CN210899826U - Antenna test welding set - Google Patents
Antenna test welding set Download PDFInfo
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- CN210899826U CN210899826U CN201921572392.3U CN201921572392U CN210899826U CN 210899826 U CN210899826 U CN 210899826U CN 201921572392 U CN201921572392 U CN 201921572392U CN 210899826 U CN210899826 U CN 210899826U
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Abstract
The utility model discloses an antenna test welding set relates to the PCB field, and the device includes it: a printed circuit board; a first pad for soldering an antenna; the first bonding pad and the second bonding pad are respectively positioned on two sides of the printed circuit board and are overlapped and connected by a through hole; the printed circuit board is provided with two states: in a first state, the antenna is not welded on the first bonding pad, and the first bonding pad and the second bonding pad are electrically connected through a through hole; and in a second state, the first pad is welded with the antenna, and the first pad is electrically connected with the second pad through the via hole. An object of the utility model is to provide an antenna test welding set can be under the condition that does not additionally increase device and area, and the connected mode of radio frequency test another side welding antenna cable is carried out to low-cost realization one side to ensured that the radio frequency performance does not have extra loss.
Description
Technical Field
The invention relates to the field of PCBs, in particular to an antenna testing and welding device.
Background
With the great development of wireless technology, terminal wireless products (such as PON terminals, routers, set-top boxes, etc.) have spread throughout the lives of people, and wireless modules such as Wi-Fi are becoming more and more popular in ordinary households as a bridge for connecting various intelligent products. At present, products such as intelligent terminals and intelligent household appliances support wireless functions, antennas serve as important components of wireless terminal products, and the wireless terminal products are various in form and variety.
For the wireless part, manufacturers need to calibrate and test the radio frequency indexes through the test bonding pad, and then connect the antenna through the antenna bonding pad to realize the transmission and the reception of radio frequency signals. Further, diversification of products brings about various forms of antenna pads and test pads, and stable operation of the antenna is ensured by the pads and the test pads.
However, when the radio frequency pad in the conventional product needs to perform equipment test on one surface of the PCB and perform antenna cable welding on the other surface of the PCB, the following disadvantages exist:
1. the traditional scheme is that a special bonding pad is manufactured for supporting equipment thimble test, and the bonding pad is only used for welding an antenna cable on the same surface.
2. The traditional scheme usually uses 0 ohm resistance jumper connection and positive and negative independent pads for the requirements of front surface testing and back surface welding, extra loss is brought to cause performance reduction, and meanwhile, cost is increased due to the fact that resistance is increased and more PCB areas are occupied.
The invention solves the defects of the traditional scheme, provides the device which can respectively test and weld the antenna on the two sides of the PCB, can realize the connection mode of carrying out radio frequency test on one side and welding the antenna cable on the other side at low cost under the condition of not additionally increasing devices and area, and ensures that the radio frequency performance has no extra loss.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide an antenna test welding device which can realize a connection mode of performing radio frequency test on one side and welding an antenna cable on the other side at low cost under the condition of not additionally increasing devices and area, and ensures that no extra loss exists in radio frequency performance.
To achieve the above object, in a first aspect, the present invention provides an antenna test welding apparatus, including:
a printed circuit board;
a first pad for soldering an antenna;
a second pad for electrical testing of the antenna pad
The first bonding pad and the second bonding pad are respectively positioned on two sides of the printed circuit board and are superposed and connected by a through hole;
the printed circuit board is provided with two states:
in a first state, the antenna is not welded on the first bonding pad, and the first bonding pad and the second bonding pad are electrically connected through a through hole;
and in a second state, the first pad is welded with the antenna, and the first pad is electrically connected with the second pad through the via hole.
As a preferred embodiment, the first pad, the second pad and the via have dimensions matching the solder antenna impedance.
As a preferred embodiment, the impedance is 50 Ω.
According to a preferred embodiment, the sizes of the first bonding pad, the second bonding pad and the via hole meet the requirements that return loss of 0-6 GHz is less than-15 dB, insertion loss is less than-0.2 dB, and internal standing wave ratio is less than 1.5.
As a preferred embodiment, the second pad is provided with at least one test pad for electrical testing.
As a preferred embodiment, the second pad is still equipped with third pad, fourth pad and fifth pad at the PCB homonymy, second pad, third pad, fourth pad and fifth pad are the "seam" and arrange, and the second pad is located the crossing point of "seam".
In a preferred embodiment, the second pad, the third pad, the fourth pad and the fifth pad are arranged to match with the electrical measuring clamp, the second pad is connected with the inner core of the electrical measuring clamp, and the third pad, the fourth pad and the fifth pad are connected with the outer core of the electrical measuring clamp.
As a preferred embodiment, the electrical tests include power calibration, power testing, sensitivity testing.
As a preferred embodiment, the second pad is also used for radio frequency signal testing.
As a preferred embodiment, the number of the first pads and the second pads on the printing plate is at least one pair.
Compared with the prior art, the invention has the advantages that:
the antenna test welding device provided by the invention is provided with the welding pads with two overlapped surfaces, can be directly connected through holes, is more space-saving, is more miniaturized in product form, and further reduces the area of a PCB (printed circuit board) of a product, reduces the use of 0 ohm resistance and reduces the product cost. Meanwhile, the pads are electrically connected through the through holes, so that loss is reduced, influence of other factors is reduced, and product performance is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings corresponding to the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
FIG. 1 is a schematic plan view of an embodiment of a conventional antenna test welding apparatus;
FIG. 2 is a perspective view of an example of an antenna test welding apparatus of the present invention;
FIG. 3 is a schematic plan view of an antenna test welding apparatus according to an embodiment of the present invention;
FIG. 4 is a 3D simulation diagram of an embodiment of the welding apparatus for antenna test according to the present invention;
FIG. 5 is a return loss plot of S11 per port for an embodiment of an antenna test welding apparatus of the present invention;
FIG. 6 is a graph of insertion loss between ports of an embodiment of an antenna test welding apparatus of the present invention;
fig. 7 is a diagram of input impedance of each port of an embodiment of the antenna testing and soldering apparatus according to the present invention.
In the figure: 1-common terminal pad of the through resistor, 2-pad of the through resistor connecting the antenna pad, 3-via connecting the through resistor and the antenna bonding pad, 4-ground pad used for electrical test, 5-ground pad used for electrical test, 6-ground pad used for electrical test, 7-ground pad used for electrical test, 8-pad electrically connected to pad 6, 9-antenna bonding pad, 10-antenna bonding ground pad, 11-first pad, 12-second pad, 13-third pad, 14-fourth pad, 15-fifth pad, 16-via, 17-seventh pad.
Detailed Description
Embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
The embodiment of the invention provides an antenna testing and welding device, which is used for testing a PCB (printed circuit board) at low cost and improving the performance of a radio frequency antenna without additionally adding devices.
In order to achieve the technical effects, the general idea of the application is as follows:
an antenna test welding set, characterized in that it includes:
a printed circuit board;
a first pad for soldering an antenna;
a second pad for electrical testing of the antenna pad
The first bonding pad and the second bonding pad are respectively positioned on two sides of the printed circuit board and are superposed and connected by a through hole;
the printed circuit board is provided with two states:
in a first state, the antenna is not welded on the first bonding pad, and the first bonding pad and the second bonding pad are electrically connected through a through hole;
and in a second state, the first pad is welded with the antenna, and the first pad is electrically connected with the second pad through the via hole.
Under the traditional scheme, in order to reduce the influence of impedance on the antenna, an independent test pad and an antenna pad are generally used, the performance of the pad is judged by testing the electrical performance of the test pad and another pad after the test pad is electrically connected through a clamp, and the test pad and the antenna cable on the other surface are welded with the pad after the test is passed. However, such a connection via additional lines, multiple pads, etc. can be unsatisfactory due to large losses or due to too high calibration requirements. As shown in fig. 1, a pad 1 is a common terminal pad of the via resistor, a pad 2 is a pad to which the via resistor is connected to an antenna pad, a pad 4 is a ground pad used for electrical measurement, a pad 5 is a ground pad used for electrical measurement, a pad 6 is a ground pad used for electrical measurement, a pad 7 is a ground pad used for electrical measurement, a pad 8 is a connection pad used for electrical measurement and electrically connected to the pad 8 and the pad 6, a pad 3 is a via hole for connecting the via resistor and the antenna bonding pad, the pad 2 and the pad 9 are connected, the pad 9 is an antenna bonding pad, and the pad 10 is a pad to which the antenna bonding is grounded. When the PCB is in a test state, the transfer resistor, namely the 0 ohm resistor is connected with the bonding pad 1 and the bonding pad 8, the inner core of the probe is abutted on the bonding pad 6 to conduct signals, and the outer core of the probe is abutted on the bonding pad 4, the bonding pad 5 and the bonding pad 7 to be grounded. When the PCB enters the SMT (Surface Mounted Technology) stage, the transfer resistor is welded to the pad 1 and the pad 2 directly, and is electrically connected to the pad 9 through the via 3.
In conclusion, the test pad and the antenna pad are directly arranged at two surfaces of the PCB and overlapped positions of the PCB, and are directly electrically connected through the via hole. The test pad and the antenna pad that design like this pass through via hole electric connection, when the emulation calculates, can directly carry out size, adjustment such as position, guarantee that the test pad and the antenna pad of design on the PCB match each other, and in actual test, the amount can directly verify the result on the software through the electric test, if anchor clamps contact first pad carry out radio frequency signal test and pass through the back, can directly install the antenna cable at the second pad, the test pad has been saved, the bridging loss and the cost of 0 ohm resistance, for traditional technique, it no longer uses 0 ohm resistance to adjust independent pad, can effectively reduce the loss, reduce the cost, reduce the PCB area.
In order to better understand the technical solution, the following detailed description is made with reference to specific embodiments.
Referring to fig. 2, an embodiment of the present invention provides an antenna test welding method, which includes:
a printed circuit board;
a first pad for soldering an antenna;
the second bonding pad is used for the electrical test of the antenna bonding pad;
the first bonding pad and the second bonding pad are respectively positioned on two sides of the printed circuit board and are superposed and connected by a through hole;
the printed circuit board is provided with two states:
in a first state, the antenna is not welded on the first bonding pad, and the first bonding pad and the second bonding pad are electrically connected through a through hole;
and in a second state, the first pad is welded with the antenna, and the first pad is electrically connected with the second pad through the via hole.
The first bonding pad and the second bonding pad are arranged on the printed circuit board, are respectively positioned on two sides of the printed circuit board and are overlapped, and are connected through the through holes. The structure of design like this, can be in the simulation stage on PCB, can directly calculate to the size of each pad, thickness isoparametric, and adjust the size of design in the simulation software, make it can reach the radio frequency signal demand, and then when actual electrical test, through the direct connection with first pad and second pad of via hole, rather than the extra bridging through 0 ohm resistance in the traditional scheme, the scheme when can be more close to the simulation design, the structure of design like this also can be more close to with the data result when designing. After the electrical test is finished, the antenna is directly welded on the first bonding pad, and the radio frequency signal is sent out through the first bonding pad. The test and the antenna welding are carried out between the first bonding pad and the second bonding pad until the operation, extra bridging and conversion are not carried out, calculation is reduced, meanwhile, the required calibration requirement is lower, the required PCB area is smaller, and therefore the cost is greatly reduced.
Preferably, the first pad, the second pad, and the via are sized to match the solder antenna impedance.
After the first bonding pad and the second bonding pad are electrically connected, the sizes of the bonding pad and the through hole are reasonable, and the resistor can assist the antenna to better release radio frequency signals. The first bonding pad is used for welding the antenna, the second bonding pad is used for electrical testing, the two bonding pads are electrically connected through the through hole, and the electrical performance of the two bonding pads is relevant, so that when the size and the resistance of the two bonding pads are designed, the two bonding pads need to be matched with each other, and the better electrical performance can be achieved. Preferably, the impedance is 50 ohms.
Furthermore, the sizes of the first bonding pad, the second bonding pad and the via hole meet the condition that the return loss of 0-6 GHz is less than-15 dB, the insertion loss is less than-0.2 dB, and the internal standing-wave ratio is less than 1.5.
Except for the second bonding pad as a testing bonding pad, how fast the testing bonding pad can be arranged, the testing bonding pad is used for electrical testing and used for ensuring the testing and connection of a plurality of items of the bonding pad.
Further, the second pad still includes still be equipped with third pad, fourth pad and fifth pad at the PCB homonymy, second pad, third pad, fourth pad and fifth pad are the "seam" and arrange, and the second pad is located the crossing point of "seam". In this embodiment, the third pad, the fourth pad, and the fifth pad are ground pads in electrical measurement.
A plurality of test bonding pads are arranged around the second bonding pad, so that the electrical performance of the surrounding bonding pads is close to that of the second bonding pad. In PCB production, the production flow and production procedures of the pads which are positioned adjacently are basically consistent. Their behavior in electrical properties is similar. Therefore, when a plurality of test pads are arranged around the second pad as much as possible and tests of other electrical items are performed, the electrical performance reflected by the test pads is substantially consistent with that of the second pad. Therefore, when a plurality of items of testing are required to be performed on the second pad a plurality of times, the same object can be achieved by testing the test pads around the second pad.
Preferably, the second pad, the third pad, the fourth pad and the fifth pad are arranged to match with an electrical measuring fixture. Because a plurality of test pads exist, it can once only test a plurality of electrical property items, and is more convenient. Therefore, the second bonding pad, the third bonding pad, the fourth bonding pad and the fifth bonding pad are matched with the electrical testing fixture, testing time can be saved by carrying out one-time multi-item testing, production process time is saved, and output is increased. Specifically, the second bonding pad is connected with an inner core of the electrical measuring clamp, and the third bonding pad, the fourth bonding pad and the fifth bonding pad are connected with an outer core of the electrical measuring clamp.
Optionally, the electrical test includes power calibration, power test, and sensitivity test.
Further, the second pad is also used for radio frequency signal testing.
Furthermore, the number of the first bonding pads and the second bonding pads on the printing plate is at least one pair. The plurality of pairs of first bonding pads and second bonding pads are arranged, so that when one pair of first bonding pads and one pair of second bonding pads on the PCB fail and are damaged, other pairs of first bonding pads and other pairs of second bonding pads are used, the yield of the PCB in the production process of the PCB is improved, and the cost of the PCB is reduced.
For example, as shown in fig. 3, the present invention provides an antenna testing and welding apparatus, which includes:
the PCB comprises a first bonding pad 11, a second bonding pad 12, a third bonding pad 13, a fourth bonding pad 14, a fifth bonding pad 15, a via hole 16 and a seventh bonding pad 17, wherein the second bonding pad 12, the third bonding pad 13, the fourth bonding pad 14 and the fifth bonding pad 15 are positioned on one surface of the PCB, and the first bonding pad 11 and the seventh bonding pad 17 are positioned on the other surface of the PCB. And the first pad 11 is connected to the second pad 12 through the via 16. The first pad 11 is an antenna bonding pad, the second pad 12 is a test pad, and the third pad 13, the fourth pad 14, the fifth pad 15, and the seventh pad 17 are all ground pads. The sizes of the second bonding pads 12, the first bonding pads 11 and the via holes 16 are adjusted through simulation, so that impedance matching during testing and antenna welding can be met. Contacting the equipment clamp with the first bonding pad to perform radio frequency signal test; finally, after the PCB passes the electrical test, the antenna cable can be installed on the second bonding pad.
As shown in fig. 4, a simulation model is established, and the changes of the input impedance and the insertion loss in the simulation result are observed through repeated adjustment and optimization of the sizes of the first pad 11 and the second pad 12 until the result meets the design specification. In this way, pads are obtained that can be used to test and solder the antenna on both sides of the PCB, respectively.
As shown in FIG. 5, in the present example, the return loss test can satisfy the requirement that 0-6 GHz is less than-15 dB.
As shown in FIG. 6, the insertion loss test in this example satisfies the requirement that 0-6 GHz is less than-0.2 dB.
As shown in FIG. 7, the input impedance test in this example satisfies the requirement that the standing-wave ratio is less than 1.5 in 0-6 GHz.
Finally, when the actual test is performed, as shown in fig. 3, the second pad 12 and the corresponding third pad 13, fourth pad 14, and fifth pad 15 form a structure that can be matched with the test probe. The first pad 11 and the second pad 12 form a structure which can meet the welding requirements of the antenna cable. Meanwhile, the sizes of the first bonding pad 11 and the second bonding pad 12 are adjusted to be matched with 50 ohm impedance, so that good radio frequency performance is achieved.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Generally, compared with the conventional technology in which an independent test pad and an antenna pad are used, and the performance of the pad is judged by testing the electrical performance of the test pad electrically connected with another pad through a clamp, the antenna test welding device provided by the embodiment of the invention can directly adjust the size, the position and the like during simulation calculation, so that the test pad and the antenna pad designed on the PCB are ensured to be matched with each other, and during actual test, the result on software can be directly verified through electrical test, for example, after the clamp contacts the first pad to perform radio frequency signal test and passes through the test pad, an antenna cable can be directly installed on the second pad, so that the loss and the cost of bridging of the test pad and the 0 ohm resistor are saved, and the loss, the cost and the area of the PCB can be effectively reduced.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. An antenna test welding set, characterized in that it includes:
a printed circuit board;
a first pad for soldering an antenna;
a second pad for electrical testing of the antenna pad
The first bonding pad and the second bonding pad are respectively positioned on two sides of the printed circuit board and are superposed and connected by a through hole;
the printed circuit board is provided with two states:
in a first state, the antenna is not welded on the first bonding pad, and the first bonding pad and the second bonding pad are electrically connected through a through hole;
and in a second state, the first pad is welded with the antenna, and the first pad is electrically connected with the second pad through the via hole.
2. The apparatus of claim 1, wherein: the sizes of the first bonding pad, the second bonding pad and the through hole are matched with the impedance of the welding antenna.
3. The apparatus of claim 2, wherein: the impedance is 50 Ω.
4. The apparatus of claim 1, wherein: the sizes of the first bonding pad, the second bonding pad and the via hole meet the condition that the return loss of 0-6 GHz is less than-15 dB, the insertion loss is less than-0.2 dB, and the internal standing-wave ratio is less than 1.5.
5. The apparatus of claim 1, wherein: the second bonding pad is provided with at least one testing bonding pad, and the testing bonding pad is used for electrical testing.
6. The apparatus of claim 5, wherein: the second pad is still equipped with third pad, fourth pad and fifth pad at the PCB homonymy, second pad, third pad, fourth pad and fifth pad are "the seam" and arrange, and the second pad is located the nodical of "the seam".
7. The apparatus of claim 6, wherein: the second bonding pad, the third bonding pad, the fourth bonding pad and the fifth bonding pad are arranged to match with the electrical measurement clamp, the second bonding pad is connected with an inner core of the electrical measurement clamp, and the third bonding pad, the fourth bonding pad and the fifth bonding pad are connected with an outer core of the electrical measurement clamp.
8. The apparatus of claim 1, wherein: the electrical test comprises power correction, power test and sensitivity test.
9. The apparatus of claim 1, wherein: the second pad is also used for radio frequency signal testing.
10. The apparatus of claim 1, wherein: the printed circuit board is provided with at least one pair of first bonding pads and second bonding pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921572392.3U CN210899826U (en) | 2019-09-20 | 2019-09-20 | Antenna test welding set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921572392.3U CN210899826U (en) | 2019-09-20 | 2019-09-20 | Antenna test welding set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210899826U true CN210899826U (en) | 2020-06-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921572392.3U Active CN210899826U (en) | 2019-09-20 | 2019-09-20 | Antenna test welding set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210899826U (en) |
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2019
- 2019-09-20 CN CN201921572392.3U patent/CN210899826U/en active Active
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