CN107608102B - Iron part, display device and stamping die for preparing iron part - Google Patents
Iron part, display device and stamping die for preparing iron part Download PDFInfo
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- CN107608102B CN107608102B CN201710882166.4A CN201710882166A CN107608102B CN 107608102 B CN107608102 B CN 107608102B CN 201710882166 A CN201710882166 A CN 201710882166A CN 107608102 B CN107608102 B CN 107608102B
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- circuit board
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Abstract
The invention discloses an iron piece, a display device and a stamping die for preparing the iron piece. This ironware includes: a substrate, wherein a surface of one side of the substrate has a plurality of circuit location score lines. Therefore, the iron part is simple in structure, the positions of the bent flexible circuit boards can be detected by utilizing the circuit position scribed lines, the alignment accuracy is improved, and the problem of distinguishing and classifying methods when liquid crystal modules need to be classified according to different bending accuracies is solved.
Description
Technical Field
The invention relates to the field of liquid crystal display, in particular to an iron piece, a display device and a stamping die for preparing the iron piece.
Background
With the development of science and technology, the market demand for liquid crystal module products is also higher and higher. The liquid crystal module comprises a liquid crystal display panel and a backlight module, wherein the backlight module emits uniform surface light, and the light irradiates human eyes through the liquid crystal display panel. The liquid crystal display panel processes incident light by pixels to display an image. In addition, the liquid crystal module also comprises an iron frame, an iron piece and other components which are used for fixing the liquid crystal display panel and winding the elements such as the flexible circuit board and the like. The flexible circuit board or printed circuit board on the liquid crystal display panel is contacted with one side of the iron piece, and is bent to the other side along the edge of the iron piece to be connected with other parts (such as a main board and the like) in the liquid crystal module.
However, the current iron, display device, and stamping die for preparing iron still need to be improved.
Disclosure of Invention
The present application is made based on the findings of the inventors on the following facts:
at present, a flexible circuit board or a printed circuit board in a liquid crystal module often has a deviation problem after winding (namely, an FPC is folded towards the back of an iron piece along one side of a diagonal line scale reference edge, or called as a U-fold). Because the flexible printed circuit board after being wound needs to be connected with other electronic components at a predetermined position, once the position of the flexible printed circuit board deviates, the flexible printed circuit board cannot be connected with the predetermined electronic component in a serious case, and the yield of the product is further affected. The inventor finds out through intensive research and a great deal of experiments that the alignment accuracy of the flexible circuit board or the printed circuit board after being bent is not easy to identify. As mentioned above, the flexible circuit board or printed circuit board on the lcd panel contacts with one side of the iron member and is bent to the other side along the edge of the iron member to connect with other components in the lcd module. Specifically, in the prior art, alignment lines are usually formed on the iron member along the outline of the flexible circuit board or the printed circuit board, and then the flexible circuit board or the printed circuit board is bent along the edge of the iron member. However, the alignment accuracy after bending is not easy to identify, and the component with low alignment accuracy may cause the deviation of the flexible circuit board or the printed circuit board, and if the component with low alignment accuracy is applied to the liquid crystal module, the yield of the product will be seriously affected. That is, the conventional iron member has only a mark for limiting the position where the flexible wiring board starts to be wound to the back side of the iron member, and it is impossible to detect whether the wound flexible wiring board is displaced.
The present invention aims to alleviate or solve at least to some extent at least one of the above mentioned problems.
In view of the above, in one aspect of the present invention, an iron member is provided. This ironware includes: a substrate, wherein a surface of one side of the substrate has a plurality of circuit location score lines. Therefore, the iron part is simple in structure, the positions of the bent flexible circuit boards can be detected by utilizing the circuit position scribed lines, the alignment accuracy is improved, and the problem of distinguishing and classifying methods when liquid crystal modules need to be classified according to different bending accuracies is solved.
According to the embodiment of the invention, both sides of the base body are provided with flexible circuit board arrangement areas; the flexible circuit board setting areas respectively positioned on two sides of the base body extend to the same edge of the base body. Thereby, the flexible circuit board can be provided in the flexible circuit board providing region of the iron member.
According to the embodiment of the invention, the circuit position scribes are arranged in parallel, and one edge of the flexible circuit board setting area, which is positioned at one side where the circuit position scribes are arranged, is parallel to the circuit position scribes. Therefore, the alignment accuracy of the flexible circuit board is convenient to detect.
According to the embodiment of the invention, the distance between the circuit position scribes is 0.1-0.15 cm. Therefore, the detection is convenient, and the alignment accuracy is improved.
According to the embodiment of the invention, the width of the circuit position scribing line is 0.02-0.06 cm. Therefore, the detection is convenient, and the alignment accuracy is further improved.
According to an embodiment of the invention, the circuit location score line is formed by subjecting the substrate to a stamping process or an etching process. Therefore, the circuit position scribed line can be obtained by the simple process, and the cost is saved.
According to an embodiment of the invention, the circuit location score line is a groove located on the substrate. Therefore, the human eyes can conveniently recognize the alignment position, and the alignment accuracy is improved.
In another aspect of the present invention, a display device is provided. According to an embodiment of the present invention, the display device includes the aforementioned iron member, and thus, the display device has all the features and advantages of the aforementioned iron member, which will not be described herein again. In general, the display device has higher quality and yield.
In another aspect of the present invention, a stamping die for manufacturing an iron article is provided. According to an embodiment of the present invention, the stamping die includes: an upper die; and the lower die is used for being matched with the upper die and limiting an iron piece accommodating space, wherein at least one of the upper die and the lower die is provided with a scribing part for forming a plurality of circuit position scribed lines. Therefore, the iron piece with the circuit position scribing line can be prepared by using the stamping die.
According to an embodiment of the invention, the scribing portion is a bump. Therefore, groove-shaped circuit position scribes can be prepared on the iron piece.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 shows a schematic structural view of a ferrous object according to one embodiment of the invention;
FIG. 2 shows a schematic structural view of a ferrous object according to another embodiment of the invention; and
FIG. 3 is a schematic structural diagram of an iron member and a flexible printed circuit according to an embodiment of the present invention;
fig. 4 shows a schematic structural view of a press die according to an embodiment of the present invention.
Description of reference numerals:
100: a substrate; 110: a flexible circuit board setting region; 120: the circuit position reticle reference edge; 200: scribing a circuit position; 300: a lower die; 400: an upper die; 500: a scribing portion; 10: an iron piece accommodating space; 600: a flexible wiring board.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention but do not require that the present invention must be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In one aspect of the invention, an iron piece is provided. According to an embodiment of the present invention, referring to fig. 1, the iron member includes: a substrate 100. Wherein the surface of one side of the substrate 100 has a plurality of circuit position scribe lines 200 arranged in parallel. Therefore, the iron part is simple in structure, the positions of the bent flexible circuit boards can be detected by utilizing the circuit position scribed lines, the alignment accuracy is improved, and the problem of distinguishing and classifying methods when liquid crystal modules need to be classified according to different bending accuracies is solved.
For ease of understanding, the following first briefly describes the principles of a ferrous object according to an embodiment of the invention:
as described above, the flexible circuit board or the printed wiring board on the liquid crystal display panel is in contact with one side of the iron member and bent to the other side thereof along the edge of the iron member. In the prior art, alignment lines are usually formed on the iron parts along the contour of the flexible circuit board or the printed circuit board, and then the flexible circuit board or the printed circuit board is bent. However, the inventor finds that the alignment accuracy of the bent flexible circuit board or printed circuit board is not easy to identify: because the surface of the iron part is not provided with a positioning hole, an injection molding glue pulling structure and the like generally, the surface of the iron part is difficult to judge whether the bending position of the flexible circuit board deviates or not depending on other structures on the surface of the iron part; in addition, for different models of display products, the specific position of the flexible circuit board after bending is required to be different. The components with low alignment accuracy may cause the offset problem of the flexible printed circuit board or the printed circuit board, and if the components with low alignment accuracy are applied to the display device, the yield of the display device may be low and the quality of the display device may be poor. In severe cases, it will lead to a situation where the flexible circuit board is not able to achieve connection with other electronic components. However, as described above, since the offset of the flexible printed circuit board is difficult to be found and adjusted at the first time after the winding and bending, when the offset of the flexible printed circuit board is found, the manufacturing process is usually carried out to the subsequent step of connecting the electronic component, and thus the position of the flexible printed circuit board cannot be adjusted.
According to the embodiment of the invention, the circuit position scribing line is arranged on one side of the iron piece, and after the flexible circuit board or the printed circuit board is bent along the edge of the iron piece, the position relation between the edge of the flexible circuit board or the printed circuit board and the circuit position scribing line can be identified by naked eyes. Therefore, after the flexible circuit board is bent (U-shaped) to the back side of the iron piece, whether the bending of the flexible circuit board deviates or not is judged, so that the flexible circuit board can be adjusted in time.
The specific arrangement position, arrangement mode, shape of the scribe lines and the like of the plurality of circuit position scribe lines are not particularly limited, and those skilled in the art can select the position according to actual conditions as long as whether the flexible printed circuit board after being U-folded is shifted or not can be judged by using the circuit position scribe lines. For example, according to an embodiment of the present invention, the plurality of circuit position scribe lines may be a plurality of straight lines arranged in parallel.
According to the embodiment of the invention, the circuit position scribes can respectively correspond to the bending positions of the flexible circuit board required by display products of different models. Therefore, whether the deviation occurs in the U-folding process can be simply judged by judging whether the edge of the flexible circuit board is superposed with the scribed line at the circuit position. That is, when the circuit position scribe lines are straight lines parallel to each other and the edge of the flexible circuit board or the printed circuit board is parallel to the circuit position scribe line, the above components have high alignment accuracy and can be applied to a display device. When the edge of the flexible circuit board or the printed circuit board is not parallel to the circuit position scribed line, the parts have lower alignment accuracy, and the flexible circuit board or the printed circuit board can deviate, so that the flexible circuit board or the printed circuit board can be bent again by adjusting the production process to have higher alignment accuracy, and then the flexible circuit board or the printed circuit board can be applied to a display device. In addition, according to the embodiment of the invention, the liquid crystal module can be classified according to the alignment precision of the bent flexible circuit board or printed circuit board. The distinguishing and classifying method is simple and convenient, so that the classifying efficiency can be improved.
The respective structures of the iron member will be described in detail below according to specific embodiments of the present invention:
according to an embodiment of the present invention, referring to fig. 2, both sides of the base body 100 have flexible circuit board arrangement regions 110 (shown in dotted lines). As will be understood by those skilled in the art, the flexible circuit board mounting area 110 is used for mounting a flexible circuit board, which is located at a middle position between the liquid crystal display panel and the iron member and is fixed to the liquid crystal display panel. According to the embodiment of the present invention, the side of the iron member disposed corresponding to the liquid crystal display panel is the side where the circuit position scribe lines 200 are not disposed (as shown in the right drawing). According to the embodiment of the present invention, the flexible circuit board mounting regions 110 respectively located at both sides of the base 100 extend to the same edge of the base 100. Thereby, the flexible circuit board disposed in the flexible circuit board disposition region can be bent along the edge. According to an embodiment of the present invention, the edge is a circuit position scribe line reference edge 120, and the plurality of parallel aligned circuit position scribe lines 200 are parallel to the circuit position scribe line reference edge 120. Therefore, after the flexible circuit board is bent along the circuit position scribing reference edge, the alignment accuracy of the flexible circuit board can be recognized through naked eyes, and the flexible circuit board is simple, convenient and accurate.
Referring to fig. 3 and the left view shown in fig. 2, an edge of the flexible circuit board placement area 110 on the side where the circuit location score line 200 is placed is parallel to the circuit location score line 200, according to an embodiment of the present invention. Therefore, the alignment accuracy of the flexible circuit board can be detected through naked eyes. That is, according to the iron member of the embodiment of the present invention, the starting position of the U-folding of the flexible printed circuit board 600 can be determined by the circuit position scribing reference edge 120, and the position of the U-folded flexible printed circuit board 600 can be determined by the plurality of circuit position scribing lines 200, so that it can be easily determined whether the flexible printed circuit board 600 is shifted during the U-folding process. Also, since the iron has a plurality of circuit position scribe lines 200, the iron can be applied to different models of display devices.
According to the embodiment of the invention, in order to improve the alignment accuracy after the flexible circuit board is bent, the distances between the circuit position scribe lines 200 need to be designed. If the distance between the circuit position scribe lines 200 is large, the distance between the edge of the flexible circuit board and the circuit position scribe line 200 is large after the flexible circuit board is bent, which causes inaccurate alignment, and thus, the flexible circuit board may still shift. If the distance between the scribe lines 200 for a plurality of circuit positions is small, it is difficult to visually recognize the circuit positions, and alignment inaccuracy may be caused, so that the flexible circuit board may be shifted. According to the embodiment of the invention, the distance between the scribe lines of the plurality of circuit positions can be 0.1-0.15 cm (shown as H in FIG. 2). Therefore, the detection is convenient, and the alignment accuracy is improved. According to an embodiment of the present invention, the circuit position scribe line 200 on the substrate 100 may also have scale marks. Therefore, when the liquid crystal module is classified by using the alignment precision, the discrimination is simpler and more convenient, and the classification efficiency is improved.
According to the embodiment of the invention, in order to further improve the alignment accuracy after the flexible circuit board is bent, the width of the circuit position scribe line 200 needs to be designed. If the width of the circuit position scribe line 200 is large, the alignment of the flexible circuit board after bending may be inaccurate. If the width of the circuit position scribe line 200 is small, it is difficult to visually identify the circuit position scribe line, and the alignment of the flexible circuit board after bending is not accurate. According to an embodiment of the present invention, the width of the circuit position scribe line 200 may be 0.02-0.06 cm (d as shown in FIG. 2). Therefore, the detection is convenient, and the alignment accuracy is further improved.
The process for preparing the circuit position scribe line is not particularly limited, and can be designed by those skilled in the art according to actual situations. For example, the circuit location scribe lines 200 may be formed by a stamping process or an etching process performed on the substrate 100, according to embodiments of the present invention. According to an embodiment of the present invention, the stamping process may be used to simultaneously prepare the ferrous object and the circuit location score lines 200 on the ferrous object. Therefore, the iron piece with the circuit position scribing line can be synchronously formed, and the production process is simplified.
According to embodiments of the present invention, the circuit location scribe line 200 can be a groove located on the substrate 100. Therefore, the human eyes can conveniently recognize the alignment position, and the alignment accuracy is improved. According to the embodiment of the invention, the groove can be prepared together through a stamping process in the process of preparing the iron piece, and can also be prepared through an etching process after the iron piece is prepared. The depth of the groove is not particularly limited as long as it is smaller than the thickness of the iron member, and those skilled in the art can design it as the case may be.
In another aspect of the present invention, a display device is provided. According to an embodiment of the present invention, the display device includes the above-described iron member, and thus, the display device has all the features and advantages of the above-described iron member, which will not be described herein again. In general, the display device has higher quality and yield.
In another aspect of the present invention, a stamping die for manufacturing an iron article is provided. According to an embodiment of the present invention, referring to fig. 4, the press die includes: an upper mold 400 and a lower mold 300. Wherein the lower mold 300 is adapted to cooperate with the upper mold 400 and define the iron receiving space 10, and at least one of the upper mold 400 and the lower mold 300 is provided with a scribing portion 500 for forming a plurality of circuit position scribes. Therefore, the iron piece with the circuit position scribing line can be prepared by using the stamping die.
According to the embodiment of the invention, the iron piece with the circuit position scribing line can be synchronously prepared by utilizing the stamping die. Therefore, the preparation process is simple and convenient to implement. According to an embodiment of the present invention, the upper mold 400 and the lower mold 300 define the iron receiving space 10 for placing a blank for preparing the iron. In the preparation process, firstly, an iron piece blank is placed in the iron piece accommodating space 10 defined by the upper die 400 and the lower die 300, and then the upper die 400 and the lower die 300 are clamped and given appropriate pressure, so that the preparation of the iron piece with the circuit position scribed lines is synchronously completed.
According to embodiments of the present invention, the scribing portion 500 for preparing the circuit position scribe line may be located in the upper mold 400, or may also be located in the lower mold 300. According to a specific embodiment of the present invention, the scribed line portion may be located in the upper mold 400 (left view as shown in fig. 3). According to embodiments of the present invention, the circuit location score lines are grooves on the substrate, and thus, the score line portions used to prepare the circuit location score lines can be protrusions. Thus, a circuit location scribe line that is convenient for visual identification can be prepared.
In the description herein, references to the description of "one embodiment," "another embodiment," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (6)
1. An iron member, comprising:
the flexible printed circuit board comprises a base body, wherein both sides of the base body are provided with flexible printed circuit board arrangement areas; the flexible circuit board arrangement areas respectively located on two sides of the substrate extend to the same edge of the substrate, the same edge is a circuit position scribing reference edge, and the substrate is provided with side edges perpendicular to the circuit position scribing reference edge;
the surface of one side of the substrate is provided with a plurality of circuit position scribed lines, and the circuit position scribed lines are used for judging whether the flexible circuit board or the printed circuit board deviates or not after the flexible circuit board or the printed circuit board is bent along the edge of the iron piece; the flexible circuit board or the printed circuit board is provided with a tail end extending towards the outer side of the base body after being bent, and the tail end extends towards the side edge;
the circuit position scribed lines are arranged in parallel, the spacing distance between the tail end of each circuit position scribed line and the side edge gradually decreases towards the direction away from the circuit position scribed line reference edge, and the circuit position scribed line farthest from the circuit position scribed line reference edge is positioned outside the flexible circuit board arrangement area;
the circuit position reticle reference edge is parallel to the circuit position reticle.
2. The ferrous part of claim 1, characterized in that the spacing between the plurality of circuit location scorelines is 0.1-0.15 cm.
3. The ferrous part of claim 1, characterized in that the width of the circuit location score line is 0.02 to 0.06 cm.
4. The ferrous part of claim 1, characterized in that the circuit location score line is formed by stamping or etching the substrate.
5. The ferrous part of claim 4, characterized in that the circuit location score line is a groove located on the base.
6. A display device, characterized in that the display device comprises an iron member according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710882166.4A CN107608102B (en) | 2017-09-26 | 2017-09-26 | Iron part, display device and stamping die for preparing iron part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710882166.4A CN107608102B (en) | 2017-09-26 | 2017-09-26 | Iron part, display device and stamping die for preparing iron part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107608102A CN107608102A (en) | 2018-01-19 |
| CN107608102B true CN107608102B (en) | 2021-02-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710882166.4A Expired - Fee Related CN107608102B (en) | 2017-09-26 | 2017-09-26 | Iron part, display device and stamping die for preparing iron part |
Country Status (1)
| Country | Link |
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| CN (1) | CN107608102B (en) |
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| CN202433637U (en) * | 2011-12-28 | 2012-09-12 | Tcl显示科技（惠州）有限公司 | Iron frame of liquid crystal display module and liquid crystal display module |
| CN203616550U (en) * | 2013-09-22 | 2014-05-28 | 武汉天马微电子有限公司 | Backlight module and liquid crystal display device |
| CN104678623A (en) * | 2013-11-30 | 2015-06-03 | 无锡博一光电科技有限公司 | Backlight FPC bending positioning structure |
| CN205229618U (en) * | 2015-12-20 | 2016-05-11 | 江西合力泰科技有限公司 | Display module assembly that FPC accurate positioning is being shaded |
| CN206002803U (en) * | 2016-08-05 | 2017-03-08 | 硕诺科技（深圳）有限公司 | A kind of liquid crystal display module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103129079A (en) * | 2013-03-18 | 2013-06-05 | 烟台正海科技有限公司 | Touch panel window back protecting film and bonding scheme |
| CN105974638B (en) * | 2016-07-26 | 2019-06-28 | 京东方科技集团股份有限公司 | A kind of display base plate and display device |
| CN106990588B (en) * | 2017-06-02 | 2019-10-01 | 厦门天马微电子有限公司 | A kind of display panel and display device |
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2017
- 2017-09-26 CN CN201710882166.4A patent/CN107608102B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070050667A (en) * | 2005-11-11 | 2007-05-16 | 삼성전자주식회사 | Bottom chassis for flat panel display and method for attaching flexible printed circuit board using the same |
| CN202433637U (en) * | 2011-12-28 | 2012-09-12 | Tcl显示科技（惠州）有限公司 | Iron frame of liquid crystal display module and liquid crystal display module |
| CN203616550U (en) * | 2013-09-22 | 2014-05-28 | 武汉天马微电子有限公司 | Backlight module and liquid crystal display device |
| CN104678623A (en) * | 2013-11-30 | 2015-06-03 | 无锡博一光电科技有限公司 | Backlight FPC bending positioning structure |
| CN205229618U (en) * | 2015-12-20 | 2016-05-11 | 江西合力泰科技有限公司 | Display module assembly that FPC accurate positioning is being shaded |
| CN206002803U (en) * | 2016-08-05 | 2017-03-08 | 硕诺科技（深圳）有限公司 | A kind of liquid crystal display module |
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| CN107608102A (en) | 2018-01-19 |
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