CN106714522A - Shielding cover structure with heat radiating function - Google Patents
Shielding cover structure with heat radiating function Download PDFInfo
- Publication number
- CN106714522A CN106714522A CN201710065286.5A CN201710065286A CN106714522A CN 106714522 A CN106714522 A CN 106714522A CN 201710065286 A CN201710065286 A CN 201710065286A CN 106714522 A CN106714522 A CN 106714522A
- Authority
- CN
- China
- Prior art keywords
- shielding
- fin
- over body
- body case
- shielding cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to a shielding cover structure with a heat radiating function. A shielding function is realized, and meanwhile, a large quantity of heating shielded protected objects can be assisted in radiating heat in time and the damage can be reduced. The shielding cover structure comprises a shielding cover shell, a radiating fin and a spring hook, wherein the radiating fin and the spring hook are matched with the shielding cover shell; the radiating fin and the spring hook are placed in the shielding cover shell; the spring hook is used for fixing the radiating fin in the shielding cover shell; and a hook notch is formed in the shielding cover shell and is used for fixing the spring hook. Only a layer of buffering material is arranged between the shielded protected object and the radiating fin, so that the progressive thermal resistance does not exist and the shielded protected object can conveniently radiate heat; the hook notch is formed in the shielding cover shell, so that no special area or element is required for fixing the spring hook on the shielded protected object; and the operation is convenient and quick.
Description
Technical field
The present invention relates to radome field, more particularly to radome heat dissipating method, specifically refer to a kind of take into account radiating
Shielding case structure.
Background technology
Existing electronic component generally all each incorporates high-frequency circuit, digital circuit and analog circuit, these electronics unit
Part can mutually produce electromagnetic interference when work, and electromagnetic interference not only influences the function of electronic component, and can endanger people
Body health.In order to prevent electromagnetic interference, typically electronic component can be all located in an electro-magnetic shielding cover for closing ground connection.Screen
It is an alloying metal cover to cover cover (shield cover/case), is the isolation to entering row metal between two spaces region, with
The sensing and radiation of control electric field and electromagnetic wave by a region to another region.Specifically, it is exactly by first portion with shield
The interference source of part, circuit, sub-assembly, cable or whole system is surrounded, and prevents interference electromagnetic field to external diffusion.
And electronic product is more and more integrated at present and develops towards miniaturization, lightening direction, heat dissipation problem just becomes
It is particularly troublesome, it would be highly desirable to solve.Be enclosed in radome region main IC (integrated circuit integrated circuit, such as
CPU, wireless chip etc.) because that without suitable heat dissipation channel, can only touch radome by heat conduction foam to radiate, radiating effect
It is really unsatisfactory.
Referring to Fig. 1, including:
IC:Usually ceramic-like encapsulated type, power consumption is big, and heating is serious;
Heat conduction foam:Material with the performance such as excellent quick conductive, radiating, insulation, vibrationproof, sealing, ageing-resistant, can
Alleviate the contact stress between radome and IC, prevent radome from deforming and damage IC by pressure;
Conventional shields:Circuit, device in Isolated Shield cover etc., protect it from other external radiation interferences, usual material
Matter is stainless steel;
Fin:For radiating, its size varies according to the power consumption of system requirements;
Spring fishhook:Pressure on a heat sink, fin is pushed down by camber of spring, prevents from coming off.
In general, the major defect that traditional radome coordinates is:
Radiating efficiency is not high, and fin directly contacts IC not over most direct mode, but by heat conduction twice
Foam primary shielding;Per pass heat conduction foam, thermal resistance becomes increase, radiating efficiency step-down.
High cost:Two heat conduction foams, fin, grab, also have to be reserved on PCB and be used to fix grab
Two pillars, material is excessively difficult management and control, relatively costly.
Install complicated:Multiple devices install combination complexity, dismounting trouble.
In view of this, it is necessary to a kind of electromagnetic shielding cover structure of invention, can shielded signal while, send out to greatest extent
It is vaporized the radiating efficiency of backing.
The content of the invention
The purpose of the present invention is the shortcoming for overcoming above-mentioned prior art, there is provided one kind can be good at solving radome internal strength
The shielding case structure for taking into account radiating of the heat dissipation problem of the big device of consumption.
To achieve these goals, the shielding case structure for taking into account radiating of the invention has as follows:
This takes into account the shielding case structure of radiating, and described shielding case structure includes fin and shielding over body case, and its is main
Feature is that described fin is fixedly installed in described shielding over body case by a spring fishhook, described shielding case
The size of the setting area of correspondence fin and fin, is provided with a radiator window on body, and on described shielding over body case also
Be provided with grab breach, for the spring fishhook described in fixation, the relevant parameter of described fin be placed in the radome knot
The relevant parameter by shielding protection object in structure is adapted.
It is preferred that being additionally provided with a fender between shielding protection object and shielding over body case in the shielding over body case
Material, is used to alleviate shielding over body case and by the contact stress between shielding protection object.
More preferably, described padded coaming is heat conduction foam.
It is preferred that described fin is a grid-type fin, described spring fishhook inlay card radiates in described grid-type
In piece, and two of the spring fishhook is separately fixed at the grab indentation, there shielded on over body case.
It is preferred that the relevant parameter of described fin includes size, the position of fin, by the phase of shielding protection object
Related parameter includes power, position, size and cooling requirements.
The shielding case structure for taking into account radiating in the invention is employed, due to being provided with radiating in the place of correspondence fin
Window, and snap notches are provided with shielding over body case are used to fix spring fishhook, therefore the present invention has compared to prior art
Have the following advantages:One layer of heat conduction foam material is reduced, laddering thermal resistance loss in heat transfer process is reduced, equivalent to quilt
Shielding protection object is directly connected on fin by heat conduction foam;The locking mode of fin is that spring fishhook is directly fixed
In the grab gap position of shielding over body case, reduce spring fishhook compared to traditional method and be fixed to when on pcb board, take
The material of the fixed grab that may be reserved on the space of pcb board and pcb board;Assembling mode becomes more succinct, and convenient disassembly,
After heat conduction foam is fixed on IC, fin and grab are loaded onto successively.At the same time spring fishhook is hooked in radome
The grab gap position of housing.The size dimension of fin is optional.
Brief description of the drawings
Fig. 1 is traditional radome radiation fin assembling mode.
Fig. 2 is the structural representation of the shielding case structure for taking into account radiating of the invention.
Fig. 3 is the assembling mode schematic diagram of the shielding case structure for taking into account radiating of the invention.
Fig. 4 is a kind of specific implementation step of the SIM locking mechanism of the invention in specific embodiment from producing to using
Suddenly.
Reference
1 shielding over body case
2 grab breach
3 fin
4 spring fishhooks
5 padded coamings
6 by shielding protection object
Specific embodiment
In order to more clearly describe technology contents of the invention, carried out with reference to specific embodiment further
Description.
Refer to Fig. 2 and Fig. 3.The invention provides a kind of shielding case structure for taking into account radiating, described shielding case structure
Including fin 3 and shielding over body case 1, described fin 3 is fixedly installed on described shielding case by a spring fishhook 4
In body 1, the setting area of correspondence fin 3 and the size of fin 3, are provided with a radiator window on described shielding over body case 1,
And grab breach 2 is additionally provided with described shielding over body case 1, for the spring fishhook 4 described in fixation.Described fin 3
Relevant parameter be adapted with the relevant parameter by shielding protection object being placed in the shielding case structure.
A padded coaming 5 is additionally provided between shielding protection object 6 and shielding over body case 1 in the shielding over body case 1,
It is used to alleviate shielding over body case 1 and by the contact stress between shielding protection object 6.
Described padded coaming 5 is heat conduction foam.
Described fin 3 is a grid-type fin 3, and the described inlay card of spring fishhook 4 is in described grid-type fin 3
In, and the spring fishhook 4 two be separately fixed at shielding over body case 1 on grab breach 2 at.
The relevant parameter of described fin 3 includes size, the position of fin 3, by the correlation ginseng of shielding protection object
Number includes power, position, size and cooling requirements.
Fig. 2, a kind of shielding case structure for taking into account radiating, including grab breach 2 are referred to, for fixing spring fishhook 4;Screen
Over body case 1 is covered, for shielding device, the electricity of circuit, magnetic influence;Radiator window, what size and location radiated according to need is protected by shielding
Depending on the size of the object of shield and position.
Fig. 3 is referred to, is that an IC, fin 3 are dissipated for a grid-type by the object of shielding protection in a kind of specific embodiment
Hot time slice, 4 points of spring fishhook is three sections, interlude inlay card grid-type fin 3 between cog, two ends be each passed through be placed in it is described
Grab breach 2 on shielding over body case 1, realizes the fixation to spring fishhook 4, and radiator window is provided with shielding over body case 1, makes institute
The fin 3 stated and directly contacted by one layer of heat conduction foam between the IC of shielding protection, without being adopted as prior art
With two-layer heat conduction foam, so as to produce laddering thermal resistance, influence is radiated.
Fig. 4 is referred to, in actual production life, the Position Design from IC in shielding case structure is protected to the shielding for completing IC
Shield, with following steps:
(1) design phase, Hardware Engineer designs relative positions of the IC relative to shielding over body case 1 according to performance requirement,
And derived type structure drawing gives structure design engineer;
(2) structure design engineer draws a design according to outgoing mould factory after structural drawings adjustment, considers radiator window opening
Size and the deformation size of spring fishhook 4 etc.;
(3) shielding case structure supplied materials, the coordinate that the structural drawings that producers give according to Hardware Engineer is indicated is carried out
Paster is produced;
(4) after heat conduction foam is fixed on IC, fin 3 and spring fishhook 4 are loaded onto successively.
The shielding case structure for taking into account radiating in the invention is employed, due to being provided with scattered in the place of correspondence fin 3
Hot window, and be provided with snap notches and be used to fix spring fishhook 4, therefore the present invention compared to existing skill on shielding over body case 1
Art has the following advantages that:One layer of heat conduction foam material is reduced, laddering thermal resistance loss in heat transfer process is reduced, quite
Directly it is connected on fin 3 by heat conduction foam in by shielding protection object 6;The locking mode of fin 3 is spring fishhook 4
It is directly anchored to shield the position of grab breach 2 of over body case 1, reduces spring fishhook 4 compared to traditional method and be fixed to pcb board
When upper, the material of the fixed grab that may be reserved on the space of occupancy pcb board and pcb board;Assembling mode becomes more succinct, and
Convenient disassembly, after heat conduction foam is fixed on IC, loads onto fin 3 and spring fishhook 4 successively.At the same time by spring
Grab 4 is hooked in the position of grab breach 2 of shielding over body case 1.The size dimension of fin 3 is optional.
In this description, the present invention is described with reference to its specific embodiment.But it is clear that can still make
Various modifications and alterations are without departing from the spirit and scope of the present invention.Therefore, specification and drawings are considered as illustrative
And it is nonrestrictive.
Claims (5)
1. a kind of shielding case structure for taking into account radiating, described shielding case structure includes fin and shielding over body case, its feature
It is that described fin is fixedly installed in described shielding over body case by a spring fishhook, described shielding over body case
The setting area of upper correspondence fin and the size of fin, are provided with a radiator window, and are also set on described shielding over body case
Be equipped with grab breach, for the spring fishhook described in fixation, the relevant parameter of described fin be placed in the shielding case structure
In the relevant parameter by shielding protection object be adapted.
2. the shielding case structure for taking into account radiating according to claim 1, it is characterised in that being shielded in the shielding over body case
Cover and be additionally provided with a padded coaming between protection object and shielding over body case, be used to alleviate shielding over body case and by shielding protection thing
Contact stress between body.
3. the shielding case structure for taking into account radiating according to claim 2, it is characterised in that described padded coaming is heat conduction
Foam.
4. the shielding case structure for taking into account radiating according to claim 1, it is characterised in that described fin is a grid-type
Fin, described spring fishhook inlay card is in described grid-type fin, and two of the spring fishhook is separately fixed at screen
Cover the grab indentation, there on over body case.
5. the shielding case structure for taking into account radiating according to claim 1, it is characterised in that the related ginseng of described fin
Number includes size, the position of fin, and power, position, size and cooling requirements are included by the relevant parameter of shielding protection object.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710065286.5A CN106714522A (en) | 2017-02-06 | 2017-02-06 | Shielding cover structure with heat radiating function |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710065286.5A CN106714522A (en) | 2017-02-06 | 2017-02-06 | Shielding cover structure with heat radiating function |
Publications (1)
Publication Number | Publication Date |
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CN106714522A true CN106714522A (en) | 2017-05-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201710065286.5A Pending CN106714522A (en) | 2017-02-06 | 2017-02-06 | Shielding cover structure with heat radiating function |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108934153A (en) * | 2018-09-25 | 2018-12-04 | 南京禾鑫坊电子科技有限公司 | A kind of filter |
CN110933923A (en) * | 2019-12-11 | 2020-03-27 | 扬州鑫龙电器有限公司 | Modular but diversion installation shield cover |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2533509Y (en) * | 2001-11-27 | 2003-01-29 | 富准精密工业(深圳)有限公司 | Heatsink |
CN2790116Y (en) * | 2005-03-29 | 2006-06-21 | 华为技术有限公司 | Radiating and shielding structure |
CN1953646A (en) * | 2005-10-18 | 2007-04-25 | 鸿富锦精密工业(深圳)有限公司 | Heat radiator capable of preventing electromagnetic interference |
CN201726632U (en) * | 2010-04-15 | 2011-01-26 | 鸿富锦精密工业(深圳)有限公司 | Cooling plate fixing structure of electronic products |
CN202135445U (en) * | 2011-06-30 | 2012-02-01 | 武汉长光科技有限公司 | Radome for fixing radiating fin |
-
2017
- 2017-02-06 CN CN201710065286.5A patent/CN106714522A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2533509Y (en) * | 2001-11-27 | 2003-01-29 | 富准精密工业(深圳)有限公司 | Heatsink |
CN2790116Y (en) * | 2005-03-29 | 2006-06-21 | 华为技术有限公司 | Radiating and shielding structure |
CN1953646A (en) * | 2005-10-18 | 2007-04-25 | 鸿富锦精密工业(深圳)有限公司 | Heat radiator capable of preventing electromagnetic interference |
CN201726632U (en) * | 2010-04-15 | 2011-01-26 | 鸿富锦精密工业(深圳)有限公司 | Cooling plate fixing structure of electronic products |
CN202135445U (en) * | 2011-06-30 | 2012-02-01 | 武汉长光科技有限公司 | Radome for fixing radiating fin |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108934153A (en) * | 2018-09-25 | 2018-12-04 | 南京禾鑫坊电子科技有限公司 | A kind of filter |
CN110933923A (en) * | 2019-12-11 | 2020-03-27 | 扬州鑫龙电器有限公司 | Modular but diversion installation shield cover |
CN110933923B (en) * | 2019-12-11 | 2021-06-29 | 扬州鑫龙电器有限公司 | Modular but diversion installation shield cover |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |
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RJ01 | Rejection of invention patent application after publication |