CN102736007A - Adjusting method and testing device of high-frequency coupling signals - Google Patents
Adjusting method and testing device of high-frequency coupling signals Download PDFInfo
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- CN102736007A CN102736007A CN2011100945657A CN201110094565A CN102736007A CN 102736007 A CN102736007 A CN 102736007A CN 2011100945657 A CN2011100945657 A CN 2011100945657A CN 201110094565 A CN201110094565 A CN 201110094565A CN 102736007 A CN102736007 A CN 102736007A
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Abstract
The invention discloses an adjusting method and a testing device of high-frequency coupling signals. The testing device comprises a high-frequency metal needle and a coupled transmission line, wherein the metal needle or the coupled transmission line forms a high-frequency line, and the other forms a coupling line. The high-frequency line is electrically connected to a signal producing source, and the coupling line is electrically connected to a signal receiving terminal. Therefore, the high-frequency coupling signals are received on the signal receiving terminal, and the transmission frequency of the high-frequency coupling signals can be adjusted by adjusting coupling capacitances and mutual inductances of the coupling line and the high-frequency line.
Description
Technical field
The invention relates to the high-frequency test signal of semiconductor test, be meant a kind of proving installation of carry high frequency coupled signal especially and change the method for adjustment that signal is coupled.
Background technology
The fundamental purpose of probe is the test signal that receives electrical measurement board (tester) output; The effect that makes circuit board and the probe of test signal through probe carry out the circuit space conversion transfers on the IC chip the only detection welding pad of fine pitch; And by chip circuit test signal receive is handled the back and output test result at the fc-specific test FC weld pad; The circuit board that sees through probe and probe again is back to the electrical measurement board; Electrical for tester's monitoring chip, reach the wafer-level test purpose of robotization.
For for the digit chip circuit of high-speed computation, during the probe test, the circuit of circuit board is laid then need have the circuit structure of high-frequency transmission desirable characteristics impedance concurrently, and reaches the impedance matching of keeping on the high-frequency signal transmission path; In like manner, be used for contact chip and also need keep the high-frequency signal transmission condition that characteristic impedance is mated, to satisfy the fiduciary level of high frequency electrical measurement with the probe structure of seeing and return test signal off.And because the characteristic impedance of high-frequency transmission has high susceptibility to the environment of transmission structure; Therefore after probe card configuration is processed; The unmatched shortcoming of impedance is often arranged between each modular structure; The joint that causes signal to be passed to modular structure produces the signal reflex consume, thereby is difficult to the high-frequency transmission specification of actual coincidence chip circuit mostly.
Therefore, the many improvement of high frequency electrical measurement recently are the induced electricity geodesic structure of non-direct contact type, utilize the electrical couplings effect between the detection welding pad of test probe and chip to be measured, make chip circuit carry out test with the coupled signal mode; Such as United States Patent (USP) disclose No. 20070296435 proposition a kind of " alternating-current parameter coupling test probe "; Sentence the direct contact chip circuit component of special insulation material except probe at needle point and form specific coupling capacitance; Also can form adjustable coupling capacitance, obtain meeting the test condition of chip circuit specification through different distances between change probe and the chip circuit element.But, make the insulation material be infected with the quality that factor influences coupled signal equally through contact abrasion or impurity because above-mentioned patent can provide the mode of electrical couplings to be the insulation material of probe tip part first; The person utilizes crack adjustment or sensing coupling capacitance between probe tip and the chip circuit element in addition, in case promptly cause the change of distance parameter after making probe needle body elastic material aging, influences the judgement of electrical specification.
The test probe card of historical facts or anecdotes border transmitting high-frequency signal almost is subject to the technology fiduciary level of probe module, perhaps receives the influence of characteristics of signals variance factor, makes the test transmission course be difficult to keep the required impedance matching of high-frequency signal transmission.
Summary of the invention
Therefore; Fundamental purpose of the present invention is to be to provide a kind of high-frequency coupling signal adjusting method and proving installation thereof; Can respond the transport property adjustment high-frequency coupling signal that proving installation transmitted of chip to be measured, effectively promote the frequency range adjustment function of high-frequency signal transmission.
For reaching aforementioned purpose; A kind of high-frequency coupling signal adjusting method provided by the present invention; It includes following steps: prepare an electric metal pin and a coupled transmission line, process a HF link with one in this electric metal pin or this coupled transmission line, another processes a coupling circuit; Make this HF link electrically connect a signal and produce the source, make this coupling circuit electrically connect a signal receiving end; And receiving above-mentioned high-frequency coupling signal at this signal receiving end, coupling capacitance and the mutual inductance of adjusting this coupling circuit and this HF link are to adjust the transmission frequency of high-frequency coupling signal.
Therefore; Aforementioned high-frequency coupling signal adjusting method can chip to be measured signal input solder joint produce the source as above-mentioned signal; This electric metal pin is local HF link, and this coupled transmission line is local coupling circuit, and the electrical measurement board is as above-mentioned signal receiving end; Otherwise, can produce the source as above-mentioned signal by the electrical measurement board, this coupled transmission line is local HF link, and this electric metal pin is this local coupling circuit, and the signal input solder joint of chip to be measured is as above-mentioned signal receiving end.
For reaching aforementioned purpose, the proving installation of a kind of high-frequency coupling signal provided by the present invention, it has: a circuit substrate is laid with a coupled transmission line; One probe base; It is equipped with the through hole of a plurality of adjacent fixed spacings, and an electric metal pin and a coupling metal needle, and it wears respectively this through hole respectively; This electric metal pin is used for a little touching IC chip; And with this coupling metal needle is adjacent is set up in parallel, this coupling metal needle electrically connects this coupled transmission line, and than the length of this electric metal pin for short.
Therefore aforementioned proving installation can be adjusted the coupling capacitance and the mutual inductance of electric metal pin and coupling metal needle; The transport property adjustment high-frequency coupling signal that can respond chip to be measured makes the high-frequency coupling signal be able to have the required specific transmission frequency of high-frequency circuit running of chip to be measured to keep the characteristic impedance of mutual coupling.
For reaching aforementioned purpose, the present invention also provides a kind of proving installation of high-frequency coupling signal, and it has: a circuit substrate, have relative a upper surface and a lower surface, and this upper surface is provided with an electrical contact, is used to electrically connect the electrical measurement board; One high frequency transmission line and a coupled transmission line, this coupled transmission line and this high frequency transmission line are set up in parallel, and this coupled transmission line electrically connects the electrical contact of this circuit substrate; And an electric metal pin, electrically connect this high frequency transmission line and be used for a little touching IC chip.
Therefore aforementioned proving installation can be adjusted the coupling capacitance and the mutual inductance of high frequency transmission line and coupled transmission line; The transport property adjustment high-frequency coupling signal that can respond chip to be measured makes the high-frequency coupling signal be able to have the required specific transmission frequency of high-frequency circuit running of chip to be measured to keep the characteristic impedance of mutual coupling.
Description of drawings
Below, will cooperate diagram to enumerate some preferred embodiments, be used for structure of the present invention and effect are elaborated, wherein used illustrated brief description is following:
Fig. 1 is the structural representation of first preferred embodiment provided by the present invention;
Fig. 2 is the partial structurtes synoptic diagram of second preferred embodiment provided by the present invention;
Fig. 3 is the structural representation of above-mentioned second preferred embodiment, expression the adjustment part that provides and coupled transmission line at the electrical connection of circuit substrate;
Fig. 4 is the structural representation of the 3rd preferred embodiment provided by the present invention;
Fig. 5 is the structural representation of the 4th preferred embodiment provided by the present invention;
Fig. 6 is the structural representation of the 5th preferred embodiment provided by the present invention;
Fig. 7 is the partial structurtes synoptic diagram of the 6th preferred embodiment provided by the present invention.
Main element symbol description of the present invention:
1,2,3,4,5,6 proving installations
104 translation fields, 102 test sections
106 probe region
10,50,60 circuit substrates, 11,51,61 upper surfaces
12,53,63 lower surfaces, 13 holders
131 notches, 133 bottom lands
135 orifice plates, 137 solder joints
14,52,62 electrical contacts, 15 leads
16,56 coupled transmission lines, 18,54,72 high frequency transmission lines
19,58 adjustment parts, 20,200 probe bases
22 upper guide plates, 24 bottom guides
26,28 through holes, 202,204 conductive layers
32 electric metal pins, 34 coupling metal needles
40,44 high-frequency coupling circuit, 42 HF links
46 coupling circuits, 64 first coupled transmission lines
70 space convertors, 71 tops
73 bottoms, 74 second coupled transmission lines
Embodiment
For making the object of the invention, technical scheme and advantage more cheer and bright, below in conjunction with embodiment and with reference to accompanying drawing, to further explain of the present invention.
See also and be illustrated in figure 1 as first preferred embodiment provided by the present invention, be the proving installation 1 with high-frequency coupling mode transmitting high-frequency signal, this proving installation 1 can carry out testing electrical property to the IC chip with operating at high-frequency demand; The present invention is that the vertical probe that has the high density arrays distribution to give an example touches IC chip as contact element with point, is application category of the present invention like cantalever type probe or micro electronmechanical integrated technique (MEMS) probe etc. such as, thereby not subject to the limits.This proving installation 1 be distinguish have from around the test section 102, a translation field 104 and the probe region 106 that distribute in regular turn to the center; This test section 102 power supply property connections one signal produces the source; Some contact like electrical measurement board (not shown); To export, receive by a signal receiving end again, like the signal input solder joint of above-mentioned integrated circuit chip (not shown) to be measured with test signal this translation field 104 of transmission from one channel to another of electrical measurement board and by these probe region 106 set vertical probes; After chip calculation process to be measured; The test signal that operation result produced is then exported by the signal output solder joint (another signal produces the source) of chip to be measured; Be back to this proving installation 1 again; Earlier after this probe region 106, translation field 104 so that test section 102, the some contact (another signal receiving end) by the electrical measurement board receives to read and the analytical test result at last.This proving installation 1 has a circuit substrate 10, a probe base 20, a plurality of electric metal pin 32 and coupling metal needle 34, wherein:
This circuit substrate 10 has relative a upper surface 11 and a lower surface 12, and circuit substrate 10 central authorities are provided with a holder 13 correspondences and are positioned at this probe region 106, is used to install this probe base 20.This upper surface 11 is provided with a plurality of electrical contacts 14 for the some contact that is electrically connected to above-mentioned electrical measurement board, and this circuit substrate 10 is laid with a plurality of leads 15 and coupled transmission line 16; Respectively this lead 15 can be like what present embodiment was given an example and is the public plate manufacturing specification of circuit substrate 10; Be to electrically connect this electrical contact 14 and extend to 104 backs, translation field from this test section 102 to electrically connect this coupled transmission line 16, make circuit space conversion that this coupled transmission line 16 can any direction ad-hoc location this electrical contact 14 conductings to probe region 106 at this upper surface 11 with the mode of radially extending.This holder 13 is for being located at a cell body of these circuit substrate 10 central authorities, and its notch 131 upwards can supply those coupled transmission lines 16 to extend into after fixing and pass bottom land 133; Bottom land 133 is provided with an orifice plate 135, and made for the material of tool good insulation characteristic, respectively the metal core of this coupled transmission line 16 can pass this orifice plate 135 and be fixedly welded on a solder joint 137 of orifice plate 135 bottoms.
This probe base 20 is located at the bottom of this orifice plate 135; Have a upper guide plate 22 and a bottom guide 24; The material that this two guide plate 22,24 is a tool good insulation characteristic is made; Be with periphery mutually stacked and each above that, the lower face correspondence wears the through hole 26,28 of a plurality of adjacent fixed spacings, being used to make respectively, this electric metal pin 32 and coupling metal needle 34 vertically wear this probe base 20; These a plurality of metal needles 32,34 are erected on this two guide plate 22,24 and form and these circuit substrate 10 orthogonal aspects; And respectively but the body portion of this metal needle 32,34 with elasticity arching is positioned at this two guide plate 22, the accommodation space between 24, therefore can be in the inner spaces that have transverse elasticity to cushion of obtaining of probe base 20 when receive normal stress.
Respectively an end of this electric metal pin 32 is to protrude the top of this upper guide plate 22 to be resisted against this orifice plate 135, and the through hole 28 that the other end then protrudes this bottom guide 24 touches measured electronic elements in order to point; Respectively be somebody's turn to do an end of coupling metal needle 34; Promptly respectively be somebody's turn to do the backshank of coupling metal needle 34; The top that is this upper guide plate 22 of protrusion electrically connects with solder joint 137 and this coupled transmission line 16 that is resisted against these orifice plate 135 bottoms, and the other end is then fixed its lateral attitudes to be the aspect that firmly is erected in this probe base 20 by the through hole 28 of this bottom guide 24.This coupling metal needle 34 and these electric metal pin 32 adjacent being set up in parallel; Be used for producing specific capacitor and mutual inductance with electric metal pin 32; Make high-frequency signal transmission lead to the high-frequency coupling signal of frequency through the specific band of this electric metal pin 32 and this coupling metal needle 34 back formation with the effect of high-pass filtering (high pass filter) or bandpass filtering (band pass filter); 26,28 of through holes that change this coupling metal needle 34 to another and this electric metal pin 32 adjacent different distance can be adjusted the transmission frequency and the characteristics of signals impedance of this high-frequency coupling signal; Not only can completely cut off direct current transmission between this electric metal pin 32 and the electrical measurement board reducing DC power consumption, and can reduce unnecessary band interference beyond the transmission frequency of high-frequency coupling signal; Therefore the horizontal spacing of 26,28 of each through holes only need be preconfigured to the fine setting amplitude corresponding with the specific transmission frequency, then can wear the metal needle 34 that is coupled according to high-frequency transmission specification through hole 26,28 around electric metal pin 32 of measured electronic elements; And respectively in fact this coupling metal needle 34 has the function of high-frequency coupling; Be not used in and a little touch measured electronic elements; Do not contact with electric metal pin 32 yet; Can only need with small this bottom guide 24 of tip portion protrusion like what present embodiment was given an example, or can directly push up to this bottom guide 24 or be fixed on the inner mode of through hole 28, and not at application category that the present invention limited.
Certainly; The probe base that present embodiment is given an example, electric metal pin and coupling metal needle are that response is used for vertical probe and corresponding structure is arranged; If like aforesaid cantalever type probe or micro electronmechanical integrated technique (MEMS) probe; Then, be not used in and a little touch measured electronic elements, only touch measured electronic elements with adjacent electric metal pin mark arranged side by side equally with the coupling metal needle electric connection coupled transmission line of high-frequency coupling function; And process the adjacent-specification of coupling metal needle and electric metal pin according to the high-frequency coupling signal of the logical frequency of the specific band of required formation, obtain the transmission frequency of required high-frequency coupling signal thus.
Therefore; After electrical contact 14 receptions of test signal by this circuit substrate 10 of electrical measurement board; Transmit scriptures this lead 15 and coupled transmission line 16 so that this coupling metal needle 34; Then form the high-frequency coupling signal by these electric metal pin 32 outputs with these electric metal pin 32 electrical couplings, the signal input solder joint by chip to be measured receives again; Such signal transmission path forms a high-frequency coupling circuit 40 of this proving installation 1; Produce the source with the electrical measurement board as above-mentioned signal; This lead 15, coupled transmission line 16 and this coupling metal needle 34 form a HF link 42 of this high-frequency coupling circuit 40; This electric metal pin 32 forms a coupling circuit of this high-frequency coupling circuit 40, and the signal input solder joint of chip to be measured is as above-mentioned signal receiving end.Otherwise; After chip calculation process to be measured, then produce the test result signal; Signal output solder joint by chip to be measured exports this electric metal pin 32 to; Form the high-frequency coupling signal again with after these coupling metal needle 34 electrical couplings,, be back to the reception of electrical measurement board at last and read and the analytical test result through this coupled transmission line 16 and 15 transmission of this lead; The transmission path of such test signal forms another high-frequency coupling circuit 44 of this proving installation 1; Signal output solder joint with chip to be measured produces the source as above-mentioned signal; This electric metal pin 32 forms a HF link of this high-frequency coupling circuit 44; This coupling metal needle 34, coupled transmission line 16 and this lead 15 form a coupling circuit 46 of this high-frequency coupling circuit 44, and the electrical measurement board is as above-mentioned signal receiving end.
Comprehensive above-mentionedly know; Proving installation provided by the present invention is the high-frequency signal that receives the source that produces from signal with HF link; And with coupling circuit output high-frequency coupling signal to signal receiving end; Be mainly the electric capacity that intercouples and the counter structure of inductance characteristic are arranged between the HF link that provided and the coupling circuit; Like above-mentioned embodiment the parallel construction of electric metal pin 32 with coupling metal needle 34 is provided; Therefore can be through the coupling capacitance and the mutual inductance of this coupling circuit of adjustment and this HF link, the transport property adjustment high-frequency coupling signal that can respond chip to be measured makes the high-frequency coupling signal be able to have the required specific transmission frequency of high-frequency circuit running of chip to be measured to keep the characteristic impedance of mutual coupling; Therefore effectively promoted the frequency range adjustment function of high-frequency signal transmission; More can avoid in highdensity test circuit structure, constituting single transmission path with different transmission mediums is transmitted to the high-frequency test signal between tester table and the chip to be measured; Thereby effectively reduced the signal reflex consume on the transmission path, and then high-frequency transmission quality and transmitting bandwidth have been promoted.
What deserves to be mentioned is; The coupling capacitance between electric metal pin 32 and the coupling metal needle 34 and the method for adjustment of mutual inductance; Except changing coupling metal needle 34 in through hole 26,28 positions that probe base 20 is worn; One proving installation 2 that also can be provided like Fig. 2 and the present invention shown in Figure 3 second preferred embodiment; A probe base 200 wherein and the above-mentioned first preferred embodiment difference person cooperate Fig. 2 A reference at the conductive layer 202 that on bottom guide 24, is laid with a plurality of ring-types, respectively these conductive layer 202 rings establish this electric metal pin 32 respectively and corresponding be positioned at electric metal pin 32 around on the adjacent through-holes 28.Like this; Respectively this coupling metal needle 34 of establishing of these electric metal pin 32 adjacent loops only needs one of them to electrically connect coupled transmission line 16; This coupling metal needle 34 that all the other rings are established can make this electric metal pin 32 and contiguous set these a plurality of coupling metal needles 34 have the coupling capacitance and the mutual inductance of single equivalence through this corresponding conductive layer 202 electrically short circuit each other; Thereby 2 need of this proving installation on probe base 200, fixed via 26,28 positions of bottom guide 22,24 are with the mode of plug coupling metal needle 34; The contiguous coupling metal needle 34 that changes electric metal pin 32 is provided with quantity, can change the coupling capacitance and the mutual inductance of coupling circuit and HF link.Certainly; Make these a plurality of coupling metal needles 34 that adjacent loops establishes each other the conductive coating structure of short circuit be not defined as the enforcement aspect that is positioned at the guide plate 24 under the probe base 20 that provides like present embodiment yet; Such as be located on 34 any structures that wear or contact of these a plurality of coupling metal needles, comprise the orifice plate 135 of circuit substrate 10 bottoms or the upper and lower guide plate 22,24 of probe base 20; Perhaps be located on a plurality of structures that these 34 of a plurality of coupling metal needles wear or contact; Shown in Fig. 2 B, be provided with conductive layer 202,204 at upper and lower guide plate 22,24 simultaneously; All can make 32 set these coupling metal needle 34 mutual short circuits of electric metal pin; More increase the quality of high-frequency coupling, have equally the present invention the effect that will produce, thereby not subject to the limits.
Trickleer adjustment for the transmission frequency that realizes the high-frequency coupling signal; This proving installation 2 is provided with an adjustment part 17 at the upper surface 11 of circuit substrate 10; Cooperate Fig. 3 reference; Be to be electric capacity, inductance or both composition elements, and make lead 15 or the coupled transmission line 16 that this coupling metal needle 34 electrically connected electrically connect these adjustment parts 17 that the numerical value that changes electric capacity or the inductance of this adjustment part 17 then can further be adjusted the transmission frequency of this high-frequency coupling signal.
In addition; See also the proving installation 3 that the present invention's the 3rd preferred embodiment as shown in Figure 4 is provided; Compared to the mode of above-mentioned each embodiment with the quantity of the spacing of adjustment electric metal pin 32 and coupling metal needle 34 or plug coupling metal needle 34; The difference of this proving installation 3 is; Be to provide probe base 20 that electric metal pin 32 and coupling metal needle 34 are set like first preferred embodiment; Also provide a high frequency transmission line 18 and electric metal pin 32 to electrically connect and be set up in parallel with coupled transmission line 16, the length through changing this high frequency transmission line 18 or with the neighbor distance of this coupled transmission line 16 to reach the coupling capacitance and the mutual inductance of adjustment coupling circuit and HF link; Further; An adjustment part 19 that also provides similar the foregoing description and provided; Be electric capacity, inductance or both composition elements; Make this coupled transmission line 16 and high frequency transmission line 18 simultaneously and this adjustment part 19 electrically connect, the numerical value that changes electric capacity or the inductance of this adjustment part 17 then can further be adjusted the coupling capacitance and the mutual inductance of coupling circuit and HF link, more effectively adjusts the transmission frequency of this high-frequency coupling signal.
As for above-mentioned each embodiment of the present invention provide coupled transmission line 16 or high frequency transmission line 18 are laid in the structure of circuit substrate 10, also are not limited to and are laid in circuit substrate 10 outsides and pass central holder 13 to circuit substrate 10 belows and probe base 20 or 200 again and connect the mode of establishing; See also the proving installation 4 that the present invention's the 4th preferred embodiment as shown in Figure 5 is provided; Be to have a circuit substrate 50 and the probe base 20 that is provided like above-mentioned first preferred embodiment, electric metal pin 32 and coupling metal needle 34; The circuit special plate of this circuit substrate 50 for having specific circuit architecture, the difference that is provided with above-mentioned first preferred embodiment is:
One upper surface 51 of this circuit substrate 50 is provided with a plurality of electrical contacts 52 for the some contact that is electrically connected to the electrical measurement board; A lower surface 53 of this circuit substrate 50 is provided with this probe base 20, and the inside of this circuit substrate 50 is laid with a plurality of adjacent high frequency transmission lines arranged side by side 54 and coupled transmission line 56 electrically connects this electric metal pin 32 and coupling metal needle 34 at this lower surface 53 respectively; This coupled transmission line 56 electrically connects this electrical contact 52 at this upper surface 51; Therefore through laying mode at these circuit substrate 50 inner integrated circuit; The high frequency transmission line 54 of laying and these coupled transmission line 56 specific distance arranged side by side can obtain the specific transmission frequency that this proving installation 4 transmits required high-frequency coupling signal.What is more; In order to make testing engineering be applied to the chip to be measured of multiple different circuit specification widely; The adjustment part 58 that the upper surface 51 of this circuit substrate 50 also is provided with similar the foregoing description and is provided; Be electric capacity, inductance or both composition elements; Make this coupled transmission line 56 and high frequency transmission line 54 simultaneously and this adjustment part 58 electrically connect, the numerical value that changes electric capacity or the inductance of this adjustment part 58 then can further be adjusted the coupling capacitance and the mutual inductance of coupling circuit and HF link, more effectively adjusts the transmission frequency of this high-frequency coupling signal; Certainly the adjustment part of being set up and arbitrary this coupled transmission line 56 or high frequency transmission line 54 or the effect that both electrically connect simultaneously; All in order to realize changing the characteristic impedance function of high-frequency signal transmission in high frequency transmission line 54; Therefore adjustment part is located at the set-up mode that circuit substrate 50 upper surfaces 51 electrically connect arbitrary this coupled transmission line 56 or high frequency transmission line 54; For example adjustment part is located at circuit substrate 50 upper surfaces 51; The two ends of adjustment part electrically connect this coupled transmission line 56 and earth terminal respectively, and perhaps the two ends with adjustment part electrically connect this high frequency transmission line 54 and earth terminal respectively, with the impedance of adjustment characteristics of signals; Have concurrently equally the present invention the effect that will bring into play, thereby not subject to the limits.
Certainly; As long as be close to constant spacing around the high frequency transmission line 54 and show a plurality of coupled transmission lines 56; The lower surface 53 of circuit substrate 50 also can be provided with the probe base 200 that is provided like second preferred embodiment; Make coupling metal needle 34 electrically connect coupled transmission lines 56, then change the coupling capacitance and the mutual inductance of coupling circuit and HF link for the mode of metal needle 34 plugs that can supply to be coupled.
In addition; The circuit function structure that the above-mentioned circuit substrate of processing with the special plate of circuit 50 is had; Also desirable on behalf of the space convertor that generally has the circuit space translation function with the public plate collocation of circuit; The present invention's the 5th preferred embodiment as shown in Figure 6 provides a proving installation 5; Be have a circuit substrate 60, a space convertor 70 and as above-mentioned second preferred embodiment probe base 200, electric metal pin 32 and the coupling metal needle 34 that are provided, the difference that is provided with above-mentioned the 4th preferred embodiment is:
The upper surface 61 of this circuit substrate 60 is provided with a plurality of electrical contacts 62 for the some contact that is electrically connected to the electrical measurement board, and extension cloth is provided with a plurality of first coupled transmission lines 64 between the upper surface 61 of this circuit substrate 60 and the lower surface 63.
One top 71 of this space convertor 70 electrically connects with this circuit substrate 60; One bottom 73 of this space convertor 70 is provided with this probe base 200 and electric metal pin 32 that wears this probe base 200 and coupling metal needle 34, second coupled transmission line 74 that the inside of this space convertor 70 is laid with a plurality of high frequency transmission lines 72 and lays with these high frequency transmission line 72 contiguous constant spacings respectively; Respectively this high frequency transmission line 72 electrically connects this electric metal pin 32, and respectively this second coupled transmission line 74 is used for electrically connecting respectively this coupling metal needle 34.
Detailed description according to above-mentioned second preferred embodiment; Establish the respectively conductive layer 204 or 202 of this electric metal pin 32 owing to be laid with ring on last or bottom guide 22 or 24 of this probe base 200; And respectively this electric metal pin 32 encircles this conductive layer 202 or 204 electrically short circuits each other that this coupling metal needle 34 of establishing can pass through correspondence, so make second coupled transmission lines 74 of respectively these high frequency transmission line 72 vicinity settings be similarly electrically short circuit each other; So respectively these high frequency transmission line 72 second contiguous coupled transmission lines 74 only need one of them to electrically connect first coupled transmission line 64 of this circuit substrate 60; Then this proving installation 5 not only has with above-mentioned second preferred embodiment and is similarly the mode with plug coupling metal needle 34; The contiguous coupling metal needle 34 that changes electric metal pin 32 is provided with coupling capacitance and the mutual inductance of quantity with adjustment coupling circuit and HF link; Also can be through lay the high frequency transmission line 72 and second coupled transmission line 74 of particular electrical circuit transmission standard with the space convertor 70 of little technology; The coupling metal needle 34 that makes corresponding plug is the high-frequency coupling signal adjustment function of high precision more; Can omit the setting of extra capacitor or inductance adjustment part thus, increase the remaining circuit space requirement on the circuit substrate 60.
What deserves to be mentioned is; Proving installation that present embodiment provides 5 makes the high-frequency coupling effect between electric metal pin 32 and coupling metal needle 34, extend to generation in the space convertor 70; Certainly, if further extend to circuit substrate 60, make to have the convenience that is provided with above-mentioned the 4th preferred embodiment and above circuit substrate 60, set up any adjustment part; With transmission frequency and the transport property impedance that further changes high-frequency signal; Also can circuit substrate 60 cloth be made as the architectural characteristic same with the 4th circuit substrate that preferred embodiment provides 50, all can realize the present invention the effect that will bring into play, thereby not subject to the limits.
In addition; Because the present invention is mainly in coupling capacitance and mutual inductance that adjustment coupling circuit and HF link are provided; Therefore on the circuit structure of circuit substrate; Like the use coupled transmission line of the 3rd and the 4th embodiment high frequency transmission line 18 arranged side by side or 54, cooperate Fig. 4 to Fig. 6 reference, all between coupled transmission line and high frequency transmission line, produce the electrical couplings effect; So even the probe base 20 that the foregoing description is provided only is provided for a little touching the electric metal pin 32 of chip to be measured; Still can obtain the high-frequency coupling signal through the laying arranged side by side of coupled transmission line and high frequency transmission line; The proving installation 6 that the present invention's the 6th preferred embodiment as shown in Figure 7 is provided; The proving installation that is provided compared to above-mentioned the 3rd preferred embodiment; Difference is to omit the setting of coupling metal needle, the coupling capacitance and the mutual inductance of therefore only reaching adjustment coupling circuit and HF link with the numerical value of the electric capacity that changes adjustment part 19 or inductance, have equally the present invention the effect that will provide.
It should be noted that above-described content is merely preferable possible embodiments of the present invention,, ought to be included in the claim of the present invention so use instructions of the present invention and the described equivalent structure variation of claim such as.
Claims (20)
1. high-frequency coupling signal adjusting method, this method includes following steps:
Prepare an electric metal pin and a coupled transmission line, process a HF link with one in this electric metal pin or this coupled transmission line, another processes a coupling circuit;
Make this HF link electrically connect a signal and produce the source, make this coupling circuit electrically connect a signal receiving end; And
Receive above-mentioned high-frequency coupling signal at this signal receiving end, coupling capacitance and the mutual inductance of adjusting this coupling circuit and this HF link are to adjust the transmission frequency of high-frequency coupling signal.
2. high-frequency coupling signal adjusting method according to claim 1; Also prepare a coupling metal needle; Electrically connect with this coupled transmission line and be set up in parallel with this electric metal pin, the neighbor distance that changes this coupling metal needle and this electric metal pin is to adjust the transmission frequency of this high-frequency coupling signal.
3. high-frequency coupling signal adjusting method according to claim 2; Also prepare a circuit substrate; Be used to lay this coupled transmission line; This coupled transmission line electrically connects this signal receiving end at a upper surface of this circuit substrate, and electrically connects the metal needle that should be coupled at a lower surface of this circuit substrate, makes this coupled transmission line and this coupling metal needle process this coupling circuit.
4. high-frequency coupling signal adjusting method according to claim 2; Also prepare a circuit substrate; Be used to lay this coupled transmission line; This coupled transmission line electrically connects this signal generation source at a upper surface of this circuit substrate, and electrically connects the metal needle that should be coupled at a lower surface of this circuit substrate, makes this coupled transmission line and this coupling metal needle process this HF link.
5. according to each described high-frequency coupling signal adjusting method in the claim 1,2,3 or 4; Also prepare a plurality of coupling metal needles and make electrically short circuit each other; And be set up in parallel with this electric metal pin respectively; Wherein one be somebody's turn to do coupling metal needle and the electric connection of this coupled transmission line, the quantity that changes these a plurality of coupling metal needles is to adjust the transmission frequency of this high-frequency coupling signal.
6. high-frequency coupling signal adjusting method according to claim 5; Also prepare a probe base; Be that the through hole that is equipped with a plurality of adjacent fixed spacings is used to supply this electric metal pin and coupling metal needle to wear, these a plurality of coupling metal needles be located in contiguous this electric metal pin around through hole.
7. high-frequency coupling signal adjusting method according to claim 1; Also prepare a high frequency transmission line; Electrically connect and should be set up in parallel with this electric metal pin with coupled transmission line, change this high frequency transmission line length or with the neighbor distance of this coupled transmission line to adjust the transmission frequency of this high-frequency coupling signal.
8. high-frequency coupling signal adjusting method according to claim 7; Also prepare a circuit substrate; Be laid with this high frequency transmission line and coupled transmission line; This coupled transmission line electrically connects this signal receiving end at a upper surface of this circuit substrate, and this high frequency transmission line electrically connects this electric metal pin at a lower surface of this circuit substrate, makes this high frequency transmission line and electric metal pin process this HF link.
9. high-frequency coupling signal adjusting method according to claim 7; Also prepare a circuit substrate; Be laid with this high frequency transmission line and coupled transmission line; This coupled transmission line electrically connects this signal generation source at a upper surface of this circuit substrate, and this high frequency transmission line electrically connects this electric metal pin at a lower surface of this circuit substrate, makes this high frequency transmission line and electric metal pin process this coupling circuit.
10. high-frequency coupling signal adjusting method according to claim 7; Also prepare a circuit substrate and a space convertor; This space convertor is stacked in a lower surface of this circuit substrate; This coupled transmission line is laid in this circuit substrate and space convertor, and electrically connects this signal receiving end at a upper surface of this circuit substrate, and this high frequency transmission line is laid in this space convertor; And electrically connect this electric metal pin at a lower surface of this space convertor, make this high frequency transmission line and electric metal pin process this HF link.
11. high-frequency coupling signal adjusting method according to claim 7; Also prepare a circuit substrate and a space convertor; This space convertor is stacked in a lower surface of this circuit substrate; This coupled transmission line is laid in this circuit substrate and space convertor, and electrically connects this signal generation source at a upper surface of this circuit substrate, and this high frequency transmission line is laid in this space convertor; And electrically connect this electric metal pin at a lower surface of this space convertor, make this high frequency transmission line and this electric metal pin process this coupling circuit.
12. the proving installation of a high-frequency coupling signal is used to connect the electrical measurement board so that IC chip is carried out testing electrical property, this proving installation has:
One circuit substrate is laid with a coupled transmission line and is used to receive the test signal that above-mentioned electrical measurement board is exported;
One probe base, it is equipped with the through hole of a plurality of adjacent fixed spacings, and
An one electric metal pin and a coupling metal needle; It wears respectively this through hole respectively; This electric metal pin is used for a little touching the said integrated circuit chip, and the coupling metal needle is adjacent is set up in parallel with this, and this coupling metal needle electrically connects this coupled transmission line; After filtering, this electric metal pin output high-frequency coupling signal is to carry out testing electrical property to the said integrated circuit chip certainly between this coupling metal needle and electric metal pin for above-mentioned test signal.
13. proving installation according to claim 12; One upper surface of this circuit substrate has an electrical contact; Be used to electrically connect above-mentioned electrical measurement board; The inside of this circuit substrate is laid with a lead inwardly radially extends from the periphery of this circuit substrate, and the two ends of this lead electrically connect this electrical contact and this coupled transmission line respectively.
14. proving installation according to claim 13 also has a high frequency transmission line, this high frequency transmission line and this electric metal pin electrically connect and are set up in parallel with this coupled transmission line.
15. proving installation according to claim 13; The central authorities of this circuit substrate are equipped with a holder; This probe base is located at the bottom of this holder; One end of this coupled transmission line is located at the upper surface of this circuit substrate, and the other end wears this holder and connects in the bottom of this holder establishes this coupling metal needle.
16. proving installation according to claim 12; The inside of this probe base is provided with a conductive layer; Be located on the contiguous on every side through hole of this electric metal pin; This probe base is provided with a plurality of coupling metal needles and passes this conductive layer and electrically connect with this conductive layer, and wherein this coupling metal needle and this coupled transmission line join.
17. the proving installation of a high-frequency coupling signal is used to connect the electrical measurement board so that IC chip is carried out testing electrical property, this proving installation includes:
One circuit substrate has relative a upper surface and a lower surface, and this upper surface is provided with an electrical contact, is used to electrically connect above-mentioned electrical measurement board;
One high frequency transmission line and a coupled transmission line; This coupled transmission line and this high frequency transmission line are set up in parallel; The electrical contact that this coupled transmission line electrically connects this circuit substrate is used to receive the test signal that above-mentioned electrical measurement board is exported; After filtering, this high frequency transmission line is exported high-frequency coupling signal to above-mentioned test signal certainly between this coupled transmission line and high frequency transmission line; And,
One electric metal pin electrically connects this high frequency transmission line and is used for a little touching the said integrated circuit chip, to export above-mentioned high-frequency coupling signal to this IC chip.
18. proving installation according to claim 17; The inside of this circuit substrate is laid with a lead and inwardly radially extends from the periphery of this circuit substrate; The two ends of this lead electrically connect this electrical contact and this coupled transmission line respectively; The central authorities of this circuit substrate are equipped with a holder, and the bottom of this holder is provided with a probe base, and this probe base is to wear this electric metal pin; One end of this coupled transmission line is located at the upper surface of this circuit substrate, and the other end wears the bottom of this holder to this holder.
19. proving installation according to claim 17; Have a probe base, this probe base is equipped with this an electric metal pin and a coupling metal needle, and this coupling metal needle is adjacent with this electric metal pin arranged side by side and electrically connect this coupled transmission line; The inside of this probe base is provided with a conductive layer; Be located at this electric metal pin around, this probe base is provided with a plurality of coupling metal needles and passes this conductive layer and electrically connect with this conductive layer, wherein this coupling metal needle and this coupled transmission line join.
20. proving installation according to claim 17; Have a probe base and a space convertor; This probe base is equipped with this an electric metal pin and a coupling metal needle, and this coupling metal needle is adjacent with this electric metal pin arranged side by side and electrically connect this coupled transmission line, and this space convertor is located at the lower surface of this circuit substrate; This probe base is located at the bottom of this space convertor; This coupled transmission line is to distinguish one first and one second coupled transmission line is arranged, and extension cloth is located at the inside of this circuit substrate and space convertor respectively, and this high frequency transmission line and this second coupled transmission line are set up in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011100945657A CN102736007A (en) | 2011-04-07 | 2011-04-07 | Adjusting method and testing device of high-frequency coupling signals |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011100945657A CN102736007A (en) | 2011-04-07 | 2011-04-07 | Adjusting method and testing device of high-frequency coupling signals |
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| CN102736007A true CN102736007A (en) | 2012-10-17 |
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Application publication date: 20121017 |