CN110337230A - A kind of shielding case and terminal - Google Patents
A kind of shielding case and terminal Download PDFInfo
- Publication number
- CN110337230A CN110337230A CN201910328862.XA CN201910328862A CN110337230A CN 110337230 A CN110337230 A CN 110337230A CN 201910328862 A CN201910328862 A CN 201910328862A CN 110337230 A CN110337230 A CN 110337230A
- Authority
- CN
- China
- Prior art keywords
- shielding
- heat dissipating
- shielding case
- dissipating layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a kind of shielding case and terminals, the shielding case includes the shielding cover body being made into integration by 3D composite integrated shielding heat dissipation film, the shielding cover body includes the covering part being covered in by shielding electronic component and the turn-up portion positioned at the covering part edge, is provided with conducting resinl in the turn-up portion.Therefore, the solution of the present invention, solving shielding case in the prior art, the assembly process is complicated, at high cost, the problem of the component reworkable property difference in shielding case.
Description
Technical field
The present invention relates to electronic technology field more particularly to a kind of shielding case and terminals.
Background technique
With the super-thin small that consumer electronics product designs, high density is assembled to PCBA and assembled height proposes more
The super-thin small of high requirement, especially Shielding plan can further decrease PCBA assembled height, reach ultimate attainment electronics and produce
Product ID design thickness.
Wherein, currently used Shielding plan includes following several:
The first, integrated metal shielding case, solder joint pin coplanarity is poor, and the assembly process is complicated, in shielding case
Component reworkable property it is poor；
Second, Split type metal shielding case is combined using mask frame with screening cover, and solder joint pin coplanarity is poor,
The assembly process is complicated, poor for the component reworkable property in shielding case；
The third, shrapnel contact one shielding case is at high cost using pin elastic slice contact pad；
4th kind, conductive shield film adds metallic shield frame, and the assembly process is complicated, at high cost.
It can be seen from the above, existing Shielding plan exists, the assembly process is complicated, and the component reworkable property in shielding case is poor
And problem at high cost.
Summary of the invention
The embodiment provides a kind of shielding case and terminals, to solve the packaging technology of shielding case in the prior art
It is complicated, at high cost, the problem of the component reworkable property difference in shielding case.
The embodiment provides a kind of shielding cases, comprising:
By the shielding cover body that is made into integration of 3D composite integrated shielding heat dissipation film, the shielding cover body including be covered in by
The covering part on electronic component and the turn-up portion positioned at the covering part edge are shielded, is provided with conducting resinl in the turn-up portion.
The embodiments of the present invention also provide a kind of terminals, including shielding case as described above, the shielding case and institute
The printed circuit board for stating terminal passes through the conductive adhesive of the shielding case, and is electrically connected.
The beneficial effect of the embodiment of the present invention is:
The embodiment of the present invention is made into integration shielding cover body using 3D composite integrated shielding heat dissipation film, and covers being located at
Turn-up portion is arranged by the edge of the covering part on shielding electronic component in lid, so that conducting resinl is arranged in turn-up portion, so that the screen
Covering cover body can be directly Nian Jie with pcb board by conducting resinl, and is electrically connected, and simplifies packaging technology, and can be easy to tear open
Shielding case is unloaded to reprocess the electronic component in shielding case.In addition, shielding case is using 3D, integrally shielding heat dissipation film is made, and is both had
There is electro-magnetic screen function, and there is device heat sinking function, has saved cost.
Detailed description of the invention
Fig. 1 shows one of the shielding cases of the embodiment of the present invention and the scheme of installation of pcb board；
Fig. 2 indicates the two of the shielding case of the embodiment of the present invention and the scheme of installation of pcb board；
Fig. 3 indicates the partial enlargement diagram of A in Fig. 1.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
The embodiment provides a kind of shielding cases, as shown in Figure 1, the shielding case includes:
The shielding cover body 1 being made into integration by 3D composite integrated shielding heat dissipation film, the shielding cover body 1 include being covered in
By the covering part 14 on shielding electronic component 3 and the turn-up portion 15 positioned at 14 edge of covering part, set in the turn-up portion 15
It is equipped with conducting resinl 16.Wherein, the conducting resinl 16 is for being bonded the shielding case and pcb board 2, and the shielding case and pcb board 2
Electrical connection.
Wherein, shielding case is integrally formed, and is being positioned over by the edge setting of the covering part 14 on shielding electronic component 3
Turn-up portion 15, thus in turn-up portion 15 be arranged conducting resinl 16, allow the shielding cover body 1 directly by conducting resinl 16 with
Pcb board 2 is bonded, and is electrically connected the shielding cover body 1 and pcb board 2, simplifies packaging technology, and can easily disassembled screen
Cover is covered to reprocess the electronic component in shielding case.In addition, shielding case is using 3D, integrally shielding heat dissipation film is made, and both has electricity
Magnetic screen function, and there is device heat sinking function, save cost.
Optionally, as shown in figure 3, the 3D composite integrated shielding heat dissipation film include: the first heat dissipating layer 11 being oppositely arranged,
Second heat dissipating layer 12 and the shielded layer 13 being set between first heat dissipating layer 11 and second heat dissipating layer 12；Wherein institute
Stating the first heat dissipating layer 11 and second heat dissipating layer 12 is that insulating materials is made, on the conducting resinl 16 and the turn-up portion 15
Shielded layer 13 be electrically connected.
Wherein, the setting of the first heat dissipating layer 11 and the second heat dissipating layer 12 can make the covering part 14 of shielding case be covered
Electronic component generate heat quickly to external diffusion, to reduce the temperature of these electronic components itself, further reduce
The possibility that electronic component is burned out.
In addition, shielded layer 13 is electrically connected with pcb board 2 after the shielding case of the embodiment of the present invention is installed on pcb board 2, from
And electro-magnetic screen function can be played to the electronic component being covered under covering part 14.
Optionally, in the turn-up portion 15, lead to towards at least one is provided on the heat dissipating layer of shielding electronic component 3
Hole 5, the conducting resinl 16 are filled in the through-hole 5, and the conducting resinl 16 is electrically connected with the shielded layer 13 in the turn-up portion 15
It connects；Wherein, towards by the heat dissipating layer of shielding electronic component be first heat dissipating layer 11 and second heat dissipating layer 12 in its
In one layer.
Wherein, shielded layer 13 is between the first heat dissipating layer 11 and the second heat dissipating layer 12, and be used for it is Nian Jie with pcb board 2 and
The conducting resinl 16 of electric connection, is electrically connected with shielded layer 13, therefore, it is necessary in the first heat dissipating layer 11 and the second heat dissipating layer 12,
Towards through-hole 5 for filling conducting resinl 16 is arranged on the heat dissipating layer of shielding electronic component 3, allow conducting resinl 16 and screen
The electrical connection of layer 13 is covered, and then the bonding and electric connection between shielded layer 13 and pcb board 2 may be implemented.
Optionally, towards being made of by the heat dissipating layer of shielding electronic component 3 elastic material, so that towards by shielding electricity
The heat dissipating layer of subcomponent 3 has elasticity, and then reduces to by the tension impact of shielding electronic component 3, to by shielding electronic component 3
It plays a protective role；Wherein, it radiates towards by the heat dissipating layer of shielding electronic component for first heat dissipating layer 11 and described second
Wherein one layer in layer 12.
Optionally, first heat dissipating layer 11, the shielded layer 13 and second heat dissipating layer 12 use method laminated into type
It is fixedly connected sequentially.Wherein, method laminated into type is to be used with or without binder, borrows heating, pressurizes identical or not identical material
The two or more layers of material are combined into whole method.And in the embodiment of the present invention, the first heat dissipating layer 11 and the second heat dissipating layer 12 are adopted
It is made from an insulative material, shielded layer 13 is metal material, therefore can make the first heat dissipating layer 11, shielding using method laminated into type
Layer 13 and the second heat dissipating layer 12 are fixedly connected sequentially.
Optionally, the covering part 14 includes sunk area and raised zones.Wherein, the sunk area and the protrusion
Region is determined according to by the height of shielding electronic component 3.Wherein, as shown in Fig. 2, distinguishing by the shielding case of the embodiment of the present invention
After being installed on multiple pcb boards 2, when every two pcb board 2 is staggered relatively according to the side of installation electronic component, it can make
The sunk area of first shielding case is embedded into the raised zones of secondary shielding cover, to save installation space, realizes PCBA mainboard
Assemble ultimate attainment ultra-thin highly dense Miniaturization Design.Wherein, the first shielding case and secondary shielding cover are the side with installation electronic component
The shielding case that pcb board 2 staggered relatively is bonded.Further, the covering part 14 by be bent to form the sunk area and
The raised zones.
In conclusion the embodiment of the present invention, is made into integration shielding cover body 1 using 3D composite integrated shielding heat dissipation film,
And turn-up portion is arranged by the edge of the covering part 14 on shielding electronic component 3 being positioned over, it is led to be arranged in turn-up portion
Electric glue 16 allows the shielding cover body 1 directly Nian Jie with pcb board 2 by conducting resinl 16, and is electrically connected, and simplifies group
Dress technique, and the electronic component in shielding case can be reprocessed with easily disassembled shielding case.In addition, shielding case is using 3D one
Shielding heat dissipation film is made, and not only has electro-magnetic screen function, but also have device heat sinking function, has saved cost.
The embodiments of the present invention also provide a kind of terminals, including shielding case described above, the shielding case with it is described
The printed circuit board (i.e. pcb board) of terminal is bonded by the conducting resinl 16 of the shielding case, and is electrically connected.
Further, at least partly conducting resinl 16 of the shielding case is Nian Jie with the ground pad of the printed circuit board,
And it is electrically connected.Specifically, as shown in Figure 1, on the conducting resinl 16 being arranged in the turn-up portion 15 of the shielding case and pcb board 2
Ground pad 4 is electrically connected.
Wherein, shielding case is made into integration using 3D composite integrated shielding heat dissipation film, and is being positioned over by shielding electronics member
Turn-up portion is arranged in the edge of covering part 14 on part 3, so that conducting resinl 16 be arranged in turn-up portion, allows the shielding case straight
It is Nian Jie with pcb board 2 to connect conducting resinl 16, and was electrically connected, simplifies packaging technology, and can be with easily disassembled shielding case to screen
The electronic component covered in cover is reprocessed.In addition, shielding case is using 3D, integrally shielding heat dissipation film is made, and has both had electromagnetic shielding function
Can, and there is device heat sinking function, save cost.
Optionally, at least two printed circuit board layers for being equipped with the shielding case, which stack, sets.
Wherein, multiple pcb boards 2 are frequently included in terminal, and need to shield certain electronic components.At this point it is possible to
The electronic component on multiple pcb boards 2 is shielded using multiple above-mentioned shielding cases, and is equipped at least two of shielding case
Placement can be laminated in pcb board 2.
Specifically, stack assembly mode can be used, i.e., it is the side of adjacent two pieces of pcb boards 2 installation electronic component is opposite
It places, and the covering part 14 of shielding case can be arranged according to bending form is set as by the different height of shielding electronic component 3
The covering part 14 includes sunk area and raised zones, as shown in Fig. 2, so that the sunk area of the first shielding case is embedded in
To the raised zones of secondary shielding cover, to save installation space, realize that the ultimate attainment ultra-thin highly dense miniaturization of PCBA mainboard assembling is set
Meter.Wherein, the first shielding case and secondary shielding cover are the screen Nian Jie with the side of installation electronic component pcb board 2 staggered relatively
Cover cover.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of shielding case characterized by comprising
The shielding cover body being made into integration by 3D composite integrated shielding heat dissipation film, the shielding cover body include being covered in be shielded
Covering part on electronic component and the turn-up portion positioned at the covering part edge are provided with conducting resinl in the turn-up portion.
2. shielding case according to claim 1, which is characterized in that the 3D composite integrated shielding heat dissipation film includes: opposite
The first heat dissipating layer, the second heat dissipating layer and the shielding being set between first heat dissipating layer and second heat dissipating layer being arranged
Layer；Wherein first heat dissipating layer and second heat dissipating layer are that insulating materials is made, the conducting resinl and the turn-up portion
On shielded layer electrical connection.
3. shielding case according to claim 2, which is characterized in that in the turn-up portion, towards by shielding electronic component
Heat dissipating layer on be provided at least one through-hole, the conducting resinl is filled in the through-hole, the conducting resinl and the flange
Shielded layer electrical connection in portion；Wherein, the direction is first heat dissipating layer and described by the heat dissipating layer of shielding electronic component
Wherein one layer in second heat dissipating layer.
4. shielding case according to claim 2, which is characterized in that direction is by the heat dissipating layer of shielding electronic component by elastic material
Material is constituted；Wherein, the direction is in first heat dissipating layer and second heat dissipating layer by the heat dissipating layer of shielding electronic component
Wherein one layer.
5. shielding case according to claim 2, which is characterized in that first heat dissipating layer, the shielded layer and described
Two heat dissipating layers are fixedly connected sequentially using method laminated into type.
6. shielding case according to claim 1, which is characterized in that the covering part includes sunk area and raised zones.
7. shielding case according to claim 6, which is characterized in that the covering part is by being bent to form the sunk area
With the raised zones.
8. a kind of terminal, which is characterized in that including shielding case as described in any one of claim 1 to 7, the shielding case and institute
The printed circuit board for stating terminal passes through the conductive adhesive of the shielding case, and is electrically connected.
9. terminal according to claim 8, which is characterized in that at least partly conducting resinl of the shielding case and the printing
The ground pad of circuit board is bonded, and is electrically connected.
10. terminal according to claim 8, which is characterized in that be equipped at least two printed circuits of the shielding case
Board stacking is placed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910328862.XA CN110337230A (en) | 2019-04-23 | 2019-04-23 | A kind of shielding case and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910328862.XA CN110337230A (en) | 2019-04-23 | 2019-04-23 | A kind of shielding case and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110337230A true CN110337230A (en) | 2019-10-15 |
Family
ID=68139734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910328862.XA Pending CN110337230A (en) | 2019-04-23 | 2019-04-23 | A kind of shielding case and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110337230A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| CN111902035A (en) * | 2020-08-10 | 2020-11-06 | 东莞市信为兴电子有限公司 | Shielding case applicable to 5G mobile phone, 5G mobile phone and production method of shielding case |
| CN115609612A (en) * | 2022-09-29 | 2023-01-17 | 达闼机器人股份有限公司 | Integrated control module and robot |
| WO2023015953A1 (en) * | 2021-08-12 | 2023-02-16 | 荣耀终端有限公司 | Shielding cover, circuit board assembly and electronic device |
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| CN109450037A (en) * | 2018-12-11 | 2019-03-08 | 安洁无线科技（苏州）有限公司 | Wireless charging mould group, apparatus and system |
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| JPH1041679A (en) * | 1996-07-22 | 1998-02-13 | Matsushita Electric Works Ltd | Electromagnetic wave shielding material and enclosure for electronic component |
| CN101516174A (en) * | 2008-02-21 | 2009-08-26 | 黄干元 | Radiating shield case |
| CN201213351Y (en) * | 2008-06-18 | 2009-03-25 | 中兴通讯股份有限公司 | Shielding cover for electromagnetically shielding circuit board and electronic device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| CN111902035A (en) * | 2020-08-10 | 2020-11-06 | 东莞市信为兴电子有限公司 | Shielding case applicable to 5G mobile phone, 5G mobile phone and production method of shielding case |
| CN111902035B (en) * | 2020-08-10 | 2022-11-04 | 东莞市信为兴电子有限公司 | Shielding case applicable to 5G mobile phone, 5G mobile phone and production method of shielding case |
| WO2023015953A1 (en) * | 2021-08-12 | 2023-02-16 | 荣耀终端有限公司 | Shielding cover, circuit board assembly and electronic device |
| CN115609612A (en) * | 2022-09-29 | 2023-01-17 | 达闼机器人股份有限公司 | Integrated control module and robot |
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Application publication date: 20191015 |
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