JP2001101371A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JP2001101371A JP2001101371A JP28253399A JP28253399A JP2001101371A JP 2001101371 A JP2001101371 A JP 2001101371A JP 28253399 A JP28253399 A JP 28253399A JP 28253399 A JP28253399 A JP 28253399A JP 2001101371 A JP2001101371 A JP 2001101371A
- Authority
- JP
- Japan
- Prior art keywords
- card
- contact
- communication
- coil
- resonance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、非接触により、外
部とのデータ通信、電源供給を行うことができる非接触
ＩＣカード又は接触／非接触ＩＣカードに関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card or a contact / non-contact IC card capable of performing data communication and power supply to the outside by non-contact.
【０００２】[0002]
【従来の技術】ＩＣカードは、接続端子を介してデータ
通信を行う接触ＩＣカードと、コイルを通じて電磁誘導
により通信を行う非接触ＩＣカードに分類され、接触Ｉ
Ｃカードは、主に決済用途に用いられ、非接触ＩＣカー
ドは、主に交通システム等のゲートアクセス管理に用い
られている。また、近年、接触ＩＣカードの機能と非接
触ＩＣカードの機能を１つのＩＣチップで併せ持つ接触
／非接触共用ＩＣカードが開発されている。2. Description of the Related Art IC cards are classified into contact IC cards that perform data communication through connection terminals and non-contact IC cards that perform communication by electromagnetic induction through coils.
The C card is mainly used for payment purposes, and the non-contact IC card is mainly used for gate access control of a transportation system or the like. In recent years, a contact / contactless shared IC card having both the function of a contact IC card and the function of a contactless IC card in one IC chip has been developed.
【０００３】図１１は、従来の非接触ＩＣカード１００
の内部構成を示す図である。従来の非接触ＩＣカード１
００は、カード基材１０８に少なくとも１つのコイル１
０１と、コイル１０１に接続されたＩＣチップ１０２と
が設けられており、コイル１０１を通じて、図示しない
外部装置であるリーダライタから送出される交流電磁波
の受信を行い、電力供給及び信号送受信を行うという手
法によりカード〜リーダライタ間の通信が行われてい
る。FIG. 11 shows a conventional non-contact IC card 100.
FIG. 3 is a diagram showing an internal configuration of the device. Conventional non-contact IC card 1
00 indicates that at least one coil 1
01 and an IC chip 102 connected to the coil 101 are provided. Through the coil 101, an AC electromagnetic wave transmitted from a reader / writer which is an external device (not shown) is received, and power is supplied and signals are transmitted and received. Communication between the card and the reader / writer is performed by the technique.
【０００４】また、近年、共振回路を利用した非接触Ｉ
Ｃカード１１０が開発されている。図１２は、共振回路
を利用した従来の非接触ＩＣカードを説明する図であ
る。図１２に示す非接触ＩＣカード１１０は、カード基
材１１８内に、外部通信用コイル１１１とコンデンサ１
１３とを備えた共振回路１１４と、少なくともＩＣチッ
プ１１５及び内部通信用コイル１１６を有する非接触Ｉ
Ｃモジュール１１７を備え、リーダライタから送出され
る交流電磁波を共振回路１１４により効率よく受信し、
共振回路１１４と非接触ＩＣモジュール１１７との間に
おいて電磁結合により電力送信及び信号送受信を行って
いる。この手法を用いた場合、カード〜リーダライタ間
の通信品質が良くなり、通信距離を伸ばすことが可能と
なる。In recent years, a non-contact I / O using a resonance circuit has been developed.
A C card 110 has been developed. FIG. 12 is a diagram illustrating a conventional non-contact IC card using a resonance circuit. The non-contact IC card 110 shown in FIG.
And a non-contact IC having at least an IC chip 115 and an internal communication coil 116.
A C module 117 is provided, and the AC electromagnetic wave transmitted from the reader / writer is efficiently received by the resonance circuit 114,
Power transmission and signal transmission / reception are performed between the resonance circuit 114 and the non-contact IC module 117 by electromagnetic coupling. When this method is used, the communication quality between the card and the reader / writer is improved, and the communication distance can be extended.
【０００５】上記非接触ＩＣカード１００におけるコイ
ル１０１又は非接触ＩＣカード１１０における共振回路
１１４の共振周波数ｆ1 をリーダライタ間の通信周波数
ｆrと同等にした場合（ｆ1 ≒ｆr ）、リーダライタ間
の通信効率は最も高くなり、通信品質及び通信可能距離
を向上させることが可能となる。[0005] When the resonance frequency f 1 of the resonant circuit 114 in the coil 101 or the contactless IC card 110 equal to the communication frequency f r between the reader-writer of the contactless IC card 100 (f 1 ≒ f r), the reader The communication efficiency between the writers is the highest, and the communication quality and the communicable distance can be improved.
【０００６】[0006]
【発明が解決しようとする課題】しかし、前述した従来
の非接触ＩＣカード１００及び非接触ＩＣカード１１０
は、複数枚の非接触ＩＣカードを重ねた場合には、各々
の非接触ＩＣカード内に備わるコイル間における相互イ
ンダクタンスにより各コイルの共振周波数ｆ1 が低くな
るｆ1 ＜ｆr ため、通信は困難となる。また、非接触Ｉ
Ｃカード１００におけるコイル１０１又は非接触ＩＣカ
ード１１０における共振回路１１４の共振周波数ｆ
1 を、リーダライタ間の通信周波数ｆr と比較し高くし
た場合（ｆ1 ＞ｆr ）、複数枚の非接触ＩＣカードを重
ねた場合においても通信は可能となるが、カード１枚時
の通信品質及び通信可能距離は、共振周波数ｆ1 を通信
周波数ｆr と同等にした場合（ｆ1 ≒ｆr ）と比較し劣
る。However, the above-mentioned conventional non-contact IC card 100 and non-contact IC card 110
, When stacked a plurality of non-contact type IC card, the resonance frequency f 1 of each coil by mutual inductance is low between the coils included in each of the non-contact IC card f 1 <Therefore f r, communication It will be difficult. Non-contact I
The resonance frequency f of the coil 101 in the C card 100 or the resonance circuit 114 in the non-contact IC card 110
1, when high compared to the communication frequency f r between the reader-writer (f 1> f r), the communication is made possible even when the stacked plurality of non-contact type IC card, when one card communication quality and communication distance is inferior in comparison with the case where the resonance frequency f 1 equal to the communication frequency f r (f 1 ≒ f r ).
【０００７】本発明の課題は、カードを複数枚重ねた状
態であっても、通信品質がよく、通信可能範囲が広いＩ
Ｃカードを提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a communication system having good communication quality and a wide communicable range even when a plurality of cards are stacked.
To provide a C card.
【０００８】[0008]
【課題を解決するための手段】本発明は、以下のような
解決手段により、前記課題を解決する。なお、理解を容
易にするために、本発明の実施形態に対応する符号を付
して説明するが、これに限定されるものではない。すな
わち、請求項１の発明は、コイル（１１，２１，５１，
６１）及び電荷蓄積手段（１３，２３，５３，６３）を
有する複数の共振回路（１０，２０，５０，６０）と、
ＩＣチップ（３２，７２）及び前記コイルとは別であっ
て前記ＩＣチップに電気的に接続されたＩＣチップ接続
コイル（３１，７１）を有するＩＣモジュール（７０，
３０）とを備えるＩＣカード（１，２）である。The present invention solves the above-mentioned problems by the following means. In addition, in order to make it easy to understand, description is given with reference numerals corresponding to the embodiment of the present invention, but the present invention is not limited to this. That is, the invention according to claim 1 includes the coils (11, 21, 51,
61) and a plurality of resonance circuits (10, 20, 50, 60) having charge storage means (13, 23, 53, 63);
An IC module (70, 70) having an IC chip connection coil (31, 71) which is separate from the IC chip (32, 72) and the coil and is electrically connected to the IC chip.
30) is an IC card (1, 2).
【０００９】請求項２の発明は、請求項１に記載のＩＣ
カードにおいて、前記複数の共振回路のうち少なくとも
１つは、その共振周波数（ｆ1 ，ｆ2 ）が外部装置との
通信周波数（ｆr ）とほぼ等しいことを特徴とするＩＣ
カードである。According to a second aspect of the present invention, there is provided an IC according to the first aspect.
In the card, at least one of said plurality of resonant circuits, IC, characterized in that the resonant frequency (f 1, f 2) is approximately equal to the communication frequency of the external device (f r)
Card.
【００１０】請求項３の発明は、請求項１又は請求項２
に記載のＩＣカードにおいて、前記複数の共振回路のう
ち少なくとも１つは、その共振周波数が前記通信周波数
よりも高いことを特徴とするＩＣカードである。[0010] The invention of claim 3 is claim 1 or claim 2.
4. The IC card according to claim 1, wherein at least one of the plurality of resonance circuits has a resonance frequency higher than the communication frequency.
【００１１】請求項４の発明は、請求項１から請求項３
までのいずれか１項に記載のＩＣカードにおいて、前記
複数の共振回路のうち少なくとも１つは、同じＩＣカー
ドが複数枚重なった状態において、その共振周波数が前
記通信周波数とほぼ等しいことを特徴とするＩＣカード
である。[0011] The invention of claim 4 is the invention of claims 1 to 3.
5. The IC card according to claim 1, wherein at least one of the plurality of resonance circuits has a resonance frequency substantially equal to the communication frequency when a plurality of the same IC cards are stacked. IC card.
【００１２】請求項５の発明は、請求項１から請求項４
までのいずれか１項に記載のＩＣカードにおいて、前記
複数の共振回路は、カード面において上下左右対称であ
ることを特徴とするＩＣカードである。The invention of claim 5 is the invention of claims 1 to 4.
The IC card according to any one of the above, wherein the plurality of resonance circuits are vertically and horizontally symmetrical on a card surface.
【００１３】請求項６の発明は、請求項１から請求項５
までのいずれか１項に記載のＩＣカードにおいて、前記
ＩＣモジュールは、前記複数の共振回路の内側にあるこ
とを特徴とするＩＣカードである。[0013] The invention of claim 6 is the invention of claims 1 to 5.
The IC card according to any one of the above, wherein the IC module is located inside the plurality of resonance circuits.
【００１４】[0014]
【発明の実施の形態】以下、図面等を参照して、本発明
の実施の形態について、さらに詳しく説明する。 （第１実施形態）図１は、本発明による非接触ＩＣカー
ド１００の第１実施形態を説明する図である。なお、前
述した従来例と同様の機能を果たす部分は、重複する説
明を適宜省略する。非接触ＩＣカード１は、第１の外部
通信用コイル１１及び第１のコンデンサ部１３を有する
第１の共振回路１０を備え、この内側に第２の外部通信
用コイル２１及び第２の外部通信用コイル２１に接続さ
れた第２のコンデンサ部２３を有する第２の共振回路２
０と内部通信用コイル３１及び内部通信用コイル３１に
接続されたＩＣチップ３２を有する非接触ＩＣモジュー
ル３０を並べてカード基材８の外形内に配置している。Embodiments of the present invention will be described below in more detail with reference to the drawings. (First Embodiment) FIG. 1 is a view for explaining a first embodiment of a non-contact IC card 100 according to the present invention. Note that, for portions that perform the same functions as those of the above-described conventional example, overlapping description will be appropriately omitted. The non-contact IC card 1 includes a first resonance circuit 10 having a first external communication coil 11 and a first capacitor unit 13, and a second external communication coil 21 and a second external communication coil inside the first resonance circuit 10. Resonance circuit 2 having second capacitor portion 23 connected to coil 21 for use
The non-contact IC module 30 having the internal communication coil 31 and the IC chip 32 connected to the internal communication coil 31 is arranged side by side in the outer shape of the card base material 8.
【００１５】各回路の作製は、絶縁性を有するカード基
材８（ＰＶＣ、１５０μｍ厚）の表裏に導体箔（銅箔１
８μｍ厚）を貼り付けた上、エッチング処理により第１
及び第２の外部通信用コイル１１，２１、第１及び第２
のコンデンサ部１３，２３及び内部通信用コイル３１の
形成を行う。第１及び第２の共振回路１０，２０を作製
するには、巻数を少なくとも１巻以上の外部通信用コイ
ル１１，２１を形成し、その両端にコンデンサ形成用導
体プレート１３ａ，２３ａを設ける。このコンデンサ形
成用導体プレート１３ａ，２３ａの裏面に、絶縁性を有
するカード基材８を介してコンデンサ形成用導体プレー
ト１３ｂ，２３ｂを作製することにより、第１及び第２
の外部通信用コイル１１，２１及びコンデンサ部１３，
２３を作製することができる。The production of each circuit is performed by forming a conductive foil (copper foil 1) on the front and back of an insulating card base material 8 (PVC, 150 μm thick).
8 μm thick), and the first
And second external communication coils 11, 21; first and second
, And the internal communication coil 31 are formed. To manufacture the first and second resonance circuits 10 and 20, the external communication coils 11 and 21 having at least one or more turns are formed, and the capacitor forming conductor plates 13a and 23a are provided at both ends thereof. By forming the capacitor forming conductor plates 13b and 23b on the back surface of the capacitor forming conductor plates 13a and 23a via the insulating card base material 8, the first and second capacitor forming conductor plates 13b and 23b are formed.
Of the external communication coils 11, 21 and the capacitor unit 13,
23 can be produced.
【００１６】第１の共振回路１０は、カード１枚時にリ
ーダライタから送出される交流電磁波を最も効率良く受
信するために、リーダライタの周波数ｆr と同程度の周
波数ｆ1 にて共振することが望ましく、外部通信用コイ
ル１１の自己インダクタンスＬ及びコンデンサ部１３の
静電容量Ｃを、ｆr ≒ｆ1 ＝１／｛２π√（ＬＣ）｝と
なるように調整した。今回は、Ｌ＝３．２μＨ，Ｃ＝２
２．１ｐＦであり、共振回路の抵抗値Ｒ＝０．３７Ωと
した。The first resonant circuit 10 in order to most efficiently receive the alternating electromagnetic wave sent from the reader-writer when a card, it resonates at the frequency f 1 of the same level as the frequency f r interrogator is desirable, the electrostatic capacitance C of the self-inductance L and the capacitor unit 13 of the external communication coil 11, was adjusted to f r ≒ f 1 = 1 / {2π√ (LC)}. This time, L = 3.2 μH, C = 2
2.1 pF, and the resistance R of the resonance circuit was set to 0.37Ω.
【００１７】第２の共振回路２０は、カードが複数枚重
なった場合に最も効率良く通信が可能なようにリーダラ
イタから送信される電磁波の周波数ｆr よりも高周波数
の周波数ｆ2 にて共振するようにコイル及びコンデンサ
を調整する（ｆ2 ＞ｆr ）。これにより、非接触ＩＣカ
ード１は、カード１枚動作時においてもカード複数枚重
ね時においても効率良くリーダライタとの通信を行うこ
とが可能となる。The second resonant circuit 20, the card resonant most efficiently the frequency higher than the frequency f r of the electromagnetic waves transmitted to communication is possible from the reader-writer at the frequency f 2 when the overlapped plurality The coil and the capacitor are adjusted so that (f 2 > f r ). Thus, the non-contact IC card 1 can efficiently communicate with the reader / writer both when operating one card and when stacking a plurality of cards.
【００１８】非接触ＩＣモジュール３０は、効率良く通
信が可能となるために、その動作周波数ｆ3 がリーダラ
イタから送信される電磁波の周波数ｆr と同等であるこ
とが望ましい。The contactless IC module 30, in order to efficiently communication can be, its operating frequency f 3 is desirably equal to the frequency f r of the electromagnetic waves transmitted from the reader-writer.
【００１９】また、第２の共振回路２０は、複数枚の非
接触カードの重ね方によらず同等の共振を取ることが可
能なように、カード内において上下左右対称に配置する
ことが望ましい。さらに、第１及び第２の共振回路１
０，２０及び非接触ＩＣモジュール３０の相対位置は、
共振回路と非接触ＩＣモジュールとの結合度を高めるた
め、第１の共振回路１０及び第２の共振回路２０の内側
に非接触ＩＣモジュール３０を配置することが望まし
い。これらのことを考慮すると、各回路の配置は、図２
に示すような配置が通信上は理想的である。ただし、第
１及び第２の共振回路１０，２０及び非接触ＩＣモジュ
ール３０をカード内におけるエンボス・エリア、磁気ス
トライプエリア等の付加機能を備えるエリアに重ならな
いように配置し、付加機能の特性を損なうことなく付加
機能を備えることが必要となる場合には、これらの配置
は適宜変更される。It is desirable that the second resonance circuits 20 are arranged vertically and horizontally symmetrically in the card so that the same resonance can be obtained irrespective of how a plurality of non-contact cards are stacked. Further, the first and second resonance circuits 1
The relative positions of 0, 20 and the non-contact IC module 30 are
In order to increase the degree of coupling between the resonance circuit and the non-contact IC module, it is desirable to dispose the non-contact IC module 30 inside the first resonance circuit 10 and the second resonance circuit 20. Considering these, the arrangement of each circuit is as shown in FIG.
Is ideal for communication. However, the first and second resonance circuits 10, 20 and the non-contact IC module 30 are arranged so as not to overlap with an area having an additional function, such as an emboss area, a magnetic stripe area, or the like in the card, and the characteristics of the additional function are adjusted. If it is necessary to provide additional functions without loss, these arrangements are appropriately changed.
【００２０】このようにして得られた第１及び第２の共
振回路１０，２０及び非接触ＩＣモジュール３０形成済
みの絶縁性基材シートの上下に図示しない絶縁性基材を
重ね合わせることにより、非接触ＩＣカード１を作製し
た。By laminating an insulating substrate (not shown) on the upper and lower sides of the insulating substrate sheet on which the first and second resonance circuits 10 and 20 and the non-contact IC module 30 thus obtained are formed. A non-contact IC card 1 was manufactured.
【００２１】以上のようにして作製した各回路のパラメ
ータは、第１の共振回路１０に関しては、Ｌ＝３．２μ
Ｈ、Ｃ＝２２．１ｐＦ、Ｒ＝０．３７Ωであり、第２の
共振回路２０に関しては、Ｌ＝１．７μＨ、Ｃ＝６８．
０ｐＦ、Ｒ＝０．２５Ωとなっており、第１の共振回路
１０の共振周波数ｆ1 は、１８．８ＭＨｚ、第２の共振
回路２０の共振周波数ｆ2 は、１４．７ＭＨｚとなっ
た。また、非接触ＩＣモジュールの共振周波数ｆ3 は、
１４．２ＭＨｚとなった。The parameters of the respective circuits manufactured as described above, for the first resonance circuit 10, are L = 3.2 μm.
H, C = 22.1 pF, R = 0.37Ω, and for the second resonance circuit 20, L = 1.7 μH, C = 68.
0 pF, R = 0.25Ω, the resonance frequency f 1 of the first resonance circuit 10 was 18.8 MHz, and the resonance frequency f 2 of the second resonance circuit 20 was 14.7 MHz. Also, the resonance frequency f 3 of the non-contact IC module is
14.2 MHz.
【００２２】第１実施形態による共振回路を備えた非接
触ＩＣカード１の電圧利得の周波数依存性は、図３
（ａ）のようになり、１３．９ＭＨｚ及び２０．８ＭＨ
ｚにおいて受信効率が高くなった。非接触ＩＣカード１
を２枚重ねあわせたときの電圧利得の周波数依存性は、
図３（ｂ）に示すように、１２．６ＭＨｚ及び１８．２
ＭＨｚにおいて受信効率が高くなった。The frequency dependence of the voltage gain of the contactless IC card 1 having the resonance circuit according to the first embodiment is shown in FIG.
As shown in (a), 13.9 MHz and 20.8 MH
In z, the reception efficiency was increased. Non-contact IC card 1
The frequency dependence of the voltage gain when two
As shown in FIG. 3B, 12.6 MHz and 18.2 MHz
The reception efficiency was increased at MHz.
【００２３】通信が１３．５６ＭＨｚの交流電磁波を用
いられて行われるリーダライタ及び本発明における非接
触ＩＣカード１、ＩＣとコイルとを直接接続した従来の
非接触ＩＣカードＡ（共振周波数：１４．０ＭＨｚ）及
び従来の非接触ＩＣカードＢ（２０．６ＭＨｚ）を用い
て、通信可能距離の比較を行った結果を、表１に示す。A reader / writer in which communication is performed using 13.56 MHz alternating-current electromagnetic waves, the non-contact IC card 1 of the present invention, and a conventional non-contact IC card A in which an IC and a coil are directly connected (resonant frequency: 14.3 MHz). Table 1 shows the results of comparison of the communicable distances using the non-contact IC card B (0 MHz) and the conventional non-contact IC card B (20.6 MHz).
【００２４】[0024]
【表１】 [Table 1]
【００２５】本実施形態による非接触ＩＣカード１は、
カード１枚動作時においては、従来の非接触ＩＣカード
Ａ（共振周波数：１４ＭＨｚ）と同等の通信特性を持っ
ている。また、カード２枚重ね合わせ時においても、従
来の非接触ＩＣカードＢ（共振周波数：２０．６ＭＨ
ｚ）と同等の通信特性を持つ非接触ＩＣカード１が得ら
れた。The contactless IC card 1 according to the present embodiment
When one card is operated, it has the same communication characteristics as the conventional non-contact IC card A (resonance frequency: 14 MHz). Also, when two cards are superposed, the conventional non-contact IC card B (resonance frequency: 20.6 MH)
A non-contact IC card 1 having the same communication characteristics as in z) was obtained.
【００２６】このように、第１実施形態によれば、従来
の非接触ＩＣカードＡ，Ｂと比較し、カード１枚動作、
２枚動作ともに通信特性が良好な非接触ＩＣカードを提
供することができる。As described above, according to the first embodiment, compared to the conventional non-contact IC cards A and B, one card operation and
It is possible to provide a non-contact IC card having good communication characteristics in both operations.
【００２７】（第２実施形態）図４は、本発明の第２実
施形態における接触／非接触ＩＣカード２の概略を説明
する図である。非接触ＩＣカード２は、第１の外部通信
用コイル５１及び第１のコンデンサ部５３を有する第１
の共振回路５０を備え、この内側に第２の外部通信用コ
イル６１及び第２の外部通信用コイル６１に接続された
第２のコンデンサ部６３を有する第２の共振回路６０と
内部通信用コイル７１及び内部通信用コイル７１に接続
されたＩＣチップ７２を有する接触／非接触ＩＣモジュ
ール７０を並べてカード基材５８の外形内に配置してい
る。(Second Embodiment) FIG. 4 is a diagram schematically illustrating a contact / non-contact IC card 2 according to a second embodiment of the present invention. The non-contact IC card 2 includes a first external communication coil 51 and a first capacitor unit 53.
A second resonance circuit 60 having a second external communication coil 61 and a second capacitor section 63 connected to the second external communication coil 61, and an internal communication coil The contact / non-contact IC module 70 having the IC chip 72 connected to the internal communication coil 71 and the internal communication coil 71 is arranged side by side within the outer shape of the card base material 58.
【００２８】図５は、接触／非接触ＩＣモジュール７０
の構成を説明するための透視図である。接触／非接触Ｉ
Ｃモジュール７０は、表面に接触端子７０ｃ、裏面にコ
イル７１を形成したＩＣ実装基板７０ｄに接触機能、非
接触機能をともに備えたＩＣチップ７２を実装し、ＩＣ
チップ７２とＩＣ実装基板７０ｄ上に設けられた接触端
子７０ｃ及びコイル端子７１ａとの接続を金線７０ａを
用いて行い、第２のＩＣチップ７２、金線７０ａ等をエ
ポキシ樹脂にて樹脂封止してモジュール外装７０ｂを形
成し、接触／非接触ＩＣモジュール７０の作製を行う。FIG. 5 shows a contact / non-contact IC module 70.
FIG. 3 is a perspective view for explaining the configuration of FIG. Contact / non-contact I
The C module 70 has an IC chip 72 having both a contact function and a non-contact function mounted on an IC mounting board 70d having a contact terminal 70c formed on the front surface and a coil 71 formed on the back surface.
The connection between the chip 72 and the contact terminals 70c and the coil terminals 71a provided on the IC mounting board 70d is performed using the gold wire 70a, and the second IC chip 72, the gold wire 70a, and the like are resin-sealed with epoxy resin. Then, the module exterior 70b is formed, and the contact / non-contact IC module 70 is manufactured.
【００２９】図６及び図７は、接触／非接触ＩＣカード
２の構成及び作製過程を説明するための一部断面透視図
である。接触／非接触ＩＣカード２０の作製は、第１実
施形態と同様にして、第１の外部通信用コイル５１及び
第１のコンデンサ部５３を有する第１の共振回路５０
と、第２の外部通信用コイル６１及び第２のコンデンサ
部６３を有する第２の共振回路６０とをＰＶＣ等の絶縁
性を有するカード基材７０−１上に設けた上、回路パタ
ーン形成済みのカード基材７０−１と少なくとも１枚の
ＰＶＣ等の絶縁性を有するカード基材（７０−２〜６）
とを熱融着又は接着剤を介して接着を行い、カード化を
行う。FIGS. 6 and 7 are partial cross-sectional perspective views for explaining the structure and manufacturing process of the contact / non-contact IC card 2. FIG. The production of the contact / contactless IC card 20 is similar to that of the first embodiment, and the first resonance circuit 50 having the first external communication coil 51 and the first capacitor unit 53 is provided.
And a second resonance circuit 60 having a second external communication coil 61 and a second capacitor portion 63 are provided on an insulating card base material 70-1 such as PVC, and a circuit pattern has been formed. Card base 70-1 and at least one insulating card base such as PVC (70-2 to 6)
Are bonded by heat fusion or an adhesive to form a card.
【００３０】第１の共振回路５０及び第２の共振回路６
０を埋設したカードに、切削加工により接触／非接触Ｉ
Ｃモジュール７０埋設用凹部５８ｂを設け、ここに接触
／非接触ＩＣモジュール７０を液状又はシート状の絶縁
性接着剤を用いて接着を行う。First resonance circuit 50 and second resonance circuit 6
Contact / non-contact I by cutting the card with embedded 0
A recess 58b for embedding the C module 70 is provided, and the contact / non-contact IC module 70 is bonded thereto using a liquid or sheet-like insulating adhesive.
【００３１】このように、第２実施形態によれば、第１
実施形態と同様に、カード１枚動作、２枚動作ともに通
信特性が良好である上に、接触通信も可能な非接触ＩＣ
カードを提供することができる。As described above, according to the second embodiment, the first
As in the embodiment, a non-contact IC that has good communication characteristics for both one-card operation and two-card operation and can also perform contact communication
Cards can be provided.
【００３２】（変形形態）以上説明した実施形態に限定
されることなく、種々の変形や変更が可能であって、そ
れらも本発明の均等の範囲内である。(Modifications) Various modifications and changes are possible without being limited to the above-described embodiments, and they are also within the equivalent scope of the present invention.
【００３３】（１）各実施形態において、第１の共振回
路、第２の共振回路及びＩＣモジュールは、図８（ｂ）
の様に配置した例を示したが、これに限らず、図８
（ａ）〜（ｃ）のいずれの配置でもよいし、その他の配
置であってもよい。(1) In each embodiment, the first resonance circuit, the second resonance circuit, and the IC module correspond to those shown in FIG.
8 is shown, but the present invention is not limited to this.
Any of the arrangements (a) to (c) may be used, and other arrangements may be used.
【００３４】（２）各実施形態において、絶縁性を有す
るカード基材としてＰＶＣシートを用いた例を示した
が、これに限らず、例えば、ＰＥＴ、ＰＥＴ−Ｇ、ＡＢ
Ｓ等、絶縁性を持つ他の基材でもよい。(2) In each embodiment, an example is shown in which a PVC sheet is used as an insulating card base material. However, the present invention is not limited to this. For example, PET, PET-G, AB
Other insulating base materials such as S may be used.
【００３５】（３）各実施形態において、電荷蓄積手段
であるコンデンサ部として、絶縁性を有するカード基材
を介した導体プレートにより作製を行う例を示したが、
これに限らず、例えば、静電容量素子（セラミック・コ
ンデンサ等）をコイル両端に接続してもよい。また、電
荷蓄積手段は、コイルを複数回巻くことにより生じる静
電容量成分で十分である場合には、コンデンサを形成し
なくてもよい。(3) In each of the embodiments, an example has been described in which the capacitor portion serving as the charge storage means is manufactured using a conductor plate via an insulating card base material.
However, the present invention is not limited to this. For example, a capacitance element (such as a ceramic capacitor) may be connected to both ends of the coil. In the case where the capacitance component generated by winding the coil a plurality of times is sufficient, the charge accumulating means does not need to form a capacitor.
【００３６】（４）各実施形態において、導体箔のエッ
チングにより導体パターン形成を行う例を示したが、こ
れに限らず、例えば、導線を複数回巻くことにより作製
してもよい。また、導電性ペーストを印刷することによ
り導体パターンを作製してもよい。(4) In each of the embodiments, the example in which the conductor pattern is formed by etching the conductor foil has been described. However, the present invention is not limited to this. For example, the conductor may be formed by winding a conductor wire a plurality of times. Alternatively, a conductive pattern may be produced by printing a conductive paste.
【００３７】（５）第１実施形態において、回路形成済
みカード基材の上下に各々１枚の絶縁性を有するカード
基材を重ね合わせた例を示したが、これに限らず、層構
成は、何枚であってもよい。また、各々の基材の貼り合
わせは、熱融着、接着剤塗布、接着シート等いかなる手
段であってもよい。(5) In the first embodiment, an example is shown in which one insulating card base material is superposed on the upper and lower sides of the circuit-formed card base material, but the present invention is not limited to this. Any number may be used. Further, the bonding of the respective substrates may be performed by any means such as heat fusion, application of an adhesive, and an adhesive sheet.
【００３８】（６）各実施形態において、ＩＣモジュー
ルは、コイル及びＩＣチップを備えた例を示したが、こ
れに限らず、例えば、コンデンサも備えてもよい。(6) In each embodiment, the example in which the IC module is provided with the coil and the IC chip has been described. However, the present invention is not limited to this. For example, the IC module may be provided with a capacitor.
【００３９】（７）第２実施形態において、共振回路を
埋設済みのカードに切削加工を施し、接触／非接触ＩＣ
モジュール埋設用凹部を設けた例を示したが、これに限
らず、例えば、射出成形等の手法を用いてカード加工段
階において接触／非接触ＩＣモジュール埋設用凹部を設
けてもよい。(7) In the second embodiment, a cutting process is performed on a card in which a resonance circuit is embedded, and a contact / non-contact IC
Although the example in which the module embedding recess is provided is shown, the invention is not limited thereto. For example, the contact / non-contact IC module embedding recess may be provided in a card processing stage using a technique such as injection molding.
【００４０】（８）各実施形態において、コイルの一端
は、コンデンサ接続をする例を示したが、これに限ら
ず、例えば、図９に示すように、スルーホール２０１等
により直接接続してもよい。この手法を用いた場合、コ
ンデンサ形成用導体プレート２０３の面積を小さくする
ことが可能となる。(8) In each embodiment, an example in which one end of the coil is connected to a capacitor is shown. However, the present invention is not limited to this. For example, as shown in FIG. Good. When this method is used, the area of the capacitor forming conductor plate 203 can be reduced.
【００４１】（９）第１実施形態において、１枚のカー
ド基材の表裏に導体パターンを設けることによりコイ
ル、コンデンサの形成を行う例を示したが、これに限ら
ず、例えば、図１０に示すように、複数枚の絶縁性を有
するカード基材２１４の片面のみに導体パターン（２１
２，２１３等）を設けた後、各々の導体パターン形成済
みのカード基材２１４を重ね合わせることにより形成し
ても構わない。(9) In the first embodiment, an example is shown in which a coil and a capacitor are formed by providing conductor patterns on the front and back of one card base material. However, the present invention is not limited to this. For example, FIG. As shown, the conductor pattern (21) is formed on only one side of a plurality of insulating card bases 214.
2, 213) may be formed by superposing the card bases 214 on which the respective conductor patterns have been formed.
【００４２】[0042]
【発明の効果】以上詳しく説明したように、請求項１の
発明によれば、複数の共振回路と、ＩＣモジュールとを
備えたので、カードを複数枚重ねた状態でも、通信品質
がよく、通信可能範囲が広いＩＣカードを提供すること
ができる。As described above in detail, according to the first aspect of the present invention, since a plurality of resonance circuits and an IC module are provided, even if a plurality of cards are stacked, the communication quality is good and the communication is improved. An IC card with a wide range can be provided.
【００４３】請求項２の発明によれば、複数の共振回路
のうち少なくとも１つは、その共振周波数が外部装置と
の通信周波数とほぼ等しいので、カード１枚時における
通信品質及び通信可能距離が通常のカードと同等で、カ
ードを複数枚重ねた状態でも、通信品質がよく、通信可
能範囲が広いＩＣカードを提供することができる。According to the second aspect of the present invention, at least one of the plurality of resonance circuits has a resonance frequency substantially equal to a communication frequency with an external device. It is possible to provide an IC card having a good communication quality and a wide communicable range even when a plurality of cards are stacked, which is equivalent to a normal card.
【００４４】請求項３の発明によれば、複数の共振回路
のうち少なくとも１つは、その共振周波数が前記通信周
波数よりも高いので、カードを複数枚重ねた状態でも、
通信品質がよく、通信可能範囲が広いＩＣカードを提供
できる。According to the third aspect of the present invention, at least one of the plurality of resonance circuits has a resonance frequency higher than the communication frequency.
An IC card with good communication quality and a wide communicable range can be provided.
【００４５】請求項４の発明によれば、複数の共振回路
のうち少なくとも１つは、同じＩＣカードが複数枚重な
った状態において、その共振周波数が通信周波数とほぼ
等しいので、カードを複数枚重ねた状態の通信効率が最
もよくなり、通信品質がよく、通信可能範囲が広いＩＣ
カードを提供できる。According to the fourth aspect of the present invention, at least one of the plurality of resonance circuits has a resonance frequency substantially equal to the communication frequency when a plurality of the same IC cards are overlapped. IC with the best communication efficiency, good communication quality and wide communicable range
We can provide the card.
【００４６】請求項５の発明によれば、複数の共振回路
は、カード面において上下左右対称であるので、カード
の重ね方によらず通信特性が安定したＩＣカードを提供
できる。According to the fifth aspect of the present invention, since the plurality of resonance circuits are vertically and horizontally symmetrical on the card surface, it is possible to provide an IC card having stable communication characteristics regardless of how the cards are stacked.
【００４７】請求項６の発明によれば、ＩＣモジュール
は、複数の共振回路の内側にあるので、通信効率がよく
なり、通信品質がよく、通信可能範囲が広いＩＣカード
を提供できる。According to the sixth aspect of the present invention, since the IC module is located inside the plurality of resonance circuits, it is possible to provide an IC card having high communication efficiency, high communication quality, and a wide communicable range.
【図１】本発明の第１実施形態における非接触ＩＣカー
ド１を説明する図である。FIG. 1 is a diagram illustrating a non-contact IC card 1 according to a first embodiment of the present invention.
【図２】本発明の第１実施形態における非接触ＩＣカー
ド１の、他の配置例を説明する図である。FIG. 2 is a diagram illustrating another example of the arrangement of the non-contact IC card 1 according to the first embodiment of the present invention.
【図３】第１実施形態によるＩＣカード１の電圧利得の
周波数依存性をカード１枚時（ａ）及びカード２枚時
（ｂ）において示した図である。FIG. 3 is a diagram showing the frequency dependence of the voltage gain of the IC card 1 according to the first embodiment when one card is used (a) and when two cards are used (b).
【図４】本発明の第２実施形態における接触／非接触Ｉ
Ｃカード２を説明する図である。FIG. 4 shows contact / non-contact I according to the second embodiment of the present invention.
FIG. 3 is a diagram illustrating a C card 2.
【図５】本発明の第２実施形態における接触／非接触Ｉ
Ｃモジュール７０の構成を説明するための透視図であ
る。FIG. 5 shows contact / non-contact I according to the second embodiment of the present invention.
FIG. 3 is a perspective view for explaining a configuration of a C module 70.
【図６】接触／非接触ＩＣカード２の構成及び作製過程
を説明するための一部断面透視図である。FIG. 6 is a partial cross-sectional perspective view for describing a configuration and a manufacturing process of the contact / non-contact IC card 2.
【図７】接触／非接触ＩＣカード２の構成及び作製過程
を説明するための一部断面透視図である。FIG. 7 is a partial cross-sectional perspective view for explaining a configuration and a manufacturing process of the contact / non-contact IC card 2.
【図８】各回路の配置の変形形態を説明する図である。FIG. 8 is a diagram illustrating a modification of the arrangement of each circuit.
【図９】コンデンサ部の変形形態を説明する図である。FIG. 9 is a diagram illustrating a modification of the capacitor unit.
【図１０】コイル、コンデンサの形成方法の変形形態を
説明する図である。FIG. 10 is a diagram illustrating a modification of the method of forming a coil and a capacitor.
【図１１】従来の非接触ＩＣカード１００の内部構成を
示す図である。FIG. 11 is a diagram showing an internal configuration of a conventional non-contact IC card 100.
【図１２】共振回路を利用した従来の非接触ＩＣカード
１１０を説明する図である。FIG. 12 is a diagram illustrating a conventional non-contact IC card 110 using a resonance circuit.
１，２ ＩＣカード １０，５０ 第１の共振回路 ２０，６０ 第２の共振回路 １１，５１ 第１の外部通信用コイル ２１，６１ 第２の外部通信用コイル １３，５３ 第１のコンデンサ部 ２３，６３ 第２のコンデンサ部 ３０ 非接触ＩＣモジュール ３１，７１ 内部通信用コイル ３２，７２ ＩＣチップ ７０ 接触／非接触ＩＣモジュール 1, 2 IC card 10, 50 First resonance circuit 20, 60 Second resonance circuit 11, 51 First external communication coil 21, 61 Second external communication coil 13, 53 First capacitor unit 23 , 63 Second capacitor unit 30 Non-contact IC module 31, 71 Internal communication coil 32, 72 IC chip 70 Contact / non-contact IC module
Claims (6)
共振回路と、 ＩＣチップ及び前記コイルとは別であって前記ＩＣチッ
プに電気的に接続されたＩＣチップ接続コイルを有する
ＩＣモジュールと、 を備えるＩＣカード。1. A plurality of resonance circuits having a coil and a charge storage means, and an IC module having an IC chip and an IC chip connection coil separate from the coil and electrically connected to the IC chip. IC card provided.
周波数が外部装置との通信周波数とほぼ等しいこと、 を特徴とするＩＣカード。2. The IC card according to claim 1, wherein at least one of the plurality of resonance circuits has a resonance frequency substantially equal to a communication frequency with an external device.
ドにおいて、 前記複数の共振回路のうち少なくとも１つは、その共振
周波数が前記通信周波数よりも高いこと、 を特徴とするＩＣカード。3. The IC card according to claim 1, wherein at least one of the plurality of resonance circuits has a resonance frequency higher than the communication frequency.
項に記載のＩＣカードにおいて、 前記複数の共振回路のうち少なくとも１つは、同じＩＣ
カードが複数枚重なった状態において、その共振周波数
が前記通信周波数とほぼ等しいこと、 を特徴とするＩＣカード。4. One of claims 1 to 3
The at least one of the plurality of resonance circuits is the same IC card.
An IC card, wherein a resonance frequency is substantially equal to the communication frequency when a plurality of cards are stacked.
項に記載のＩＣカードにおいて、 前記複数の共振回路は、カード面において上下左右対称
であること、 を特徴とするＩＣカード。5. The method according to claim 1, wherein:
3. The IC card according to claim 1, wherein the plurality of resonance circuits are vertically and horizontally symmetrical on a card surface.
項に記載のＩＣカードにおいて、 前記ＩＣモジュールは、前記複数の共振回路の内側にあ
ること、 を特徴とするＩＣカード。6. Any one of claims 1 to 5
The IC card according to claim 1, wherein the IC module is inside the plurality of resonance circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28253399A JP4205823B2 (en) | 1999-10-04 | 1999-10-04 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28253399A JP4205823B2 (en) | 1999-10-04 | 1999-10-04 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001101371A true JP2001101371A (en) | 2001-04-13 |
| JP4205823B2 JP4205823B2 (en) | 2009-01-07 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| JP28253399A Expired - Fee Related JP4205823B2 (en) | 1999-10-04 | 1999-10-04 | IC card |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2004055721A1 (en) | 2002-12-13 | 2004-07-01 | Giesecke & Devrient Gmbh | Transponder for contactlessly transmitting data |
| JP2006157603A (en) * | 2004-11-30 | 2006-06-15 | Toshiba Corp | Wireless communication terminal, containing case thereof adaptive sheet thereof, and adaptive display apparatus thereof |
| JP2007193598A (en) * | 2006-01-19 | 2007-08-02 | Sharp Corp | Ic card |
| WO2007135658A1 (en) * | 2006-05-22 | 2007-11-29 | On Track Innovations Ltd. | Chip card having a coil antenna with reduced footprint |
| JP2008182528A (en) * | 2007-01-25 | 2008-08-07 | Toshiba Corp | Loop antenna and radio transmitter-receiver provided with same |
| JP2008197714A (en) * | 2007-02-08 | 2008-08-28 | Dainippon Printing Co Ltd | Non-contact data carrier device, and auxiliary antenna for non-contact data carrier |
| JP2008301241A (en) * | 2007-05-31 | 2008-12-11 | Toshiba Corp | Loop antenna and radio transmitter/receiver with loop antenna |
| EP2207240A1 (en) * | 2007-12-26 | 2010-07-14 | Murata Manufacturing Co., Ltd. | Antenna apparatus and wireless ic device |
| US7773047B2 (en) | 2005-09-21 | 2010-08-10 | Hitachi Cable, Ltd. | Antenna and method of making the same |
| JP4775440B2 (en) * | 2006-06-01 | 2011-09-21 | 株式会社村田製作所 | Wireless IC device and composite component for wireless IC device |
| EP2385580A1 (en) * | 2009-01-30 | 2011-11-09 | Murata Manufacturing Co., Ltd. | Antenna and wireless ic device |
| JP2015170268A (en) * | 2014-03-10 | 2015-09-28 | 共同印刷株式会社 | Ic card and inlet |
| CN105447553A (en) * | 2014-09-26 | 2016-03-30 | 北京同方微电子有限公司 | Bracelet-shaped contactless smart card |
| JP2017051096A (en) * | 2011-03-29 | 2017-03-09 | ソニー株式会社 | Power supply device, power supply system, and electronic device |
| EP3168932A1 (en) * | 2006-04-14 | 2017-05-17 | Murata Manufacturing Co., Ltd. | Antenna |
| WO2020016615A1 (en) * | 2018-07-20 | 2020-01-23 | Drayson Technologies (Europe) Limited | Circuitry for use in smart cards and other applications |
| EP3599574A1 (en) * | 2018-07-27 | 2020-01-29 | STMicroelectronics Design and Application s.r.o. | Antenna and system for rf communications |
| WO2021166458A1 (en) * | 2020-02-19 | 2021-08-26 | ソニーグループ株式会社 | Communication device and antenna device |
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1999
- 1999-10-04 JP JP28253399A patent/JP4205823B2/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004055721A1 (en) | 2002-12-13 | 2004-07-01 | Giesecke & Devrient Gmbh | Transponder for contactlessly transmitting data |
| JP2006157603A (en) * | 2004-11-30 | 2006-06-15 | Toshiba Corp | Wireless communication terminal, containing case thereof adaptive sheet thereof, and adaptive display apparatus thereof |
| JP4649183B2 (en) * | 2004-11-30 | 2011-03-09 | 株式会社東芝 | Wireless communication terminal |
| US7865214B2 (en) | 2004-11-30 | 2011-01-04 | Kabushiki Kaisha Toshiba | Radio communication terminal, radio communication terminal housing case, radio communication terminal sheet and radio communication terminal display device |
| US7773047B2 (en) | 2005-09-21 | 2010-08-10 | Hitachi Cable, Ltd. | Antenna and method of making the same |
| JP2007193598A (en) * | 2006-01-19 | 2007-08-02 | Sharp Corp | Ic card |
| EP3168932A1 (en) * | 2006-04-14 | 2017-05-17 | Murata Manufacturing Co., Ltd. | Antenna |
| WO2007135658A1 (en) * | 2006-05-22 | 2007-11-29 | On Track Innovations Ltd. | Chip card having a coil antenna with reduced footprint |
| US8544754B2 (en) | 2006-06-01 | 2013-10-01 | Murata Manufacturing Co., Ltd. | Wireless IC device and wireless IC device composite component |
| JP4775440B2 (en) * | 2006-06-01 | 2011-09-21 | 株式会社村田製作所 | Wireless IC device and composite component for wireless IC device |
| JP2008182528A (en) * | 2007-01-25 | 2008-08-07 | Toshiba Corp | Loop antenna and radio transmitter-receiver provided with same |
| JP2008197714A (en) * | 2007-02-08 | 2008-08-28 | Dainippon Printing Co Ltd | Non-contact data carrier device, and auxiliary antenna for non-contact data carrier |
| JP2008301241A (en) * | 2007-05-31 | 2008-12-11 | Toshiba Corp | Loop antenna and radio transmitter/receiver with loop antenna |
| US8070070B2 (en) | 2007-12-26 | 2011-12-06 | Murata Manufacturing Co., Ltd. | Antenna device and radio frequency IC device |
| EP2207240A1 (en) * | 2007-12-26 | 2010-07-14 | Murata Manufacturing Co., Ltd. | Antenna apparatus and wireless ic device |
| EP2207240A4 (en) * | 2007-12-26 | 2011-05-25 | Murata Manufacturing Co | Antenna apparatus and wireless ic device |
| CN103500875B (en) * | 2007-12-26 | 2015-12-02 | 株式会社村田制作所 | Antenna assembly and Wireless IC device |
| EP2717196A3 (en) * | 2007-12-26 | 2017-06-28 | Murata Manufacturing Co., Ltd. | Antenna device and wireless IC device |
| EP2557528A3 (en) * | 2007-12-26 | 2017-01-18 | Murata Manufacturing Co., Ltd. | Antenna device and wireless IC device |
| EP2385580A4 (en) * | 2009-01-30 | 2012-08-08 | Murata Manufacturing Co | Antenna and wireless ic device |
| US9104950B2 (en) | 2009-01-30 | 2015-08-11 | Murata Manufacturing Co., Ltd. | Antenna and wireless IC device |
| EP2385580A1 (en) * | 2009-01-30 | 2011-11-09 | Murata Manufacturing Co., Ltd. | Antenna and wireless ic device |
| JP2017051096A (en) * | 2011-03-29 | 2017-03-09 | ソニー株式会社 | Power supply device, power supply system, and electronic device |
| JP2015170268A (en) * | 2014-03-10 | 2015-09-28 | 共同印刷株式会社 | Ic card and inlet |
| CN105447553A (en) * | 2014-09-26 | 2016-03-30 | 北京同方微电子有限公司 | Bracelet-shaped contactless smart card |
| WO2020016615A1 (en) * | 2018-07-20 | 2020-01-23 | Drayson Technologies (Europe) Limited | Circuitry for use in smart cards and other applications |
| US11995490B2 (en) | 2018-07-20 | 2024-05-28 | Freevolt Technologies Limited | Circuitry for use in smart cards and other applications |
| EP3599574A1 (en) * | 2018-07-27 | 2020-01-29 | STMicroelectronics Design and Application s.r.o. | Antenna and system for rf communications |
| US11031672B2 (en) | 2018-07-27 | 2021-06-08 | Stmicroelectronics Design And Application S.R.O. | Antenna and system for RF communications |
| WO2021166458A1 (en) * | 2020-02-19 | 2021-08-26 | ソニーグループ株式会社 | Communication device and antenna device |
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