CN112616252A - Method and device applied to power supply of high-power-consumption PCBA of general server - Google Patents
Method and device applied to power supply of high-power-consumption PCBA of general server Download PDFInfo
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- CN112616252A CN112616252A CN202011427627.7A CN202011427627A CN112616252A CN 112616252 A CN112616252 A CN 112616252A CN 202011427627 A CN202011427627 A CN 202011427627A CN 112616252 A CN112616252 A CN 112616252A
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- pcba
- conductive
- conductive strip
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- power supply
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a method and a device applied to power supply of a high-power consumption PCBA of a general server, wherein the method applied to the power supply of the high-power consumption PCBA of the general server comprises the following steps: step S1, calculating the height X of the required conductive strip according to the current I and the thickness H of the conductive strip required by the layout requirement of the mainboard; step S2, performing tinning treatment on the conductive pins in the filling areas of the conductive strips, and performing insulating layer spraying on the non-filling areas of the conductive strips; and step S3, welding the conductive pins of the filling area of the conductive strip on the mainboard. The invention can increase the bus bars aiming at the mainboard where the universal server high-power consumption PCBA is positioned, not only can solve the problem of insufficient power supply of the PCBA, but also can avoid the defects that the thickness or the size of a circuit board of the PCBA is increased due to insufficient wiring space and the like, and has simple and effective implementation mode, strong pertinence and good effect.
Description
Technical Field
The invention relates to a power supply method for a PCBA, in particular to a method applied to the power supply of the high-power consumption PCBA of a general server, and relates to a device adopting the method applied to the power supply of the high-power consumption PCBA of the general server.
Background
With the continuous development of information technology, the application of technologies such as artificial intelligence, big data and cloud computing is more and more extensive, and the server is used as a carrier for the development of the information technology, so that the requirements on the server are higher and higher, and the requirements on power consumption are correspondingly higher and higher. The PCBA indirectly bears responsibility for resolving power consumption as the brain of the server, but the prior art generally has difficulty in balancing between sufficient power and insufficient routing space.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a method for supplying power to a high-power consumption PCBA of a general server, which can solve the problem of insufficient power supply of the PCBA and simultaneously avoid the defects that the thickness or the size of a circuit board of the PCBA is increased due to insufficient wiring space, and further provide a device adopting the method for supplying power to the high-power consumption PCBA of the general server.
Therefore, the invention provides a method for supplying power to a high-power consumption PCBA of a general server, which comprises the following steps:
step S1, calculating the height X of the required conductive strip according to the current I and the thickness H of the conductive strip required by the layout requirement of the mainboard;
step S2, performing tinning treatment on the conductive pins in the filling areas of the conductive strips, and performing insulating layer spraying on the non-filling areas of the conductive strips;
and step S3, welding the conductive pins of the filling area of the conductive strip on the mainboard.
In a further improvement of the present invention, in the step S1, the formula is used
And calculating the height X of the conductive strip where p is the resistivity (H + X) × 2; s is the cross-sectional area S ═ H × X of the conductive strip; ktIs the comprehensive heat dissipation coefficient; m is the cross-sectional perimeter of the conductive strip; τ is the temperature rise coefficient.
A further development of the invention is that the thickness H of the conductive strips is predefined according to the layout of the main board.
In a further development of the invention, the unfilled region is teflon.
The invention also provides a device for supplying power to the high-power consumption PCBA of the general-purpose server, which comprises at least one conductive strip welded on the mainboard, wherein the conductive strip adopts the method for supplying power to the high-power consumption PCBA of the general-purpose server.
The invention is further improved in that at least two filling area conductive pins are arranged on one side of the conductive strip close to the mainboard, and the filling area conductive pins are electrically connected with the mainboard.
The invention has the further improvement that the conductive strip is also provided with a bending part, and one side of the bending part, which is close to the mainboard, is provided with a conductive pin of the filling area.
The invention is further improved in that a gap is left between the conductive strip welded on the main board and the main board.
Compared with the prior art, the invention has the beneficial effects that: calculate the high X of required busbar according to the required electric current I of mainboard overall arrangement demand and the thickness H of busbar, and then can carry out the increase of busbar to the mainboard at general server high-power consumption PCBA place, not only can solve the not enough problem of PCBA power supply, also can avoid PCBA to increase drawbacks such as its circuit board thickness or size because of walking the not enough of line space simultaneously, the implementation is simple effective, and with strong points, it is effectual.
Drawings
FIG. 1 is a schematic workflow diagram of one embodiment of the present invention;
FIG. 2 is a schematic diagram of a conductive strip structure according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a structure of a motherboard with a conductive strip soldered thereon according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a structure for soldering a conductive strip on a motherboard with components soldered thereon according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another conductive strip soldered on a motherboard according to an embodiment of the present invention.
Detailed Description
Preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
As shown in fig. 1 to 4, the present example provides a method applied to power supply of a high-power consumption PCBA of a general-purpose server, including the following steps:
step S1, calculating the height X of the required conductive strip 1 according to the current I required by the layout requirement of the mainboard 2 and the thickness H of the conductive strip 1;
step S2, performing tinning treatment on the conductive pins 3 in the filling areas of the conductive strips 1, and performing insulating layer spraying on the non-filling areas of the conductive strips 1;
step S3, soldering the conductive pins 3 in the filling area of the conductive strip 1 on the motherboard 2.
The bus bar 1 in this example comprises a bus bar body, such as a copper bar, for serving as a power supply channel carrier; the filling area conductive pin 3 is an intermediate medium connected between the conductive strip 1 and the main board 2, is used for realizing welding and electric connection, and can be obtained by filling a conductive medium; the non-filling area refers to the conductive strip 1 except the conductive pins 3 in the filling area, the non-filling area is subjected to insulating layer spraying, and refers to that the area of the conductive strip 1 except the conductive pins 3 in the filling area is subjected to insulating layer spraying, such as teflon spraying, and is used as a protective layer for isolating the conductive strip 1 (conductive carrier) from the external environment, so that interference between elements is avoided.
Teflon is a different name of Polytetrafluoroethylene (Polytetrafluoethylene), abbreviated in English to PTFE, commonly known as "Kara" plastics, and has the chemical formula of- (CF2-CF2) n-. The trade name Teflon is also called Teflon, Teflon and the like in China because of pronunciation, and is the transliteration of Teflon. Products of such materials are generally referred to collectively as non-stick coatings; is an artificially synthesized high molecular material which uses fluorine to replace all hydrogen atoms in polyethylene. The material has the characteristics of acid resistance, alkali resistance and various organic solvents resistance, and is almost insoluble in all solvents. Meanwhile, the polytetrafluoroethylene has the characteristic of high temperature resistance, has extremely low friction coefficient, can be used for lubricating, and becomes an ideal coating which does not stick to the inner layer of a pot and a water pipe.
Among them, the non-tackiness is exhibited in that almost all substances do not adhere to the polytetrafluoroethylene coating film, and a very thin film also exhibits excellent non-tackiness. The heat resistance property of the polytetrafluoroethylene coating is excellent in heat resistance and low temperature resistance, can resist high temperature to 300 ℃ in a short time, can be continuously used generally at 240-260 ℃, has remarkable heat stability, can work at a freezing temperature without embrittlement, and does not melt at high temperature, so that the polytetrafluoroethylene coating is particularly suitable for application environment of high-power consumption PCBA of a general server, can resist high temperature and facilitate heat dissipation on the one hand, can realize passive heat resistance on the other hand based on the property, does not generate high temperature rise, and is suitable for high-power consumption servers.
The sliding property is shown in that the polytetrafluoroethylene coating has a low friction coefficient, and the friction coefficient changes when the polytetrafluoroethylene coating slides under load, but the value is only between 0.05 and 0.15. The moisture resistance is shown in that the surface of the polytetrafluoroethylene coating film is not stained with water and oil, and the polytetrafluoroethylene coating film is not easy to be stained with solution during production operation, if a small amount of dirt is adhered, and can be removed by simply wiping. The application in the server needs short downtime, saves working hours and can improve working efficiency. The wear resistance is expressed in high load, and the wear-resistant rubber has excellent wear resistance and has double advantages of wear resistance and non-adhesion under certain load. The corrosion resistance is shown in that the polytetrafluoroethylene is hardly corroded by drugs, can bear the action of all strong acids (including aqua regia), strong oxidants, reducing agents and various organic solvents except molten alkali metal, fluorinated media and sodium hydroxide with the temperature higher than 300 ℃, and can protect parts from any kind of chemical corrosion.
In addition, it has good insulating property in chemical property: the device can not be influenced by environment and frequency, the volume resistance can reach 1018 ohm-cm, the dielectric loss is small, and the breakdown voltage is high; has high and low temperature resistance: the influence on the temperature is not large, the temperature range is wide, and the temperature can be between-190 ℃ and 260 ℃; the lubricating oil has self-lubricating property: has the minimum friction coefficient in plastics, and is an ideal oil-free lubricating material; has atmospheric aging resistance: the irradiation resistance and the lower permeability are realized, the surface and the performance are kept unchanged after long-term exposure to the atmosphere; the flame retardant has the following characteristics: the oxygen limit index is below 90, so that the server can be effectively prevented from being on fire.
In step S1 in this example, the formula is used
And M ═ H + X) × 2 calculating said conductanceHeight X of the bar 1, where ρ is the resistivity; s is the cross-sectional area S ═ H × X of the conductive strip 1; ktIs the comprehensive heat dissipation coefficient (for the commonly used thin plastic wire, the comprehensive heat dissipation coefficient KtGenerally at 4.3W/m2Left and right); m is the cross-sectional perimeter of the conductive strip 1; τ is the temperature rise coefficient (preferably τ 70K).
In practical application, the thickness H, the setting position, and the length L of the conductive strip 1 are mainly determined according to the size of the space of the main board 2 and the size that can be provided by the position where the conductive strip 1 needs to be set, and the thickness H, the setting position, and the length L of the conductive strip 1 can be predefined and modified according to actual conditions and needs.
In this embodiment, the current I required by the layout requirement of the motherboard 2 through the conductive strips 1 is known or calculable when designing a circuit board, which is not difficult for those skilled in the art, and a little more current I can be reserved on the basis of meeting the conductive requirement of the motherboard 2 to facilitate function expansion, and the process of the current I is not described in detail in this embodiment; when a current I flows through the conductor, the heating power of the conductor is P1,
wherein L is a conductor length of the conductive strip 1; when the bus bar 1 enters a stable working state, the heat dissipation power P2 is: p2 ═ KtML tau, the heat generating power is equal to the heat dissipating power, i.e. P1 is equal to P2, and then the heat generating power can be obtained through
And M ═ 2 (H + X) × calculates the height X of the conducting strip 1, other parameters in the formula belong to known values, the calculation process is simple and effective, and then the thickness H and the height X of the conducting strip 1 are obtained, and the setting position and the length L of the conducting strip 1 are preset according to the layout actual situation and the requirement of the mainboard 2, and then all the parameters of the required conducting strip 1 are obtained.
In this embodiment, after the parameters of the conductive strip 1 are obtained in step S1, a tin plating process is performed on the conductive pin 3 in the filling area of the conductive strip body as the carrier of the power supply channel, and the non-filling area of the conductive strip 1 is subjected to the insulating layer spraying; and then welding the conductive pins 3 in the filling area of the conductive strips 1 at the positions of the mainboard 2 needing to be conducted.
As shown in fig. 2 to fig. 5, this example further provides an apparatus for supplying power to a high-power consumption PCBA of a general-purpose server, which includes at least one conductive strip 1 soldered on a motherboard 2, where the conductive strip 1 adopts the method for supplying power to a high-power consumption PCBA of a general-purpose server as described above.
In this embodiment, at least two filling area conductive pins 3 are disposed on one side of the conductive strip 1 close to the motherboard 2, and the filling area conductive pins 3 are electrically connected to the motherboard 2, so that the conductive strip 1 can be electrically connected and fixed stably and reliably.
As shown in fig. 2 and fig. 5, in this embodiment, the conductive bar 1 is further provided with a bending portion 4, and one side of the bending portion 4 close to the main board 2 is provided with a filling area conductive pin 3, which is designed to meet the requirement of the position layout of the main board 2 and also to avoid some key elements, and the one side of the bending portion 4 close to the main board 2 is provided with the filling area conductive pin 3 to improve the stability of the bending portion 4.
The conductive strip 1 welded on the main board 2 and the main board 2 of the present embodiment have a gap therebetween, that is, the conductive strip 1 is not directly attached to the surface of the main board 2, such a design can better achieve a heat dissipation effect, and meanwhile, welding, dismounting and mounting in a limited space are facilitated, and processing and manufacturing are facilitated.
Preferably, the conductive strip 1 is a copper strip, and a tin layer is plated on the copper strip; and in the non-filling area of the conductive strip, the insulating protective layer is arranged on the tin layer in a spraying mode. The reason for this is that: a tin layer is plated on the surface of the copper bar before the Teflon plating, so that the conductivity of the conductive bar 1 is further increased on the basis of the copper bar; then, a teflon protective layer is sprayed after the tin layer is electroplated for realizing the functions of insulation, heat dissipation, flame retardance and the like, and when the tin layer is electroplated, in order to facilitate the application, one end of the conductive strip 1 is further provided with a through hole 5, as shown in fig. 2, the electroplating processing is realized through a hook.
To sum up, this example calculates the height X of required busbar 1 according to the required electric current I of 2 overall arrangement demands on mainboard and the thickness H of busbar 1, and then can carry out the increase of busbar 1 to mainboard 2 at the high-power consumption PCBA of general purpose server place, not only can solve the not enough problem of PCBA power supply, also can avoid PCBA to increase drawbacks such as its circuit board thickness or size because of walking the not enough of line space simultaneously, and the implementation is simple effective, and with strong points, effectual.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (8)
1. A method for supplying power to a high-power consumption PCBA of a general server is characterized by comprising the following steps:
step S1, calculating the height X of the required conductive strip according to the current I and the thickness H of the conductive strip required by the layout requirement of the mainboard;
step S2, performing tinning treatment on the conductive pins in the filling areas of the conductive strips, and performing insulating layer spraying on the non-filling areas of the conductive strips;
and step S3, welding the conductive pins of the filling area of the conductive strip on the mainboard.
2. The method applied to the power supply of the universal server high-power-consumption PCBA (printed circuit board assembly) as recited in claim 1, wherein in the step S1, the formula is used
And calculating the height X of the conductive strip where p is the resistivity (H + X) × 2; s is the cross section of the conductive stripProduct S ═ H × X; ktIs the comprehensive heat dissipation coefficient; m is the cross-sectional perimeter of the conductive strip; τ is the temperature rise coefficient.
3. The method applied to the power supply of the universal server high-power-consumption PCBA (printed circuit board assembly) as recited in claim 1 or 2, wherein the thickness H of the conductive strips is set according to the layout of a mainboard in a predefined mode.
4. The method applied to the power supply of the universal server high-power-consumption PCBA (printed circuit board assembly) as recited in claim 1 or 2, wherein the non-filled area is made of Teflon.
5. An apparatus for supplying power to a high-power consumption PCBA of a general-purpose server, the apparatus comprising at least one conductive strip soldered to a motherboard, the conductive strip using the method as claimed in any one of claims 1 to 4.
6. A device applied to power supply of a universal server high-power consumption PCBA as recited in claim 5, wherein one side of the conductive strip near the motherboard is provided with at least two pad conductive pins electrically connected with the motherboard.
7. The device applied to power supply of a universal server high-power-consumption PCBA as recited in claim 5, wherein the conductive strip is further provided with a bent portion, and a side of the bent portion close to the main board is provided with a filling area conductive pin.
8. A device applied to power supply of a universal server high-power consumption PCBA as recited in claim 5, wherein a gap is left between a conductive strip soldered on the motherboard and the motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011427627.7A CN112616252B (en) | 2020-12-09 | 2020-12-09 | Method and device applied to power supply of high-power-consumption PCBA of general server |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011427627.7A CN112616252B (en) | 2020-12-09 | 2020-12-09 | Method and device applied to power supply of high-power-consumption PCBA of general server |
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| CN112616252A true CN112616252A (en) | 2021-04-06 |
| CN112616252B CN112616252B (en) | 2022-07-19 |
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