CN219419014U - Sensor chip packaging structure - Google Patents

Abstract

The application discloses sensor chip packaging structure, including chip body, mainboard body, second welded plate, ceramic shell, metal support frame, bonding mechanism and heat dissipation mechanism, mainboard body top right side fixed connection second welded plate, the welding of second welded plate top has the solder ball, the perforation is seted up at chip body middle part, chip body top fixedly connected with pin, the pin runs through inside the perforation. Through filling the silicone grease between ceramic shell and chip bottom side, be convenient for through the heat conduction of silicone grease with the heat introduction inside the ceramic shell of chip main part production, and through the heat conduction of ceramic shell to, give off the department with the heat from the exposed one side of pottery again, and through the department that meets copper line and ceramic shell, be convenient for give off the heat that the copper line produced, avoid the copper line to take place the oxidation under the high temperature, cause the life reduction of copper line.

Description

Sensor chip packaging structure

Technical Field

The application relates to the field of sensor chip packaging, in particular to a sensor chip packaging structure.

Background

The chip package, i.e. the housing for mounting the semiconductor integrated circuit chip, has the functions of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. The chip package is a bridge for communicating the world inside the chip with an external circuit, the contact points of the chip are connected to the pins of the package shell by wires, and the pins are connected with other devices by wires on the printed board; the package plays an important role in CPU and other LSI integrated circuits, and has the advantages of increased pin number, reduced pin spacing, reduced weight, improved reliability and more convenient use.

The existing chip packaging structure has poor heat dissipation effect, so that the reliability of the chip is deteriorated, the delay is increased, the rated frequency is not reached, time delay faults are caused, and most of the circuits bonded in the chip are copper wires, but the copper wires are oxidized easily at high temperature, so that the service life of the copper wires is reduced. Therefore, a sensor chip package structure is proposed for the above-described problems.

Disclosure of Invention

The embodiment provides a sensor chip packaging structure which is used for solving the problems that the heat dissipation effect of the chip packaging structure in the prior art is poor, the reliability of a chip is deteriorated, the delay is increased, the rated frequency is not reached, the delay fault is caused, most of the circuits bonded in the chip are copper wires, but the copper wires are oxidized easily at high temperature, and the service life of the copper wires is reduced.

According to an aspect of the application, there is provided a sensor chip packaging structure, which comprises a chip body, a main board body, a second welding plate, a ceramic shell, a metal support frame, a bonding mechanism and a heat dissipation mechanism, wherein the right side of the top end of the main board body is fixedly connected with the second welding plate, the top end of the second welding plate is welded with a solder ball, a through hole is formed in the middle of the chip body, a pin is fixedly connected to the top end of the chip body, and the pin penetrates through the through hole.

Further, the heat dissipation mechanism comprises silicone grease and a ceramic shell, and the silicone grease is adhered between the bottom end of the chip body and the top end of the ceramic shell.

Further, the bonding mechanism comprises copper wires, a first welding plate and a second welding plate, the bottom end of the main board body is fixedly connected with the top end of the chip body, the first welding plate is fixedly connected with the top end of the main board body, and the left side of the bottom end of the first welding plate and the right side of the bottom end of the second welding plate are fixedly connected with two ends of the copper wires.

Further, the two sides of the ceramic shell are fixedly connected with metal support frames respectively, and the top ends of the metal support frames are fixedly connected with metal sheets.

Further, copper line outer wall fixed connection limiting block, limiting block outer wall fixed connection ceramic housing top, ceramic housing top closely laminates the copper line surface, the mainboard body is link up respectively at copper line both ends.

Further, resin is bonded between the inside of the ceramic shell and the main board body and between the main board and the metal sheet.

Through this above-mentioned embodiment, chip body has been adopted, the mainboard body, the second welds the board, the ceramic casing, metal support frame, bonding mechanism and heat dissipation mechanism, chip packaging structure's radiating effect is poor, lead to the chip reliability to worsen the time delay increase, and reach rated frequency, cause time delay trouble, and the circuit of the inside bonding of chip is copper line mostly, but copper line runs into high temperature and appears the oxidation easily, lead to the problem that life of copper line reduces, the heat that the chip main part produced is led into inside the ceramic casing through filling silicone grease between ceramic casing and chip bottom side to the heat conductivity of silicone grease of having been convenient for, and through ceramic casing's heat conduction way, give off the department from the pottery exposes one side again with the heat, and through the department that meets copper line and ceramic casing, be convenient for give off the heat that the copper line produced, avoid the copper line to take place to oxidize under high temperature, cause the effect that life of copper line reduces.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a schematic diagram of the overall internal structure of an embodiment of the present application;

FIG. 2 is a schematic diagram illustrating a connection structure between a chip body and a bonding pad according to an embodiment of the present disclosure;

fig. 3 is a schematic top view of a motherboard according to an embodiment of the present application.

In the figure: 1. a chip body; 101. pins; 2. a main board body; 201. perforating; 202. a first solder plate; 203. a second solder plate; 204. solder balls; 205. copper wire; 3. silicone grease; 4. a ceramic housing; 5. a metal support frame; 6. a metal thin plate; 7. a resin; 8. the block is restricted.

Detailed Description

In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the present application described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are used primarily to better describe the present application and its embodiments and are not intended to limit the indicated device, element or component to a particular orientation or to be constructed and operated in a particular orientation.

Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "configured," "provided," "connected," "coupled," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Referring to fig. 1-3, the sensor chip package structure includes a chip body 1, a main board body 2, a second solder plate 203, a ceramic housing 4, a metal support 5, a bonding mechanism and a heat dissipation mechanism, wherein the right side of the top end of the main board body 2 is fixedly connected with the second solder plate 203, the top end of the second solder plate 203 is welded with a solder ball 204, a through hole 201 is formed in the middle of the chip body 1, the top end of the chip body 1 is fixedly connected with a pin 101, the pin 101 penetrates through the inside of the through hole 201, silicone grease 3 is filled between the ceramic housing 4 and the bottom side of the chip, so that heat generated by the chip body is conveniently led into the ceramic housing 4 through the thermal conductivity of the silicone grease 3, and is dissipated from the exposed side of the ceramic housing 4 through the thermal conduction direction, and the copper wire 205 is conveniently dissipated with the contact of the ceramic housing, so that the copper wire 205 is prevented from being oxidized at high temperature, and the service life of the copper wire 205 is reduced;

the heat dissipation mechanism comprises a silicone grease 3 and a ceramic shell 4, the silicone grease 3 is adhered between the bottom end of the chip body 1 and the top end of the ceramic shell 4, so that heat of the chip body 1 is eliminated, the bonding mechanism comprises copper wires 205, a first welding plate 202 and a second welding plate 203, the bottom end of the main board body 2 is fixedly connected with the top end of the chip body 1, the top end of the main board body 2 is fixedly connected with the first welding plate 202, two ends of the copper wires 205 are fixedly connected between the left side of the bottom end of the first welding plate 202 and the right side of the bottom end of the second welding plate 203, the bonding of the first welding plate 202 and the second welding plate 203 is facilitated, two sides of the ceramic shell 4 are respectively fixedly connected with a metal support frame 5, the top end of the metal support frame 5 is fixedly connected with a metal sheet 6, the outer wall of the copper wires 205 is fixedly connected with a limiting block 8, the top end of the limiting block 8 is fixedly connected with the ceramic shell 4, the top end of the ceramic shell 4 is tightly adhered with the surface of the copper wires 205, the two ends of the copper wires 205 are respectively communicated with the main board body 2, and resin 7 is adhered between the inside the ceramic shell 4 and the main board body 2 and the metal sheet 6.

When the novel copper wire bonding device is used, the metal plate supporting frames are arranged on two sides of the ceramic shell 4, so that the overall stability and hardness are improved, resin 7 is arranged between the inside of the ceramic shell 4 and the main board body 2 and between the metal sheets 6 of the main board body 2, the internal leads are protected conveniently, silicone grease 3 is filled between the ceramic shell 4 and the bottom side of a chip, heat generated by the main chip body is conveniently guided into the inside of the ceramic shell 4 through the heat conductivity of the silicone grease 3, the heat is dissipated from the exposed side of the ceramic through the heat conduction direction of the ceramic shell 4, the copper wires 205 are conveniently dissipated at the joint of the copper wires 205 and the ceramic shell, oxidation of the copper wires 205 at high temperature is avoided, the service life of the copper wires 205 is reduced, the first welding plate 202 and the second welding plate 203 are bonded through the copper wires 205, the cost is conveniently saved, the copper wires 205 have the characteristics of high conductivity, the maximum allowable current is high, the stability at high temperature and the like, the hardness of the copper wires 205 is high relative to other wires, and the service life is convenient to improve.

The beneficial point of the application lies in:

1. the silicone grease is filled between the ceramic shell and the bottom side of the chip, so that heat generated by the chip main body is conveniently led into the ceramic shell through the heat conductivity of the silicone grease, and is dissipated from the exposed side of the ceramic through the heat conductivity direction of the ceramic shell, and the copper wire is conveniently dissipated through the junction of the copper wire and the ceramic shell, so that the copper wire is prevented from being oxidized at high temperature, and the service life of the copper wire is reduced;

2. the first welding plate and the second welding plate are bonded through the copper wire, so that cost is saved, the copper wire is good in conductivity, the maximum allowable current is high, the stability at high temperature is high, the hardness of the copper wire is high relative to other wires, and the service life is prolonged.

The related circuits, electronic components and modules are all in the prior art, and can be completely implemented by those skilled in the art, and needless to say, the protection of the present application does not relate to improvements of software and methods.

The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (4)

1. Sensor chip packaging structure, its characterized in that: the novel chip comprises a chip body (1), a main board body (2), a second welding plate (203), a ceramic shell (4), a metal support frame (5), a bonding mechanism and a heat dissipation mechanism, wherein the right side of the top end of the main board body (2) is fixedly connected with the second welding plate (203), the top end of the second welding plate (203) is welded with a solder ball (204), a through hole (201) is formed in the middle of the chip body (1), pins (101) are fixedly connected to the top end of the chip body (1), and the pins (101) penetrate through the inside of the through hole (201);

the bonding mechanism comprises a copper wire (205), a first welding plate (202) and a second welding plate (203), wherein the bottom end of the main board body (2) is fixedly connected with the top end of the chip body (1), the top end of the main board body (2) is fixedly connected with the first welding plate (202), and two ends of the copper wire (205) are fixedly connected between the left side of the bottom end of the first welding plate (202) and the right side of the bottom end of the second welding plate (203);

the copper wire (205) outer wall fixed connection limiting block (8), limiting block (8) outer wall fixed connection ceramic shell (4) top, ceramic shell (4) top closely laminate copper wire (205) surface, copper wire (205) both ends link up mainboard body (2) respectively.

2. The sensor chip package according to claim 1, wherein: the heat dissipation mechanism comprises silicone grease (3) and a ceramic shell (4), wherein the silicone grease (3) is bonded between the bottom end of the chip body (1) and the top end of the ceramic shell (4).

3. The sensor chip package according to claim 1, wherein: the two sides of the ceramic shell (4) are fixedly connected with metal support frames (5) respectively, and the top ends of the metal support frames (5) are fixedly connected with metal thin plates (6).

4. The sensor chip package according to claim 1, wherein: and resin (7) is bonded between the inside of the ceramic shell (4) and the main board body (2) and between the main board and the metal sheet (6).