CN202713786U - Printed circuit board connection structure - Google Patents

Printed circuit board connection structure Download PDF

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Publication number
CN202713786U
CN202713786U CN 201220303910 CN201220303910U CN202713786U CN 202713786 U CN202713786 U CN 202713786U CN 201220303910 CN201220303910 CN 201220303910 CN 201220303910 U CN201220303910 U CN 201220303910U CN 202713786 U CN202713786 U CN 202713786U
Authority
CN
China
Prior art keywords
printed circuit
circuit board
connection structure
printed
printed substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220303910
Other languages
Chinese (zh)
Inventor
陈勇
叶兵
张传敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guiyang Yongqing Instruments and Electronic Science and Technology Co Ltd
Original Assignee
Guiyang Yongqing Instruments and Electronic Science and Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guiyang Yongqing Instruments and Electronic Science and Technology Co Ltd filed Critical Guiyang Yongqing Instruments and Electronic Science and Technology Co Ltd
Priority to CN 201220303910 priority Critical patent/CN202713786U/en
Application granted granted Critical
Publication of CN202713786U publication Critical patent/CN202713786U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a printed circuit board connection structure. The connection structure comprises a printed circuit board PCB1, a printed circuit board PCB2, spacers, and fasteners for connecting or conducting two circuit boards. The printed circuit board PCB1 is provided with metalized through holes, the lower surface of the printed circuit board PCB1 is provided with metal pads around the metalized through holes, and a layer of soldering paste is printed onto the metal pads. According to the utility model, through the structure improvement of the connection between the printed circuit boards and the spacers, a layer of soldering paste is printed onto the metal pads, and a certain gap exists around the spacers and the metalized through holes, so the manual soldering method in which a soldering iron is used can be replaced with a reflow soldering machine, so that the semi-automatic soldering of the printed circuit boards is realized, the production efficiency is improved, and the product quality is well ensured.

Description

A kind of connection structure of printed wiring board
Technical field
The utility model belongs to electronic technology field, relates to a kind of connection structure of printed wiring board.
Background technology
In current electron trade, printed substrate is almost ubiquitous, little of electronic watch, calculator, general-purpose computer, large to computer, communication electronic equipment, Aeronautics and Astronautics, military armament systems, as long as the electronic devices and components such as integrated circuit are arranged, electric interconnection all will be used printed substrate between them.The production process of printed substrate is comparatively complicated, the processing range that it relates to is wider, for connection structure of printed wiring board, being connected between traditional printed substrate and the spacer mainly is to adopt direct welding manner, spacer is inserted in the printed substrate, weld by manual flatiron, this connected mode production efficiency is low, and quality is without guarantee, because the production process of printed substrate is a kind of discrete streamline form, any one link goes wrong all can cause the consequence that completely stops production or scrap in a large number, and if printed substrate scrap just can't recycling.Therefore how to improve the production efficiency of printed substrate, quality is protected, the rate of reducing the number of rejects and seconds is electron trade department problem demanding prompt solution.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of connection structure of printed wiring board is provided.
The utility model is achieved by following technical solution.
A kind of connection structure of printed wiring board, comprise that printed substrate PCB1, printed substrate PCB2, spacer reach the securing member that is used for connection or two wiring boards of conducting, described printed substrate PCB1 is provided with the metallization via hole, be provided with metal pad in printed substrate PCB1 upper and lower surface by metallization via hole periphery, at metal pad printing one deck solder(ing) paste.
Be provided with the gap around the metallization via hole of described spacer insertion end and printed substrate PCB1, when being convenient to weld, make solder(ing) paste flow to gap location, spacer is able to firm the connection with printed substrate PCB1 after the cooling.
Be threaded installing hole in the described spacer, outer surface is zinc-plated.
Described securing member for connection or two wiring boards of conducting adopts screw, and is simple in structure, easy to operate.
Compared with prior art, the beneficial effects of the utility model are: the architecture advances between the utility model connects by printed substrate and spacer, at metal pad printing one deck solder(ing) paste, and leave certain interval at spacer and metallization via hole periphery, can adopt reflow machine to replace manual flatiron welding, realization is welded the semi-automation of printed substrate, thereby enhances productivity, and product quality obtains fine guarantee.
Description of drawings
Fig. 1 is the utility model wiring board syndeton schematic diagram;
Fig. 2 is the E-E cutaway view of Fig. 1;
Fig. 3 is the K place zoomed-in view of Fig. 2;
Fig. 4 is the utility model assembly exploded perspective view.
Among the figure: 1-metallization via hole, 2-metal pad, 3-solder(ing) paste, 4-spacer, 5-gap, 6-securing member.
Embodiment
Further describe the technical solution of the utility model below in conjunction with accompanying drawing, but that claimed scope is not limited to is described.
As shown in Figures 1 to 4, a kind of connection structure of printed wiring board, comprise that printed substrate PCB1, printed substrate PCB2, spacer 4 reach the securing member 6 that is used for connection or two wiring boards of conducting, described printed substrate PCB1 is provided with metallization via hole 1, be provided with metal pad 2 in printed substrate PCB1 upper and lower surface by the periphery of metallization via hole 1, at metal pad 2 printing one deck solder(ing) pastes 3.
Be provided with gap 5 around the metallization via hole 1 of described spacer 4 insertion ends and printed substrate PCB1, when being convenient to weld, make solder(ing) paste 3 flow to 5 places, gap, spacer 4 is able to firm the connection with printed substrate PCB1 after the cooling.
Be provided with threaded mounting hole in the described spacer 4, outer surface is zinc-plated.
Described securing member 6 for connection or two wiring boards of conducting adopts screws, and is simple in structure, easy to operate.

Claims (4)

1. connection structure of printed wiring board, comprise that printed substrate PCB1, printed substrate PCB2, spacer (4) reach the securing member (6) that is used for connection or two wiring boards of conducting, it is characterized in that: described printed substrate PCB1 is provided with metallization via hole (1), be provided with metal pad (2) in printed substrate PCB1 upper and lower surface by the periphery of metallization via hole (1), print one deck solder(ing) paste (3) at metal pad (2).
2. a kind of connection structure of printed wiring board according to claim 1, it is characterized in that: the metallization via hole (1) of described spacer (4) insertion end and printed substrate PCB1 is provided with gap (5) all around.
3. a kind of connection structure of printed wiring board according to claim 1, it is characterized in that: described spacer is provided with threaded mounting hole in (4), and outer surface is zinc-plated.
4. a kind of connection structure of printed wiring board according to claim 1 is characterized in that: described for connecting or the securing member (6) of two wiring boards of conducting is screw.
CN 201220303910 2012-06-26 2012-06-26 Printed circuit board connection structure Expired - Fee Related CN202713786U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220303910 CN202713786U (en) 2012-06-26 2012-06-26 Printed circuit board connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220303910 CN202713786U (en) 2012-06-26 2012-06-26 Printed circuit board connection structure

Publications (1)

Publication Number Publication Date
CN202713786U true CN202713786U (en) 2013-01-30

Family

ID=47594037

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220303910 Expired - Fee Related CN202713786U (en) 2012-06-26 2012-06-26 Printed circuit board connection structure

Country Status (1)

Country Link
CN (1) CN202713786U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102724808A (en) * 2012-06-26 2012-10-10 贵阳永青仪电科技有限公司 Printed circuit board (PCB) connecting structure and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102724808A (en) * 2012-06-26 2012-10-10 贵阳永青仪电科技有限公司 Printed circuit board (PCB) connecting structure and manufacturing method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130130

Termination date: 20140626

EXPY Termination of patent right or utility model