CN206461848U - It is a kind of support sizes PCB wave-solderings produce control instrument - Google Patents

Abstract

The utility model belongs to PCB manufacturing technologies field, specifically a kind of to support what sizes PCB wave-solderings produced to control instrument.The instrument of controlling of the support sizes PCB wave-solderings production of the utility model includes loading plate, also include travel(l)ing rest one and travel(l)ing rest two, loading plate edge is provided with baffle plate one, baffle plate two, baffle plate three and baffle plate four, baffle plate one, baffle plate two, baffle plate three and baffle plate four and opens up limited location recess respectively；Travel(l)ing rest one is slidably matched respectively with baffle plate one, baffle plate three, and travel(l)ing rest two is slidably matched respectively with baffle plate two, baffle plate four, and some positioning studs are respectively arranged with travel(l)ing rest one, travel(l)ing rest two.The tool construction of controlling of support sizes PCB wave-solderings production of the present utility model designs advantages of simple, the risk that can effectively avoid portion from having part to contact, and can arbitrarily adjust frame size size, with good application value.

Description

A governance tool that supports wave soldering production of PCBs of various sizes

technical field

The utility model relates to the technical field of PCB production and manufacturing, and specifically provides a processing tool supporting wave soldering production of PCBs of various sizes.

Background technique

With the development of electronic products, the upgrading of electronic products is getting faster and faster, and the price is getting lower and lower. There are more and more upgrades and new product research and development of electronic products, faster and faster, cost reduction and production With the shortening of the cycle, product development must meet the requirements of low cost and fast delivery in order to meet the market demand. PCB (Printed Circuit Board) is a printed circuit board, which is an important component in electronic products. In the production process of printed circuit boards, two process operations, reflow soldering and wave soldering, are required for printed circuit boards. With the continuous development of the electronics industry, the convenience of electronic products determines the popularity of the market. In addition, due to the increase in the functions of electronic products, the volume of various components tends to be miniaturized, and printed circuit boards are also developing in the direction of thinner and lighter. Light and thin printed circuit boards are prone to distortion and deformation during wave soldering, which will damage the quality of printed circuit boards.

In the patent document whose patent number is CN103447648A, a wave soldering carrier is disclosed. The wave soldering carrier of this structure includes a base plate, the base plate is formed with a receiving groove matching the shape of the circuit board and a plurality of through holes communicating with the receiving groove. The receiving groove is used for placing the circuit board. The through hole corresponds to the electronic circuit on the circuit board that needs to be wave soldered. A fixing component is arranged on the bottom plate. The fixing assembly includes fixing pieces. The fixing part includes a fixing shaft fixed on the bottom plate and a limit shaft protruding from one end of the fixing shaft. The diameter of the limiting shaft is larger than that of the fixed shaft, so that a step is formed between the fixed shaft and the limiting shaft. The wave soldering carrier of the structure fixes the circuit board in the accommodating groove through the fixing component, which avoids distortion, deformation and the like caused by the floating of the circuit board by tin wave impact during the wave soldering process. However, the wave soldering carrier of the described structure cannot be adjusted accordingly according to the actual size of the printed circuit board, and can only be applied to the printed circuit board of the same size. When the product is upgraded, the original special carrier will be scrapped, and the printed circuit board The production of circuit board wave soldering needs to be redesigned and made a new special carrier, which not only causes waste and increases production costs, but also prolongs the production cycle and correspondingly reduces the production efficiency of the enterprise.

Contents of the invention

In order to solve the above existing problems, the utility model provides a simple and reasonable structural design, which can effectively avoid the risk that some parts cannot be touched, and can adjust the size of the frame arbitrarily to support the production of PCB wave soldering in various sizes. tool.

In order to achieve the above object, the utility model provides the following technical solutions:

A processing tool that supports the production of PCB wave soldering in various sizes, including a bearing plate, and also includes a movable bracket 1 and a movable bracket 2, and the surrounding edges of the bearing plate are respectively provided with baffles 1, baffles 2, baffles 3 and baffles. Plate four, baffle plate 1, baffle plate 2, baffle plate 3, and baffle plate 4 are connected end to end in sequence, and baffle plate 1, baffle plate 2, baffle plate 3, and baffle plate 4 are respectively provided with limited recesses; the movable bracket 1 Slidingly cooperate with baffle plate 1 and baffle plate 3 respectively, movable support 2 and baffle plate 2 and baffle plate 4 respectively slide and cooperate, movable support 1 and movable support 2 are respectively provided with a number of positioning studs; baffle plate 1 and baffle plate 2 1. The first movable bracket and the second movable bracket are respectively provided with buckle parts.

The position of the movable bracket 1 and the movable bracket 2 can be adjusted arbitrarily, so that the jig tool is suitable for wave soldering processing of all single-sided patch printed circuit boards within the size of 310*260mm.

During the wave soldering production process of PCBs of different sizes, the PCB is placed on the carrier board, and the positions of the movable bracket 1 and the movable bracket 2 are adjusted according to the size of the PCB. After adjusting the positions of the movable bracket 1 and the movable bracket 2, use The positioning studs on the movable bracket one and the movable bracket two are respectively aligned with the limit recesses on the first baffle plate, the third baffle plate, the second baffle plate and the fourth baffle plate, tighten the positioning studs, and align the first movable bracket and the second movable bracket The position is fixed. Then rotate each buckle part to exert pressure on the PCB board, press the PCB board on the carrier board, and then perform wave soldering production on the PCB.

Preferably, the bottom of the carrier board is provided with several hollowed out parts, so that the positions of the components to be soldered correspond to the positions of the hollowed out parts during the PCB placement process.

Preferably, the buckle parts on the first baffle and the second baffle are in the shape of a cuboid.

As a preference, the buckle parts on the movable bracket 1 and the movable bracket 2 are in the shape of "7", which is beneficial to compress the PCB board.

Preferably, the first baffle, the second baffle, the third baffle, and the fourth baffle are integrated with the bearing plate, which is beneficial to ensure the firmness of the treatment tool during use.

Compared with the prior art, the utility model supports the production of multi-size PCB wave soldering tool has the following prominent beneficial effects:

(1) The jig tool is provided with a movable bracket 1 and a movable bracket 2, and the positions of the movable bracket 1 and the movable bracket 2 can be adjusted according to the actual size of the PCB, so that the jig tool is suitable for all single-sided PCBs within a size of 310*260mm. The wave soldering processing of SMD printed circuit board has strong versatility, saves enterprise costs and improves work efficiency;

(2) The baffle 1, the baffle 2, the movable bracket 1 and the movable bracket 2 are all provided with buckle parts, and during the wave soldering production process of the PCB, the press buckle parts are rotated to apply pressure to the PCB board, and the PCB The board is pressed tightly on the carrier board to prevent tin waves from flowing to the printed circuit board along the gap, and can effectively prevent the printed circuit board from warping due to thermal deformation and improve the quality of PCB production;

(3) The said treatment tool is simple in structure, low in cost, has a wide range of applications, and has good practicability.

Description of drawings

Fig. 1 is a structural schematic diagram of a tool for supporting wave soldering production of PCBs of various sizes described in the present invention.

Among them, 1. bearing plate, 2. movable bracket one, 3. movable bracket two, 4. baffle plate 1, 5. baffle plate 2, 6. baffle plate 3, 7. baffle plate 4, 8. limiting recess, 9 .Positioning studs, 10. Press buckle parts, 11. Hollow part.

detailed description

In the following, with reference to the accompanying drawings and embodiments, the tool for supporting wave soldering production of PCBs of various sizes of the present invention will be further described in detail.

Example

As shown in Figure 1, the utility model supports the multi-size PCB wave soldering production tools mainly by the carrier plate 1, movable support 2, movable support 2 3, baffle 1 4, baffle 2 5, baffle 3 6 and baffle plate four 7 constitute. A hollow portion 11 is opened at the bottom of the carrying plate 1 . Baffle plate one 4, baffle plate two 5, baffle plate three 6 and baffle plate four 7 are sequentially connected and fixed on the edge around the carrier plate 1, baffle plate one 4, baffle plate two 5, baffle plate three 6, baffle plate four 7 and The bearing plate 1 has an integrated structure, and the first baffle plate 4, the second baffle plate 5, the third baffle plate 6, and the fourth baffle plate 7 are respectively provided with limiting recesses 8. Movable support one 2 is slidingly matched with baffle plate one 4, baffle plate three 6, and movable support two 3 is slidably matched with baffle plate two 5, baffle plate four 7. Positioning studs 9 are respectively assembled on the two ends of the movable bracket 1 and the movable bracket 2 , and the positions of the positioning studs 9 correspond to the positions of the limiting recesses 8 respectively. The first baffle plate 4 and the second baffle plate 5 are respectively provided with cuboid buckle parts 10, and the movable bracket one 2 and the movable bracket two 3 are respectively provided with "7" shaped buckle parts 10.

The use process of the utility model supporting the multi-size PCB wave soldering production tool is as follows: place the PCB on the carrier board 1, adjust the positions of the movable support 1 2 and the movable support 2 3 according to the size of the PCB, and adjust the activities After the positions of the bracket one 2 and the movable bracket two 3, the positioning studs 9 on the movable bracket one 2 and the movable bracket two 3 are respectively aligned with the baffle plate 1 4 and the baffle plate 3 6, the baffle plate 2 5 and the baffle plate 4 7 The limit concave portion 8 on the top, tighten the positioning stud 9, and fix the position of the movable support one 2 and the movable support two 3. Then rotate each pressing part 10 to apply pressure to the PCB board, press the PCB board on the carrier board 1, and then perform wave soldering production on the PCB.

The above-mentioned embodiments are only preferred specific implementations of the utility model, and the usual changes and replacements performed by those skilled in the art within the scope of the technical solution of the utility model shall be included in the protection scope of the utility model.

Claims (5)

1. A treatment tool that supports the production of PCB wave soldering in multiple sizes, including a carrier plate, is characterized in that: it also includes a movable support one and a movable support two, and the surrounding edges of the carrier plate are respectively provided with a baffle plate 1 and a baffle plate 2 , baffle plate 3 and baffle plate 4, baffle plate 1, baffle plate 2, baffle plate 3, and baffle plate 4 are connected end to end in sequence, and baffle plate 1, baffle plate 2, baffle plate 3, and baffle plate 4 are provided with limited recesses respectively ; The movable bracket 1 is slidingly matched with the baffle plate 1 and the baffle plate 3 respectively, and the movable bracket 2 is slidably matched with the baffle plate 2 and the baffle plate 4 respectively, and the movable bracket 1 and the movable bracket 2 are respectively provided with a number of positioning studs; The plate 1, the baffle plate 2, the movable support 1 and the movable support 2 are respectively provided with buckle parts. 2. The jig tool supporting wave soldering production of PCBs of various sizes according to claim 1, characterized in that: the bottom of the carrier board is provided with several hollowed out parts. 3. The processing tool supporting wave soldering production of PCBs of various sizes according to claim 1 or 2, characterized in that: the buckle parts on the first baffle and the second baffle are in the shape of a cuboid. 4. The processing tool supporting wave soldering production of PCBs of various sizes according to claim 3, characterized in that: the buckle parts on the movable bracket 1 and the movable bracket 2 are in the shape of "7". 5. The processing tool supporting wave soldering production of PCBs of various sizes according to claim 4, characterized in that: the first baffle, the second baffle, the third baffle, and the fourth baffle are integrated with the load-bearing board.