CN207219178U - A fixture for SMT printing - Google Patents
A fixture for SMT printing Download PDFInfo
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- CN207219178U CN207219178U CN201720721110.6U CN201720721110U CN207219178U CN 207219178 U CN207219178 U CN 207219178U CN 201720721110 U CN201720721110 U CN 201720721110U CN 207219178 U CN207219178 U CN 207219178U
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Abstract
Description
技术领域technical field
本实用新型属于SMT(表面贴装技术)技术领域,涉及一种SMT印刷用治具。The utility model belongs to the technical field of SMT (surface mount technology), and relates to a fixture for SMT printing.
背景技术Background technique
随着电子行业的迅速发展,电子产品品种繁多,精密电子元器件被广泛的应用于各个行业,同时对精密电子元器件的品质和良品率要求更高。PCB板的SMT好坏直接影响其生产的加工效率、良品率,而SMT的好坏与印刷钢网息息相关,所以印刷钢网的结构设计非常重要。With the rapid development of the electronics industry, there are a wide variety of electronic products, and precision electronic components are widely used in various industries. At the same time, the quality and yield of precision electronic components are required to be higher. The quality of SMT of PCB directly affects the processing efficiency and yield rate of its production, and the quality of SMT is closely related to the printing stencil, so the structural design of the printing stencil is very important.
印刷钢网是用来印刷锡膏的模具,印刷锡膏时通过钢网开口漏铺到PCB板焊盘上,即通过钢网开口尺寸印到PCB板焊盘上,然后过炉。目前SMT印锡双面制程普遍采用的方式是先印刷、贴片、回流生产其中一面,再翻版后,经过再次印刷、再次回流生产另一面。两次回流过程就需要增加一台回流炉设备,从而增加了单位产值的能耗;同时,在双面印刷时,翻版后印刷时,其另一面上的锡膏容易被破坏。The printing stencil is a mold used to print solder paste. When printing solder paste, it is leaked onto the PCB pad through the opening of the stencil, that is, it is printed on the PCB pad through the size of the stencil opening, and then passed through the furnace. At present, the SMT tin printing double-sided process generally adopts the method of first printing, patching, and reflowing to produce one side, and then reprinting, reprinting, and reflowing to produce the other side. Two reflow processes need to add a reflow furnace equipment, thereby increasing the energy consumption per unit of output value; at the same time, when printing on both sides, the solder paste on the other side is easily damaged when printing after reprinting.
因此,如何解决上述问题,是本领域技术人员要研究的内容。Therefore, how to solve the above problems is what those skilled in the art should study.
发明内容Contents of the invention
为克服上述现有技术中的不足,本实用新型目的在于提供一种结构简单、生产成本低的SMT印刷用治具。In order to overcome the deficiencies in the above-mentioned prior art, the purpose of the utility model is to provide a jig for SMT printing with simple structure and low production cost.
为实现上述目的及其他相关目的,本实用新型提供一种SMT用治具,包括印刷丝网及底板;所述印刷丝网包括丝网本体,所述丝网本体上开设有与所述印制电路板匹配的印刷孔;所述丝网本体的四个角部设有定位孔;所述底板上也开设有与所述印制电路板匹配的印刷孔;所述底板上对应所述丝网本体上的定位孔设有与之配合的固定孔;所述印刷丝网与所述底板之间形成供容置所述印制电路板的容纳腔。In order to achieve the above purpose and other related purposes, the utility model provides a fixture for SMT, including a printing screen and a bottom plate; the printing screen includes a screen body, and the screen body is provided with a The printing holes matching the circuit board; the four corners of the screen body are provided with positioning holes; the bottom plate is also provided with printing holes matching the printed circuit board; the bottom plate corresponds to the screen The positioning hole on the body is provided with a fixing hole matched therewith; an accommodating cavity for accommodating the printed circuit board is formed between the printing screen and the bottom plate.
上述技术方案中,相关内容解释如下:In the above technical solution, the relevant content is explained as follows:
1、上述方案中,所述印刷丝网为厚度为0.2mm的磁性钢片。1. In the above solution, the printing screen is a magnetic steel sheet with a thickness of 0.2mm.
2、上述方案中,所述底板的周向上设有弧形凹边。2. In the above solution, arc-shaped concave edges are provided on the circumference of the bottom plate.
3、上述方案中,所述底板的四个角上设有供所述印制电路板的角部插入的三角形固定槽;所述固定孔也设在所述三角形固定槽上的槽壁上。3. In the above solution, the four corners of the bottom plate are provided with triangular fixing grooves for inserting the corners of the printed circuit board; the fixing holes are also arranged on the groove walls of the triangular fixing grooves.
由于上述技术方案运用,本实用新型与现有技术相比具有的优点是:Due to the use of the above technical solutions, the utility model has the following advantages compared with the prior art:
本实用新型采用印刷治具固定印制电路板,采用印刷-翻板-再次印刷-贴片-回流焊接-清洗印制电路板的印刷工艺,较传统工艺省去了一次回流焊接步骤,同时节省了一台回流炉设备,降低了单位产值的能耗,节约了成本,简化了印刷工艺,提高了印刷效率及印刷质量,并避免了生产时锡膏被破坏的风险。The utility model adopts the printing fixture to fix the printed circuit board, and adopts the printing process of printing-turning board-re-printing-patch-reflow welding-cleaning the printed circuit board, which saves a reflow welding step compared with the traditional process, and saves A reflow furnace equipment was installed, which reduces the energy consumption per unit output value, saves costs, simplifies the printing process, improves printing efficiency and printing quality, and avoids the risk of solder paste being damaged during production.
附图说明Description of drawings
图1为本实用新型用结构示意图;Fig. 1 is a structural representation of the utility model;
图2为本实用新型中印刷丝网结构示意图;Fig. 2 is the schematic diagram of printing screen structure in the utility model;
图3为本实用新型工艺流程示意图。Fig. 3 is a schematic diagram of the process flow of the utility model.
具体实施方式Detailed ways
以下由特定的具体实施例说明本实用新型的实施方式,熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本实用新型的其他优点及功效。The implementation of the present utility model is illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification.
请参阅图1至图3。须知,本说明书所附图式所绘示的结构、比例、大小等,均仅用以配合说明书所揭示的内容,以供熟悉此技术的人士了解与阅读,并非用以限定本实用新型可实施的限定条件,故不具技术上的实质意义,任何结构的修饰、比例关系的改变或大小的调整,在不影响本实用新型所能产生的功效及所能达成的目的下,均应仍落在本实用新型所揭示的技术内容得能涵盖的范围内。同时,本说明书中所引用的如“上”、“下”、“左”、“右”、“中间”及“一”等的用语,亦仅为便于叙述的明了,而非用以限定本实用新型可实施的范围,其相对关系的改变或调整,在无实质变更技术内容下,当亦视为本实用新型可实施的范畴。See Figures 1 through 3. It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the utility model Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of The technical content disclosed by the utility model must be within the scope covered. At the same time, terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description and are not used to limit this specification. The practicable range of the utility model, and the change or adjustment of its relative relationship, without any substantial change in the technical content, shall also be regarded as the practicable scope of the utility model.
如图1和图2所示,一种SMT印刷工艺用印刷治具,包括印刷丝网及底板1;所述印刷丝网包括丝网本体2,所述丝网本体2上开设有与所述印制电路板5匹配的印刷孔3;所述丝网本体2的四个角部设有定位孔4;所述底板1上也开设有与所述印制电路板匹配的印刷孔(图中未示出);所述底板1上对应所述丝网本体2上的定位孔4设有与之配合的固定孔6;所述印刷丝网与所述底板1之间形成供容置所述印制电路板5的容纳腔。As shown in Fig. 1 and Fig. 2, a kind of SMT printing process uses printing jig, comprises printing screen and base plate 1; Described printing screen comprises screen body 2, is provided with described screen body 2 The printing hole 3 that printed circuit board 5 matches; The four corners of described screen body 2 are provided with positioning hole 4; Also offer the printing hole that matches with described printed circuit board on the described base plate 1 (in the figure not shown); the bottom plate 1 is provided with a fixed hole 6 corresponding to the positioning hole 4 on the screen body 2; the printing screen and the bottom plate 1 are formed for accommodating the An accommodating cavity for the printed circuit board 5 .
所述印刷丝网为厚度为0.2mm的磁性钢片。The printing screen is a magnetic steel sheet with a thickness of 0.2mm.
所述底板1的周向上设有弧形凹边11。该凹边11的凹陷底部位于所述印制电路板5的边缘内侧,便于印制电路板5的取放。An arc-shaped concave edge 11 is provided on the circumference of the bottom plate 1 . The concave bottom of the concave edge 11 is located inside the edge of the printed circuit board 5 , which is convenient for taking and placing the printed circuit board 5 .
所述底板1的四个角上设有供所述印制电路板5的角部插入的三角形固定槽7;所述固定孔6也设在所述三角形固定槽7上的槽壁上。The four corners of the bottom plate 1 are provided with triangular fixing slots 7 for inserting the corners of the printed circuit board 5 ; the fixing holes 6 are also provided on the walls of the triangular fixing slots 7 .
如图3所示,使用该印刷治具的SMT印刷工艺;包括以下步骤:As shown in Figure 3, the SMT printing process using the printing fixture; includes the following steps:
制作印刷治具:按照SMT元器件在印制电路板上的位置及焊盘形状,制作用于漏印焊锡膏的印刷治具; Making printing fixtures: According to the position of SMT components on the printed circuit board and the shape of the pads, make printing fixtures for missing solder paste;
丝网漏印焊锡膏:把印制电路板固设在所述印刷治具内,将焊锡膏均匀地漏印在元器件的电极焊盘上; Screen solder paste printing: fix the printed circuit board in the printing fixture, and evenly print the solder paste on the electrode pads of the components;
翻板:翻转治具,将焊锡膏均匀地漏印在印制电路板另一面上的元器件的电极焊盘上; Flip board: Flip the jig and print the solder paste evenly on the electrode pads of the components on the other side of the printed circuit board;
贴装SMT元器件:把SMT元器件贴装到印制电路板上,使其电极准确定位于各自的焊盘; Mount SMT components: mount SMT components on the printed circuit board so that the electrodes are accurately positioned on their respective pads;
回流焊接:用回流焊方法进行焊接; Reflow soldering: soldering by reflow soldering method;
清洗印制电路板,完成印刷。 Clean the printed circuit board and complete the printing.
在所述步骤中,在焊接过程中,将焊锡膏熔化再次流动,充分浸润元器件和印制电路板的焊盘。in the step During the soldering process, the solder paste is melted and reflowed to fully infiltrate the components and the pads of the printed circuit board.
在所述步骤中,在清洗过程中,把回流焊接后的印刷电路板泡在无机溶液中,用超声波冲击清洗。in the step In the cleaning process, the printed circuit board after reflow soldering is soaked in an inorganic solution and cleaned by ultrasonic shock.
本实用新型采用印刷治具固定印制电路板,采用印刷-翻板-再次印刷-贴片-回流焊接-清洗印制电路板的印刷工艺,较传统工艺省去了一次回流焊接步骤,同时节省了一台回流炉设备,降低了单位产值的能耗,节约了成本,简化了印刷工艺,提高了印刷效率及印刷质量,并避免了生产时锡膏被破坏的风险,具有显著的进步。The utility model adopts the printing fixture to fix the printed circuit board, and adopts the printing process of printing-turning board-re-printing-patch-reflow welding-cleaning the printed circuit board, which saves a reflow welding step compared with the traditional process, and saves A reflow furnace equipment has been installed, which reduces the energy consumption per unit output value, saves costs, simplifies the printing process, improves printing efficiency and printing quality, and avoids the risk of solder paste being damaged during production, which is a significant improvement.
上述实施例仅例示性说明本实用新型的原理及其功效,而非用于限制本实用新型。任何熟悉此技术的人士皆可在不违背本实用新型的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本实用新型所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本实用新型的权利要求所涵盖。The above-mentioned embodiments only illustrate the principles and effects of the present utility model, but are not intended to limit the present utility model. Anyone familiar with this technology can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the utility model should still be covered by the claims of the utility model.
Claims (4)
- A kind of 1. SMT printings tool, it is characterised in that:Including printing screen and bottom plate;The printing screen includes silk screen sheet Body, the printing hole matched with printed circuit board is offered on the silk screen body;Four corners of the silk screen body are provided with fixed Position hole;Also the printing hole matched with printed circuit board is offered on the bottom plate;Corresponded on the bottom plate on the silk screen body Positioning hole be provided with matched fixing hole;Formed between the printing screen and the bottom plate for housing the printed circuit The accommodating chamber of plate.
- 2. SMT printings tool according to claim 1, it is characterised in that:The printing screen is that thickness is 0.2mm's Magnetic steel disc.
- 3. SMT printings tool according to claim 1, it is characterised in that:It is recessed that the circumference of the bottom plate is provided with arc Side.
- 4. SMT printings tool according to claim 1, it is characterised in that:Four angles of the bottom plate are provided with and supply institute State the triangle fixing groove of the corner insertion of printed circuit board;The fixing hole is also provided in the cell wall in the triangle fixing groove On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720721110.6U CN207219178U (en) | 2017-06-20 | 2017-06-20 | A fixture for SMT printing |
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| CN201720721110.6U CN207219178U (en) | 2017-06-20 | 2017-06-20 | A fixture for SMT printing |
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| CN207219178U true CN207219178U (en) | 2018-04-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112004316A (en) * | 2020-07-17 | 2020-11-27 | 苏州浪潮智能科技有限公司 | Printed circuit board structure with stacked element design and welding method |
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2017
- 2017-06-20 CN CN201720721110.6U patent/CN207219178U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112004316A (en) * | 2020-07-17 | 2020-11-27 | 苏州浪潮智能科技有限公司 | Printed circuit board structure with stacked element design and welding method |
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Effective date of registration: 20191212 Address after: 215000 Building 5, No.199, Jinfeng Road, high tech Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Shiwei Electronic Technology Co.,Ltd. Address before: 215000 B1 building, 159 Zhujiang Road, Jiangsu, Suzhou Patentee before: SUZHOU SHIWEI ELECTRONIC Co.,Ltd. |
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Effective date of registration: 20250805 Granted publication date: 20180410 |