CN107295782A - The structure and terminal of a kind of silicagel pad suitable for terminal - Google Patents
The structure and terminal of a kind of silicagel pad suitable for terminal Download PDFInfo
- Publication number
- CN107295782A CN107295782A CN201710542557.1A CN201710542557A CN107295782A CN 107295782 A CN107295782 A CN 107295782A CN 201710542557 A CN201710542557 A CN 201710542557A CN 107295782 A CN107295782 A CN 107295782A
- Authority
- CN
- China
- Prior art keywords
- silicagel pad
- chip
- terminal
- height
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 120
- 239000000741 silica gel Substances 0.000 title claims abstract description 120
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 120
- 229960001866 silicon dioxide Drugs 0.000 title claims abstract description 120
- 238000004080 punching Methods 0.000 claims description 3
- 238000010276 construction Methods 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 abstract 1
- 239000000956 alloy Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present embodiments relate to the structure and terminal of field of terminal equipment, more particularly to a kind of silicagel pad suitable for terminal, for contact chip cooling and be used as supporting construction.In the embodiment of the present invention, the structure of silicagel pad includes：At least two through holes in silicagel pad；At least two through holes are used to radiate to each chip at least one chip；Wherein, silicagel pad is located between terminal enclosure and at least one chip.Because in the embodiment of the present invention, each chip slapper at least one chip produces heat in the course of work, by being provided with least two through holes in silicagel pad, it is possible to achieve each chip is radiated；Further, silicagel pad is located between terminal enclosure and at least one chip, in this way, silicagel pad can support terminal enclosure and chip as flexible support structure again.
Description
Technical field
The present embodiments relate to field of terminal equipment, more particularly to a kind of structure of silicagel pad suitable for terminal and end
End.
Background technology
With widely using for terminal, requirement more and more higher of the user to terminal structure.Terminal structure includes centre
Manage device (Central Processing Unit, abbreviation CPU) chip and memory Memory chips etc., due to cpu chip and
Memory chips can produce substantial amounts of heat, it is necessary to be radiated in time during work, otherwise can cause terminal device event
Barrier.
In the prior art, gap is left between cpu chip or plane and metal-back where Memory chips, this is due to
What the material tolerance and terminal structure of chip and metal-back were caused in installation process.Wherein, the width in gap is about 0.3-
0.5mm, the gap can cause the structural instability in terminal；The mainboard being likely to result in terminal was deformed upon or at end
End unbalance stress causes the deformation of other structures, or makes chip stress when terminal is staggered along impact, causes failure of chip.
At present, in order to avoid above mentioned problem, generally with heat-conducting silica gel sheet come blind.Heat-conducting silica gel sheet blind it
Afterwards, it can solve the above problems, and the heat produced when can be to cpu chip and Memory chip operations radiates.But
It is one side, when with heat-conducting silica gel sheet blind, the heat transfer temperature rise between the heating position and radiator portion of chip
It can not solve；On the other hand, with heat conductive silica gel radiating following metal-back can be caused to generate heat, that is, causes terminal hot.Therefore, need badly
Corresponding solution.
The content of the invention
The embodiments of the invention provide a kind of structure and terminal of the silicagel pad suitable for terminal, for the chip to contact
Radiating and it is used as supporting construction.
The embodiment of the present invention provides a kind of structure of silicagel pad suitable for terminal, including：In silicagel pad at least
Two through holes；At least two through holes are used to radiate to each chip at least one chip；Wherein, silicagel pad is located at eventually
Between end housing and at least one chip.
Alternatively, the shape of the cross section of each through hole includes any one of herein below at least two through holes：Just
Square, rectangle, circle, triangle, rhombus, ellipse；Wherein, two through holes adjacent at least two through holes formation day word
Shape.
Alternatively, the heat conductivility of silicagel pad is less than heat conduction threshold value.
Alternatively, the shape of silicagel pad and the form fit of chip.
Alternatively, the thickness of silicagel pad is determined according to the height in gap between chip and terminal enclosure；The thickness of silicagel pad
It is less than thickness threshold value with the absolute value of the difference of the height in gap.
Alternatively, silicagel pad includes first end and the second end；At least two chips include the first chip and the second chip；Silicon
The first end of rubber cushion is located between terminal enclosure and the first chip, the second end of silicagel pad be located at terminal enclosure and the second chip it
Between.
Alternatively, the absolute value of the difference of the height in the thickness of the first end of silicagel pad and the first gap is less than thickness threshold
Value；The absolute value of the difference of the thickness at the second end of silicagel pad and the height in the second gap is less than thickness threshold value；Wherein, the first seam
The height of gap is determined according to the height between the first chip and terminal enclosure；The height in the second gap is according to the second chip and terminal
The height in gap is determined between shell.
Alternatively, each through hole at least two through holes in silicagel pad is formed by punching press or oil pressure.
The embodiment of the present invention provides a kind of terminal, wraps the structure for stating silicagel pad.
In the embodiment of the present invention, the structure of silicagel pad includes at least two through holes being located in silicagel pad；At least two lead to
Hole is used to radiate to each chip at least one chip；Wherein, silicagel pad is located at terminal enclosure and at least one core
Between piece.Due in the embodiment of the present invention, each chip slapper at least one chip produces heat in the course of work, by
At least two through holes are provided with silicagel pad, it is possible to achieve each chip is radiated；Further, silicagel pad is located at outside terminal
Between shell and at least one chip, in this way, silicagel pad can support terminal enclosure and chip as flexible support structure again.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, makes required in being described below to embodiment
Accompanying drawing is briefly introduced.
Fig. 1 is a kind of structural representation of the terminal including silicagel pad provided in an embodiment of the present invention；
Fig. 2 is a kind of structural representation of silicagel pad provided in an embodiment of the present invention；
Fig. 3 is the structural representation of another silicagel pad provided in an embodiment of the present invention；
Fig. 4 is a kind of terminal structure schematic diagram of embedded silicagel pad provided in an embodiment of the present invention；
Fig. 5 is the structural representation of another terminal including silicagel pad provided in an embodiment of the present invention；
Fig. 6 is the structural representation of the thickness of silicagel pad in this Fig. 5.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
Fig. 1 shows a kind of structural representation of terminal including silicagel pad using the embodiment of the present invention.Such as Fig. 1 institutes
Show, the structure includes silicagel pad 100, silicagel pad is located between terminal enclosure 102 and at least one chip, at least one chip bag
Chip 103 is included, at least two through holes in silicagel pad 101, through hole 101a and through hole 101b；At least two through holes be used for pair
Each chip at least one chip is radiated.
Because in the embodiment of the present invention, the structure of silicagel pad includes at least two through holes being located in silicagel pad；At least two
Individual through hole is used to radiate to chip；Wherein, silicagel pad is located between terminal enclosure and at least one chip, at least one core
Each chip in piece produces heat in the course of work, by being provided with least two through holes in silicagel pad, it is possible to achieve right
Each chip is radiated；Further, silicagel pad is located between terminal enclosure and at least one chip, in this way, silicagel pad may be used again
To support terminal enclosure and chip as flexible support structure.
Silicagel pad 100 in the embodiment of the present invention can have shown in a variety of, as shown in Figure 2 silicagel pad 101 and Fig. 3
Silicagel pad 107.Fig. 2 shows a kind of structural representation of silicagel pad using the embodiment of the present invention.As shown in Fig. 2 silicagel pad
Include the shape of the cross section of each through hole at least two through holes, through hole 101a and through hole 101b, at least two through holes on 101
Including any one of herein below：Square, rectangle, circle, triangle, rhombus, ellipse.Alternatively, at least two lead to
Two adjacent through holes formation day font in hole.
4,6 or more through hole can be set in the embodiment of the present invention, in silicagel pad, 4,6 or more
Through hole between form day font or matrix pattern.Fig. 3 shows the structure of another silicagel pad using the embodiment of the present invention
Schematic diagram.As shown in figure 3, including 8 through holes in silicagel pad 107：Through hole 107a, through hole 107b, through hole 107c, through hole 107d,
Through hole 107e, through hole 107f, through hole 107g, through hole 107h, the shape of the cross section of each through hole include square, four through holes
Between form matrix pattern.
A kind of implementation that through hole is formed in silicagel pad is provided in the embodiment of the present invention：At least two in silicagel pad
Each through hole in individual through hole is formed by punching press or oil pressure.
Shape, thickness, quantity of through hole of silicagel pad in the embodiment of the present invention etc. are set according to the demand of terminal structure；
In specific implementation, the shape of silicagel pad is set according to actual needs, and two kinds of silicagel pads are provided in the embodiment of the present invention
The facilities of shape, a kind of is the shape of silicagel pad and the form fit of chip；It is easy to the heating part of chip to pass through silicagel pad
Through hole radiated, the problem of temperature rise of terminal can be solved.Another is the shape of the shape of silicagel pad and terminal enclosure
Match somebody with somebody, it is possible to achieve silicagel pad is embedded in terminal enclosure.Fig. 4 shows a kind of end of embedded silicagel pad using the embodiment of the present invention
End structure schematic diagram.As shown in figure 4, terminal enclosure can be terminal alloy shell 102a, silicagel pad 107, the shape of silicagel pad 107
Shape, the size of shape, size and terminal alloy shell 102a match, silicagel pad insertion terminal alloy shell 102a position.
Alternatively, the heat conductivility of silicagel pad is less than heat conduction threshold value.In the embodiment of the present invention, the material of silicagel pad is included not
Heat conductive silica gel, includes at least two through holes on not heat conductive silica gel, and two through holes are used for each core at least one chip
Piece is radiated, and can realize silicagel pad not in heat transfer to housing.Moreover, the present invention, which implements silica gel in power, is lined with one
Fixed tension force, pliability, insulating properties, pressure-resistant, high temperature resistant, low temperature resistant, chemical property stabilization, Environmental Safety, free from extraneous odour, do not dissolve in
Water or any solvent, are a kind of green products of high activity.
A kind of terminal enclosure alternatively is provided in the embodiment of the present invention, the terminal enclosure includes terminal alloy shell,
Plane where chip and there is gap between terminal alloy shell, be embedded in silicagel pad in gap, realized using the silicagel pad
Chip and terminal alloy shell are supported, when helping to solve mobile terminal, mainboard deformation or unbalance stress or impact of staggering along make
Chip stress, causes the problem of chip rosin joint connects energy failure.
Alternatively, the thickness of silicagel pad is determined according to the height in gap between chip and terminal enclosure；The thickness of silicagel pad
It is less than thickness threshold value with the absolute value of the difference of the height in gap.In specific implementation, because silicagel pad belongs to flexible material, silica gel
The thickness of pad can cause structure connection more to encrypt slightly larger than the height in gap between chip and terminal enclosure.
Fig. 5 shows the structural representation of another terminal including silicagel pad using the embodiment of the present invention.Such as Fig. 5 institutes
Show, the terminal includes terminal enclosure 102, silicagel pad 107, mainboard 104, silicagel pad 107 includes the end 106 of first end 105 and second；
At least two chips include the first chip 103 and the second chip 103a；The first end 105 of silicagel pad is located at the He of terminal enclosure 102
Between first chip 103, the second end 106 of silicagel pad is located between the core 103a pieces of terminal enclosure 102 and second.Alternatively,
One chip and the second chip can be the same or different, and the first chip and the second chip include cpu chip and Memory chips.
Fig. 6 shows the structural representation of the thickness of silicagel pad in Fig. 5.As shown in Figure 6；The terminal includes terminal enclosure
102, silicagel pad 107, silicagel pad 107 include the end 106 of first end 105 and second, the first chip 103 and the second chip 103a, silicon
The first end 105 of rubber cushion is located between the chip 103 of terminal enclosure 102 and first, and the second end 106 of silicagel pad is located at terminal enclosure
102 and second between core 103a pieces, the thickness H of the first end 105 of silicagel pad1With the height h in the first gap1Difference it is absolute
Value is less than thickness threshold value；The thickness H at the second end 106 of silicagel pad2With the height h in the second gap2Difference absolute value be less than thickness
Spend threshold value；Wherein, the height in the first gap is determined according to the height between the first chip and terminal enclosure；The height in the second gap
Determined according to the height in gap between the second chip and terminal enclosure.In the embodiment of the present invention, the first end thickness of silicagel pad is omited
More than the height in the first gap；Second end thickness of silicagel pad is slightly larger than the height in the second gap；In this way, silicagel pad can be caused
Between embedded terminal enclosure and chip so that structure is completely embedded.
Alternatively, above-mentioned silica gel mat structure is applied to terminal, and the terminal, which includes mobile phone, tablet personal computer etc., includes housing, core
Any terminal structure of piece and silicagel pad.
It should be noted is that：The explanation of the structure of above-mentioned silicagel pad is only exemplary and explanatory, is not used to
Limit the present invention.
It can be seen from the above：Because in the embodiment of the present invention, the structure of silicagel pad includes being located in silicagel pad
At least two through holes；At least two through holes are used to radiate to each chip at least one chip；Wherein, silicagel pad position
Between terminal enclosure and at least one chip.Because in the embodiment of the present invention, each chip slapper at least one chip exists
The course of work produces heat, by being provided with least two through holes in silicagel pad, it is possible to achieve each chip is radiated；
Further, silicagel pad is located between terminal enclosure and at least one chip, in this way, silicagel pad can be used as flexible support structure again
Support terminal enclosure and chip.
, but those skilled in the art once know basic creation although preferred embodiments of the present invention have been described
Property concept, then can make other change and modification to these embodiments.So, appended claims are intended to be construed to include excellent
Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (9)
1. a kind of structure of silicagel pad suitable for terminal, it is characterised in that including：
At least two through holes in the silicagel pad；At least two through hole is used for each at least one chip
Chip is radiated；
Wherein, the silicagel pad is located between terminal enclosure and at least one described chip.
2. structure as claimed in claim 1, it is characterised in that the shape of the cross section of each through hole at least two through hole
Shape includes any one of herein below：
Square, rectangle, circle, triangle, rhombus, ellipse.
3. structure as claimed in claim 1, it is characterised in that the heat conductivility of the silicagel pad is less than heat conduction threshold value.
4. structure as claimed in claim 1, it is characterised in that the shape of the silicagel pad and the form fit of the chip.
5. structure as claimed in claim 1, it is characterised in that the thickness of the silicagel pad is according to the chip and the terminal
The height in gap is determined between shell；
The thickness of the silicagel pad and the absolute value of the difference of the height in the gap are less than thickness threshold value.
6. structure as claimed in claim 1, it is characterised in that the silicagel pad includes first end and the second end；It is described at least
Two chips include the first chip and the second chip；
The first end of the silicagel pad is located between the terminal enclosure and the first chip, and the second end of the silicagel pad is located at institute
State between terminal enclosure and the second chip.
7. structure as claimed in claim 6, it is characterised in that the thickness of the first end of the silicagel pad and the height in the first gap
The absolute value of the difference of degree is less than the thickness threshold value；The thickness at the second end of the silicagel pad and the height in second gap
Difference absolute value be less than the thickness threshold value；
Wherein, the height in first gap is determined according to the height between first chip and the terminal enclosure；It is described
The height in the second gap is determined according to the height in gap between second chip and the terminal enclosure.
8. structure as claimed in claim 1, it is characterised in that at least two through holes positioned in the silicagel pad
Each through hole is formed by punching press or oil pressure.
9. a kind of terminal, it is characterised in that including：The structure of silicagel pad described in any one of claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710542557.1A CN107295782B (en) | 2017-07-05 | 2017-07-05 | Silica gel pad structure suitable for terminal and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710542557.1A CN107295782B (en) | 2017-07-05 | 2017-07-05 | Silica gel pad structure suitable for terminal and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107295782A true CN107295782A (en) | 2017-10-24 |
| CN107295782B CN107295782B (en) | 2024-02-23 |
Family
ID=60100887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710542557.1A Active CN107295782B (en) | 2017-07-05 | 2017-07-05 | Silica gel pad structure suitable for terminal and terminal |
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| Country | Link |
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| CN (1) | CN107295782B (en) |
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