CN216671606U - Chip packaging body and electronic device - Google Patents
Chip packaging body and electronic device Download PDFInfo
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- CN216671606U CN216671606U CN202122812590.6U CN202122812590U CN216671606U CN 216671606 U CN216671606 U CN 216671606U CN 202122812590 U CN202122812590 U CN 202122812590U CN 216671606 U CN216671606 U CN 216671606U
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- chip
- metal layer
- chip package
- circuit board
- heat dissipation
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Abstract
The utility model discloses a chip packaging body and an electronic device, wherein the chip packaging body comprises: the circuit board comprises a core board, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged on two sides of the core board; the metal base is arranged in the accommodating groove; the chip is provided with a front surface and a back surface which are opposite, the front surface is fixed on the metal base through conductive adhesive, the back surface is provided with an electric connection area, and the electric connection area is connected with the first metal layer through a conductive wire; an insulating packaging layer covering the chip and the first metal layer; the radiating cover is arranged on one side, far away from the chip, of the metal base and is in contact with the metal base. Through the mode, the chip packaging body can meet the heat dissipation requirement of the chip, and is beneficial to the miniaturization design of the chip packaging body.
Description
Technical Field
The present invention relates to the field of device packaging technologies, and in particular, to a chip package and an electronic apparatus.
Background
5G communication application, more and more radio frequency chip application scenes of microwave frequency, high frequency and small size. The radio frequency power amplification chip has high power consumption and high heat dissipation requirement. The radio frequency chip package has high miniaturization requirement, the package heat dissipation effect is limited, and the chip work abnormity caused by poor heat dissipation often occurs in thermal simulation and practical application due to the low heat conductivity coefficient of the plastic package in the common plastic package scheme.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the technical problem of providing a chip packaging body and an electronic device so as to meet the heat dissipation requirement of a chip.
In order to solve the above technical problem, one technical solution adopted by the present invention is to provide a chip package, including: the circuit board comprises a core board, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged on two sides of the core board; the metal base is arranged in the accommodating groove; the chip is provided with a front surface and a back surface which are opposite, the front surface is fixed on the metal base through conductive adhesive, the back surface is provided with an electric connection area, and the electric connection area is connected with the first metal layer through a conductive wire; the insulating packaging layer covers the chip and the first metal layer; the radiating cover is arranged on one side, far away from the chip, of the metal base and is in contact with the metal base.
The heat dissipation cover is a flat sheet, is adhered to one side, facing the second metal layer, of the circuit board through conductive adhesive, and is in contact heat dissipation with the metal base through the conductive adhesive.
The heat dissipation cover is provided with a protruding portion, the circuit board is provided with a groove portion corresponding to the protruding portion, and the heat dissipation cover is matched with the groove portion through the protruding portion to be connected with the circuit board.
Wherein, the radiating cover is detachably provided with a radiating fin.
Wherein the chip package comprises: and the first end of the copper column is welded on the bonding pad on the first metal layer, the second end of the copper column extends towards one side far away from the circuit board, and the second end of the copper column is exposed outside the insulating packaging layer.
Wherein the second end of the copper column is provided with an electroplated layer.
Wherein the chip package further comprises: an electronic component disposed on the first metal layer.
And the electronic component is connected with the welding disc on the first metal layer in a welding mode.
And the electronic component is connected with the bonding pad on the first metal layer through a conducting wire.
In order to solve the above technical problem, another technical solution of the present invention is to provide an electronic device, where the electronic device includes any one of the chip packages.
The utility model has the beneficial effects that: unlike the case of the prior art, the chip package of the present invention includes: the circuit board comprises a core board, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged on two sides of the core board; the metal base is arranged in the accommodating groove; the chip is provided with a front surface and a back surface which are opposite, the front surface is fixed on the metal base through conductive adhesive, the back surface is provided with an electric connection area, and the electric connection area is connected with the first metal layer through a conductive wire; the insulating packaging layer covers the chip and the first metal layer; and the heat dissipation cover is arranged on one side of the metal base, which is far away from the chip, and is contacted with the metal base. Through set up the storage tank that runs through on the circuit board, set up the metal base in the storage tank, then can pass through the conducting resin with the chip and set up on the metal base to keep away from chip one side at the metal base and set up the heat dissipation lid, then can dispel the heat to the chip through heat dissipation lid and metal base, the radiating efficiency is high, can satisfy the heat dissipation demand of chip, is favorable to the miniaturized design of chip package body.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:
fig. 1 is a schematic structural diagram of a chip package according to an embodiment of the utility model.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a chip package according to an embodiment of the utility model. In the embodiment of the present application, the chip package 10 includes: a circuit board 100, wherein the circuit board 100 includes a core board 1000, and a first metal layer 1001 and a second metal layer 1002 disposed on two sides of the core board 1000, and a receiving groove (not shown) penetrating the circuit board 100 is disposed on the circuit board 100; the metal base 101 is arranged in the accommodating groove; a chip 102 having a front surface and a back surface opposite to each other, the front surface being fixed to the metal base 101 by a conductive adhesive 103, the back surface having an electrical connection region (not shown) connected to the first metal layer 1001 by a conductive wire 104; an insulating encapsulation layer 105, wherein the insulating encapsulation layer 105 covers the chip 102 and the first metal layer 1001; and the heat dissipation cover 106 is arranged on one side of the metal base 101, which is far away from the chip 102, and the heat dissipation cover 106 is in contact with the metal base 101.
It can be understood that, since the electrical connection area on the back of the chip 102 is connected to the first metal layer 1001 through the conductive wire 104, the circuit board 100 of the present application is a patterned circuit board 100, that is, the first metal layer 1001 and the second metal layer 1002 on both sides of the core board 1000 of the circuit board 100 are patterned metal layers, the patterning of the metal layers is correspondingly set to be suitable for the logic circuit to be implemented by the chip 102, while different chip pins correspond to different patterned electrical paths, and the patterning can be accomplished by a chemical etching method or an ion etching method.
Since the insulating encapsulation layer 105 covers the chip 102 and the first metal layer 1001, it can be understood that the encapsulation material used to form the insulating encapsulation layer 105 has greater mechanical strength after curing, and thus the insulating encapsulation layer 105 can protect the chip 102 and the first metal layer 1001. In an embodiment, the packaging material of the insulating packaging layer 105 may be resin or plastic, for example, the chip 102 and the circuit board 100 may be covered by silk-screen resin or laminated with thermoplastic plastics such as polypropylene, which not only can reduce the cost, but also can ensure the reliable fixation of the chip 102.
Specifically, the chip 102 may be a high-power consumption and high-heat-generation chip such as a radio frequency power amplifier chip or a power supply power chip, the metal base 101 may be a copper block, and the heat dissipation cover 106 may have any heat conductive material, for example, the heat dissipation cover 106 may be a copper heat dissipation cover, an aluminum heat dissipation cover, or a copper-nickel alloy heat dissipation cover. Through arranging a through accommodating groove on the circuit board 100 and arranging the metal base 101 in the accommodating groove, the chip 102 can be arranged on the metal base 101 through the conductive adhesive 103, and the side of the metal base 101 away from the chip 102 is provided with the heat dissipation cover 106; the conductive adhesive 103 is an adhesive with a certain conductivity after being cured or dried, such as one of a silver conductive adhesive, a gold conductive adhesive, a copper conductive adhesive and a carbon conductive adhesive, or an adhesive alloy, such as one of copper, aluminum, gold, silver and an alloy thereof or a metal-filled organic matter; the conductive paste 103 may connect the chip 102 and the metal base 101 together. Chip 102 during operation, conducting resin 103 can be on conducting the metal base 101 with the heat that produces on chip 102, metal base 101 is again on conducting the heat dissipation lid 106 with the heat, the heat is conducted and is gone up to scattering all around to heat dissipation lid 106, can reduce chip 102's temperature in short time, can dispel the heat to chip 102 through heat dissipation lid 106 and metal base 101 promptly, short heat dissipation route and higher heat dissipation efficiency have, the heat dissipation demand of chip 102 of high power can be satisfied, be favorable to chip package 10's miniaturized design.
In an embodiment, the heat dissipation cover 106 is a flat sheet, and the heat dissipation cover 106 is adhered to the side of the circuit board 100 facing the second metal layer 1002 through the conductive adhesive 103, and contacts the metal base 101 through the conductive adhesive 103 to dissipate heat. When the chip 102 works, the conductive adhesive 103 can conduct heat generated on the chip 102 to the metal base 101, the metal base 101 conducts the heat to the heat dissipation cover 106 through the conductive adhesive 103, the heat is conducted to the heat dissipation cover 106 and then is dispersed to the periphery, the temperature of the chip 102 can be reduced in a short time, namely the metal base 101 and the heat dissipation cover 106 are connected together through the conductive adhesive 103, the heat generated by the chip 102 is favorably transmitted to the heat dissipation cover 106 through the metal base 101, the heat is further dissipated through the heat dissipation cover 106, the heat dissipation efficiency is high, and the heat dissipation requirement of the chip 102 can be met; in addition, by providing the heat dissipation cover 106 on the side of the circuit board 100 facing the second metal layer 1002, the warpage of the circuit board 100 is also facilitated to be reduced.
Further, a protrusion (not shown) may be disposed on the heat dissipation cover 106, and a groove (not shown) corresponding to the protrusion is disposed on the circuit board 100, so that the heat dissipation cover 106 is fixed to the circuit board 100 by the protrusion and the groove. Through the connection of the conductive adhesive 103 and the dual connection mode of the matching of the protruding part and the groove part, the structure between the heat dissipation cover 106 and the circuit board 100 is stable.
Further, a heat sink (not shown) is detachably attached to the heat dissipation cover 106. When the chip 102 works, the conductive adhesive 103 can conduct heat generated on the chip 102 to the metal base 101, the metal base 101 conducts the heat to the heat dissipation cover 106 through the conductive adhesive 103, the heat is conducted to the heat dissipation cover 106 and then is dispersed all around, and the heat dissipation fins on the heat dissipation cover 106 further dissipate the heat, so that the temperature of the chip 102 can be reduced in a short time. For example, the heat sink may be installed in a slot pre-set in the heat dissipation cover 106 in an inserting manner, and the heat sink and the heat dissipation cover 106 are vertically arranged in space, so that heat transferred to the heat dissipation cover 106 can be rapidly transferred to the heat sink, and the heat is dissipated by the heat sink, thereby increasing the heat dissipation effect and improving the heat dissipation efficiency.
In an embodiment, the chip package 10 further includes a copper pillar 107, a first end 1071 of the copper pillar 107 is soldered on the pad on the first metal layer 1001, a second end 1072 of the copper pillar 107 extends to a side away from the circuit board 100, and the second end 1072 of the copper pillar 107 is exposed outside the insulating encapsulation layer 105. Specifically, the number of the copper pillars 107 may be set as required, and the copper pillars 107 may transfer heat generated in the circuit board 100 to the outside of the insulating encapsulation layer 105, so that the chip package 10 has a good heat dissipation effect.
Further, the second end 1072 of the copper pillar 107 is provided with a plating 1073. Then, the copper pillar 107 provided on the circuit board 100 is exposed from the insulating package layer 105 at the second end 1072 of the copper pillar 107 by connecting the first end 1071 of the copper pillar 107 to the metal pad on the first metal layer 1001, and after the plating layer 1073 is provided at the second end 1072 of the copper pillar 107, the plating layer 1073 can be used as a pad for other external devices.
In an embodiment, the chip package 10 further includes an electronic component 108, and the electronic component 108 is disposed on the first metal layer 1001. The electronic component 108 may be a chip with relatively low power consumption, such as an IC chip, or may be a chip inductor capacitor.
In one embodiment, the electronic component 108 may be connected to the pads on the first metal layer 1001 by soldering. In another embodiment, the electronic component 108 may be connected to the pads on the first metal layer 1001 by conductive lines.
Regarding the preparation of the chip package 10, in an application scenario, after the patterned circuit board 100 is provided, the circuit board 100 includes a core board 1000 and a first metal layer 1001 and a second metal layer 1002 disposed on both sides of the core board 1000, a through-going accommodating slot may be formed on the circuit board 100 in a preset slotting manner, the preset slotting manner may be a laser slotting manner, a water jet drilling manner, a mechanical slotting manner, and the like, for example, the accommodating slot may be formed in the mechanical slotting manner, and since the accommodating slot has a relatively large thickness, the mechanical slotting manner is adopted, and under the condition that the size of the accommodating slot is satisfied, the manufacturing efficiency may be ensured; then, a metal base 101 is placed in the accommodating groove, and the metal base 101 can be embedded in the core board 1000 of the circuit board 100; then fixing the high-power chip 102 on the metal base 101 by using a conductive adhesive 103, specifically, the chip 102 has a front surface and a back surface opposite to each other, the front surface of the chip 102 is fixed on the metal base 101 by using the conductive adhesive 103, the back surface of the chip 102 has an electrical connection region, and the electrical connection region is connected with the first metal layer 1001 by using a conductive wire 104; meanwhile, the circuit board 100 may be provided with the copper pillar 107 and the electronic component 108 by using SMT (Surface mount Technology), specifically, the first end 1071 of the copper pillar 107 is soldered to a pad on the first metal layer 1001, the second end 1072 of the copper pillar 107 extends to a side away from the circuit board 100, and the electronic component 108 is connected to the pad on the first metal layer 1001 by a soldering method or a conductive wire method; then, an injection molding process is utilized to form an insulating packaging layer 105 on the side, facing the first metal layer 1001, of the circuit board 100, and the chip 102, the first metal layer 1001, the electronic component 108 and the copper pillar 107 are covered by the insulating packaging layer 105; then, the insulating encapsulation layer 105 higher than the second end 1072 of the copper pillar 107 is removed, so that the second end 1072 of the copper pillar 107 is exposed outside the insulating encapsulation layer 105, and an electroplating layer 1073 is formed on the second end 1072 of the copper pillar 107 by electroplating; then, the heat dissipation cover 106 is adhered to the side of the circuit board 100 facing the second metal layer 1002 through the conductive adhesive 103, and is contacted with the metal base 101 through the conductive adhesive 103 for heat dissipation, so as to obtain the chip package 10.
The utility model also provides an electronic device, which comprises any chip packaging body 10. In the electronic device of the present invention, the chip package 10 is provided with the through receiving groove on the circuit board 100, and the metal base 101 is disposed in the receiving groove, so that the chip 102 can be disposed on the metal base 101 through the conductive adhesive 103, and the heat dissipation cover 106 is disposed on the side of the metal base 101 away from the chip 102, so that the chip 102 can be dissipated through the heat dissipation cover 106 and the metal base 101, and the heat dissipation efficiency is high, which can meet the heat dissipation requirement of the chip 102, and is beneficial to the miniaturization design of the chip package 10.
It is noted that, in the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all modifications that can be made by using equivalent structures or equivalent principles in the contents of the specification and the drawings or directly or indirectly applied to other related technical fields are also included in the scope of the present application.
Claims (10)
1. A chip package, comprising:
the circuit board comprises a core board, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged on two sides of the core board;
the metal base is arranged in the accommodating groove;
the chip is provided with a front surface and a back surface which are opposite, the front surface is fixed on the metal base through conductive adhesive, the back surface is provided with an electric connection area, and the electric connection area is connected with the first metal layer through a conductive wire;
the insulating packaging layer covers the chip and the first metal layer;
the radiating cover is arranged on one side, far away from the chip, of the metal base and is in contact with the metal base.
2. The chip package of claim 1,
the heat dissipation cover is a flat sheet, is adhered to one side of the circuit board, which faces the second metal layer, through conductive adhesive, and is in contact with the metal base for heat dissipation through the conductive adhesive.
3. The chip package of claim 2,
the radiating cover is provided with a protruding portion, the circuit board is provided with a groove portion corresponding to the protruding portion, and the radiating cover is matched with the groove portion through the protruding portion to be connected with the circuit board.
4. The chip package according to claim 2 or 3,
the radiating cover is detachably provided with radiating fins.
5. The chip package according to claim 1, wherein the chip package comprises:
and the first end of the copper column is welded on the bonding pad on the first metal layer, the second end of the copper column extends towards one side far away from the circuit board, and the second end of the copper column is exposed outside the insulating packaging layer.
6. The chip package of claim 5,
and the second end of the copper column is provided with an electroplated layer.
7. The chip package of claim 1, wherein the chip package further comprises:
an electronic component disposed on the first metal layer.
8. The chip package of claim 7,
and the electronic component is connected with the welding disc on the first metal layer in a welding mode.
9. The chip package of claim 7,
the electronic component is connected with the bonding pad on the first metal layer through a conducting wire.
10. An electronic device, characterized in that the electronic device comprises a chip package according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122812590.6U CN216671606U (en) | 2021-11-16 | 2021-11-16 | Chip packaging body and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122812590.6U CN216671606U (en) | 2021-11-16 | 2021-11-16 | Chip packaging body and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216671606U true CN216671606U (en) | 2022-06-03 |
Family
ID=81783332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122812590.6U Active CN216671606U (en) | 2021-11-16 | 2021-11-16 | Chip packaging body and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216671606U (en) |
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2021
- 2021-11-16 CN CN202122812590.6U patent/CN216671606U/en active Active
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhao Xiaowei Inventor after: Liu Jianhui Inventor before: Zhao Xiaowei |
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| CB03 | Change of inventor or designer information |