CN220106550U - LCC packaging structure - Google Patents
LCC packaging structure Download PDFInfo
- Publication number
- CN220106550U CN220106550U CN202321146876.8U CN202321146876U CN220106550U CN 220106550 U CN220106550 U CN 220106550U CN 202321146876 U CN202321146876 U CN 202321146876U CN 220106550 U CN220106550 U CN 220106550U
- Authority
- CN
- China
- Prior art keywords
- bonding pad
- metallized film
- tube shell
- film block
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 12
- 239000011104 metalized film Substances 0.000 claims abstract description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides an LCC packaging structure which comprises a photoelectric coupler chip, a tube shell and pins, wherein the photoelectric coupler chip is embedded in the tube shell, an upper bonding pad is arranged on the top surface of the tube shell, a metallized film block is arranged on the bottom surface of the tube shell, the photoelectric coupler chip is electrically connected with the upper bonding pad, one end of each pin is fixedly connected with the upper bonding pad, the other end of each pin is fixedly connected with a lower bonding pad, and the lower bonding pad and the metallized film block are overlapped together. By adopting the technical scheme of the utility model, the external dimension of the lower bonding pad is increased, so that the electronic element with the LCC packaging structure can be fixed on the PCB by reflow soldering and manual soldering, thereby being convenient for personnel to overhaul or replace the electronic element, enabling soldering tin to be easier to fill in a gap between the bottom surface of the tube shell and the PCB and a step between the lower bonding pad and the metallized film block, ensuring that the lower bonding pad is reliably electrically connected with the metallized film block, and reducing the probability of occurrence of cold soldering and off soldering.
Description
Technical Field
The utility model belongs to the technical field of electronic element packaging structures, and particularly relates to an LCC packaging structure.
Background
Today, various electronic products are widely used, which include a plurality of electronic components, the yield and the demand of the electronic components are increasing, with the development of large-scale integrated circuits, the outline size of the electronic components is decreasing, the various electronic components are usually fixed on a PCB board, and then are mounted in various electronic products, the PCB is a printed circuit board, which is one of the important parts of the electronic industry, almost every electronic device, as small as an electronic watch, a calculator, as large as a computer, a communication electronic device, a military weapon system, etc., as long as the electronic components of the integrated circuits, etc., use PCBs for electrical interconnection therebetween, and in order to fix and electrically connect the electronic components on the PCBs, copper foils are typically mounted on the PCB substrates as pads, and then solder pastes are coated on the copper foils to electrically connect and fix the electronic components on the PCBs.
Various electronic components can be classified into DIP dual in-line, SMD patch, QFP quad flat package, LCC leadless chip package, etc. according to their packaging forms, wherein LCC leadless chip package has a wide application, for example, the publication number: patent document CN205356806U discloses an LCC package pad, comprising a copper foil for soldering components mounted on a PCB substrate, the copper foil comprising a first area and a pair of second areas symmetrically disposed on the left and right sides of the first area, the first area comprising a first rectangular portion, a pair of short sides of which extend from front and rear sides respectively to at least two second rectangular portions, comprising at least two pad structures, the pad structures comprising an integrally formed third rectangular portion and a semicircular portion. According to the technical scheme provided by the patent document, the pad copper foil formed by the first rectangular part, the second rectangular part, the third rectangular part and the semicircular part is irregular, the contact area of the pad copper foil and solder paste is increased, the heat dissipation area is increased, the contact area of the pad copper foil and an integrated circuit board is increased, the contact between an IC and the pad is firm, the patch is not easy to short-circuit, the corresponding integrated circuit from nine signal pins to seventeen signal pins can be compatible, and the pad copper foil has better stability.
However, in the LCC leadless chip package structure, the tail ends of the pins are disposed on the bottom surface of the whole package structure, and the overall dimension is very small, and the package structure can be generally fixed on a PCB board only by means of reflow soldering, which is inconvenient for manually soldering by using an electric soldering iron when repairing or replacing the electronic component, and is very inconvenient in operation.
Disclosure of Invention
In order to solve the technical problems, the utility model provides an LCC packaging structure.
The utility model is realized by the following technical scheme.
The utility model provides an LCC packaging structure which comprises a photoelectric coupler chip, a tube shell and pins, wherein the photoelectric coupler chip is embedded in the tube shell, an upper bonding pad is arranged on the top surface of the tube shell, a metallized film block is arranged on the bottom surface of the tube shell, the photoelectric coupler chip is electrically connected with the upper bonding pad, one end of each pin is fixedly connected with the upper bonding pad, the other end of each pin is fixedly connected with a lower bonding pad, and the lower bonding pad is overlapped with the metallized film block.
And the outline dimension of the lower bonding pad is smaller than that of the metallized film block.
The surface of the metallized film block is sequentially subjected to nickel plating and gold plating treatment.
The thickness of the metallized film block is not less than 0.15mm.
The whole metallized film block is rectangular.
The thickness of the lower bonding pad is not less than 0.15mm.
The whole lower bonding pad is rectangular.
The number of the pins is 4.
The utility model has the beneficial effects that: by adopting the technical scheme of the utility model, the external dimension of the lower bonding pad is increased, so that the electronic element with the LCC packaging structure can be fixed on the PCB in a reflow soldering mode, and also can be fixed on the PCB in a manual soldering mode, thereby facilitating the maintenance or replacement of the electronic element by personnel; on the other hand, a step is formed between the lower bonding pad and the metallized film block, soldering tin can be filled in the step more easily, so that the lower bonding pad and the metallized film block are electrically connected reliably, and the probability of occurrence of cold joint and cold joint stripping is reduced.
Drawings
FIG. 1 is a front view of the present utility model;
FIG. 2 is a top view of the present utility model;
FIG. 3 is a top view of the present utility model;
fig. 4 is a left side view of the present utility model.
In the figure: 1-photoelectric coupler chip, 2-tube shell, 3-pin, 4-upper bonding pad, 5-metallized film block and 6-lower bonding pad.
Detailed Description
The technical solution of the present utility model is further described below, but the scope of the claimed utility model is not limited to the above.
As shown in fig. 1, 2, 3 and 4, the utility model provides an LCC packaging structure, which comprises a photoelectric coupler chip 1, a tube shell 2 and a pin 3, wherein the photoelectric coupler chip 1 is embedded in the tube shell 2, an upper bonding pad 4 is arranged on the top surface of the tube shell 2, a metallized film block 5 is arranged on the bottom surface of the tube shell 2, the photoelectric coupler chip 1 is electrically connected with the upper bonding pad 4, one end of the pin 3 is fixedly connected with the upper bonding pad 4, the other end of the pin 3 is fixedly connected with a lower bonding pad 6, and the lower bonding pad 6 is overlapped with the metallized film block 5.
By adopting the technical scheme of the utility model, the external dimension of the lower bonding pad is increased, so that the electronic element with the LCC packaging structure can be fixed on the PCB in a reflow soldering mode, and also can be fixed on the PCB in a manual soldering mode, thereby facilitating the maintenance or replacement of the electronic element by personnel; on the other hand, a step is formed between the lower bonding pad and the metallized film block, soldering tin can be filled in the step more easily, so that the lower bonding pad and the metallized film block are electrically connected reliably, and the probability of occurrence of cold joint and cold joint stripping is reduced.
Specifically, the outer dimension of the lower pad 6 is smaller than the outer dimension of the metallized film block 5. The surface of the metallized film block 5 is sequentially subjected to nickel plating and gold plating. Among various metal materials, the metal film block 5 having the highest conductivity of gold element is subjected to nickel plating and gold plating treatment, so that the conductivity of the metal film block 5 can be improved.
In addition, the thickness of the metallized film block 5 is preferably not less than 0.15mm. The metallized film block 5 is generally rectangular in shape. The thickness of the lower bonding pad 6 is not less than 0.15mm. The lower pad 6 has a rectangular shape as a whole. The number of pins 3 is 4.
Claims (8)
1. An LCC package, characterized in that: including photoelectric coupler chip (1), tube shell (2) and pin (3), photoelectric coupler chip (1) inlay in tube shell (2), the top surface of tube shell (2) is equipped with pad (4), the bottom surface of tube shell (2) is equipped with metallized film piece (5), photoelectric coupler chip (1) and last pad (4) electric connection, the one end and the last pad (4) of pin (3) link firmly, the other end and the lower pad (6) of pin (3) link firmly, and lower pad (6) with metallized film piece (5) coincide together.
2. The LCC package according to claim 1, wherein: the outline dimension of the lower bonding pad (6) is smaller than that of the metallized film block (5).
3. The LCC package according to claim 1, wherein: the surface of the metallized film block (5) is sequentially subjected to nickel plating and gold plating treatment.
4. A LCC package according to any one of claims 1 to 3, wherein: the thickness of the metallized film block (5) is not less than 0.15mm.
5. The LCC package according to claim 1, wherein: the whole metallized film block (5) is rectangular.
6. The LCC package according to claim 1, wherein: the thickness of the lower bonding pad (6) is not less than 0.15mm.
7. The LCC package according to claim 1, wherein: the whole lower bonding pad (6) is rectangular.
8. The LCC package according to claim 1, wherein: the number of the pins (3) is 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321146876.8U CN220106550U (en) | 2023-05-13 | 2023-05-13 | LCC packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321146876.8U CN220106550U (en) | 2023-05-13 | 2023-05-13 | LCC packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220106550U true CN220106550U (en) | 2023-11-28 |
Family
ID=88881791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321146876.8U Active CN220106550U (en) | 2023-05-13 | 2023-05-13 | LCC packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220106550U (en) |
-
2023
- 2023-05-13 CN CN202321146876.8U patent/CN220106550U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2021063267A1 (en) | Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method | |
| CN109041418B (en) | Circuit board structure and electronic equipment | |
| CN220106550U (en) | LCC packaging structure | |
| CN215732107U (en) | Copper bar connecting piece with novel voltage sampling points and voltage sampling connecting structure | |
| CN215243650U (en) | Ladder steel mesh structure for long element printing solder paste | |
| CN211090145U (en) | Circuit board and electronic equipment | |
| CN214588265U (en) | Resistor and its foot piece | |
| CN218768787U (en) | Copper flat wire for PCB | |
| CN220235062U (en) | Earphone bonding pad wiring structure | |
| CN214176018U (en) | Power semiconductor packaging structure | |
| CN109587947A (en) | A kind of circuit board | |
| CN217064094U (en) | Novel circuit board | |
| CN218587382U (en) | Novel circuit board | |
| CN210928126U (en) | PCB assembly | |
| CN216528861U (en) | Packaging structure of power device | |
| CN214708144U (en) | PCB board for MEMS sensor | |
| CN220710655U (en) | Plastic packaging patch type SMT terminal | |
| CN218959201U (en) | Metal spring plate structure welded on PCB through SMT | |
| CN211788891U (en) | Integrated surface-mounted fuse | |
| CN219419014U (en) | Sensor chip packaging structure | |
| CN213752692U (en) | Packaging base and packaging base combined board | |
| CN214256150U (en) | Module assembly structure replacing pressure-sensitive rectifier bridge | |
| CN214256741U (en) | Can be used for solving line and line welding efficiency's circuit board | |
| CN215499743U (en) | Straight pin component circuit board structure | |
| CN203589005U (en) | Recessed welding point package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |