JPH02175192A - Module for ic card - Google Patents
Module for ic cardInfo
- Publication number
- JPH02175192A JPH02175192A JP63331396A JP33139688A JPH02175192A JP H02175192 A JPH02175192 A JP H02175192A JP 63331396 A JP63331396 A JP 63331396A JP 33139688 A JP33139688 A JP 33139688A JP H02175192 A JPH02175192 A JP H02175192A
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- resin
- sealing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 239000004593 Epoxy Substances 0.000 claims abstract description 3
- 239000011521 glass Substances 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 238000003780 insertion Methods 0.000 abstract description 5
- 230000037431 insertion Effects 0.000 abstract description 5
- 229910001111 Fine metal Inorganic materials 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 241001044340 Marma Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はｒｓｏ準拠のＩＣカードに使用、するＩＣモ
ジュールの特に、半導体素子′ｆｔｆｔ州土封止封止エ
リアの形状に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC module used in an RSO-compliant IC card, and particularly to the shape of a semiconductor element'ftft state sealing area.
第４図は従来のＩＣカード用モジュールを不す上面図、
第５図は第４図のマー１礫における断面図である。図に
おいて、１１１は半導体塔載基板、（！１は基板…の表
面に設けられた基板と同じガラスエポキシ又はＢＴレジ
ン等で出来たダム基板、＋３１ ｔ１基板＋１１に設け
られた導出リード、１４１は半導体素子、＋５１は半導
体素子１４１の表面に設けられた電極、（６１は半導体
素子（４１を基板１１１に接着させるための接着剤、（
１）は外部電極。Figure 4 is a top view of the conventional IC card module.
FIG. 5 is a cross-sectional view of the Mar 1 gravel shown in FIG. 4. In the figure, 111 is a semiconductor mounting board, (!1 is a dam board made of the same glass epoxy or BT resin as the board provided on the surface of the board, +31 is a lead-out lead provided on the t1 board +11, and 141 is a A semiconductor element, +51 is an electrode provided on the surface of the semiconductor element 141, (61 is an adhesive for bonding the semiconductor element (41) to the substrate 111, (
1) is an external electrode.
（８）は導出リード（３１と電極＋１１１を接続する金
属細線、（９）は導出リード；３１と外部電極（７）を
接続する基板内スルーホール、 ＋１１は封止用樹脂で
ある。(8) is a lead-out lead (a thin metal wire that connects 31 and electrode +111; (9) is a lead-out lead; a through hole in the substrate that connects 31 and external electrode (7); and +11 is a sealing resin.
次に動作について説明する。導出リード＋３１および外
部電極ｔ７１を形成しにモジュール基板…に半導体素子
１４）を接着剤１６）によって接着し固定する。次に、
半導体素子１４）上の電極・６１七導出１７−ド（３１
を金属細線（８１によって接続する。導出り一ド１３ν
は基板内部のスルーホール（９）を介して外部電極（７
１に接続されている。次いで、半導体素子４；全外部か
らの腐食等を防ぐため、封止用樹脂叫で封止する。かか
る後に加熱機（図示せず〕により、発生する熱により加
熱された空気（図示せず）を媒体として封止用樹脂＋１
０１を加熱し樹脂の硬化を完了させる。Next, the operation will be explained. After forming the lead-out leads +31 and the external electrodes t71, the semiconductor element 14) is bonded and fixed to the module substrate using an adhesive 16). next,
Electrode 617 lead-out 17-dead (31) on semiconductor element 14)
are connected by a thin metal wire (81).
is connected to the external electrode (7) through the through hole (9) inside the substrate.
Connected to 1. Next, the semiconductor element 4 is completely sealed with a sealing resin to prevent corrosion from the outside. After that, a heating machine (not shown) generates heat to heat the air (not shown) as a medium to sealing resin +1.
01 is heated to complete curing of the resin.
次に機械研磨によってモジュール全一定の厚みに仕上げ
る。ダム基板（２Ｉは封止用樹脂（１０１の流れを防ぐ
ために設けたものである。Next, the entire module is finished to a uniform thickness by mechanical polishing. A dam board (2I is provided to prevent the sealing resin (101) from flowing.
従来のＩＣカード用モジュールは以上の様に構成されて
いたので、樹脂封止するエリアのダム基板の形状が４角
形になってい友ため、封止面が左右、上下対称の場合封
止面から見たモジュールの方向が判らず、またＩＣモジ
ュールをカードＶＣ増込む際方向がわからず外部電極で
方向を用字するし乃・なく、確認の手間や逆向きに埋込
む原因ともなっていた。あるいＨｘａモジュールをカー
ドへ自動供給しモジュールの方向勿自＃Ｊ磯で認識させ
る場合、認識出来ないなどの問題点余有していｆｔ。Conventional IC card modules are configured as described above, and the shape of the dam board in the area to be resin-sealed is square. Therefore, if the sealing surface is horizontally and vertically symmetrical, It was difficult to know the direction of the module when viewed, and when adding an IC module to the card VC, the direction was not known and the direction had to be written on the external electrode, which caused trouble in checking and embedding the IC module in the opposite direction. Alternatively, if you automatically supply the Hxa module to the card and have it recognized in the direction of the module, there are still problems such as not being able to recognize it.
この発明は上記の様な問題点を解決するためになされた
もので、鋼脂封止のエリアの基板形状に方向性を持たせ
、誤挿入？なくする様にするとともに、ＩＣモジュール
を自動供給した場合モジュールの方向が自助認識出来る
様にしたＩＣカード用モジュールを得ることを目的とす
る。This invention was made in order to solve the above-mentioned problems.It gives directionality to the shape of the board in the area of steel and fat sealing, and prevents incorrect insertion. To provide an IC card module which is capable of automatically recognizing the direction of the module when the IC module is automatically supplied.
この発明に係るＩＣカード用モジュールは封止用樹脂の
流入を防ぐために設けたダム基板の封とエリアの形状に
方向性を持たせるとともに。The IC card module according to the present invention has directionality in the shape of the sealing area of the dam board provided to prevent the inflow of the sealing resin.
ダム基板に自ｓｇｓ用のマークを付けたものである。This is a dam board with a mark for its own SGS.
この発明におけるＩＣカード用モジュールは樹脂封止後
の封止面を一目でＩＣモジュールの方向がはっきりと町
り、゛またマークによってカードへ埋込む際のモジュー
ルの誤挿入を防止出来さらにモジュールの方向や位置が
自助認識出来る。In the IC card module of this invention, the direction of the IC module can be clearly determined at a glance from the sealing surface after resin sealing, and the mark prevents incorrect insertion of the module when embedding it in the card. Self-help recognition of location and location.
〔実施−１〕 以下、この発明の一実施例を図について説明する。[Implementation-1] An embodiment of the present invention will be described below with reference to the drawings.
嬉１図にこの発明のＩＣカード用モジュールの一実施例
１に示す上面図で、第２図は第１図■−０における断面
図である。図において、符号ＩＩ〜（１０１は前記従来
のものと同一のものである。Fig. 1 is a top view showing Embodiment 1 of the IC card module of the present invention, and Fig. 2 is a sectional view taken at Fig. 1--0. In the figure, reference numerals II to (101) are the same as those of the conventional device.
１υはダム基板イ２１の樹脂封止エリアの形状を方向が
わかる様にしたマークである。ｔＩ２１は自助認識用マ
ークで、半導体素子封止エリアの対角線上にダム基板１
２；を設は念ものである。1υ is a mark indicating the direction of the shape of the resin-sealed area of the dam board I21. tI21 is a self-help recognition mark, and there is a dam board 1 on the diagonal of the semiconductor element sealing area.
2; is a matter of caution.
ＩＣモジュールをカード、で埋込む場合、方向のわかる
マークｄυおよび自助認識出来るマーク（１２１を使用
してカードへ埋込む様にしたものである。When an IC module is embedded in a card, a mark dυ that shows the direction and a mark (121) that can be self-recognized are used to embed the IC module in the card.
前記の様に構成されたＩＣカード用モジュールにおいて
この発明の特徴である樹脂封止エリアの形状を方向がわ
かる様にした事により、カードへ埋込む際のＪＡ誤挿入
確認の手間がなくなり、埋込み作業性の困難さも解消さ
れる。In the IC card module configured as described above, the shape of the resin-sealed area, which is a feature of this invention, is made so that the direction can be seen, thereby eliminating the trouble of checking for incorrect JA insertion when embedding the card, and making it easier to embed the card. Difficulties in workability are also resolved.
また、ダム基板：２）に自助認識用マーク（１カを設け
ることによってモジュールを自助で供給した４合、モジ
ュールの位置認識用マークとしても使用出来る。In addition, by providing a self-help recognition mark (1) on the dam board (2), it can also be used as a mark for recognizing the position of the module when the module is self-supplied.
なお、上記実ｉ例では半導体素子を樹脂封止するエリア
のダム基板１２１の形状によって方向がわかる様にした
場合を示したが、第３図に示す様に樹脂封止するエリア
外に方向性のわかるマークｔｉｌＩを付けても同様の効
果を奏する。また、上記実旌例では自＃ｌ認識用のマー
ク（ｌりは半導体素子を樹脂封止するエリアの対角線上
に設けた場合を示したが、上下、左右どちらに設けても
良い。図では左右に設けた場合を示す。In addition, in the above-mentioned example, the direction is determined by the shape of the dam board 121 in the area where the semiconductor element is resin-sealed, but as shown in FIG. A similar effect can be obtained by attaching a mark tilI that makes it easy to understand. In addition, in the above practical example, the mark for self-#l recognition (the mark is provided on the diagonal of the area where the semiconductor element is sealed with resin is shown), but it may be provided on either the top, bottom, left or right. The case where it is installed on the left and right is shown.
以上の様にこの発明によれば、ＩＣカード用モジュール
のダム基板の樹脂封止エリアの形状を方向がわかる形状
にしたので、ＩＣモジュールの方向確認が容易となり、
ｆ４認の手間がなくなシ、またカードへ埋込む際の誤挿
入がなくなり、不良の発生がなくなる。また、自＃Ｊ認
識が４、As described above, according to the present invention, since the shape of the resin-sealed area of the dam board of the IC card module is shaped so that the direction can be recognized, it becomes easy to confirm the direction of the IC module.
This eliminates the hassle of F4 verification, eliminates incorrect insertion when embedding into a card, and eliminates the occurrence of defects. Also, self #J recognition is 4,
第１図汀この発明の一実８Ｍ例ＶＣよるＩＣカード用モ
ジュールの上面図、第２図は第１図の１−ｎ＠における
断面図、Ｍｓ図汀他の実施例によるＩＣカード用モジュ
ールの上面図、第４図に従来のＩＣカード用モジュール
の上面図、第５図ｔ−ｊ＠４図のマーマ線における断面
図である。
図中％Ｉｌｌは半導体塔＠基板、（！１はダム基板％１
３１は導出リード、（４１ｒ１半導体素子、１６１は半
導体素子表面の電極、１６）は接着剤、＋？）け外部電
極、（８１は金属線ｌ！、（９１は基板内スルーホール
、ｔｌ（１１＃−ｒ封正用樹脂、ａυは方向性マーク、
ｌＩ２１Ｖｉ自動認識用マークである。
なお、図中、同一符号は同一１念は相当部分を示す。Fig. 1 is a top view of an IC card module according to an example 8M of the present invention, Fig. 2 is a sectional view taken along 1-n@ of Fig. 1, and Ms Fig. is a top view of an IC card module according to another embodiment of the present invention. FIG. 4 is a top view of a conventional IC card module, and FIG. 5 is a sectional view taken along the marma line of tj@4. In the figure, %Ill is a semiconductor tower@substrate, (!1 is a dam board%1
31 is a lead-out lead, (41r1 semiconductor element, 161 is an electrode on the surface of the semiconductor element, 16) is an adhesive, +? ) external electrode, (81 is metal wire l!, (91 is through hole in board, tl (11#-r sealing resin, aυ is directional mark,
This is a mark for automatic recognition of lI21Vi. In the drawings, the same reference numerals indicate corresponding parts.
Claims (1)
を有する基板と、この基板内に１個又は複数個の半導体
素子を塔載、この素子と外部電極へ導出するリードを接
続する金属細線と、これらを封止する封止用樹脂とから
構成され一定の厚みに仕上げたＩＣカード用モジユール
において、封止用樹脂のエリアの形状をモジユールの方
向が判る様な封止形状にした事を特徴とするＩＣカード
用モジユール。A substrate having an external electrode made of glass epoxy or BT resin, etc., one or more semiconductor elements mounted within this substrate, thin metal wires connecting this element to leads leading to the external electrodes, and these. A module for an IC card, which is composed of a sealing resin for sealing the module and finished to a certain thickness, is characterized in that the area of the sealing resin has a sealing shape that allows the direction of the module to be determined. Module for IC cards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63331396A JPH02175192A (en) | 1988-12-27 | 1988-12-27 | Module for ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63331396A JPH02175192A (en) | 1988-12-27 | 1988-12-27 | Module for ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02175192A true JPH02175192A (en) | 1990-07-06 |
Family
ID=18243229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63331396A Pending JPH02175192A (en) | 1988-12-27 | 1988-12-27 | Module for ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02175192A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58135656A (en) * | 1982-02-08 | 1983-08-12 | Dainippon Printing Co Ltd | Integrated circuit module |
| JPS6134687A (en) * | 1984-07-26 | 1986-02-18 | Dainippon Printing Co Ltd | Ic card |
| JPS6170679A (en) * | 1984-09-13 | 1986-04-11 | Dainippon Printing Co Ltd | Ic card |
-
1988
- 1988-12-27 JP JP63331396A patent/JPH02175192A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58135656A (en) * | 1982-02-08 | 1983-08-12 | Dainippon Printing Co Ltd | Integrated circuit module |
| JPS6134687A (en) * | 1984-07-26 | 1986-02-18 | Dainippon Printing Co Ltd | Ic card |
| JPS6170679A (en) * | 1984-09-13 | 1986-04-11 | Dainippon Printing Co Ltd | Ic card |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW293164B (en) | A ball grid array structure and method for packaging an integrated circuit chip | |
| US6040622A (en) | Semiconductor package using terminals formed on a conductive layer of a circuit board | |
| TW390004B (en) | Device for storing semiconductor chip and method for making the same | |
| CN205750831U (en) | Integrated circuit modules and integrated circuit card for integrated circuit card | |
| TW517318B (en) | Semiconductor device | |
| TW468260B (en) | Semiconductor device and method of manufacturing the same | |
| JPH02175192A (en) | Module for ic card | |
| JP2008026183A (en) | Ic-integrated acceleration sensor | |
| KR100651796B1 (en) | Chip module for IC card | |
| CN101103253A (en) | Rotation detection device | |
| JP2010277307A (en) | Contact type ic card | |
| JPH05151424A (en) | Integrated circuit token | |
| JPH0262297A (en) | Integrated circuit device and ic card using same | |
| JPH01106455A (en) | Semiconductor integration circuit device | |
| US5256903A (en) | Plastic encapsulated semiconductor device | |
| JP2503984Y2 (en) | Hybrid integrated circuit | |
| JPH0199891A (en) | Ic card | |
| JPS62135395A (en) | Integrated circuit module for integrated circuit card | |
| JP3737093B2 (en) | Semiconductor device | |
| JP4393323B2 (en) | Semiconductor pressure sensor | |
| JPS60194553A (en) | Hybrid ic device | |
| JP2682072B2 (en) | Hybrid integrated circuit device | |
| JP2547565B2 (en) | Manufacturing method of hybrid integrated circuit | |
| JPH05166967A (en) | Semiconductor device | |
| JPS60142488A (en) | Ic card |