CN105792612A - Electronic device - Google Patents
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- CN105792612A CN105792612A CN201610249088.XA CN201610249088A CN105792612A CN 105792612 A CN105792612 A CN 105792612A CN 201610249088 A CN201610249088 A CN 201610249088A CN 105792612 A CN105792612 A CN 105792612A
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- layer
- heat
- electronic equipment
- heat dissipating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
Abstract
The invention discloses an electronic device. Heat generated by heating elements is transmitted and dispersed layer-by-layer with the actual heat radiation areas of the layers being gradually increasing, so that the final heat radiation area of the electronic device is increased, and the heat dissipating capacity is increased accordingly. The integral performance of the electronic device can be prevented from being affected by poor heat radiation performance, and the fault probability of components in the electronic device can be minimized.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of electronic equipment.
Background technology
At present, the hand-hold electronic equipments heat dissipation capacity such as smart mobile phone, Intelligent flat is big, and is mainly distributed on chip area and photographic head region.Prior art often utilizes the heat sink material feature that the coefficient of overall heat transmission is high on the direction being perpendicular to electronic equipment backboard, the material such as paster silicone grease, gel or heat conduction foam on radome after chip package so that electronic equipment realizes heat power at 3W about 10W on the direction be perpendicular to backboard.But, this kind of heat dissipating method can only solve the heat dissipation problem in the small surfaces territory of electronic equipment, the i.e. problem of Z-direction point heat radiation, when the chip in electronic equipment is when high load capacity works or when charging at electronic equipment, feel from the back side of electronic equipment and still can feel that the heat in chip area and photographic head region is maximum, the most hot, if electronic equipment is chronically at the situation that this regional area heat is bigger, the electric property of part components and parts can be impacted, serious in burning out components and parts, cause electronic failure to be continuing with.
Visible, electronic equipment of the prior art also exists and causes that heat dissipation capacity is less owing to area of dissipation is less, thus have impact on the overall performance of electronic equipment, and also the components and parts of electronic equipment internal can be made to break down the higher technical problem of rate.
Summary of the invention
The application provides a kind of electronic equipment, also exist and cause that heat dissipation capacity is less in order to solve electronic equipment of the prior art owing to area of dissipation is less, thus have impact on the overall performance of electronic equipment, and also the components and parts of electronic equipment internal can be made to break down the higher technical problem of rate.
The application provides a kind of electronic equipment on the one hand, including:
Display screen, the surface of described display screen is the first surface of described electronic equipment；
Circuit board；
Heater element, is arranged on described circuit board；
Shell on the back, is formed between described shell on the back and described display screen for housing described circuit board and the accommodation space of described heater element, and the surface of described shell on the back is the second surface of described electronic equipment；
Radiator structure, it is arranged on region corresponding with described heater element in described accommodation space, along described first surface to the first direction of described second surface, described radiator structure includes at least two-layer heat dissipating layer, along described first direction, the heat that described heater element produces in described at least two-layer heat dissipating layer the area of dissipation on a rear heat dissipating layer of each two adjacent heat radiation layer more than the area of dissipation on previous heat dissipating layer.
Alternatively, described electronic equipment also includes heat-conducting layer, and described heat-conducting layer contacts with described heater element, for the heat conduction extremely described heat dissipating layer produced by described heater element.
Alternatively, last layer of heat dissipating layer in described at least two-layer heat dissipating layer contacts setting with described shell on the back, the heat that described heater element produces by described heat-conducting layer along described first direction, in the way of expanding area of dissipation gradually, it is transferred to described last layer of heat dissipating layer from the first heat dissipating layer adjacent with described heat-conducting layer, and then is dissipated to outside described electronic equipment by described shell on the back.
Alternatively, described heat-conducting layer is the material layer carrying out heat transmission along described first direction；
Described heat dissipating layer is the heat dissipating layer of face diffusion radiating mode, and wherein, described diffusion radiating mode is the mode carrying out heat transmission along the X direction of the plane vertical with described first direction and y direction.
Alternatively, described heat-conducting layer is specially silicone grease layer, gel layer or foamed cotton layer.
Alternatively, described radiator structure includes the first graphite linings.
Alternatively, described radiator structure also includes the first thermal insulation layer, it is arranged on after described first graphite linings prolongs described first direction, and second graphite linings, it is arranged on after described first thermal insulation layer prolongs described first direction, wherein, the area of described first thermal insulation layer and the area of described first graphite linings match.
Alternatively, the area of dissipation of described first graphite linings is more than described silicone grease layer, or the area of dissipation of described gel layer or described foamed cotton layer, and the area of dissipation of described second graphite linings is more than the area of dissipation of described first graphite linings.
Alternatively, described heater element is data processing chip or photographic head.
The one or more technical schemes provided in the embodiment of the present application, at least have the following technical effect that or advantage:
Technical scheme in the embodiment of the present application achieves the heat sent by heater element by transmitting layer by layer, and the mode that actual area of dissipation expands layer by layer is dispelled the heat, so that the area of dissipation expansion that electronic equipment is final, heat dissipation capacity is also expanded accordingly, avoid the overall performance affecting electronic equipment because of the reason of poor heat radiation, and it is also possible that the probability that the components and parts of electronic equipment internal break down effectively is reduced.
The embodiment of the present application at least also has the following technical effect that or advantage:
Further, technical scheme in the embodiment of the present application can also be passed through will be closest to the heat-conducting layer of heater element and adopt the mode directly contacted with described heater element to be configured, and the heat dissipating layer that will be closest to shell on the back adopts the mode that direct and described shell on the back contacts to be configured equally, so that heat can be undertaken obtaining and distributing by the most direct effective manner, therefore there is the technique effect improving radiating efficiency.
Further, the heat-conducting layer in technical scheme in the embodiment of the present application is the material layer that the z-axis direction being plane with its face, place carries out dispelling the heat, described heat dissipating layer be with its face, place be plane x-axis and y-axis direction on occur the mode of heat transmission to carry out the material layer that dispels the heat.In actual mechanical process, can pass through at the edge of described heat-conducting layer and described heat dissipating layer, and the edge at two often adjacent heat dissipating layers, the heat-conductive bridges being connected with next layer of heat dissipating layer is set, so that heat can be delivered to next layer from the marginal position of heat dissipating layer, and, due to heat dissipating layer in x-axis and y-axis direction heat transmission performance preferably, therefore can ensure that the efficiency that heat is transmitted by plane, therefore have and expand area of dissipation further and improve the technique effect of radiating efficiency.
Further, owing to the materials such as silicone grease, gel, foam and heat conduction foam are with face, described heat-conducting layer place for plane, it is perpendicular to the heat dispersion on the z-axis direction of this plane preferably, therefore, adopt the heat transmission that such material making heat-conducting layer can be implemented on z-axis direction more efficient, there is the technique effect improving the heat acquisition efficiency that heater element is distributed.
Further, technical scheme in the embodiment of the present application can also adopt graphite material to make heat dissipating layer, thus improve heat heat transference efficiency in the x-axis being plane with face, heat dissipating layer place and y-axis direction, thereby ensure that also have the technique effect of good heat radiating efficiency while area of dissipation expands.
Further, sealing coat in the embodiment of the present application can isolate the air heat prolonged on the described first direction transmission formed between described heat dissipating layer by air dielectric, thus can so that the heat that heater element gives out adopts face diffusion way that heat transmission occurs by heat dissipating layer to greatest extent, ensure that the area of dissipation obtained on described heat dissipating layer expands, there is the technique effect ensureing to expand area of dissipation.
Further, technical scheme in the embodiment of the present application can also by being set greater than described silicone grease layer by the area of dissipation of graphite linings, or the area of dissipation of described gel layer or described foamed cotton layer, thereby may be ensured that through the heat that described silicone grease layer or described gel layer or described foamed cotton layer absorb, therefore there is raising heat acquisition rate, improve the technique effect of heat radiation adequacy.
Further, technical scheme in the embodiment of the present application can also by carrying out the setting of radiator structure for data processing chip and/or photographic head, therefore, it is possible to discharged by the most of heat in electronic equipment, there is the technique effect of the effectiveness improving the radiating treatment to electronic equipment.
Accompanying drawing explanation
A kind of electronic devices structure figure that Fig. 1 provides for the embodiment of the present invention.
Detailed description of the invention
The application provides a kind of electronic equipment, also exist and cause that heat dissipation capacity is less in order to solve electronic equipment of the prior art owing to area of dissipation is less, thus have impact on the overall performance of electronic equipment, and also the components and parts of electronic equipment internal can be made to break down the higher technical problem of rate.
Technical scheme in the embodiment of the present application is for solving above-mentioned technical problem, and general thought is as follows:
Technical scheme in the embodiment of the present application achieves the heat sent by heater element by transmitting layer by layer, and the mode that actual area of dissipation expands layer by layer is dispelled the heat, so that the area of dissipation expansion that electronic equipment is final, heat dissipation capacity is also expanded accordingly, avoid the overall performance affecting electronic equipment because of the reason of poor heat radiation, and it is also possible that the probability that the components and parts of electronic equipment internal break down effectively is reduced.
Below by accompanying drawing and specific embodiment, technical scheme is described in detail, the specific features being to be understood that in the embodiment of the present application and embodiment is the detailed description to technical scheme, rather than the restriction to technical scheme, when not conflicting, the embodiment of the present application and the technical characteristic in embodiment can be mutually combined.
The terms "and/or", is only a kind of incidence relation describing affiliated partner, and expression can exist three kinds of relations, for instance, A and/or B, it is possible to represent: individualism A, there is A and B, individualism B these three situation simultaneously.It addition, character "/" herein, typically represent forward-backward correlation to as if the relation of a kind of "or".
Embodiment one
Refer to Fig. 1, the embodiment of the present application one provides a kind of electronic equipment, including:
Display screen 101, the first surface that surface is described electronic equipment of described display screen 101；
Circuit board 102；
Heater element 103, is arranged on described circuit board 102；
Shell on the back, is formed with the accommodation space for housing described circuit board 102 and described heater element 103 between described shell on the back and described display screen 101, the surface of described shell on the back is the second surface of described electronic equipment；
Radiator structure 104, the region that to be arranged in described accommodation space corresponding with described heater element 103, along described front first surface to the first direction of described second surface, described radiator structure 104 includes at least two-layer heat dissipating layer, along described first direction, the heat that described heater element 103 produces in described at least two-layer heat dissipating layer the area of dissipation on a rear heat dissipating layer of each two adjacent heat radiation layer more than the area of dissipation on previous heat dissipating layer.
Described first surface can be the face, display floater place of display screen 101, and described second surface can be the surface that described shell on the back is maximum with the area of contacting external air.
Described radiator structure 104 can be arranged as required in the region corresponding with heater element 103, and when heater element 103 is multiple, described radiator structure 104 can also be multiple.
Described heat dissipating layer can adopt heat sink material to make, in actual mechanical process, it is possible to as desired different heat dissipating layers is set to different heat sink materials, and certainly, described at least two-layer heat dissipating layer is it can also be provided that consistent heat sink material is made.As long as being capable of the heat that heater element 103 gives out to be propagated later layer heat dissipating layer by preceding layer heat dissipating layer, and the actual area of dissipation of later layer heat dissipating layer being more than the area of dissipation of preceding layer heat dissipating layer.
Such as, the iron plate that area is a predetermined value can made for employing iron material near the preceding layer heat dissipating layer of display screen 101 in described adjacent heat radiation layer, and in described adjacent heat radiation layer near the later layer heat dissipating layer of the described shell on the back of electronic equipment can be the aluminium flake adopting the area that aluminum is made be similarly this predetermined value, owing to the heat dispersion of aluminum is better than the heat dispersion of iron material, therefore, the actual area of dissipation of the aluminium flake of identical material area is more than the actual area of dissipation of iron plate.
Again such as, the aluminium flake that area is the first predetermined value can made for employing aluminum near the preceding layer heat dissipating layer of display screen 101 in described adjacent heat radiation layer, and near the later layer heat dissipating layer of electronic equipment shell on the back also for adopting area that aluminum the makes aluminium flake more than described first predetermined value in described adjacent heat radiation layer, therefore, the actual area of dissipation of later layer heat dissipating layer is more than the actual area of dissipation of preceding layer heat dissipating layer.
Thus achieve the heat sent by heater element 103 by transmitting layer by layer, and the mode that actual area of dissipation expands layer by layer is dispelled the heat, so that the area of dissipation expansion that electronic equipment is final, heat dissipation capacity is also expanded accordingly, avoid the overall performance affecting electronic equipment because of the reason of poor heat radiation, and it is also possible that the probability that the components and parts of electronic equipment internal break down effectively is reduced.
Simultaneously, when practical operation, heat transmission can be realized by the mode being medium with air between described at least two-layer heat dissipating layer, certainly, the heat transfer member that heat conductivility is good can also be set between described at least two-layer heat dissipating layer, thus at least heat transfer efficiency between two-layer heat dissipating layer described in improving.
Alternatively, described electronic equipment also includes heat-conducting layer 105, and described heat-conducting layer 105 contacts with described heater element 103, for the heat conduction extremely described heat dissipating layer produced by described heater element 103.
Alternatively, last layer of heat dissipating layer in described at least two-layer heat dissipating layer contacts setting with described shell on the back, the heat that described heater element 103 produces by described heat-conducting layer 105 along described first direction, in the way of expanding area of dissipation gradually, it is transferred to described last layer of heat dissipating layer from the first heat dissipating layer adjacent with described heat-conducting layer 105, and then is dissipated to outside described electronic equipment by described shell on the back.
In actual mechanical process, the material of described heat-conducting layer 105 and described heat dissipating layer can be different, and structure can also be different.Such as, owing to heat-conducting layer 105 obtains heat for directly contacting with heater element 103, therefore the making material of heat-conducting layer 105 can be communicated up heat preferably material prolonging described first party, and described heat dissipating layer for mainly to utilize it to transmit heat preferably performance in the plane being perpendicular to described first direction, therefore can adopt transmission heat preferably material in the plane to make.Actual mechanical process can be arranged as desired voluntarily.
That is, in the technical scheme of the embodiment of the present application, heat-conducting layer 105 near heater element 103 adopts the mode that direct and described heater element 103 contacts to be configured, and thus the heat that can realize heater element 103 distributes the most effectively obtains.Then, heat dissipating layer is transferred heat into again through heat-conducting layer 105, and it is transferred to, by the mode of transmission layer by layer and area of dissipation expansion layer by layer between heat dissipating layer, the heat dissipating layer that last layer contacts with the shell on the back of electronic equipment, thus heat is distributed eventually through the mode directly contacted with shell on the back.
Visible, technical scheme in the embodiment of the present application can also be passed through will be closest to the heat-conducting layer 105 of heater element 103 and adopt the mode that direct and described heater element 103 contacts to be configured, and the heat dissipating layer that will be closest to shell on the back adopts the mode that direct and described shell on the back contacts to be configured equally, so that heat can be undertaken obtaining and distributing by the most direct effective manner, therefore there is the technique effect improving radiating efficiency.
Alternatively, described heat-conducting layer 105 is the material layer carrying out heat transmission along described first direction；
Described heat dissipating layer is the heat dissipating layer of face diffusion radiating mode, and wherein, described diffusion radiating mode is the mode carrying out heat transmission along the X direction of the plane vertical with described first direction and y direction.
It is to say, described heat-conducting layer 105 is the material layer that the z-axis direction being plane with its face, place carries out dispelling the heat, described heat dissipating layer be with its face, place be plane x-axis and y-axis direction on occur the mode of heat transmission to carry out the material layer that dispels the heat.In actual mechanical process, can pass through at the edge of described heat-conducting layer 105 and described heat dissipating layer, and the edge at two often adjacent heat dissipating layers, the heat-conductive bridges being connected with next layer of heat dissipating layer is set, so that heat can be delivered to next layer from the marginal position of heat dissipating layer, and, due to heat dissipating layer in x-axis and y-axis direction heat transmission performance preferably, therefore can ensure that the efficiency that heat is transmitted by plane, therefore have and expand area of dissipation further and improve the technique effect of radiating efficiency.
Alternatively, described heat-conducting layer 105 is specially silicone grease layer, gel layer or foamed cotton layer.
Owing to the materials such as silicone grease, gel, foam and heat conduction foam are with face, described heat-conducting layer 105 place for plane, it is perpendicular to the heat dispersion on the z-axis direction of this plane preferably, therefore, adopt the heat transmission that such material making heat-conducting layer 105 can be implemented on z-axis direction more efficient, there is the technique effect improving the heat acquisition efficiency that heater element 103 is distributed.
Alternatively, described heat dissipating layer includes the first graphite linings 1041.
Spread, in face, the feature that the radiating efficiency under radiating mode is higher, say, that when graphite material is set to described heat dissipating layer, it is possible to improve heat heat transference efficiency in the x-axis being plane with face, heat dissipating layer place and y-axis direction owing to graphite material has.
Visible, technical scheme in the embodiment of the present application can also adopt graphite material to make heat dissipating layer, thus improve heat heat transference efficiency in the x-axis being plane with face, heat dissipating layer place and y-axis direction, thereby ensure that also have the technique effect of good heat radiating efficiency while area of dissipation expands.
Alternatively, described radiator structure 104 also includes the first thermal insulation layer 1043, it is arranged on after described first graphite linings 1041 prolongs described first direction, and second graphite linings 1042, it is arranged on after described first thermal insulation layer 1043 prolongs described first direction, wherein, the area of described first thermal insulation layer 1043 and the area of described first graphite linings 1041 match.
Wherein, the area of described first thermal insulation layer 1043 and the area of described first graphite linings 1041 match and refer to, when practical operation, thermal insulation layer can be consistent and form fit with the area of graphite linings, and when forming heat dissipating layer can centered by the mode alignd with limit with center alignment and limit.
Described thermal insulation layer can isolate the air heat prolonged on the described first direction transmission formed between described heat dissipating layer by air dielectric, thus can so that the heat that heater element 103 gives out adopts face diffusion way that heat transmission occurs by heat dissipating layer to greatest extent, ensure that the area of dissipation obtained on described heat dissipating layer expands, there is the technique effect ensureing to expand area of dissipation.
Alternatively, the area of dissipation of described first graphite linings 1041 is more than described silicone grease layer, or the area of dissipation of described gel layer or described heat-conducting layer 105 is more than the area of dissipation of described first graphite linings 1041.
Owing to the area of dissipation of graphite linings is more than the area of dissipation of silicone grease layer or gel layer or foamed cotton layer, thus can ensure that through the heat that described silicone grease layer or described gel layer or described foamed cotton layer absorb, can fully distributing or be delivered in graphite linings, the mode transmitted by face diffusion type heat then through graphite linings is delivered in heat dissipating layer below.
Visible, technical scheme in the embodiment of the present application can also by being set greater than described silicone grease layer by the area of dissipation of graphite linings, or the area of dissipation of described gel layer or described foamed cotton layer, thereby may be ensured that through the heat that described silicone grease layer or described gel layer or described foamed cotton layer absorb, therefore there is raising heat acquisition rate, improve the technique effect of heat radiation adequacy.
Alternatively, described heater element 103 is data processing chip or photographic head.
Due in the electronic device, data processing chip and photographic head are two kinds of electronic components that caloric value is relatively large, therefore, the setting of radiator structure 104 is carried out for data processing chip and photographic head, can ensure and the most of heat in electronic equipment is discharged, it is ensured that the electric property of electronic equipment.
Visible, technical scheme in the embodiment of the present application can also by carrying out the setting of radiator structure 104 for data processing chip and/or photographic head, therefore, it is possible to discharged by the most of heat in electronic equipment, there is the technique effect of the effectiveness improving the radiating treatment to electronic equipment.
As can be seen here, technical scheme in the embodiment of the present application achieves the heat sent by heater element by transmitting layer by layer, and the mode that actual area of dissipation expands layer by layer is dispelled the heat, so that the area of dissipation expansion that electronic equipment is final, heat dissipation capacity is also expanded accordingly, avoid the overall performance affecting electronic equipment because of the reason of poor heat radiation, and it is also possible that the probability that the components and parts of electronic equipment internal break down effectively is reduced.
The embodiment of the present application at least also has the following technical effect that or advantage:
Further, technical scheme in the embodiment of the present application can also be passed through will be closest to the heat-conducting layer of heater element and adopt the mode directly contacted with described heater element to be configured, and the heat dissipating layer that will be closest to shell on the back adopts the mode that direct and described shell on the back contacts to be configured equally, so that heat can be undertaken obtaining and distributing by the most direct effective manner, therefore there is the technique effect improving radiating efficiency.
Further, the heat-conducting layer in technical scheme in the embodiment of the present application is the material layer that the z-axis direction being plane with its face, place carries out dispelling the heat, described heat dissipating layer be with its face, place be plane x-axis and y-axis direction on occur the mode of heat transmission to carry out the material layer that dispels the heat.In actual mechanical process, can pass through at the edge of described heat-conducting layer and described heat dissipating layer, and the edge at two often adjacent heat dissipating layers, the heat-conductive bridges being connected with next layer of heat dissipating layer is set, so that heat can be delivered to next layer from the marginal position of heat dissipating layer, and, due to heat dissipating layer in x-axis and y-axis direction heat transmission performance preferably, therefore can ensure that the efficiency that heat is transmitted by plane, therefore have and expand area of dissipation further and improve the technique effect of radiating efficiency.
Further, owing to the materials such as silicone grease, gel, foam and heat conduction foam are with face, described heat-conducting layer place for plane, it is perpendicular to the heat dispersion on the z-axis direction of this plane preferably, therefore, adopt the heat transmission that such material making heat-conducting layer can be implemented on z-axis direction more efficient, there is the technique effect improving the heat acquisition efficiency that heater element is distributed.
Further, technical scheme in the embodiment of the present application can also adopt graphite material to make heat dissipating layer, thus improve heat heat transference efficiency in the x-axis being plane with face, heat dissipating layer place and y-axis direction, thereby ensure that also have the technique effect of good heat radiating efficiency while area of dissipation expands.
Further, sealing coat in the embodiment of the present application can isolate the air heat prolonged on the described first direction transmission formed between described heat dissipating layer by air dielectric, thus can so that the heat that heater element gives out adopts face diffusion way that heat transmission occurs by heat dissipating layer to greatest extent, ensure that the area of dissipation obtained on described heat dissipating layer expands, there is the technique effect ensureing to expand area of dissipation.
Further, technical scheme in the embodiment of the present application can also by being set greater than described silicone grease layer by the area of dissipation of graphite linings, or the area of dissipation of described gel layer or described foamed cotton layer, thereby may be ensured that through the heat that described silicone grease layer or described gel layer or described foamed cotton layer absorb, therefore there is raising heat acquisition rate, improve the technique effect of heat radiation adequacy.
Further, technical scheme in the embodiment of the present application can also by carrying out the setting of radiator structure for data processing chip and/or photographic head, therefore, it is possible to discharged by the most of heat in electronic equipment, there is the technique effect of the effectiveness improving the radiating treatment to electronic equipment.
Although having been described for the preferred embodiment of the application, but those skilled in the art are once know basic creative concept, then these embodiments can be made other change and amendment.So, claims are intended to be construed to include preferred embodiment and fall into all changes and the amendment of the application scope.
Obviously, the application can be carried out various change and modification without deviating from spirit and scope by those skilled in the art.So, if these amendments of the application and modification belong within the scope of the application claim and equivalent technologies thereof, then the application is also intended to comprise these change and modification.
Claims (9)
1. an electronic equipment, including:
Display screen, the surface of described display screen is the first surface of described electronic equipment；
Circuit board；
Heater element, is arranged on described circuit board；
Shell on the back, is formed between described shell on the back and described display screen for housing described circuit board and the accommodation space of described heater element, and the surface of described shell on the back is the second surface of described electronic equipment；
Radiator structure, it is arranged on region corresponding with described heater element in described accommodation space, along described first surface to the first direction of described second surface, described radiator structure includes at least two-layer heat dissipating layer, along described first direction, the heat that described heater element produces in described at least two-layer heat dissipating layer the area of dissipation on a rear heat dissipating layer of each two adjacent heat radiation layer more than the area of dissipation on previous heat dissipating layer.
2. electronic equipment as claimed in claim 1, it is characterised in that described electronic equipment also includes heat-conducting layer, and described heat-conducting layer contacts with described heater element, for the heat conduction extremely described heat dissipating layer produced by described heater element.
3. electronic equipment as claimed in claim 2, it is characterized in that, last layer of heat dissipating layer in described at least two-layer heat dissipating layer contacts setting with described shell on the back, the heat that described heater element produces by described heat-conducting layer along described first direction, in the way of expanding area of dissipation gradually, it is transferred to described last layer of heat dissipating layer from the first heat dissipating layer adjacent with described heat-conducting layer, and then is dissipated to outside described electronic equipment by described shell on the back.
4. electronic equipment as claimed in claim 3, it is characterised in that described heat-conducting layer is the material layer carrying out heat transmission along described first direction；
Described heat dissipating layer is the heat dissipating layer of face diffusion radiating mode, and wherein, described diffusion radiating mode is the mode carrying out heat transmission along the X direction of the plane vertical with described first direction and y direction.
5. electronic equipment as claimed in claim 3, it is characterised in that described heat-conducting layer is specially silicone grease layer, gel layer or foamed cotton layer.
6. electronic equipment as claimed in claim 3, it is characterised in that described radiator structure includes the first graphite linings.
7. electronic equipment as claimed in claim 6, it is characterized in that, described radiator structure also includes the first thermal insulation layer, it is arranged on after described first graphite linings prolongs described first direction, and second graphite linings, being arranged on after described first thermal insulation layer prolongs described first direction, wherein, the area of described first thermal insulation layer and the area of described first graphite linings match.
8. electronic equipment as claimed in claim 7, it is characterised in that the area of dissipation of described first graphite linings is more than the area of dissipation of described heat-conducting layer, and the area of dissipation of described second graphite linings is more than the area of dissipation of described first graphite linings.
9. the electronic equipment as described in claim any one of claim 1-8, it is characterised in that described heater element is data processing chip or photographic head.
Priority Applications (1)
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| CN201610249088.XA CN105792612B (en) | 2016-04-20 | 2016-04-20 | A kind of electronic equipment |
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| CN201610249088.XA CN105792612B (en) | 2016-04-20 | 2016-04-20 | A kind of electronic equipment |
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| CN105792612A true CN105792612A (en) | 2016-07-20 |
| CN105792612B CN105792612B (en) | 2018-10-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602933A (en) * | 2019-10-18 | 2019-12-20 | Oppo广东移动通信有限公司 | Heat radiating fin for display screen and electronic equipment |
| CN114071962A (en) * | 2021-11-12 | 2022-02-18 | 合肥维信诺科技有限公司 | Heat radiation structure and electronic equipment |
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