CN110716071B - High-frequency probe card device and crimping module and support thereof - Google Patents
High-frequency probe card device and crimping module and support thereof Download PDFInfo
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- CN110716071B CN110716071B CN201810770566.0A CN201810770566A CN110716071B CN 110716071 B CN110716071 B CN 110716071B CN 201810770566 A CN201810770566 A CN 201810770566A CN 110716071 B CN110716071 B CN 110716071B
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- conductive elastic
- circuit board
- transmission layer
- positioning structure
- bracket
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
Abstract
The invention discloses a high-frequency probe card device, a crimping module and a support piece thereof. The stroke structure can move integrally relative to the positioning structure, and the stroke structure comprises a bracket and a plurality of conductive elastic pieces. The bracket is provided with a plurality of positioning slots penetrating through the bracket, and the bracket can be movably arranged on the positioning structure, and the surface of the bracket far away from the positioning structure defines a bearing surface. The conductive elastic pieces are respectively arranged in the positioning slot holes, and each conductive elastic piece is provided with a first end and a second end which are positioned on opposite sides. The first end of each conductive elastic element corresponds to the bearing surface, and the second end of each conductive elastic element penetrates out of the bracket. Therefore, the stroke structure can integrally move relative to the positioning structure, so that the displacement strokes of the detection lugs are the same, and a relatively accurate detection result is obtained.
Description
Technical Field
The present invention relates to a high frequency probe card, and more particularly, to a high frequency probe card apparatus, a pressure bonding module and a support member thereof.
Background
A conventional high frequency probe card includes a Plunger (Plunger), a flexible printed circuit (fpc) partially disposed on an end surface of the Plunger, and a plurality of inspection bumps fixed to the fpc. The detection bumps are used for abutting and electrically coupling with an object to be detected and transmitting corresponding signals through the flexible circuit board.
However, since the plunger is of a single-piece structure, when the detecting bumps of the conventional probe card are abutted against the object to be tested, the plunger is easily stressed and deflected, so that the detecting bumps generate different displacement strokes, thereby affecting the detecting result of the conventional probe card.
The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.
Disclosure of Invention
Embodiments of the present invention provide a high frequency probe card apparatus, a press-fit module and a support thereof, which can effectively overcome the defects of the conventional high frequency probe card.
The embodiment of the invention discloses a high-frequency probe card device which comprises a supporting piece, a transmission layer, a plurality of detection bumps and a circuit board. The supporting piece comprises a positioning structure and a stroke structure, and the positioning structure is arranged on a bearing piece; the stroke structure is movably arranged on the positioning structure and comprises a support and a plurality of conductive elastic pieces, a plurality of penetrating positioning slot holes are formed in the support, the support is movably arranged on the positioning structure, and the surface of the support far away from the positioning structure defines a bearing surface; a plurality of conductive elastic pieces respectively arranged in the plurality of positioning slots, and each conductive elastic piece is provided with a first end and a second end which are positioned at opposite sides; the first end of each conductive elastic piece corresponds to the bearing surface, and the second end of each conductive elastic piece penetrates through the bracket and is used for abutting against the bearing piece; the transmission layer is at least partially arranged on the bearing surface and is abutted against the first end of each conductive elastic piece; the detection bumps are arranged on the transmission layer, and the detection bumps and the supporting piece are respectively positioned on two opposite sides of the transmission layer; the circuit board is electrically connected with one of the detection bumps, and comprises a first board surface and a second board surface which are positioned at two opposite sides, and the second board surface of the circuit board is used for electrically coupling a test machine; wherein the stroke structure is movable as a whole relative to the positioning structure so that the displacement strokes of the plurality of detection bumps are the same.
Preferably, the circuit board is formed with an accommodating hole penetrating through the first board surface and the second board surface, and a part of the supporting member is located in the accommodating hole; the supporting member further includes a connecting plate, and the positioning structure is disposed on the connecting plate.
Preferably, the circuit board and the corresponding detection bump are electrically coupled to each other through the support; the connecting board is connected to the second board surface of the circuit board, and the connecting board includes a metal pad electrically coupled to the circuit board, the first end of one of the conductive elastic members abuts against the transmission layer and is electrically coupled to the detection bump corresponding to the circuit board, and the second end of the one of the conductive elastic members abuts against the metal pad.
Preferably, the circuit board and the corresponding detection bump are electrically coupled to each other only through the transmission layer, and the transmission layer includes a first block, a second block and a connection block. The first block is arranged on the bearing surface, and the plurality of detection bumps are arranged on the first block; the second block is connected to the second board surface of the circuit board; the connecting block is positioned between the first block and the second block, and part of the connecting block is positioned in the accommodating hole.
Preferably, the transmission layer includes a circuit matching unit disposed on the connection block, and the circuit matching unit is adjacent to the first block and electrically coupled to the circuit board and the corresponding detection bump.
Preferably, the transmission layer is completely disposed on the carrying surface, and the circuit board and the corresponding detection bump are electrically coupled to each other through the transmission layer and the supporting member.
Preferably, the transmission layer and the circuit board are respectively located on two opposite sides of the support member, and the circuit board includes a metal pad located on the first board surface and electrically coupled to the second board surface; the positioning structure is disposed on the first board surface of the circuit board, the first end of one of the conductive elastic members abuts against the transmission layer and is electrically coupled to the detection bump corresponding to the circuit board, and the second end of the one of the conductive elastic members abuts against the metal pad.
The embodiment of the invention also discloses a crimping module of the high-frequency probe card device, which comprises a supporting piece, a transmission layer and a plurality of detection bumps. The supporting piece comprises a positioning structure and a stroke structure; the stroke structure is movably arranged on the positioning structure, and the stroke structure comprises: the support is movably arranged on the positioning structure, and the surface of the support far away from the positioning structure defines a bearing surface; a plurality of conductive elastic pieces respectively arranged in the plurality of positioning slots, and each conductive elastic piece is provided with a first end and a second end which are positioned at opposite sides; wherein the first end of each conductive elastic element corresponds to the bearing surface, and the second end of each conductive elastic element penetrates out of the bracket; the transmission layer is at least partially arranged on the bearing surface and is abutted against the first end of each conductive elastic piece; the detection bumps are arranged on the transmission layer, and the detection bumps and the supporting piece are respectively positioned on two opposite sides of the transmission layer; wherein the stroke structure is movable as a whole relative to the positioning structure so that the displacement strokes of the plurality of detection bumps are the same.
Preferably, the transmission layer is completely disposed on the carrying surface, the first end of one of the conductive elastic members abuts against the transmission layer and is electrically coupled to one of the detection bumps, and the second end of the one of the conductive elastic members abuts against a metal pad.
The embodiment of the invention also discloses a support member of the high-frequency probe card device, which comprises a positioning structure and a stroke structure. A stroke structure movably arranged on the positioning structure and capable of moving integrally relative to the positioning structure, wherein the stroke structure comprises a support and a plurality of conductive elastic pieces, a plurality of positioning slot holes penetrating through the support are formed in the support, the support is movably arranged on the positioning structure, and the surface of the support far away from the positioning structure defines a bearing surface; a plurality of conductive elastic pieces respectively arranged in the plurality of positioning slots, and each conductive elastic piece is provided with a first end and a second end which are positioned at opposite sides; the first end of each conductive elastic element corresponds to the bearing surface, and the second end of each conductive elastic element penetrates out of the bracket.
In summary, the high-frequency probe card device and the crimping module and the supporting member thereof disclosed in the embodiments of the present invention have the positioning structure and the stroke structure that are matched with each other, so that the stroke structure can move integrally relative to the positioning structure, and the displacement strokes of the plurality of detection bumps above the supporting member are substantially the same, so that the high-frequency probe card device can have a relatively accurate detection result.
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.
Drawings
Fig. 1 is a schematic plan view of a high-frequency probe card device according to a first embodiment of the present invention.
Fig. 2 is a schematic plan view of a high-frequency probe card device according to a second embodiment of the present invention.
Fig. 3 is a schematic plan view of a high-frequency probe card device according to a third embodiment of the present invention.
Fig. 4 is a schematic plan view of a high-frequency probe card device according to a fourth embodiment of the present invention.
Fig. 5 is a schematic plan view of a high-frequency probe card device according to a fifth embodiment of the present invention.
Detailed Description
Please refer to fig. 1, which is an embodiment of the present invention, and it should be noted that, in the embodiment, relevant numbers and shapes mentioned in relation to the drawings are only used for describing the embodiments of the present invention specifically, so as to facilitate understanding of the contents of the present invention, and are not used for limiting the scope of the present invention.
[ example one ]
Fig. 1 shows a first embodiment of the present invention. The present embodiment discloses a high frequency probe card apparatus 100, which can be used to test an object (not shown) to be tested (e.g., a semiconductor wafer). It should be noted that, for the convenience of understanding of the present embodiment, the drawings are illustrated in a partial plan view of the high frequency probe card apparatus 100.
The high frequency probe card apparatus 100 includes a supporting member 1, a transmission layer 2 disposed on the supporting member 1, a plurality of inspection bumps 3 disposed on the transmission layer 2, a circuit board 4 corresponding to the supporting member 1 in position, and a coaxial cable 5 disposed between the transmission layer 2 and the circuit board 4. The construction of each component of the high frequency probe card apparatus 100 will be described below, and the connection relationship between each component of the high frequency probe card apparatus 100 will be described in due course.
It should be noted that the transmission layer 2, the plurality of detection bumps 3, the circuit board 4 and the coaxial cable 5 may also be defined as a signal transmission module in the present embodiment, and the present embodiment is described by matching the signal transmission module with the supporting member 1, but the invention is not limited thereto. For example, in other embodiments of the present invention, the signal transmission module may be used alone (e.g., sold) or in combination with other components.
The supporting member 1 includes a connecting plate 11, a positioning structure 12 disposed on the connecting plate 11 (corresponding to a supporting member), and a stroke structure 13 movably disposed on the positioning structure 12. The stroke structure 13 can be integrally moved relative to the positioning structure 12, so that the displacement strokes of the plurality of detection lugs 3 above the support 1 are substantially the same.
The connecting plate 11 is preferably a flexible plate, but the embodiment is not limited thereto. The connecting board 11 includes a conductive trace 111, and a metal pad 112 and a metal contact 113 respectively connected to two ends of the conductive trace 111, and the metal pad 112 and the metal contact 113 are located on the same side of the connecting board 11 (e.g. on the upper side of the connecting board 11 in fig. 1); that is, the metal pad 112 and the metal contact 113 are electrically connected to each other through the conductive trace 111.
In the present embodiment, the positioning structure 12 includes a plurality of guide pins 121 fixed on the connecting plate 11 at intervals, and the plurality of guide pins 121 are fixed on the connecting plate 11 where the metal pad 112 is disposed, but the metal pad 112 is preferably not completely covered by the plurality of guide pins 121.
The stroke structure 13 is electrically coupled to the metal pad 112 of the connection board 11, and a surface of the stroke structure 13 away from the positioning structure 12 (e.g., a top surface of the stroke structure 13 in fig. 1) defines a carrying surface 1311, and the carrying surface 1311 is connected to the transmission layer 2. In this embodiment, the stroke structure 13 includes a bracket 131 movably disposed on the positioning structure 12 and a plurality of conductive elastic members 132 telescopically disposed in the bracket 131.
In more detail, the surface of the frame 131 away from the positioning structure 12 (e.g., the top surface of the frame 131 in fig. 1) is defined as the carrying surface 1311, and a plurality of track grooves 1312 are recessed and formed on the surface of the frame 131 adjacent to the positioning structure 12 (e.g., the bottom surface of the frame 131 in fig. 1).
The bracket 131 is respectively coupled to the guiding pins 121 of the positioning structure 12 via a plurality of rail grooves 1312, so that the bracket 131 can move in a height direction H (e.g. a distance direction between the top surface and the bottom surface of the bracket 131 in fig. 1) relative to the positioning structure 12 via the cooperation between the rail grooves 1312 and the guiding pins 121; however, the matching manner between the bracket 131 and the positioning structure 12 can be adjusted and changed according to the design requirement, and is not limited to the embodiment. For example, in other embodiments of the present invention, which are not shown, the positioning structure 12 may include a plurality of track grooves, and the bracket 131 may be formed with a plurality of guide pins respectively coupled to the plurality of track grooves.
Furthermore, a plurality of positioning slots 1313 are formed in the bracket 131 (along the height direction H) and pass through the bracket 131, and the plurality of conductive elastic elements 132 are respectively disposed in the plurality of positioning slots 1313 of the bracket 131. Each of the conductive elastic members 132 has a first end 1321 and a second end 1322 on opposite sides, the first end 1321 of the conductive elastic member 132 corresponds to (or is adjacent to) the supporting surface 1311 of the bracket 131, and the second end 1322 of the conductive elastic member 132 penetrates through (the bottom surface of) the bracket 131 and abuts against the connecting plate 11. In the present embodiment, the second end 1322 of one of the conductive elastic members 132 abuts against the metal pad 112 of the connection board 11 for electrical connection.
It should be noted that the conductive elastic element 132 is illustrated as a Pogo-pin in the embodiment, but the specific structure of the conductive elastic element 132 can be adjusted and changed according to the requirement of the designer in practical application, and is not limited to the embodiment.
In the present embodiment, the transmission layer 2 is completely disposed on the carrying surface 1311 of the supporting member 1, and the transmission layer 2 is a multi-layer stacked structure, and the transmission layer 2 of the present embodiment is illustrated by a bottom layer 21 and a top layer 22 stacked on the bottom layer 21. The bottom layer 21 is disposed on the carrying surface 1311 of the supporting member 1 and abuts against the first ends 1321 of the conductive elastic members 132, and the transmission layer 2 is disposed with a plurality of contacts 221 in the top layer 22 thereof, and one of the contacts 221 extends to the bottom layer 21 and abuts against the conductive elastic member 132 abutting against the metal pad 112.
The detecting bumps 3 are respectively disposed on the contacts 221 of the transmission layer 2, that is, the detecting bumps 3 and the supporting member 1 are respectively located on two opposite sides of the transmission layer 2. The detecting bump 3 preferably has no elasticity in the present embodiment, and the detecting bump 3 is used to detachably abut against an object to be tested (not shown, such as a semiconductor chip).
The circuit board 4 includes a first board surface 41 and a second board surface 42 located at two opposite sides, and the circuit board 4 is formed with an accommodating hole 43 and a connecting hole 44 penetrating through the first board surface 41 and the second board surface 42. The thickness of the circuit board 4 is preferably not greater than the thickness of the supporting member 1, and the aperture of the receiving hole 43 corresponds to (e.g., slightly larger than) the width of the supporting member 1, and the aperture of the connecting hole 44 corresponds to (e.g., slightly larger than) the width of the coaxial cable 5. The receiving hole 43 is located at the center of the circuit board 4, and the connecting hole 44 is located at one side of the receiving hole 43, the number of the receiving holes 44 can be adjusted (e.g. increased) according to the testing requirement, and is not limited to the attached drawings.
In more detail, a machine contact 421 and a transmission contact 422 electrically coupled to each other are disposed on a side portion of the second board 42 of the circuit board 4 (e.g., a right side portion of the second board 42 in fig. 1), and the second board 42 of the circuit board 4 is electrically coupled to a testing machine (not shown) through the machine contact 421.
Furthermore, a part of the supporting member 1 (e.g., at least a part of the positioning structure 12 and the stroke structure 13) is located in the accommodating hole 43 of the circuit board 4, and the transmission contact 422 of the circuit board 4 is connected to the metal contact 113 of the supporting member 1, so that the connecting plate 11 is connected to the second plate surface 42 of the circuit board 4; that is, the metal pads 112 of the connecting board 11 can be electrically coupled to the circuit board 4 through the conductive traces 111 and the metal contacts 113. Accordingly, the circuit board 4 can be electrically coupled to one of the detecting bumps 3 '(i.e. the detecting bump 3' electrically coupled to the metal pad 112) through the transmission layer 2 and the support member 1 (the connection board 11 and the electrically conductive elastic member 132 electrically coupled thereto).
In other words, the first end 1321 of one of the conductive elastic members 132 abuts against the transmission layer 2 and is electrically coupled to the detection bump 3' corresponding to the circuit board 4, and the second end 1322 thereof penetrates through the bracket 131 and abuts against the metal pad 112 of the connection board 11.
The coaxial cable 5 includes a core wire 5a, an insulating layer (not shown) embedding the core wire 5a therein, a mesh-shaped shielding layer 5b surrounding the core wire 5a and covering the insulating layer, and a plastic jacket (not shown) covering the mesh-shaped shielding layer 5 b. When the coaxial cable 5 is modified to be connected with other members, the coaxial cable 5 includes a through section 51, and an embedded end section 52 and an external end section 53 located at two opposite sides of the through section 51.
The through section 51 of the coaxial cable 5 is located in the connection hole 44 of the circuit board 4, the embedded end section 52 is embedded and fixed in the transmission layer 2 (located between the bottom layer 21 and the top layer 22), and the core wire 5a of the embedded end section 52 is electrically coupled to one of the detection bumps 3 ″. The external terminal section 53 penetrates through the second board surface 42 of the circuit board 4 and is used for electrically coupling to a testing machine. In the present embodiment, the coaxial cable 5 is electrically coupled to two of the detecting bumps 3 ″ by the core wire 5a and the mesh shielding layer 5b of the embedded end section 52; that is, the core wires 5a and the mesh-type shielding layer 5b are electrically coupled to different detecting bumps 3 ", respectively, and the detecting bumps 3 ″ of the core wires 5a and the mesh-type shielding layer 5b are also different from the detecting bumps 3' of the circuit board 4.
Accordingly, the detecting bump 3 ″ electrically coupled to the core wire 5a can directly transmit the detected signal to the tester through the coaxial cable 5, thereby providing a better transmission effect. The core wire 5a and the corresponding detecting bump 3 ″ are preferably used to transmit a high frequency signal in the present embodiment.
Further, the external end section 53 may be provided with a coaxial connector for being inserted into a testing machine to achieve electrical coupling, and an included angle between the length direction of the embedded end section 52 and the length direction of the penetrating section 51 is preferably 80-100 degrees. Furthermore, the high frequency probe card apparatus 100 of the present embodiment does not need to have any capacitor or inductor, but the invention is not limited thereto.
[ example two ]
As shown in fig. 2, this embodiment is similar to the first embodiment, and the same parts of the two embodiments are not repeated, but the differences between the first embodiment and the second embodiment mainly lie in: the structure of the transmission layer 2 and the support 1.
The circuit board 4 and the corresponding detecting bump 3' are electrically coupled to each other only through the transmission layer 2 in the present embodiment; that is, there is no electrical connection between the transmission layer 2 and the conductive elastic members 132, and the conductive elastic members 132 are only used to provide the elastic force required by the support member 1 during the reciprocating displacement, but are not used for signal transmission. Furthermore, the connecting board 11 is only used as a carrier of the positioning structure 12, but is not provided with the conductive traces 111, the metal pads 112, and the metal contacts 113 for electrical transmission.
In more detail, the transmission layer 2 in this embodiment includes a first block 2a, a second block 2b, a connection block 2c located between the first block 2a and the second block 2b, and a circuit matching unit 2d disposed in the connection block 2 c. Wherein the first block 2a is completely disposed on the carrying surface 1311 of the supporting member 1, and the plurality of inspection bumps 3 are disposed on the first block 2 a; that is, the first block 2a is equivalent to the transmission layer 2 of the first embodiment, and the connection block 2c and the second block 2b are equivalent to the top layer 22 of the first block 2a integrally extending outward.
The part of the connecting block 2c is located in the accommodating hole 43 of the circuit board 4 and between the supporting member 1 and the wall of the accommodating hole 43 of the circuit board 4. The connecting block 2c is formed with a through hole 21c, and the through hole 21c is located outside the accommodating hole 43 and adjacent to the first block 2a, so that the coaxial cable 5 passes through the through hole 21c of the connecting block 2 c.
The second block 2b is connected to the second board surface 42 of the circuit board 4 (e.g., the metal contact 113), the transmission layer 2 is provided with at least one transmission line 23 extending from the first block 2a to the second block 2b in the embodiment, and the inspection bump 3 'corresponding to the circuit board 4 is disposed on the transmission line 23, so that the circuit board 4 and the inspection bump 3' corresponding to the circuit board 4 can be electrically coupled through the transmission line 23 of the transmission layer 2.
Furthermore, the circuit matching unit 2d (e.g., capacitor or/and inductor) is mounted on the connection block 2c at the transmission layer 2 portion and adjacent to the first block 2 a. The circuit matching unit 2d is electrically coupled to the circuit board 4 and the corresponding detection bump 3' to adjust the characteristic impedance through the circuit matching unit 2d, thereby achieving the effect of impedance matching.
[ third example ]
As shown in fig. 3, which is a third embodiment of the present invention, the present embodiment is similar to the second embodiment, and the same points of the two embodiments are not repeated, but the differences of the present embodiment compared to the second embodiment mainly lie in: the high frequency probe card apparatus 100 of the present embodiment does not include the coaxial cable 5 and the corresponding structure (e.g., the connection hole 44, the through hole 21c, and the contact 221).
More specifically, the transmission line 23 on the transmission layer 2 is a patterned transmission structure, and the plurality of inspection bumps 3 are all disposed on the transmission line 23, so that all the inspection bumps 3 of the present embodiment can be electrically coupled to the circuit board 4 only through the transmission layer 2. That is, the detecting bumps 3 in the present embodiment are all detecting bumps 3' electrically coupled to the circuit board 4. It should be noted that the detecting bumps 3' can be patterned by the transmission line 23, so that the detecting bumps 3 are electrically coupled to the circuit board 4 independently.
Furthermore, there is no electrical connection between the transmission layer 2 and the conductive elastic members 132, and the conductive elastic members 132 are only used to provide the elastic force required by the support member 1 during the reciprocating displacement, but are not used for signal transmission.
[ example four ]
As shown in fig. 4, it is a fourth embodiment of the present invention, which is similar to the first embodiment, and the same points of the two embodiments are not repeated, but the differences of the present embodiment compared to the first embodiment mainly lie in: the circuit board 4 and the corresponding relationship between the circuit board and the supporting member 1 are also provided, and the supporting member 1 of the present embodiment does not include the connecting plate 11.
The circuit board 4 in this embodiment includes at least one metal pad 411 located on the first board surface 41 and electrically coupled to the second board surface 42. In this embodiment, the number of the metal pads 411 is plural, and the circuit board 4 is also provided with a plurality of transmission contacts 422 electrically coupled to the machine contacts 421 on the second board surface 42, and the metal pads 411 are electrically coupled to the transmission contacts 422 of the second board surface 42 respectively.
Furthermore, the transmission layer 2 and the circuit board 4 are respectively located on two opposite sides of the supporting member 1, and the circuit board 4 and the corresponding detecting bump 3' are electrically coupled to each other through the transmission layer 2 and the supporting member 1. The positioning structure 12 of the supporting member 1 is disposed on the first board surface 41 of the circuit board 4 and adjacent to the metal pads 411, and the stroke structure 13 is movably disposed on the positioning structure 12 and electrically coupled to the metal pads 411, so that the stroke structure 13 can move integrally relative to the positioning structure 12, and the detecting bumps 3 can move synchronously and have substantially the same displacement stroke.
More specifically, the first ends 1321 of the conductive elastic members 132 abut against the transmission layer 2 and are electrically coupled to the detection bumps 3' corresponding to the circuit board 4, and the second ends 1322 of the conductive elastic members 132 penetrate through the bracket 131 and abut against the metal pads 411, respectively.
[ example five ]
As shown in fig. 5, a fifth embodiment of the present invention is similar to the fourth embodiment, and the same parts of the two embodiments are not repeated, but the differences of the present embodiment compared to the fourth embodiment mainly lie in: the structure of the circuit board 4.
The circuit board 4 further includes a layer-adding structure 45, and the layer-adding structure 45 is located at a position (e.g., a top portion of the circuit board 4) of the circuit board 4 far from the second board surface 42, and an outer surface of the layer-adding structure 45 is defined as the first board surface 41. The metal pads 411 are disposed on the build-up structure 45, and the positioning structure 12 of the supporting member 1 is also disposed on the build-up structure 45 of the circuit board 4. In addition, the layer-adding structure 45 is illustrated as being located on the top of the circuit board 4 in the embodiment, but the invention is not limited thereto. For example: in other embodiments of the present invention, which are not shown, the circuit board 5 may also be further provided with a build-up structure 45 on the bottom thereof.
[ technical effects of embodiments of the present invention ]
In summary, the high frequency probe card device 100 and the signal transmission module thereof disclosed in the embodiments of the present invention have the coaxial cable 5 fixed on the transmission layer 2 and the circuit board 4, so that the detection bumps 3, 3', 3 "electrically coupled to the core wire 5a of the coaxial cable 5 can directly transmit the detected signal (e.g., high frequency signal) to the testing machine through the coaxial cable 5, thereby providing a better transmission effect.
Furthermore, the high frequency probe card apparatus 100 disclosed in the embodiment of the present invention can provide the support 1 including the positioning structure 12 and the stroke structure 13, so that the stroke structure 13 can move integrally relative to the positioning structure 12, and the displacement strokes of the plurality of detecting bumps 3, 3', 3 ″ located above the support 1 are substantially the same, so that the high frequency probe card apparatus 100 can have a relatively precise detecting result.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the present invention, which is defined by the appended claims.
Claims (10)
1. A high-frequency probe card apparatus, characterized by comprising:
a support member comprising;
a positioning structure for being disposed on a carrier;
a stroke structure movably disposed on the positioning structure, and the stroke structure includes:
a bracket, in which a plurality of positioning slots are formed, and the bracket is movably disposed on the positioning structure, and the surface of the bracket far from the positioning structure defines a bearing surface; and
a plurality of conductive elastic pieces respectively arranged in the plurality of positioning slots, and each conductive elastic piece is provided with a first end and a second end which are positioned at opposite sides; the first end of each conductive elastic piece corresponds to the bearing surface, and the second end of each conductive elastic piece penetrates through the bracket and is used for abutting against the bearing piece;
the transmission layer is at least partially arranged on the bearing surface and is abutted against the first end of each conductive elastic piece;
the detection bumps are arranged on the transmission layer and are used for being detachably abutted against an object to be detected, and the detection bumps and the supporting piece are respectively positioned on two opposite sides of the transmission layer; and
the circuit board is electrically connected with one of the detection bumps, and comprises a first board surface and a second board surface which are positioned at two opposite sides, and the second board surface of the circuit board is used for electrically coupling a test machine;
wherein the stroke structure is movable as a whole relative to the positioning structure so that the displacement strokes of the plurality of detection bumps are the same.
2. The high-frequency probe card apparatus according to claim 1, wherein the circuit board is formed with a receiving hole penetrating the first board surface and the second board surface, and a part of the supporting member is located in the receiving hole; the supporting member further includes a connecting plate, and the positioning structure is disposed on the connecting plate.
3. The high-frequency probe card device according to claim 2, wherein the circuit board and the corresponding detection bump are electrically coupled to each other through the support member; the connecting board is connected to the second board surface of the circuit board, and the connecting board includes a metal pad electrically coupled to the circuit board, the first end of one of the conductive elastic members abuts against the transmission layer and is electrically coupled to the detection bump corresponding to the circuit board, and the second end of the one of the conductive elastic members abuts against the metal pad.
4. The high-frequency probe card device according to claim 2, wherein the circuit board and the corresponding detection bump are electrically coupled to each other only through the transmission layer, and the transmission layer includes:
the first block is arranged on the bearing surface, and the detection bumps are arranged on the first block;
the second block is connected to the second board surface of the circuit board;
the connecting block is positioned between the first block and the second block, and part of the connecting block is positioned in the accommodating hole.
5. The high-frequency probe card apparatus of claim 4, wherein the transmission layer comprises a circuit matching unit disposed on the connection block, and the circuit matching unit is adjacent to the first block and electrically coupled to the circuit board and the corresponding detection bump.
6. The high-frequency probe card apparatus according to claim 1, wherein the transmission layer is completely disposed on the carrying surface, and the circuit board and the corresponding inspection bump are electrically coupled to each other through the transmission layer and the supporting member.
7. The high-frequency probe card apparatus as claimed in claim 6, wherein the transmission layer and the circuit board are respectively disposed on opposite sides of the supporting member, and the circuit board includes a metal pad disposed on the first board surface and electrically coupled to the second board surface; the positioning structure is disposed on the first board surface of the circuit board, the first end of one of the conductive elastic members abuts against the transmission layer and is electrically coupled to the detection bump corresponding to the circuit board, and the second end of the one of the conductive elastic members abuts against the metal pad.
8. A crimping module of a high-frequency probe card device, characterized by comprising:
a support member comprising;
a positioning structure;
a stroke structure movably disposed on the positioning structure, and the stroke structure includes:
a bracket, in which a plurality of positioning slots are formed, and the bracket is movably disposed on the positioning structure, and the surface of the bracket far from the positioning structure defines a bearing surface; and
a plurality of conductive elastic pieces respectively arranged in the plurality of positioning slots, and each conductive elastic piece is provided with a first end and a second end which are positioned at opposite sides; wherein the first end of each conductive elastic element corresponds to the bearing surface, and the second end of each conductive elastic element penetrates out of the bracket;
the transmission layer is at least partially arranged on the bearing surface and is abutted against the first end of each conductive elastic piece; and
the detection bumps are arranged on the transmission layer and are used for being detachably abutted against an object to be detected, and the detection bumps and the supporting piece are respectively positioned on two opposite sides of the transmission layer;
wherein the stroke structure is movable as a whole relative to the positioning structure so that the displacement strokes of the plurality of detection bumps are the same.
9. The crimping module of a high-frequency probe card device as claimed in claim 8, wherein the transmission layer is completely disposed on the carrying surface, the first end of one of the conductive elastic members abuts against the transmission layer and is electrically coupled to one of the detecting bumps, and the second end of the one of the conductive elastic members abuts against a metal pad.
10. A support for a high frequency probe card device, the support comprising:
a positioning structure; and
a stroke structure movably disposed on the positioning structure and capable of moving integrally relative to the positioning structure, the stroke structure comprising:
a bracket, in which a plurality of positioning slots are formed, and the bracket is movably disposed on the positioning structure, and the surface of the bracket far from the positioning structure defines a bearing surface; and
a plurality of conductive elastic pieces respectively arranged in the plurality of positioning slots, and each conductive elastic piece is provided with a first end and a second end which are positioned at opposite sides; the first end of each conductive elastic element corresponds to the bearing surface, and the second end of each conductive elastic element penetrates out of the bracket.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810770566.0A CN110716071B (en) | 2018-07-13 | 2018-07-13 | High-frequency probe card device and crimping module and support thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810770566.0A CN110716071B (en) | 2018-07-13 | 2018-07-13 | High-frequency probe card device and crimping module and support thereof |
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| CN110716071A CN110716071A (en) | 2020-01-21 |
| CN110716071B true CN110716071B (en) | 2021-09-24 |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113640555B (en) * | 2020-05-11 | 2023-11-10 | 台湾中华精测科技股份有限公司 | Array type thin film probe card and test module thereof |
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| CN1662820A (en) * | 2002-06-24 | 2005-08-31 | 纳米纳克斯公司 | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
| TW200730847A (en) * | 2006-02-15 | 2007-08-16 | Via Tech Inc | Plunger and chip-testing module applying the same |
| TW200809204A (en) * | 2006-08-08 | 2008-02-16 | Taiwan Semiconductor Mfg | Improved probe card for flip chip testing |
| CN201464507U (en) * | 2009-07-31 | 2010-05-12 | 中芯国际集成电路制造(上海)有限公司 | Probe card and metal probe |
| TW201107758A (en) * | 2009-03-12 | 2011-03-01 | Tokyo Electron Ltd | Probe card |
| CN207318550U (en) * | 2017-04-05 | 2018-05-04 | 中华精测科技股份有限公司 | Support structure of probe card carrier plate |
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| US10295566B2 (en) * | 2016-02-19 | 2019-05-21 | Dpix, Llc | Method of providing a high density test contact solution |
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| CN1662820A (en) * | 2002-06-24 | 2005-08-31 | 纳米纳克斯公司 | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
| TW200730847A (en) * | 2006-02-15 | 2007-08-16 | Via Tech Inc | Plunger and chip-testing module applying the same |
| TW200809204A (en) * | 2006-08-08 | 2008-02-16 | Taiwan Semiconductor Mfg | Improved probe card for flip chip testing |
| TW201107758A (en) * | 2009-03-12 | 2011-03-01 | Tokyo Electron Ltd | Probe card |
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| Publication number | Publication date |
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| CN110716071A (en) | 2020-01-21 |
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