CN216671609U

CN216671609U - Three-dimensional chip that piles up of area heat dissipation function

Info

Publication number: CN216671609U
Application number: CN202123335078.3U
Authority: CN
Inventors: 刘伟
Original assignee: Shenzhen Gaote Microelectronics Co ltd
Current assignee: Shenzhen Gaote Microelectronics Co ltd
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2022-06-03
Anticipated expiration: 2031-12-28

Abstract

The utility model relates to the technical field of three-dimensional stacked chips, in particular to a three-dimensional stacked chip with a heat dissipation function, which comprises a chip main board, wherein one side of the chip main board is fixedly connected with a plurality of pins, one side of the chip main board is fixedly connected with four telescopic columns, the outer surfaces of the four telescopic columns are respectively provided with a spring, one side of each telescopic column is fixedly connected with a protection plate, and one side of the main board is fixedly connected with a heat dissipation plate. The utility model has the advantages that: according to the utility model, the telescopic column and the protection plate are arranged, the protection plate can play a role of isolating pins, when the chip is not required to be installed for use, the elastic force of the spring can push the protection plate to be away from the pins to isolate and protect the chip, when the chip is required to be installed, and the chip mainboard is pressed down, the protection plate can gradually approach the pins until the pins pass through the pin jacks, so that the pins can be contacted with contacts on the installation plate.

Description

Three-dimensional chip that piles up of area heat dissipation function

Technical Field

The utility model relates to the technical field of three-dimensional stacked chips, in particular to a three-dimensional stacked chip with a heat dissipation function.

Background

In the three-dimensional stacked chip structure, the heat of the internal chip is difficult to dissipate, so the highest temperature of the stacked chip can appear in the internal chip, and the temperature of the internal chip is too high, so that the chip is easy to lose efficacy, and the improvement of the integration level and the power of the whole device is limited. At present, the best scheme for the heat dissipation treatment of the three-dimensional stacked chip structure is to arrange a process micro-channel with certain height, width and length in a packaged chip, liquid enters from the micro-channel and takes away heat conducted to the heat dissipation structure by the chip, but pins on the chip are particularly easy to deform and bend when the existing stacked chip is stored or installed, particularly during the storage process before installation, if the pins deform in a bending manner, poor contact can be caused, the chip cannot work normally, and the pins are very difficult to repair due to small size.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provides a three-dimensional stacked chip with a heat dissipation function.

The purpose of the utility model is realized by the following technical scheme: the utility model provides a three-dimensional chip that piles up of area heat dissipation function, includes the chip mainboard, a plurality of stitches of one side fixedly connected with of chip mainboard, four flexible posts of one side fixedly connected with of chip mainboard, four the surface of flexible post all is provided with a spring, protection shield of one side fixedly connected with of flexible post, heating panel of one side fixedly connected with of mainboard.

Optionally, the chip mainboard is a cuboid structure, and is a plurality of the bottom surface of stitch perpendicular to chip mainboard is a plurality of the stitch is linear array distribution, and is a plurality of the stitch is cylindrical.

Optionally, four one side of telescopic link is fixed connection respectively in the four corners of chip mainboard one side, four one side of telescopic link perpendicular to chip mainboard, and four the length of telescopic link is greater than the length of stitch.

Optionally, the inside of the spring is respectively sleeved on the outer surfaces of the four telescopic rods, and two sides of the spring are respectively lapped with one side of the chip main board and one side of the protection plate.

Optionally, the size of the protection board is the same as that of the chip main board, a plurality of pin jacks are formed in one side of the protection board, the pin jacks penetrate through one side of the protection board, the inner surfaces of the pin jacks are matched with the outer surfaces of pins, and the positions of the pin jacks correspond to the positions of the pins.

Optionally, the heat dissipation plate is of a cuboid plate structure, and the size of the heat dissipation plate is larger than that of the chip main board.

Optionally, a plurality of placing grooves are formed in one side of the heat dissipation plate, the placing grooves are distributed in a linear array mode, a heat dissipation copper pipe is clamped inside each placing groove, and the diameter of each heat dissipation copper pipe is the same as the depth of each placing groove.

Optionally, one side of the heat dissipation plate, which is far away from the chip main board, is provided with a cover plate, the size of the cover plate is equal to that of the heat dissipation plate, the cover plate is fixedly connected with the heat dissipation plate through a plurality of screws, and the cover plate is made of metal aluminum.

The utility model has the following advantages:

when the existing stacked chip is stored or installed, pins on the chip are particularly easy to deform and bend, particularly in the storage process before installation, poor contact can be caused if the pins are bent and deformed, and the chip cannot work normally.

Drawings

FIG. 1 is a schematic view of the structure of the present invention;

FIG. 2 is an enlarged schematic view of FIG. 1 at A according to the present invention;

FIG. 3 is a schematic view of the connection structure of the heat dissipation copper tube of the present invention;

fig. 4 is a schematic structural diagram of the protection board of the present invention.

In the figure: 1-chip mainboard, 2-pins, 3-telescopic columns, 4-springs, 5-protective plates, 501-pin jacks, 6-heat dissipation plates, 601-placing grooves, 602-heat dissipation copper pipes and 7-cover plates.

Detailed Description

The utility model will be further described with reference to the accompanying drawings, but the scope of the utility model is not limited to the following.

As shown in fig. 1-4, a three-dimensional stacked chip with a heat dissipation function includes a chip main board 1, a plurality of pins 2 fixedly connected to one side of the chip main board 1, four telescopic columns 3 fixedly connected to one side of the chip main board 1, a spring 4 disposed on the outer surface of each of the four telescopic columns 3, a protection plate 5 fixedly connected to one side of each of the telescopic columns 3, and a heat dissipation plate 6 fixedly connected to one side of the main board 1.

As a preferred technical scheme of the utility model: chip mainboard 1 is a cuboid structure, the bottom surface of a plurality of stitch 2 perpendicular to chip mainboard 1, and a plurality of stitch 2 are linear array and distribute, and a plurality of stitch 2 are cylindrical.

As a preferred technical scheme of the utility model: one side of four telescopic links 3 is fixed connection respectively in the four corners of chip mainboard 1 one side, and one side of four telescopic links 3 perpendicular to chip mainboard 1, and the length of four telescopic links 3 is greater than the length of stitch 2.

As a preferred technical scheme of the utility model: the inside of spring 4 cup joints respectively in the surface of four telescopic links 3, and the both sides of spring 4 overlap joint with one side of chip mainboard 1 and protection shield 5 respectively.

As a preferred technical scheme of the utility model: the size of the protection plate 5 is the same as that of the chip mainboard 1, one side of the protection plate 5 is provided with a plurality of pin jacks 501, the plurality of pin jacks 501 penetrate one side of the protection plate 5, the inner surfaces of the plurality of pin jacks 501 are matched with the outer surfaces of the pins 2, and the positions of the plurality of pin jacks 501 correspond to the positions of the pins 2, when the existing stacked chip is stored or installed, the pins on the chip are particularly easy to deform and bend, particularly in the storage process before installation, if the pins are deformed in a bending way, poor contact can be caused, the chip cannot work normally, and the pins are very difficult to repair due to small size, the protection plate 5 can play a role of isolating the pins 2 by arranging the telescopic columns 3 and the protection plate 5, when the chip is not required to be installed, the elasticity of the springs 4 can prop against the protection plate 5 to be far away from the pins 2 to conduct isolation protection, when the chip needs to be mounted and the chip main board 1 is pressed down, the protection board 5 will gradually approach the pins 2 until the pins 2 pass through the pin insertion holes 501, so that the pins 2 can contact with the contacts on the mounting board.

As a preferred technical scheme of the utility model: the heat dissipation plate 6 is of a cuboid plate-shaped structure, and the size of the heat dissipation plate 6 is larger than that of the chip mainboard 1.

As a preferred technical scheme of the utility model: a plurality of standing grooves 601 have been seted up to one side of heating panel 6, and a plurality of standing grooves 601 are linear array and distribute, and the equal joint in inside of every standing groove 601 has a heat dissipation copper pipe 602, and the diameter of heat dissipation copper pipe 602 is the same with the degree of depth of standing groove 601, and heat dissipation copper pipe 602 is the copper structure, and the inside of heat dissipation copper pipe 602 is provided with the coolant liquid, can carry out fine heat dissipation to chip mainboard 1.

As a preferred technical scheme of the utility model: one side that chip mainboard 1 was kept away from to heating panel 6 is provided with a apron 7, and the size of apron 7 equals with the size of heating panel 6, and apron 7 is through a plurality of screws and 6 fixed connection of heating panel, and the material of apron 7 is metallic aluminum, and heat dissipation silicone grease can be paintd to one side of apron 7, further dispels the heat to whole chip, and 7 heat conductivities of apron of metallic aluminum material are better, and the radiating rate is faster.

In summary, the following steps: when the existing stacked chip is stored or installed, pins on the chip are particularly easy to deform and bend, particularly in the storage process before installation, poor contact can be caused if the pins are bent and deformed, the chip cannot work normally, and the pins are very difficult to repair due to small size.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a three-dimensional chip that piles up of area heat dissipation function which characterized in that: including chip mainboard (1), a plurality of stitch (2) of one side fixedly connected with of chip mainboard (1), four flexible post (3), four of one side fixedly connected with of chip mainboard (1) the surface of flexible post (3) all is provided with one spring (4), protection shield (5) of one side fixedly connected with of flexible post (3), heating panel (6) of one side fixedly connected with of mainboard (1).

2. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: chip mainboard (1) is a cuboid structure, and is a plurality of bottom surface of stitch (2) perpendicular to chip mainboard (1) is a plurality of stitch (2) are linear array and distribute, and are a plurality of stitch (2) are cylindrical.

3. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: four one side of flexible post (3) is fixed connection respectively in the four corners of chip mainboard (1) one side, four one side of flexible post (3) perpendicular to chip mainboard (1), and four the length of flexible post (3) is greater than the length of stitch (2).

4. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: the inner part of the spring (4) is respectively sleeved on the outer surfaces of the four telescopic columns (3), and the two sides of the spring (4) are respectively in lap joint with one side of the chip main board (1) and one side of the protection board (5).

5. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: the size of protection shield (5) is the same with the size of chip mainboard (1), a plurality of stitch jack (501), a plurality of have been seted up to one side of protection shield (5) stitch jack (501) run through to one side of protection shield (5), a plurality of the internal surface of stitch jack (501) and the surface looks adaptation of stitch (2), a plurality of the position of stitch jack (501) is corresponding with the position of stitch (2).

6. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: the heating panel (6) is of a cuboid plate-shaped structure, and the size of the heating panel (6) is larger than that of the chip main board (1).

7. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: a plurality of placing grooves (601) are formed in one side of the heat dissipation plate (6), the placing grooves (601) are distributed in a linear array mode, a heat dissipation copper pipe (602) is clamped inside each placing groove (601), and the diameter of each heat dissipation copper pipe (602) is the same as the depth of each placing groove (601).

8. The three-dimensional stacked chip with the heat dissipation function according to claim 1, wherein: one side that chip mainboard (1) was kept away from in heating panel (6) is provided with a apron (7), the size of apron (7) equals with the size of heating panel (6), apron (7) are through a plurality of screws and heating panel (6) fixed connection, the material of apron (7) is metallic aluminum.