CN207410645U - The structure and terminal of a kind of silicagel pad suitable for terminal - Google Patents
The structure and terminal of a kind of silicagel pad suitable for terminal Download PDFInfo
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- CN207410645U CN207410645U CN201720808188.1U CN201720808188U CN207410645U CN 207410645 U CN207410645 U CN 207410645U CN 201720808188 U CN201720808188 U CN 201720808188U CN 207410645 U CN207410645 U CN 207410645U
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Abstract
The utility model embodiment is related to the structure and terminal of field of terminal equipment more particularly to a kind of silicagel pad suitable for terminal, for contact chip cooling and as support construction.In the utility model embodiment, the structure of silicagel pad includes：At least two through holes in silicagel pad；At least two through holes are used to radiate to each chip at least one chip；Wherein, silicagel pad is between terminal enclosure and at least one chip.Since in the utility model embodiment, each chip slapper at least one chip generates heat in the course of work, by being provided at least two through holes in silicagel pad, can realize and radiate to each chip；Further, silicagel pad is between terminal enclosure and at least one chip, in this way, silicagel pad can be used as flexible support structure support terminal enclosure and chip again.
Description
Technical field
The utility model embodiment is related to the structure of field of terminal equipment more particularly to a kind of silicagel pad suitable for terminal
And terminal.
Background technology
With widely using for terminal, requirement of the user to terminal structure is higher and higher.Terminal structure includes centre
Manage device (Central Processing Unit, abbreviation CPU) chip and memory Memory chips etc., due to cpu chip and
Memory chips can generate substantial amounts of heat, it is necessary to radiate in time during work, and no it will cause terminal device events
Barrier.
In the prior art, gap is left between cpu chip or plane where Memory chips and metal-back, this is because
The material tolerance and terminal structure of chip and metal-back are caused by installation process.Wherein, the width in gap is about 0.3-
0.5mm, the gap can cause the structural instability in terminal；The mainboard being likely to result in terminal deformed upon or at end
End unbalance stress causes the deformation of other structures or makes chip stress when terminal is staggered along impact, causes failure of chip.
At present, in order to avoid the above problem, usually with heat-conducting silica gel sheet come blind.Heat-conducting silica gel sheet blind it
Afterwards, it can solve the above problems, and can radiate to the heat generated when cpu chip and Memory chip operations.But
Be on the one hand, when with heat-conducting silica gel sheet blind, the heat transfer Wen Sheng between the heating position and radiator portion of chip
It can not solve；On the other hand, with heat conductive silica gel heat dissipation following metal-back can be caused to generate heat, that is, causes terminal hot.Therefore, there is an urgent need for
Corresponding solution.
Utility model content
The utility model embodiment provides a kind of structure and terminal of the silicagel pad suitable for terminal, for contact
Chip cooling and as support construction.
The utility model embodiment provides a kind of structure of silicagel pad suitable for terminal, including：In silicagel pad
At least two through holes；At least two through holes are used to radiate to each chip at least one chip；Wherein, silicagel pad position
Between terminal enclosure and at least one chip.
Optionally, the shape of the cross section of each through hole includes any one of herein below at least two through holes：Just
Square, rectangle, circle, triangle, diamond shape, ellipse；Wherein, two through holes adjacent at least two through holes form day word
Shape.
Optionally, the heat conductivility of silicagel pad is less than heat conduction threshold value.
Optionally, the shape of silicagel pad and the form fit of chip.
Optionally, the thickness of silicagel pad is determined according to the height in gap between chip and terminal enclosure；The thickness of silicagel pad
It is less than thickness threshold value with the absolute value of the difference of the height in gap.
Optionally, silicagel pad includes first end and second end；At least two chips include the first chip and the second chip；Silicon
The first end of rubber cushion between terminal enclosure and the first chip, the second end of silicagel pad be located at terminal enclosure and the second chip it
Between.
Optionally, the absolute value of the difference of the height in the thickness of the first end of silicagel pad and the first gap is less than thickness threshold
Value；The absolute value of the difference of the height in the thickness of the second end of silicagel pad and the second gap is less than thickness threshold value；Wherein, the first seam
The height of gap is determined according to the height between the first chip and terminal enclosure；The height in the second gap is according to the second chip and terminal
The height in gap determines between shell.
Optionally, each through hole at least two through holes in silicagel pad is formed by punching press or oil pressure.
The utility model embodiment provides a kind of terminal, wraps the structure for stating silicagel pad.
In the utility model embodiment, the structure of silicagel pad includes at least two through holes being located in silicagel pad；At least two
A through hole is used to radiate to each chip at least one chip；Wherein, silicagel pad is located at terminal enclosure and at least one
Between a chip.Since in the utility model embodiment, each chip slapper at least one chip generates heat in the course of work
Amount by being provided at least two through holes in silicagel pad, can be realized and radiated to each chip；Further, silicagel pad
Between terminal enclosure and at least one chip, in this way, silicagel pad can be used as flexible support structure to support terminal enclosure again
And chip.
Description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly introduced.
Fig. 1 is a kind of structure diagram for terminal including silicagel pad that the utility model embodiment provides；
Fig. 2 is a kind of structure diagram for silicagel pad that the utility model embodiment provides；
Fig. 3 is the structure diagram for another silicagel pad that the utility model embodiment provides；
Fig. 4 is a kind of terminal structure schematic diagram for embedded silicagel pad that the utility model embodiment provides；
Fig. 5 is the structure diagram for the terminal that the another kind that the utility model embodiment provides includes silicagel pad；
Fig. 6 is the structure diagram of the thickness of silicagel pad in this Fig. 5.
Specific embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, those of ordinary skill in the art's all other embodiments obtained without creative efforts, belongs to
The scope of the utility model protection.
Fig. 1 shows a kind of structure diagram of terminal including silicagel pad using the utility model embodiment.Such as Fig. 1
Shown, which includes silicagel pad 100, and silicagel pad is between terminal enclosure 102 and at least one chip, at least one chip
Including chip 103, at least two through holes in silicagel pad 101, through hole 101a and through hole 101b；At least two through holes are used for
It radiates to each chip at least one chip.
Since in the utility model embodiment, the structure of silicagel pad includes at least two through holes being located in silicagel pad；Extremely
Few two through holes are used to radiate to chip；Wherein, silicagel pad is between terminal enclosure and at least one chip, and at least one
Each chip in a chip generates heat in the course of work, by being provided at least two through holes, Ke Yishi in silicagel pad
Now radiate to each chip；Further, silicagel pad is between terminal enclosure and at least one chip, in this way, silicagel pad
Flexible support structure support terminal enclosure and chip can be used as again.
Silicagel pad 100 in the utility model embodiment can there are many, silicagel pad 101 as shown in Figure 2 and Fig. 3 institutes
The silicagel pad 107 shown.Fig. 2 shows a kind of structure diagram of silicagel pad using the utility model embodiment.Such as Fig. 2 institutes
Show, at least two through holes, through hole 101a and through hole 101b are included in silicagel pad 101, the horizontal stroke of each through hole at least two through holes
The shape in section includes any one of herein below：Square, rectangle, circle, triangle, diamond shape, ellipse.Optionally,
Two adjacent through holes form stud at least two through holes.
Can be set in the utility model embodiment, in silicagel pad 4,6 either more through holes 4,6 or
Stud or matrix pattern are formed between more through holes.Fig. 3 shows another silica gel using the utility model embodiment
The structure diagram of pad.As shown in figure 3, include 8 through holes in silicagel pad 107：It is through hole 107a, through hole 107b, through hole 107c, logical
Hole 107d, through hole 107e, through hole 107f, through hole 107g, through hole 107h, the shape of the cross section of each through hole include square,
Matrix pattern is formed between four through holes.
A kind of realization method that through hole is formed in silicagel pad is provided in the utility model embodiment：In silicagel pad extremely
Each through hole in few two through holes is formed by punching press or oil pressure.
The shape of silicagel pad in the utility model embodiment, thickness, the quantity etc. of through hole are according to the demand of terminal structure
Setting；In specific implementation, the shape of silicagel pad is set according to actual needs, and two kinds are provided in the utility model embodiment
The facilities of the shape of silicagel pad, a kind of is the shape of silicagel pad and the form fit of chip；Lead to convenient for the heating part of chip
The through hole for crossing silicagel pad radiates, and can solve the problem of temperature rise of terminal.Another kind is the shape and terminal enclosure of silicagel pad
Form fit, can realize silicagel pad be embedded in terminal enclosure.Fig. 4 shows a kind of insertion using the utility model embodiment
The terminal structure schematic diagram of formula silicagel pad.As shown in figure 4, terminal enclosure can be terminal alloy shell 102a, silicagel pad 107,
Shape, the size of the shape of silicagel pad 107, size and terminal alloy shell 102a match, outside silicagel pad insertion terminal alloy
The position of shell 102a.
Optionally, the heat conductivility of silicagel pad is less than heat conduction threshold value.In the utility model embodiment, the material bag of silicagel pad
Not heat conductive silica gel is included, at least two through holes are included on not heat conductive silica gel, two through holes are used for every at least one chip
A chip radiates, and can realize silicagel pad not in heat transfer to housing.Moreover, the utility model implements silicon in power
Rubber cushion has certain tension, flexibility, insulating properties, pressure-resistant, high temperature resistant, low temperature resistant, chemical property is stable, Environmental Safety, is no different
Taste, not soluble in water or any solvent, are a kind of green products of high activity.
A kind of terminal enclosure optionally is provided in the utility model embodiment, which is included outside terminal alloy
Shell, plane where chip and has the gap between terminal alloy shell, is embedded in silicagel pad in gap, is padded using the silica gel
Chip and terminal alloy shell are now supported, when helping to solve mobile terminal, mainboard deformation or unbalance stress or impact of staggering along
The problem of making chip stress, chip rosin joint is caused to connect energy failure.
Optionally, the thickness of silicagel pad is determined according to the height in gap between chip and terminal enclosure；The thickness of silicagel pad
It is less than thickness threshold value with the absolute value of the difference of the height in gap.In specific implementation, since silicagel pad belongs to flexible material, silica gel
The thickness of pad can cause structure connection more to encrypt slightly larger than the height in gap between chip and terminal enclosure.
Fig. 5 shows the structure diagram for the terminal for including silicagel pad using the another kind of the utility model embodiment.Such as
Shown in Fig. 5, the terminal include terminal enclosure 102, silicagel pad 107, mainboard 104, silicagel pad 107 include first end 105 and second
End 106；At least two chips include the first chip 103 and the second chip 103a；The first end 105 of silicagel pad is located at terminal enclosure
102 and first between chip 103, and the second end 106 of silicagel pad is located between 102 and second core 103a pieces of terminal enclosure.It is optional
Ground, the first chip and the second chip can be the same or different, and the first chip and the second chip include cpu chip and Memory
Chip.
Fig. 6 shows the structure diagram of the thickness of silicagel pad in Fig. 5.As shown in Figure 6；The terminal includes terminal enclosure
102, silicagel pad 107, silicagel pad 107 include first end 105 and second end 106, the first chip 103 and the second chip 103a, silicon
The first end 105 of rubber cushion is located between 102 and first chip 103 of terminal enclosure, and the second end 106 of silicagel pad is located at terminal enclosure
102 and second between core 103a pieces, the thickness H of the first end 105 of silicagel pad1With the height h in the first gap1Difference it is absolute
Value is less than thickness threshold value；The thickness H of the second end 106 of silicagel pad2With the height h in the second gap2Difference absolute value be less than thickness
Spend threshold value；Wherein, the height in the first gap is determined according to the height between the first chip and terminal enclosure；The height in the second gap
It is determined according to the height in gap between the second chip and terminal enclosure.In the utility model embodiment, the first end of silicagel pad is thick
Degree is slightly larger than the height in the first gap；The second end thickness of silicagel pad is slightly larger than the height in the second gap；In this way, it can cause silicon
Rubber cushion is embedded between terminal enclosure and chip so that structure is completely embedded.
Optionally, above-mentioned silica gel mat structure is suitable for terminal, which, which includes mobile phone, tablet computer etc., includes housing, core
The arbitrary terminal structure of piece and silicagel pad.
It should be noted is that：The explanation of the structure of above-mentioned silicagel pad is only exemplary and explanatory, is not used to
Limit the utility model.
It can be seen from the above：Since in the utility model embodiment, the structure of silicagel pad includes being located at silicagel pad
On at least two through holes；At least two through holes are used to radiate to each chip at least one chip；Wherein, silica gel
Pad is between terminal enclosure and at least one chip.It is each at least one chip due in the utility model embodiment
Chip slapper generates heat in the course of work, by being provided at least two through holes in silicagel pad, can realize to each chip
It radiates；Further, silicagel pad is between terminal enclosure and at least one chip, in this way, silicagel pad can be used as again it is soft
Property support construction support terminal enclosure and chip.
Although the preferred embodiment of the utility model has been described, those skilled in the art once know substantially
Creative concept can then make these embodiments other change and modification.So appended claims are intended to be construed to wrap
It includes preferred embodiment and falls into all change and modification of the scope of the utility model.
Obviously, those skilled in the art can carry out the utility model various modification and variations without departing from this practicality
New spirit and scope.If in this way, these modifications and variations of the utility model belong to the utility model claims and
Within the scope of its equivalent technologies, then the utility model is also intended to comprising including these modification and variations.
Claims (9)
1. a kind of structure of silicagel pad suitable for terminal, which is characterized in that including：
At least two through holes in the silicagel pad；At least two through hole is used for each at least one chip
Chip radiates；
Wherein, the silicagel pad is located between terminal enclosure and at least one chip.
2. structure as described in claim 1, which is characterized in that the shape of the cross section of each through hole at least two through hole
Shape includes any one of herein below：
Square, rectangle, circle, triangle, diamond shape, ellipse.
3. structure as described in claim 1, which is characterized in that the heat conductivility of the silicagel pad is less than heat conduction threshold value.
4. structure as described in claim 1, which is characterized in that the shape of the silicagel pad and the form fit of the chip.
5. structure as described in claim 1, which is characterized in that the thickness of the silicagel pad is according to the chip and the terminal
The height in gap determines between shell；
The thickness of the silicagel pad and the absolute value of the difference of the height in the gap are less than thickness threshold value.
6. structure as described in claim 1, which is characterized in that the silicagel pad includes first end and second end；It is described at least
Two chips include the first chip and the second chip；
For the first end of the silicagel pad between the terminal enclosure and the first chip, the second end of the silicagel pad is located at institute
It states between terminal enclosure and the second chip.
7. structure as claimed in claim 6, which is characterized in that the thickness of the first end of the silicagel pad and the height in the first gap
The absolute value of the difference of degree is less than the thickness threshold value；The difference of the height in the thickness of the second end of the silicagel pad and the second gap
The absolute value of value is less than the thickness threshold value；
Wherein, the height in first gap is determined according to the height between first chip and the terminal enclosure；It is described
The height in the second gap is determined according to the height in gap between second chip and the terminal enclosure.
8. structure as described in claim 1, which is characterized in that at least two through holes positioned in the silicagel pad
Each through hole is formed by punching press or oil pressure.
9. a kind of terminal, which is characterized in that including：The structure of claim 1-8 any one of them silicagel pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720808188.1U CN207410645U (en) | 2017-07-05 | 2017-07-05 | The structure and terminal of a kind of silicagel pad suitable for terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720808188.1U CN207410645U (en) | 2017-07-05 | 2017-07-05 | The structure and terminal of a kind of silicagel pad suitable for terminal |
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| CN207410645U true CN207410645U (en) | 2018-05-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107295782A (en) * | 2017-07-05 | 2017-10-24 | 华勤通讯技术有限公司 | The structure and terminal of a kind of silicagel pad suitable for terminal |
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2017
- 2017-07-05 CN CN201720808188.1U patent/CN207410645U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107295782A (en) * | 2017-07-05 | 2017-10-24 | 华勤通讯技术有限公司 | The structure and terminal of a kind of silicagel pad suitable for terminal |
| CN107295782B (en) * | 2017-07-05 | 2024-02-23 | 华勤技术股份有限公司 | Silica gel pad structure suitable for terminal and terminal |
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Address after: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Patentee after: Huaqin Technology Co.,Ltd. Address before: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Patentee before: Huaqin Technology Co.,Ltd. Address after: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Patentee after: Huaqin Technology Co.,Ltd. Address before: 201210 Building 1, 399 Keyuan Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai Patentee before: HUAQIN TELECOM TECHNOLOGY Co.,Ltd. |