JP2008026183A - Ic-integrated acceleration sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC-integrated acceleration sensor, which can be reduced in overall size and height, and can be easily manufactured. <P>SOLUTION: This sensor comprises an acceleration sensor 2, an IC chip 3, a housing 6 of a storing means and a cover 7, and the acceleration sensor 2 comprises an acceleration sensor terminal 2d provided on a beam supporting side face 2e of a support body 2c and the IC chip 3 comprises a processing circuit forming face 3a where a processing circuit and an IC chip element 3b are formed. The IC chip 3 and the acceleration sensor 2 are arranged so that the beam support side face 2e and the processing circuit forming face 3a are positioned in the opposite direction with a fixed distance apart and are fixed by a conductive means 4 of a gold bump 41 and an electric conductive resin 42 set between the acceleration sensor terminal 2d and the IC chip terminal 3b. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an IC-integrated acceleration sensor, and more specifically, an acceleration sensor that converts acceleration into an electrical detection signal, and an IC chip that includes a processing circuit that electrically processes the detection signal of the acceleration sensor. The present invention relates to an integrated IC acceleration sensor.

  As a conventional IC-integrated acceleration sensor, Patent Document 1 discloses an IC-integrated acceleration sensor configured as shown in FIG. The IC integrated acceleration sensor 100 includes an acceleration sensor 102 having a piezoresistive element that converts acceleration into an electrical detection signal, an IC chip 103 that electrically processes the detection signal of the acceleration sensor 102, and the acceleration sensor. 102 and a housing 105 that accommodates the IC chip 103 in the internal space thereof, and a lid 106 that seals the internal space of the housing 105.

  The acceleration sensor 102 is disposed at the center of the acceleration sensor 102 and supports the weight portion 102a that swings due to acceleration, and the upper four sides of the weight portion 102a, and supports the weight portion 102a so as to be swingable. It is comprised from the beam part 102b of this, and the support body 102c which supports these four beam parts 102b. Each of the four beam portions 102b is provided with a piezoresistive element, and acceleration is converted into an electrical detection signal by the piezoresistive element. The plurality of acceleration sensor terminals 102d of the acceleration sensor 102 are formed in a line on the upper surface of one side of the support 102c, that is, the beam support side surface 102e of the support 102c.

  The IC chip 103 is disposed above the acceleration sensor 102 at a predetermined interval in order to have a function as a regulating plate that regulates the swing range of the weight portion 102 a of the acceleration sensor 102. The IC chip 103 has a processing circuit forming surface 103a on which the processing circuit and a plurality of IC chip terminals 103b are formed. The IC chip 103 is bonded to the upper surface of the support 102c of the acceleration sensor 102 with an adhesive containing fine hard plastic spheres.

  Corresponding terminals of the plurality of acceleration sensor terminals 102 d of the acceleration sensor 102 and the plurality of IC chip terminals 103 b of the IC chip 103 are connected to each other by Au wires 104. In order to secure a connection space by the Au wire 104, the IC chip 103 is arranged to be unevenly distributed in the horizontal direction (the direction of the arrow X shown in FIG. 6) with respect to the acceleration sensor 102.

JP 2005-169541 A

  In the IC integrated acceleration sensor as described above, the IC chip 103 is arranged so as to be unevenly distributed in the horizontal direction with respect to the acceleration sensor 102. Accordingly, there is a problem that the size of the acceleration sensor 102 and the IC chip 103 thus overlapped cannot be made smaller than that of the IC chip 103. Furthermore, at present, the size of the acceleration sensor is smaller than that of the IC chip. However, the configuration as described above has a problem that even when this reduced acceleration sensor is used, the entire IC integrated acceleration sensor cannot be reduced in size.

  Furthermore, since the Au wire 104 that connects the plurality of acceleration sensor terminals 102d of the acceleration sensor 102 and the plurality of IC chip terminals 103b of the IC chip 103 protrudes above the processing circuit formation surface 103a of the IC chip 103, There is a problem that the overall height of the IC integrated acceleration sensor cannot be reduced.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an IC-integrated acceleration sensor that can be reduced in overall size and height and can be easily manufactured.

  An IC-integrated acceleration sensor according to the present invention includes an acceleration sensor that converts acceleration into an electrical detection signal, an IC chip that electrically processes the detection signal of the acceleration sensor, the acceleration sensor, and the IC chip. An IC-integrated acceleration sensor having an accommodating means for accommodating, wherein the acceleration sensor supports a weight portion that swings due to acceleration, a beam portion that supports the weight portion so as to be swingable, and the beam portion. A support body and an acceleration sensor terminal provided on a beam support side surface of the support body, and the IC chip has a processing circuit forming surface on which a processing circuit and an IC chip terminal are formed, and the acceleration The sensor and the IC chip are disposed such that a beam support side surface of the support body of the acceleration sensor and the processing circuit forming surface of the IC chip face each other with a predetermined gap therebetween, and Characterized in that it is fixed by the conductive means provided between the speed sensor terminal and the IC chip terminals.

  Further, in the IC integrated acceleration sensor according to the present invention, the housing means is a housing and a lid, and the IC chip constitutes the lid which is a part of the housing means, and the housing means and the conductive body are electrically conductive. It is preferably fixed by means.

  In the IC integrated acceleration sensor according to the present invention, it is preferable that the horizontal size of the housing is the same as the horizontal size of the IC chip.

  Further, in the IC integrated acceleration sensor according to the present invention, the housing means is composed of a rigid substrate made of glass epoxy or the like as a base material and a sealing resin, and a sealing member for securing a space around the weight portion. Is preferably provided.

  Furthermore, the IC-integrated acceleration sensor according to the present invention is a general semiconductor package such as SOIC in which the housing means is composed of a metal plate and a sealing resin, so as to secure a space around the weight portion. It is preferable that a sealing member is provided.

  In the IC integrated acceleration sensor according to the first aspect, the acceleration sensor and the IC chip face each other with a predetermined interval between the beam support side surface of the support of the acceleration sensor and the processing circuit forming surface of the IC chip. And is fixed by conductive means provided between the acceleration sensor terminal and the IC chip terminal. Therefore, it is not necessary to use an Au wire or an Al wire to connect the acceleration sensor and the IC chip. For this reason, in order to secure a connection space for the Au wire, the IC chip is unevenly distributed in the horizontal direction with respect to the acceleration sensor. There is no need. Therefore, since the connection space of the Au wire is unnecessary, the IC integrated acceleration sensor can be downsized. In addition, since no Au wire is used, the overall height of the integrated IC acceleration sensor can be further reduced.

  Furthermore, since the acceleration sensor terminal and the IC chip terminal can be electrically connected by the conductive means without using the Au wire, it is not necessary to perform a wire bonding operation using the Au wire for the connection. For this reason, it is possible to reduce the manufacturing time and the manufacturing cost.

  Furthermore, by adjusting the vertical height of the conductive means, it is possible to set the distance between the beam support side surface of the acceleration sensor support and the processing circuit formation surface of the IC chip. For this reason, the height adjustment of the swingable region of the weight portion and the electrical connection between the acceleration sensor terminal and the IC chip terminal can be performed at the same time, thereby reducing the manufacturing time and the manufacturing cost. be able to.

  Since the IC integrated acceleration sensor according to the second aspect of the invention constitutes a lid body in which the IC chip is a part of the accommodating means, the lid body as an independent component is not required. Therefore, the overall height of the integrated IC acceleration sensor can be further reduced, and the manufacturing cost can be reduced by reducing the number of components.

  Furthermore, since the IC chip is fixed by the accommodating means and the conductive means, the connection work step using Au wires or the like can be omitted, and the manufacturing time can be shortened and the manufacturing cost can be reduced.

  In the IC integrated acceleration sensor according to the third aspect of the invention, since the horizontal size of the housing is the same as the horizontal size of the IC chip, the horizontal size of the IC integrated acceleration sensor is set to the IC chip. The IC-integrated acceleration sensor can be further reduced in size.

  Since the IC-integrated acceleration sensor according to the fourth aspect of the present invention is composed of a rigid substrate whose base means is inexpensive glass epoxy or the like and a sealing resin, the manufacturing cost of the IC-integrated acceleration sensor Can be reduced. Further, since the sealing member is provided, it is possible to prevent the sealing resin from penetrating into the space around the weight portion of the acceleration sensor.

  Since the IC integrated acceleration sensor according to the invention of claim 5 is a general semiconductor package such as SOIC in which the accommodating means is composed of a metal plate and a sealing resin, it is more than the case where a glass epoxy substrate is used. Furthermore, the manufacturing cost can be reduced.

  Hereinafter, an integrated IC acceleration sensor 1 according to a first embodiment of the present invention will be described in detail with reference to FIG. In addition, the term “upper” or “lower” used in the description of the specification expresses what is located on the upper side in the accompanying drawings as upper and what is located on the lower side as lower.

  The IC integrated acceleration sensor 1 of this embodiment includes an acceleration sensor 2 that converts acceleration into an electrical detection signal, an IC chip 3 that electrically processes the detection signal of the acceleration sensor 2, and the acceleration sensor 2. An IC-integrated acceleration sensor having a housing 6 and a lid body 7 that house the IC chip 3, wherein the acceleration sensor 2 includes a weight portion 2a that swings due to acceleration, and the weight portion 2a. The IC chip 3 includes a beam portion 2b that supports the beam portion 2b, a support body 2c that supports the beam portion 2b, and an acceleration sensor terminal 2d that is provided on a beam support side surface 2e of the support body 2c. Has a processing circuit forming surface 3a on which a processing circuit (not shown) and an IC chip terminal 3b are formed. The acceleration sensor 2 and the IC chip 3 are the support body 2c of the acceleration sensor 2. of The portion supporting side surface 2e and the processing circuit forming surface 3a of the IC chip 3 are disposed so as to face each other with a predetermined interval, and are provided between the acceleration sensor terminal 2d and the IC chip terminal 3b. Further, the conductive means 4 is fixed by a gold bump 41 and a conductive resin 42.

  The acceleration sensor 2 includes a weight portion 2a that swings due to acceleration, four beam portions 2b that support the weight portion 2a in a swingable manner, a support body 2c that supports each beam portion 2b, and a beam of the support body 2c. It is comprised from the acceleration sensor terminal 2d provided in the part support side surface 2e. And it arrange | positions in the state which orient | assigned the beam part support side surface 2e of the support body 2c below. Each beam portion 2b is provided with a piezoresistive element or the like (not shown). When each beam portion 2b is bent by the weight portion 2a that swings due to acceleration, the piezoresistive element or the like electrically transmits the acceleration. Convert to a simple detection signal. In order to output this detection signal to the outside of the acceleration sensor 2, a plurality of acceleration sensor terminals 2d are formed on the beam support side surface 2e of the support 2c.

  The IC chip 3 is an IC chip that electrically processes a detection signal from the acceleration sensor 2 and has a flat plate shape. The IC chip 3 has a processing circuit forming surface 3a on which a processing circuit (not shown) and a plurality of IC chip terminals 3b are formed, and is disposed with the processing circuit forming surface 3a facing upward. Yes.

  The acceleration sensor 2 and the IC chip 3 are disposed so that the beam support side surface 2e of the acceleration sensor 2 and the processing circuit forming surface 3a of the IC chip 3 face each other with a predetermined interval. For this reason, the space 8 exists between the beam portion supporting side surface 2e and the processing circuit forming surface 3a, and a swingable region of the weight portion 2a of the acceleration sensor 2 can be secured. Further, the processing circuit forming surface 3a constitutes a stopper surface that restricts excessive swinging of the weight portion 2a.

  The acceleration sensor terminal 2d of the acceleration sensor 2 and the IC chip terminal 3b of the IC chip 3 are fixed by the gold bump 41 and the conductive resin 42 as the conductive means 4 by applying a flip chip mounting technique. It is also electrically connected. Further, without using a conductive resin, the acceleration sensor terminal 2d and the IC chip terminal 3b of the IC chip 3 can be fixed to a gold bump by pressure welding or ultrasonic bonding. The height of the space 8 can be set by adjusting the vertical height of the gold bump 41. In addition, it is also possible to use a solder bump instead of the gold bump 41, and when the vertical height of the conductive means 4 can be adjusted, the gold bump 41 and the solder bump are not used. It is also possible to use only a conductive resin. Further, it is possible to perform bonding using high-temperature solder bumps without using conductive resin.

  The accommodating means for accommodating the acceleration sensor 2 and the IC chip 3 includes a housing 6 and a lid body 7. The housing 6 is formed using a ceramic multilayer substrate or the like, and the lower surface of the IC chip 3 is bonded to the upper surface of the internal space of the housing 6. The internal space has a plurality of internal terminals 61 used for connection with the IC chip terminals 3 c of the IC chip 3, and a plurality of external terminals (not shown) are provided outside the housing 6. Each internal terminal 61 and the corresponding IC chip terminal 3 c are electrically connected by Au wires 5.

  The lid body 7 is a thin plate, and the peripheral portion thereof is bonded to the upper surface of the housing 6. The lower surface of the lid 7 is also bonded to the upper surface of the support 2c of the acceleration sensor 2.

  The upper surface of the weight portion 2a of the acceleration sensor 2 and the lower surface of the lid body 7 are arranged to face each other with a predetermined interval. For this reason, the space 9 exists between the upper surface of the weight part 2a and the lower surface of the cover body 7, and the area | region which can rock | fluctuate the weight part 2a of the acceleration sensor 2 can be ensured. Further, the lower surface of the lid body 7 constitutes a stopper surface that restricts excessive swinging of the weight portion 2a.

Hereinafter, the effect of this embodiment is demonstrated.
The acceleration sensor 2 and the IC chip 3 of the IC integrated acceleration sensor 1 of the present embodiment are such that the beam support side surface 2e of the support 2c of the acceleration sensor 2 and the processing circuit formation surface 3a of the IC chip 3 have a predetermined distance. It is arranged so as to be opposed to each other, and is fixed by a gold bump 41 and a conductive resin 42 which are conductive means 4 provided between the acceleration sensor terminal 2d and the IC chip terminal 3b. Therefore, it is not necessary to use an Au wire to connect the acceleration sensor 2 and the IC chip 3. For this reason, the IC chip 3 needs to be unevenly distributed in the horizontal direction with respect to the acceleration sensor 2 in order to secure a connection space for the Au wire. There is no. Therefore, since the connection space for the Au wire is unnecessary, the IC integrated acceleration sensor 1 can be reduced in size. Further, since no Au wire is used, the overall height of the IC integrated acceleration sensor 1 can be further reduced.

  Further, the acceleration sensor terminal 2d and the IC chip terminal 3b can be electrically connected by the gold bump 41 and the conductive resin 42 which are the conductive means 4 without using the Au wire. There is no need to perform wire bonding work with wires. For this reason, it is possible to reduce the manufacturing time and the manufacturing cost.

  Further, by adjusting the vertical height of the gold bump 41 which is the conductive means 4, the height of the space 8, that is, the beam support side surface 2 e of the support 2 c of the acceleration sensor 2 and the processing circuit of the IC chip 3. An interval between the formation surface 3a can be set. For this reason, since the height adjustment of the swingable region of the weight portion 2a and the electrical connection between the acceleration sensor terminal 2d and the IC chip terminal 3b can be performed simultaneously, the manufacturing time can be shortened and the manufacturing cost can be reduced. Reduction can be achieved.

  Next, an IC integrated acceleration sensor 1a according to a second embodiment of the present invention will be described in detail with reference to FIG. In addition, in 2nd Embodiment and other embodiment mentioned later, about the member which has the same or similar function as each member in the said 1st Embodiment, it uses the same code | symbol used in description of the said 1st Embodiment. explain.

  In the IC-integrated acceleration sensor 1a of the present embodiment, the IC chip 3 constitutes a lid that is a part of the accommodating means, and is fixed by the housing 6 that is a part of the accommodating means and the conductive means 5a. It is characterized by.

  In the IC integrated acceleration sensor 1a of the present embodiment, the positional relationship between the acceleration sensor 2 and the IC chip 3 in the first embodiment is opposite in the vertical direction of the drawing. In addition, since the IC chip 3 is used instead of the lid 7 which is a part of the housing means of the first embodiment, the lid 7 is not necessary. The gap 62 existing between the IC chip 3 and the housing 6 is sealed with a sealing resin (not shown).

  Furthermore, in the IC integrated acceleration sensor 1a of the present embodiment, the IC chip terminal 3b of the IC chip 3 and the internal terminal 61 of the housing 6 are fixed by the gold bump 51 and the conductive resin 52 which are the conductive means 5a. Moreover, it differs from the IC integrated acceleration sensor 1 of the first embodiment in that it is also electrically connected.

Hereinafter, the effect of this embodiment is demonstrated.
The IC integrated acceleration sensor 1a of the present embodiment does not require the lid 7 because the IC chip 3 is used instead of the lid 7. Therefore, the overall height of the integrated IC acceleration sensor can be further reduced, and the manufacturing cost can be reduced by reducing the number of components.

  Further, in the IC integrated acceleration sensor 1a of the present embodiment, the IC chip terminal 3b of the IC chip 3 and the internal terminal 61 of the housing 6 are fixed by the conductive means 5a. Therefore, the work process for connecting the Au wire can be omitted, and the manufacturing time can be shortened and the manufacturing cost can be reduced. Further, since no Au wire is required and the space of the Au wire can be omitted, the horizontal direction can be further reduced in size.

  Next, an IC integrated acceleration sensor 1b according to a third embodiment of the present invention will be described with reference to FIG.

  The IC integrated acceleration sensor 1b of the present embodiment has substantially the same configuration as the IC integrated acceleration sensor 1a of the second embodiment, but the horizontal size W1 of the housing 6 is the IC chip 3. The difference is that it is the same as the horizontal size W2. The gap 63 existing between the IC chip 3 and the housing 6 is sealed with a sealing resin (not shown).

Next, the effect of this embodiment is demonstrated.
In the IC integrated acceleration sensor 1b of the present embodiment, the horizontal size W1 of the housing 6 and the horizontal size W2 of the IC chip 3 are the same, and therefore the horizontal size of the IC integrated acceleration sensor 1b. The height of the IC chip 3 can be made horizontal, and the size can be further reduced as compared with the IC integrated acceleration sensor 1a of the second embodiment.

  Next, an IC integrated acceleration sensor 1c according to a fourth embodiment of the present invention will be described with reference to FIG.

  In the IC integrated acceleration sensor 1c of this embodiment, the housing means is composed of the glass epoxy substrate 11 and the sealing resin 6a, and the sealing member 12 for securing the space 9 around the weight portion 2a of the acceleration sensor 2 is provided. It is provided.

  An IC chip 3 is disposed on the glass epoxy substrate 11, and the acceleration sensor 2 is disposed on the IC chip 3. The acceleration sensor 2 and the IC chip 3 are disposed such that the beam support side surface 2e of the acceleration sensor 2 and the processing circuit formation surface 3a of the IC chip 3 face each other with a predetermined interval.

  A plate-like sealing member 12 is bonded to the upper surface of the support 2c of the acceleration sensor 2. A space 9 exists between the upper surface of the weight portion 2a of the acceleration sensor 2 and the lower surface of the sealing member 12, and the sealing member 12 can secure a swingable region of the weight portion 2a of the acceleration sensor 2.

  The viscosity of the sealing resin 6 a is adjusted so that the sealing resin 6 a does not penetrate into the space 8 and the space 9. In order to adjust the permeability of the sealing resin 6a, it is possible to use a sealing resin containing a filler or the like for the sealing resin 6a.

  The IC chip terminal 3 c of the IC chip 3 and the internal terminal 11 b of the glass epoxy substrate 11 are electrically connected by an Au wire 5. 4 is a solder ball provided on the glass epoxy substrate 11, and has a function as an external terminal of the integrated IC acceleration sensor 1c.

Next, the effect of this embodiment is demonstrated.
In the present embodiment, the housing means is composed of the glass epoxy substrate 11 and the sealing resin 6a, which are cheaper than a housing using a ceramic multilayer substrate or the like, so that the manufacturing cost of the integrated IC acceleration sensor can be reduced. Can be planned. Moreover, since the sealing member 12 is provided, the penetration of the sealing resin 6a into the space 9 can be prevented.

  Next, an IC integrated acceleration sensor 1d according to a fifth embodiment of the present invention will be described with reference to FIG.

  The IC-integrated acceleration sensor 1d of this embodiment is an SOIC package in which the accommodating means is composed of the metal plate 14 and the sealing resin 6a, and is used for securing the space 9 around the weight portion 2a of the acceleration sensor 2. The sealing member 12 is provided.

  The IC integrated acceleration sensor 1d of this embodiment has substantially the same configuration as the IC integrated acceleration sensor 1c of the fourth embodiment, but instead of the glass epoxy substrate 11, a metal plate 14 and a plurality of leads. 13 and an SOIC package. Each lead 13 is electrically connected to the corresponding IC chip terminal 3 c of the IC chip 3 by the Au wire 5.

Next, the effect of this embodiment is demonstrated.
In the present embodiment, since the accommodating means is an SOIC package in which the accommodating means is composed of the metal plate 14 and the sealing resin 6a, it is further manufactured than when the glass epoxy substrate is used as in the fourth embodiment. Cost can be reduced.

It is a section explanatory view of IC integrated acceleration sensor 1 of a 1st embodiment concerning the present invention. It is a section explanatory view of IC integrated acceleration sensor 1a of a 2nd embodiment concerning the present invention. It is a section explanatory view of IC integrated acceleration sensor 1b of a 3rd embodiment concerning the present invention. It is a section explanatory view of IC integrated acceleration sensor 1c of a 4th embodiment concerning the present invention. It is sectional explanatory drawing of IC integrated acceleration sensor 1d of 5th Embodiment which concerns on this invention. It is sectional explanatory drawing of the conventional IC integrated acceleration sensor 100. FIG.

Explanation of symbols

1, 1a, 1b, 1c, 1d, 100 IC integrated acceleration sensor 2, 102 Acceleration sensor 2a, 102a Weight part 2b, 102b Beam part 2c, 102c Support body 2d, 102d Acceleration sensor terminal 2e, 102e Beam part support side surface 3 , 103 IC chip 3a, 103a Processing circuit forming surface 3b, 103b IC chip terminal 4, 5a Conductive means 41, 51 Gold bump 42, 52 Conductive resin 5, 104 Au wire 6, 105 Housing 6a Sealing resin 61 Internal terminal 61, 62 Gap 7, 106 Lid 8, 9 Space 11 Glass epoxy board 11a Solder ball 11b Internal terminal 12 Sealing member 13 Lead 14 Metal plate W1 Horizontal size of housing 6 W2 Horizontal size of IC chip 3

Claims (5)

An acceleration sensor that converts acceleration into an electrical detection signal;
An IC chip that electrically processes the detection signal of the acceleration sensor;
An IC-integrated acceleration sensor having a housing means for housing the acceleration sensor and the IC chip,
The acceleration sensor includes a weight portion that swings due to acceleration, a beam portion that supports the weight portion so as to be swingable, a support body that supports the beam portion, and an acceleration provided on a beam support side surface of the support body. A sensor terminal,
The IC chip has a processing circuit forming surface on which a processing circuit and an IC chip terminal are formed,
The acceleration sensor and the IC chip are disposed such that a beam support side surface of the support body of the acceleration sensor and the processing circuit forming surface of the IC chip face each other with a predetermined interval therebetween, An IC-integrated acceleration sensor characterized by being fixed by conductive means provided between the acceleration sensor terminal and the IC chip terminal.   The housing unit is a housing and a lid, and the IC chip constitutes the lid that is a part of the housing unit, and is fixed by the housing unit and a conductive unit. 2. The integrated IC acceleration sensor according to 1.   3. The integrated IC acceleration sensor according to claim 2, wherein the horizontal size of the housing is the same as the horizontal size of the IC chip.   2. The integrated IC acceleration sensor according to claim 1, wherein the housing means is composed of a rigid substrate and a sealing resin, and a sealing member for securing a space around the weight portion is provided. 2. The IC integrated type according to claim 1, wherein the housing means is a semiconductor package composed of a metal plate and a sealing resin, and a sealing member for securing a space around the weight portion is provided. Acceleration sensor.

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