JP2003203944A - Module for non-contact communication apparatus and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a module for non-contact communication and the manufacturing method of the same, which is increased in connection strength between an antenna pad and a bump, by providing a connecting part with a recessed and projected configuration. <P>SOLUTION: When the antenna pad 6, formed on an antenna base board 4, is connected to the pad 2 of a chip 1 by a bump 3 through flip-chip method, the bump is provided with the recessed and projected configuration, whereby the bump and the antenna pad are engaged mutually through the recessed and projected connection part. According to the connection of recessed and projected configuration, the connection strength of the part is increased. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact communication device module used for non-contact communication devices such as non-contact type IC cards, mobile phones, and mobile terminals.
In particular, the present invention relates to improvement of a connecting portion for connecting an antenna pad of a transmitting / receiving antenna and an IC chip or the like with a bump.

[0002]

2. Description of the Related Art In recent years, due to advances in semiconductor technology, downsizing of mobile phones, personal digital assistants, and portable data processing devices,
Significant reduction in power consumption. On the other hand, network technology represented by the Internet and its environment have been rapidly developed. Furthermore, in order to improve the convenience of these portable devices as a mobile information terminal, applications for wireless communication between these devices and a physical network, that is, contactless communication are expanding.

The convenience of the information terminal having the contactless communication function is not only in a communication system having a base station covering a large area over a wide area, but also in a short-distance communication represented by a contactless IC card. Also applies.

The IC card has a contact type having a mechanical connection terminal, a non-contact type having no connection terminal, or both a contact type and a non-contact type interface depending on the form of the information interface with the reader / writer device. It is classified as a combination type. Among them, the non-contact type and combination type IC cards perform data processing (overpass processing) by holding them over the reader / writer device. Alternatively, data processing (touch & go processing) is performed by bringing the reader / writer device into instantaneous contact.

The contactless communication device module used in the IC card as described above is provided with an antenna for contactless communication by electromagnetic waves. However, since IC cards, especially non-contact type IC cards and combination type IC cards, are very thin and have low mechanical strength, there is a possibility that connection failure may occur at the connection portion against external force.

Therefore, a structure for improving the reliability of the connecting portion between the IC chip and the antenna is disclosed in Japanese Patent Application Laid-Open No. 11-345302.

FIG. 12 shows a connecting portion between an IC chip and an antenna in the non-contact communication device module shown in the publication. In this module, the antenna board 4
The antenna 5 is formed on the top of which the IC chip 1 is mounted by the flip chip method. The electrical and mechanical connection between the IC chip 1 and the antenna 5 is performed by connecting the pad 2 of the IC chip 1 to the antenna pad 6 via the bump 3. The periphery of the bump 3 is hardened with resin 7. In order to improve the reliability of the connection with the substrate by the flip chip method, it is necessary to perform high cost processes such as accurately aligning the bumps 3 formed on the IC chip 1 and smoothing the mounting surface of the substrate. In this technique, the bump 3 is inserted into the antenna pad 6 to be connected to the antenna pad 6 for the necessity. That is, the antenna pad 6 and the pad 2 are connected to the bump 3
When the connection is made by the flip chip method via the IC chip 1, the back surface of the IC chip 1 is pressed and heated so that the bumps 3 are inserted into the antenna pad 6 at the connection portion. Figure 13
It shows a state in which the bump 3 is embedded in and connected to the antenna pad 6 having an area larger than the connection surface.

[0008]

In the conventional structure shown in FIG. 12 for improving the reliability of the connecting portion for connecting the antenna and the IC chip, the antenna pad 6 is crushed by the bumps 3 and has a concave shape. It is connected. In this concave connection state, the bump 3 having a smaller area is placed on the antenna pad 6, and if the material of the antenna substrate is softer than the bump 3, the antenna pad 6 is formed by the flip chip method. It is pushed by the bump 3 and easily sinks into a dish. That is, in the connection state of the concave shape in which the bump 3 is sunk in the antenna pad 6, the reliability of the connection state is improved as the contact area is increased.

However, the resin 7 for fixing the bumps and the adhesive (not shown) for fixing the bumps around the bumps 3 have a temperature dependency of expansion due to a temperature rise, and therefore the antenna pad 6 is affected by the ambient temperature. There is a problem that mechanical stress is applied to the connection portion of the bump 3 and the connection strength is reduced.

It is an object of the present invention to provide a module for a non-contact communication device and a method for manufacturing the same, in which the connection strength between the antenna pad and the bump is increased by making the shape of the connection portion uneven.

[0011]

In order to solve the above problems, the present invention mounts an antenna, an IC chip for processing a signal transmitted and received through the antenna, and the IC chip on which the antenna is formed. In the module for a non-contact communication device, comprising: an antenna substrate for connecting the antenna pad, and a connecting portion where the antenna pad of the antenna and the IC chip are connected to each other via bumps, the connecting portion has bumps with uneven shapes. The bump and the antenna are fitted to each other at the concavo-convex connection portion.

In the present invention, since the bump and the antenna are connected in a concavo-convex shape, not only the shearing force in the vertical and horizontal directions with respect to the connecting portion but also the bending moment force becomes strong. That is, even if the adhesive or fixing resin for fixing the connection portion expands due to a temperature rise, or if the connection portion is subjected to a physical peeling force due to bending or twisting, the connection state is kept. It can prevent the deterioration. The reason for this is that the bumps or antenna pads are connected so that they are uneven and fit together, so that even if shearing force or bending moment force in the horizontal or vertical direction is generated, the concave structure or convex This is because it is possible to overcome those external forces as compared with a structure in which only partial structures are connected.

Further, since the contact area is increased as compared with the conventional case where the connection is made only by the concave portion, the mechanical connection strength is increased by the increased amount.

There are various conceivable structures for forming the bumps in an uneven shape.

For example, by folding back the wiring pattern of the antenna, bumps can be arranged in the gap between the two folded antenna pads, and the bumps can be fitted in a concavo-convex shape. Also, bumps may be fitted into the gaps and the ends of the two antenna pads in a concave-convex shape, or the antenna pad may be ring-shaped and the bumps may be fitted in a peripheral portion of the annular antenna pad. A bump having a diameter larger than the width of one linear antenna pad is fitted in an uneven shape so as to wrap the antenna pad, or two ends of the two bumps are provided at both ends of the linear antenna pad. It is possible to fit them so as to wrap them in an uneven shape.

By folding back the antenna wiring pattern so that two antenna wiring patterns run in parallel, the connection range as an antenna pad is expanded, and when the bumps are connected by the flip chip method, the connection failure due to the positional deviation can be reduced. There are advantages.

As an antenna substrate, PETG (amorphous copolyethylene terephthalate), PVC (Polyvinyl Chlo
By using a resin material such as ride regin) or PLA (biodegradable resin), a distortion of a concave state occurs around the antenna pad of the antenna substrate, but it becomes a concave state because of the large elastic modulus of the antenna substrate. The force to return to the previous state acts. By this action, the antenna pad is pushed up and the connection stability in the uneven state is further improved.

[0018]

1 is a sectional view of a non-contact type IC card according to an embodiment of the present invention. FIG. 2 shows a plan view of the IC card. The chip 1 is an IC chip for performing arithmetic processing, the pad 2 is an electrode for electrically connecting the chip 1, the bump 3 is a connecting member formed on the pad 2, and the antenna substrate 4 is a substrate on which the antenna 5 is formed. , The antenna pad 6 is an electrode for electrically connecting the antenna 5,
The resin 7 includes the chip 1, the pad 2, and the antenna pad 6.
The resin for fixing the connection portion with and the card printing base material 8 are the base materials of the main body of the IC card.

The contactless communication device module of the present embodiment is configured by a portion excluding the card printing substrate 8 in the above configuration.

The contactless communication device module is shown in FIG.
Compared with the conventional module shown in FIG. 2, the shape of the connecting portion between the bump 3 and the antenna pad 6 formed on the pad 2, specifically, the shape of the bump 3 is different. That is, in the conventional module shown in FIG. 12, the antenna pad 6 sinks like a dish and the bumps 3 are connected in a convex shape, whereas in the module shown in FIG. It is connected to the antenna pad 6. In this embodiment, the two antenna pads 6 run in parallel, and the bumps 3 are located in this gap.
Both end portions are concave and are connected to a particularly upper region of the antenna pad 6, and the central portion of the bump 3 is convex and are connected to a particularly lateral region of the antenna pad 6.

In FIG. 1, two antenna pads 6 run in parallel, but an example of a shape in which two antenna pads run in parallel is shown in FIGS. 3 (A) and 3 (B). Figure 3
(A) is a shape in which two antenna wiring patterns (antenna patterns) are folded back so as to run in parallel as shown in the figure. The antenna pad 6 is formed at the position A where the two wires run side by side, and the bump 3 is located in the gap between the antenna pads 6. In FIG. 3B, two bumps 3 are located in the gap and the end of the antenna pad 6. 3 (A) and 3 (B), the bumps 3 are fitted into the gaps between the two antenna pads in an uneven shape, and in FIG.
The bumps 3 are fitted in a concavo-convex shape at the upper end of the.

FIGS. 3C and 3D show still another embodiment.

In FIG. 3C, the antenna pad 6 has an annular shape, and the bumps 3 are located around the annular antenna pad and are fitted in an uneven shape. In addition, FIG.
The bumps 3 having a diameter larger than the width of the antenna pad 6 on the straight line are fitted in a concavo-convex shape with the antenna pad 6 wrapped around. In any of the embodiments, the bumps are uneven and fit into the antenna pad 6. Further, since the connection portion is uneven, the contact area between the bump 3 and the antenna pad 6 becomes larger, so that the mechanical strength becomes stronger accordingly.

In any of the above embodiments, the bump 3
Since it is embedded in the antenna pad 6 to form a concavo-convex shape, the thickness of the antenna pad 6 is set to be considerably thicker than that of the antenna used in the conventional module shown in FIG. As an example, the thickness is set to 90 μm.

Next, a method of manufacturing an IC card using the above module will be described.

A linear 100 to 230 μm copper wire is drawn on about 250 μm of the antenna substrate 4 of FIG. 1, and the antenna 5 is placed on the antenna substrate 4 so that the antenna 5 is flush with the surface of the antenna substrate 4. It is embedded and formed.

Next, a counterbore portion (a portion obtained by cutting the antenna substrate 4 into a concave shape), which is a space for mounting the chip 1 on the antenna substrate 4, is formed. The counterbore processing method will be described with reference to FIG.

On the antenna substrate 4, a region having a size slightly larger than the size of the chip 1 is cut by laser beam irradiation. The base material of the antenna is PET, P
A VC system or the like is used. The laser beam has a linear 1
The strength is set such that almost half of the 80 μm antenna 5 is exposed. A part of the antenna 5 is exposed on the countersink 9 thus cut.
The laser beam is also applied to. Since a conductive metal such as copper is used for the antenna 5, the insulating coating of the antenna is peeled off, but the antenna main body remains and is exposed. By the cutting process using the laser beam as described above, the counterbore 9 in which the exposed antenna 5 is cut is formed, and the antenna pad 6 is formed in the counterbore 9.
Is exposed.

Next, a process of mounting the chip 1 by the flip chip method will be described with reference to FIG.

Gold-plated bumps 3 are formed on the pads 2 of the chip 1. Alternatively, gold-plated bumps 3 are formed on the pads 2 on the chip by wire bonding. next,
The thermosetting resin film 7 having the same size as the chip 1 is attached to the counterbore 9 in FIG. Alternatively, an adhesive is applied to this area. In this way, the chip 1 is mounted on the counterbore 9 by the flip chip method. Thereafter, heat of 50 to 280 ° C. and pressure of 75 to 240 gf / bump are applied from the back surface of the mounted chip 1 to heat and pressure bond the bump 3 formed on the pad 2 of the chip 1 and the antenna pad 6. . As a result of this step, as shown in FIG. 5, the bump 3 has a convex shape at the center and a concave shape at both ends, and is fitted and connected to the antenna pad 6 in an uneven shape.

At the same time when the above heating / pressurization is performed, the thermosetting resin film 7 is simultaneously cured to fix the connection state between the bump 3 and the antenna pad 6. Finally, a card printing substrate 8 (see FIG. 1) is attached to both surfaces of the antenna substrate 4 on which the chip 1 is mounted to complete an IC card.

Next, a second embodiment will be described.

In the above embodiment, the counterbore 9 provided on the antenna substrate 4 was formed by laser beam irradiation, but it can also be formed by mechanical milling. The manufacturing method in this case will be described with reference to FIGS. In the mechanical milling cutting, the antenna wire 5 is simultaneously cut when the counterbore 9 is formed (FIG. 6). From this state, as shown in FIG. 7, the antenna pad 6 is further recessed by slightly cutting the end thereof downward. The end to be cut at this time is an inner end where the antenna pads running in parallel face each other. That is, in the processing, the antenna pad 6 is cut further downward than the flat bottom surface of the counterbore 9, and the pump 3 is fitted into the cut portion to make the bump 3 uneven so that the antenna pad 6 is formed. Connecting. By such processing, the bumps 3 are easily embedded in the antenna pad 6.

Further, as a third embodiment, after a copper plate having a thickness of 5 to 25 μm is attached to the antenna base material 4, the copper plate may be etched into a predetermined shape to form an antenna pattern.

8 to 10 show an example of a module in which the copper plate is etched to form an antenna pattern. FIG. 8 shows an embodiment in which the pump 3 is formed between two antenna pads running in parallel, and FIG. 9 shows an embodiment in which the pump 3 is formed so as to cover one antenna pad 6.
Shows an example in which bumps 3 are formed on the outer ends of two antenna pads running in parallel. In the module of this embodiment, after the copper plate is etched to form the antenna pattern, the pad of the chip 1 is connected to the antenna pad 6 by the flip chip method, and then,
The resin 7 fixes the bottom of the chip 1 including the periphery of the bump 3. After the module is formed, the card printing base material 8 is vertically piled up and fixed as shown in FIG. 11 to form an IC cart. At this time, a counterbore 9 is formed on the upper card printing substrate 8, and the chip 1 is housed in the counterbore 9.

[0036]

According to the present invention, since the bump is uneven and the bump and the antenna pad are fitted to each other at the uneven connecting portion, only the shearing force to the connecting portion in the vertical and horizontal directions is applied. Instead, it also becomes stronger against bending moment force. That is, even if the adhesive or fixing resin for fixing the connection portion expands due to a temperature rise, or if the connection portion is subjected to a physical peeling force due to bending or twisting, the connection state is kept. It can prevent the deterioration.
Therefore, the reliability of the entire module can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view of a non-contact type IC card according to an embodiment of the present invention.

FIG. 2 is a plan view of the IC card.

FIG. 3 Example of antenna pad

FIG. 4 is a diagram showing a spot facing method.

FIG. 5 is a diagram showing a module manufacturing method.

FIG. 6 is a view showing a spot facing forming method according to a second embodiment of the present invention.

FIG. 7 is a diagram showing a module manufacturing method according to a second embodiment of the present invention.

FIG. 8 is a diagram showing an example of a module manufacturing method according to the third embodiment of the present invention.

FIG. 9 is a diagram showing another example of the module manufacturing method according to the third embodiment of the present invention.

FIG. 10 is a diagram showing another example of the module manufacturing method according to the third embodiment of the present invention.

FIG. 11: I manufactured in the third embodiment of the present invention.
Structural drawing of C card

FIG. 12 is a view showing a conventional module manufacturing method.

FIG. 13 is a view showing a connection part of a conventional module.

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Claims (12)

[Claims] 1. An antenna, an IC chip for processing a signal transmitted and received via the antenna, an antenna substrate on which the antenna is formed and the IC chip is mounted, an antenna pad of the antenna, and the IC chip. In a module for non-contact communication equipment, comprising: a connection part connected to each other via a bump, the connection part has the bumps in an uneven shape, and the bumps and the antenna pad are formed by the uneven connection parts. A module for non-contact communication equipment, characterized in that and are fitted to each other. 2. The connecting portion has a shape in which substantially two antenna pads provided on the antenna pattern run side by side when the wiring pattern of the antenna is folded back. The module for non-contact communication device according to claim 1, wherein the bumps are fitted into the gap in an uneven shape. 3. The connecting portion has a shape in which substantially two antenna pads provided on the antenna pattern run side by side when the wiring pattern of the antenna is folded back. The module for non-contact communication device according to claim 1, wherein the bumps are fitted into the gap and the end portion in an uneven shape. 4. An antenna pad provided on the wiring pattern of the antenna has an annular shape in the connecting portion,
The contactless communication device module according to claim 1, wherein the bumps are fitted in a concave-convex shape on the peripheral portion of the annular antenna pad. 5. In the connection portion, an antenna pad provided on a wiring pattern of the antenna has a linear shape, and the pump having a diameter larger than the width of the linear antenna pad is an antenna pad. The module for non-contact communication device according to claim 1, wherein the module is fitted in an uneven shape in a wrapped state. 6. The connecting portion has a linear shape of an antenna pad provided on a wiring pattern of the antenna, and the ends of the two pumps are uneven at both ends of the linear antenna pad. The non-contact communication device module according to claim 1, wherein the module is fitted in a state of being wrapped in a shape. 7. An antenna substrate made of a conductor such as copper is embedded in an antenna substrate, and an IC chip for processing signals transmitted and received through the antenna is mounted on the antenna substrate. When the antenna pad and the IC chip formed on the substrate are connected to each other via bumps, the bumps and the antenna pad are fitted to each other and connected so that the pump has an uneven shape. And a method for manufacturing a module for contactless communication equipment. 8. The antenna base material is formed by bonding a conductor such as copper to the antenna substrate and then etching the antenna substrate into a predetermined shape.
A method for manufacturing a module for a non-contact communication device as described above. 9. An antenna substrate is formed by embedding the antenna substrate, and a counterbore portion which is a space for mounting the IC chip on the antenna substrate is formed so that the antenna pad is exposed on the bottom surface. The method for manufacturing a module for non-contact communication equipment according to claim 7, which is formed by laser beam processing. 10. After forming the antenna base material by embedding it in the antenna base plate, a counterbore portion which is a space for mounting the IC chip on the antenna base material is processed by a mechanical cutting means such as a milling device. In the processing, the antenna pad is cut further downward than the flat bottom surface of the countersunk portion, and the bump fits into the cut portion to form the bumps in an uneven shape. The method for manufacturing a module for contactless communication equipment according to claim 7, wherein the module is connected to a pad. 11. An IC card in which a module for contactless communication equipment according to any one of claims 1 to 6 is integrally provided on a card base material. 12. The card base material is formed by laminating both sides of the non-contact communication device module, and one card base material is provided with a counterbore portion for accommodating the module by counterboring. The IC card according to item 11.