperature-uniforming plate to correspond to above-mentioned each first clamping portion for one end or the second end
Then it is provided with plural second clamping portion.
4. as claimed in claim 3 tool EMI suppression masking structure radiator, it is characterised in that above-mentioned each first clamping portion and
Each second clamping portion optionally hole or lug each other, make each first clamping portion and the mutual snapping in each second clamping portion or riveting
It closes.
5. the radiator of tool EMI suppression masking structure as described in claim 1, it is characterised in that above-mentioned shielding framework is integrated
It is molding to be made or assembled respectively with above-mentioned each barricade, to form above-mentioned shielding space.
6. the radiator of tool EMI suppression masking structure as described in claim 1, it is characterised in that also above-mentioned equal comprising being configured at
A Heat Conduction Material between warm plate and heat generating component and be set to the temperature-uniforming plate another surface plurality of radiating fins.
7. the radiator of tool EMI suppression masking structure as described in claim 1, it is characterised in that above-mentioned temperature-uniforming plate also has court
To and the Heat Conduction Material that abuts a bending part of above-mentioned heat generating component and be set between the bending part and the heat generating component.
8. the radiator of tool EMI suppression masking structure as described in claim 1, it is characterised in that the material of above-mentioned each barricade
For aluminium, copper, iron or its alloy.
9. a kind of radiator of tool EMI suppression masking structure, it is characterised in that including：
One heat generating component a, including circuit board and plural heat generating component, each heat generating component are spaced and are electrically coupled to
The circuit board；
One temperature-uniforming plate, a surface of the temperature-uniforming plate is corresponding to amplexiform each heat generating component；And
One shielding framework, includes four barricades of the plural heat generating component of the masking being arranged, and each barricade surrounds jointly
Corresponding respectively opening abuts the respectively barricade respectively for corresponding two opening, the temperature-uniforming plate and the circuit board, wherein appointing two adjacent
An intermediate plate is each configured between the heat generating component, respectively the intermediate plate forms plural shielding space with the respectively barricade.
10. the radiator of tool EMI suppression masking structure as claimed in claim 9, it is characterised in that the two of above-mentioned each intermediate plate
End is separately connected above-mentioned each barricade, and each intermediate plate is identical as the height of each barricade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820300526.5U CN207854398U (en) | 2018-03-05 | 2018-03-05 | Has the radiator of EMI suppression masking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820300526.5U CN207854398U (en) | 2018-03-05 | 2018-03-05 | Has the radiator of EMI suppression masking structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207854398U true CN207854398U (en) | 2018-09-11 |
Family
ID=63408977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820300526.5U Active CN207854398U (en) | 2018-03-05 | 2018-03-05 | Has the radiator of EMI suppression masking structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207854398U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108200752A (en) * | 2018-03-05 | 2018-06-22 | 昇业科技股份有限公司 | Has the radiator of EMI suppression masking structure |
-
2018
- 2018-03-05 CN CN201820300526.5U patent/CN207854398U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108200752A (en) * | 2018-03-05 | 2018-06-22 | 昇业科技股份有限公司 | Has the radiator of EMI suppression masking structure |
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