CN2790116Y - Radiating and shielding structure - Google Patents
Radiating and shielding structure Download PDFInfo
- Publication number
- CN2790116Y CN2790116Y CNU200520056473XU CN200520056473U CN2790116Y CN 2790116 Y CN2790116 Y CN 2790116Y CN U200520056473X U CNU200520056473X U CN U200520056473XU CN 200520056473 U CN200520056473 U CN 200520056473U CN 2790116 Y CN2790116 Y CN 2790116Y
- Authority
- CN
- China
- Prior art keywords
- fin
- radome
- opening
- radiating
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Abstract
The utility model provides a radiating and shielding structure for the purpose of solving the problem that devices need radiating can not radiate well after adopting a shielding cover which has a complicated structure in the prior art. The radiating and shielding structure comprises one or more metal radiating fins on the surface of an exothermic device, which are arranged on a printed circuit board, and a shielding cover which carries out shielding for a region where the exothermic device is positioned, wherein the peripheral dimension of the basal bottom of each radiating fin is greater than the peripheral dimension of the exothermic device and an opening just corresponding to each radiating fin is arranged on the shielding cover. The dimension of the opening is smaller than the dimension of the basal bottom of the radiating fin just corresponding to the opening of which the periphery of the opening is well contacted with the upper surface of the radiating fin just corresponding to the opening, which enables the radiating fins to form a part of the shielding structure. After the structure of the utility model is adopted, the radiating fins can be still installed on the exothermic device even though the shielding cover needs to be installed so as to ensure favorable radiating and shielding effects and the shielding cover has the advantages of simple structure and convenient installation.
Description
Technical field
The utility model relates to the heat dissipation technology in the electronics or the communications field, more particularly, relates to heat radiation and shielding construction on a kind of printed circuit board.
Background technology
In electronic product, often need carry out electromagnetic shielding to certain part of printed circuit board assembly, a simple way is in the part that needs shield metallic shield to be installed, and this radome is welded on the printed circuit board.
As shown in Figure 1, when the caloric value of certain device 104 on the printed circuit board 102 is big, need dispel the heat in device surface installation fins formula or pin type fin 106 usually.Fin 108 or pin on the fin of being installed can increase area of dissipation, thereby by air more heat are taken away.
If desired the bigger electronic device of caloric value is shielded, in the prior art, because radome can cover in electronic device fully, this makes the air of radome inside not circulate with extraneous air, so cannot dispel the heat by aforesaid way at device surface installation fin.
For addressing this problem, the shell fragment or the projection of normally stretching out downwards in the prior art at the internal production of radome, and these shell fragments or projection are contacted with the device surface that needs heat radiation, thereby the heat that device is produced is transmitted on the radome, that is to say, make radome play the function of fin simultaneously.Its shortcoming is complex structure, required precision height, can increases the cost of radome; In addition, because the heat-sinking capability of radome is subjected to the restriction of radome size, and inner air can not circulate with the outside, so very likely can not satisfy radiating requirements.
The utility model content
The utility model provides a kind of heat radiation and shielding construction, can not good heat radiating to solve the device that needs heat radiation behind the available technology adopting radome, and the shielding case structure complicated problems.
For solving the problems of the technologies described above, the utility model provides a kind of heat radiation and shielding construction, comprise: be arranged on the metal fin on one or more heater members surface on the printed circuit board, also comprise the radome that the zone to described one or more heater members place shields; Also comprise:
The peripheral size of the substrate of each described fin is greater than the peripheral size of the heater members at its place;
On described radome with each fin over against the position be provided with an opening, the size of described opening less than its over against the size of foundation base of fin; The periphery of described opening with its over against the upper surface of fin well contact, make described fin constitute the part of shielding construction.
The periphery of described radome is installed on the described printed circuit board by bending structure.
Distance between the inboard of described radome and the described printed circuit board upper surface is slightly larger than the distance between described fin upper surface of substrate and the described printed circuit board upper surface.
The edge of each the described opening on the described radome is a laciniation, and downward-sloping suitable angle.
Described fin is fin type fin or pin type fin, fin on each described fin or pin from it over against described opening part reach described radome outside.
Adopt after the structure of the present utility model,, still fin can be installed on heater members, to guarantee good heat radiation and shield effectiveness even need radome is installed; And radome is simple in structure, easy for installation, and heat sink sizes also can not limited by radome.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the schematic diagram of the heater members on the printed circuit board of the prior art when fin is housed;
Fig. 2 is the heat radiation in preferred embodiment of the utility model and the vertical view of shielding construction;
Fig. 3 is the A-A cutaway view of Fig. 2;
Fig. 4 is the vertical view of radome shown in Fig. 2.
Embodiment
A preferred embodiment of the present utility model as shown in Figures 2 and 3.In the present embodiment,,, calculate the suitable fin type or the heat radiating fin structure of pin type by the traditional design mode at first according to conditions such as device heating amount, wind speed, limitation in height.On the basis of this design, with the substrate periphery of fin to around extend about 3mm, obtain final fin 106.
Then, according to the size of needs masked segment on the printed circuit board, the structure of design radome.Wherein, the distance from circuit board 102 upper surfaces to radome 112 inboards should increase about 0.5mm than the distance from circuit board 102 upper surfaces to fin 106 upper surface of substrate.
On radome with each device that need dispel the heat over against the position, be provided with an opening, the size of this opening is all dwindled 1mm than each limit of fin size of foundation base.Wherein, the edge of radome opening is designed to zigzag, about the pointed end inclination 1mm of sawtooth 116, thereby can guarantee good contact the between radome and the fin substrate, makes fin constitute the part of shielding construction.Simultaneously, design several " L " type pins on each limit of radome, and, then these pins are inserted in the corresponding circular hole at the relevant position of printed circuit board design slotted hole.
When carrying out the printed circuit board assembling, earlier fin 106 is installed on the electronic device 104 that needs heat radiation, radome 112 is installed again.The fin 108 of fin or pin stretch out from the opening part of radome, 116 on the sawtooth on radome opening edge edge push down the fin substrate around, continuous shielding is provided.After radome is inserted on the printed circuit board 102,, radome can be fixed, finish the welding of radome at last lower end 114 rotations 45 to 90 degree of " L " type pin.
Adopt after the structure of the present utility model,, still fin can be installed on heater members, to guarantee good heat radiation and shield effectiveness even need radome is installed; And radome is simple in structure, easy for installation, and heat sink sizes also can not limited by radome.
Claims (5)
1, a kind of heat radiation and shielding construction comprise: be arranged on the metal fin on one or more heater members surface on the printed circuit board, also comprise the radome that the zone to described one or more heater members place shields; It is characterized in that,
The peripheral size of the substrate of each described fin is greater than the peripheral size of the heater members at its place;
On described radome with each fin over against the position be provided with an opening, the size of described opening less than its over against the size of foundation base of fin; The periphery of described opening with its over against the upper surface of fin well contact, make described fin constitute the part of shielding construction.
2, heat radiation according to claim 1 and shielding construction is characterized in that, the periphery of described radome is installed on the described printed circuit board by bending structure.
3, heat radiation according to claim 2 and shielding construction is characterized in that, the distance between the inboard of described radome and the described printed circuit board upper surface is slightly larger than the distance between described fin upper surface of substrate and the described printed circuit board upper surface.
4, heat radiation according to claim 3 and shielding construction is characterized in that, the edge of each the described opening on the described radome is a laciniation, and downward-sloping suitable angle.
5, heat radiation according to claim 4 and shielding construction is characterized in that, described fin is fin type fin or pin type fin, fin on each described fin or pin from it over against described opening part reach described radome outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200520056473XU CN2790116Y (en) | 2005-03-29 | 2005-03-29 | Radiating and shielding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200520056473XU CN2790116Y (en) | 2005-03-29 | 2005-03-29 | Radiating and shielding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2790116Y true CN2790116Y (en) | 2006-06-21 |
Family
ID=36790449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200520056473XU Expired - Fee Related CN2790116Y (en) | 2005-03-29 | 2005-03-29 | Radiating and shielding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2790116Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7894183B2 (en) | 2008-04-25 | 2011-02-22 | Shenzhen Mindray Bio-Medical Electronics Co., Ltd. | Shielded and insulated heat removing system |
| US8181921B2 (en) | 2008-03-24 | 2012-05-22 | Shenzhen Mindray Bio-Medical Electronics Co., Ltd. | Platform telescoping mechanism |
| WO2013063748A1 (en) * | 2011-10-31 | 2013-05-10 | Thomson Licensing | Shielding structure for electronic device |
| WO2015144007A1 (en) * | 2014-03-27 | 2015-10-01 | 特富特科技(深圳)有限公司 | Enclosed housing for electromagnetic device |
| WO2016058182A1 (en) * | 2014-10-17 | 2016-04-21 | 华为技术有限公司 | Heat dissipation shielding structure and communication product |
| CN106714522A (en) * | 2017-02-06 | 2017-05-24 | 上海市共进通信技术有限公司 | Shielding cover structure with heat radiating function |
| CN107580449A (en) * | 2017-09-21 | 2018-01-12 | 广东欧珀移动通信有限公司 | Radome, radiating subassembly and electronic equipment |
| CN116761413A (en) * | 2023-08-24 | 2023-09-15 | 深圳市九洲卓能电气有限公司 | Circuit board shielding cover assembly of automobile |
-
2005
- 2005-03-29 CN CNU200520056473XU patent/CN2790116Y/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8181921B2 (en) | 2008-03-24 | 2012-05-22 | Shenzhen Mindray Bio-Medical Electronics Co., Ltd. | Platform telescoping mechanism |
| US7894183B2 (en) | 2008-04-25 | 2011-02-22 | Shenzhen Mindray Bio-Medical Electronics Co., Ltd. | Shielded and insulated heat removing system |
| WO2013063748A1 (en) * | 2011-10-31 | 2013-05-10 | Thomson Licensing | Shielding structure for electronic device |
| WO2015144007A1 (en) * | 2014-03-27 | 2015-10-01 | 特富特科技(深圳)有限公司 | Enclosed housing for electromagnetic device |
| WO2016058182A1 (en) * | 2014-10-17 | 2016-04-21 | 华为技术有限公司 | Heat dissipation shielding structure and communication product |
| US10292253B2 (en) | 2014-10-17 | 2019-05-14 | Huawei Technologies Co., Ltd. | Heat-dissipation and shielding structure and communications product |
| CN106714522A (en) * | 2017-02-06 | 2017-05-24 | 上海市共进通信技术有限公司 | Shielding cover structure with heat radiating function |
| CN107580449A (en) * | 2017-09-21 | 2018-01-12 | 广东欧珀移动通信有限公司 | Radome, radiating subassembly and electronic equipment |
| CN116761413A (en) * | 2023-08-24 | 2023-09-15 | 深圳市九洲卓能电气有限公司 | Circuit board shielding cover assembly of automobile |
| CN116761413B (en) * | 2023-08-24 | 2023-12-26 | 深圳市九洲卓能电气有限公司 | Circuit board shielding cover assembly of automobile |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060621 Termination date: 20100329 |