CN105785615A - Substrate cutting method and substrate cutting device - Google Patents
Substrate cutting method and substrate cutting device Download PDFInfo
- Publication number
- CN105785615A CN105785615A CN201610347153.2A CN201610347153A CN105785615A CN 105785615 A CN105785615 A CN 105785615A CN 201610347153 A CN201610347153 A CN 201610347153A CN 105785615 A CN105785615 A CN 105785615A
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- Prior art keywords
- cutting
- cut
- colored filter
- daughter board
- boards
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133302—Rigid substrates, e.g. inorganic substrates
Abstract
The invention discloses a substrate cutting method. The cutting method comprises the following steps: aligning a mother board; carrying out primary cutting: continuously cutting the mother board into a plurality of sub-boards, wherein widths of allay substrates of all the sub-boards are cut according to a first size, the widths of color filters of a row of sub-boards close to a preset reference object are cut according to a second size, the widths of the color filters of the other sub-boards except the row of sub-boards close the preset reference object are cut according to the first size, and therefore, the color filters of the corresponding sub-boards are staggered from the allay substrates by a preset waste size; and carrying out secondary cutting, namely cutting the color filters, protruding the array substrates, on the sub-boards except the row of sub-boards close the preset reference object. The invention further discloses a substrate cutting device. According to the method and the device, the cutting procedure of a substrate is finished through two procedures, the mother board is primarily cut into multiple sub-boards, and waste can be smoothly and cleanly cut after the secondary cutting, so that the phenomenon that the waste is remained at the end part in the cutting process is avoided.
Description
Technical field
The present invention relates to Display Technique field, particularly relate to cutting method and the device of a kind of substrate.
Background technology
Liquid crystal display (LiquidCrystalDisplay, LCD) it has been widely used in various electronic product, liquid crystal display major part is backlight liquid crystal display, and it is made up of display panels and backlight module (backlightmodule).Display panels is made up of two panels transparency carrier and the liquid crystal that is enclosed between substrate.In the processing procedure of display floater, one piece of large substrate can be cut into the multiple base board units being appropriately sized.
Currently used as the cutting method of substrate cut relatively common be chiasma type cutting method, specifically first by a certain cut direction, baseplate material cut into multiple list structure, more each list structure is cut into base board unit one by one along another predetermined cuts direction.But, single base board unit array base palte (TFT) and the area of colored filter (CF) differing, the two end face is also not exclusively coplanar, need repeatedly to cut, after causing that cutting completes, often having waste wood to remain in the end of base board unit, the process removing waste wood also can cause the damage of base board unit unavoidably, makes base board unit scrap.
Summary of the invention
In view of the deficiency that prior art exists, the invention provides the cutting method of a kind of substrate and device, it is possible to solve the problem that cutting metacoxal plate waste wood residual rate is too high, reach the effect of 100% removal substrate waste wood.
In order to realize above-mentioned purpose, present invention employs following technical scheme:
A kind of cutting method of substrate, including:
Motherboard para-position step: place motherboard along predetermined reference object；
Cut first: described motherboard is cut into some daughter boards continuously, wherein, the width of the array base palte of all daughter boards cuts by first size, width near the colored filter of the string daughter board of described predetermined reference object cuts by the second size, except the width of the colored filter of other daughter boards except the string daughter board of described predetermined reference object cuts by described first size, make the waste material size that the described colored filter of corresponding daughter board staggers predetermined with described array base palte；
Secondary cuts: by except other daughter board epireliefs except the string daughter board of described predetermined reference object are for the colored filter excision of the predetermined waste material size of array base palte.
As one of which embodiment, described cutting first includes:
First cuts and crosses step: cuts described motherboard along the first direction intersected and second direction, forms the first cutting line along described first direction and the second cutting line along described second direction on described motherboard；
First sliver step: described motherboard is cut into some daughter boards along described first cutting line and described second cutting line.
As one of which embodiment, described secondary cuts and includes:
Second cuts and crosses step: the daughter board that colored filter protrudes from array base palte is chosen, and its colored filter protrudes from the part cutting of array base palte, forms threeth cutting line corresponding with array base palte border on corresponding colored filter；
Second sliver step: removed by color filter portion unnecessary for the corresponding daughter board chosen along described 3rd cutting line, forms the base board unit that less colored filter is stacked on bigger array base palte to form.
As one of which embodiment, described first direction is vertical with described second direction.
As one of which embodiment, the cutting method of described substrate also includes taking sheet step first, for being peeled off and be carried to ad-hoc location by daughter board without waste wood after described first sliver step process.
As one of which embodiment, the described sheet step that takes first also includes to rotate to specific direction without the daughter board of waste wood after described first sliver step process.
As one of which embodiment, the cutting method of described substrate also includes again taking sheet step, for being peeled off and be carried to ad-hoc location by the described base board unit after described second sliver step process.
As one of which embodiment, the described sheet step that again takes includes also rotating the daughter board after described second sliver step process to specific direction.
Fracture for applying blanking pressure at corresponding cutting line place as one of which embodiment, described first sliver step and/or the splinter method in described second sliver step.
Another object of the present invention is to provide the cutter sweep of a kind of substrate, including pan feeding assembly, first cut unit and second and cut unit, the motherboard sent into is after described pan feeding assembly place machinery para-position, first cut unit by described first and cut into several daughter boards, then cut the colored filter of redundance in unit excision daughter board by described second.
The present invention is by completing the cutting process of substrate with two procedures, and motherboard forms some daughter boards after cutting first, secondary cuts and can ensure that waste material is cut out with a snap, it is to avoid cutting waste material in process remains in the phenomenon of end.
Accompanying drawing explanation
Fig. 1 is the structural representation of base board unit.
Fig. 2 is the principle schematic of the cutting method of the substrate of the embodiment of the present invention.
Fig. 3 is the cutting track schematic diagram of the motherboard of the embodiment of the present invention.
Fig. 4 is the cutting part schematic diagram of the substrate of the embodiment of the present invention.
Fig. 5 is the first time cutting assembly cutting part schematic diagram of the substrate of the embodiment of the present invention.
Fig. 6 is the first time sliver assembly sliver position schematic diagram of the substrate of the embodiment of the present invention.
The secondary that Fig. 7 is the substrate of the embodiment of the present invention cuts principle schematic.
Fig. 8 is the structural representation of the cutter sweep of the substrate of the embodiment of the present invention.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is described in more detail.Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
Consult Fig. 1, usual motherboard cut after the base board unit that finished product is specific dimensions and shape one by one 100, each base board unit 100 includes colored filter 101 and the array base palte 102 of stacked on top, array base palte 102 therein be sized larger than colored filter 101, and colored filter 101 is coplanar with the side of the width of array base palte 102, opposite side is stepped.
Shown in Fig. 2～Fig. 7, the method for dividing substrate of the present invention includes:
Motherboard para-position step: place motherboard 10 along predetermined reference object；
Cut first: motherboard 10 is cut into some daughter boards continuously, wherein, the width of the array base palte of all daughter boards cuts by first size L, width near the colored filter of the string daughter board of predetermined reference object cuts by the second size l, except the width of the colored filter of other daughter boards except the string daughter board of predetermined reference object cuts by first size L, make the waste material size L-l (such as Fig. 5 and Fig. 6) that the colored filter of corresponding daughter board staggers predetermined with array base palte；
Secondary cuts: by except other daughter board epireliefs except the string daughter board of predetermined reference object are for colored filter excision (such as Fig. 7) of the predetermined waste material size L-l of array base palte.
Wherein, cut first and include first and cut and cross step and the first sliver step.
In conjunction with Fig. 3 and Fig. 5, first cuts and crosses step specifically: cut motherboard 10 along the first direction X intersected and second direction Y, forms the second cutting line Y0 of the first cutting line X0 and Y in a second direction of X in the first direction on motherboard 10；
Such as Fig. 6, the first sliver step specifically: along the first cutting line X0 and the second cutting line Y0, motherboard 10 is cut into some daughter boards.
In conjunction with Fig. 3 and Fig. 7, secondary cuts and includes second and cut and cross step and the second sliver step.
Second cuts and crosses step specifically: the daughter board that colored filter protrudes from array base palte is chosen, and its colored filter is protruded from part (the i.e. waste material size L-l part) cutting of array base palte, corresponding colored filter is formed threeth cutting line corresponding with array base palte border；
Second sliver step is specifically: removed by color filter portion unnecessary for the corresponding daughter board chosen along the 3rd cutting line Y1, forms the base board unit 100 that less colored filter is stacked on bigger array base palte to form.
For cutting out the base board unit profile of rectangle, the first direction X of the present embodiment is vertical with second direction Y.It is understood that in other embodiments, first direction X and second direction Y can be adjusted according to the demand of cutting.
As one of which embodiment, the cutting step of substrate also includes taking sheet step first and again taking sheet step, take sheet step first can include rotating to specific direction/and be carried to ad-hoc location without the daughter board of waste wood after the first sliver step process, again take sheet step and can include the base board unit 100 after by the second sliver step process and peel off rotation to specific direction or/and be carried to ad-hoc location.
Fracture for applying blanking pressure at corresponding cutting line place as one of which embodiment, the first sliver step and/or the splinter method in the second sliver step.
For motherboard being cut into the base board unit 100 of numerous regulatory specifications, implement above-mentioned cutting process, embodiments provide the cutter sweep of a kind of substrate, as shown in Figure 8, this cutter sweep includes pan feeding assembly 1, first cuts unit 2 and second cuts unit 3, send into the motherboard 10 of cutter sweep after pan feeding assembly 1 place carries out machinery para-position, first being cut unit 2 by first cuts into several daughter boards, cut unit 3 by second again and excise the colored filter of redundance in daughter board, if desired, discharge component 4 also can be set, it is correspondingly arranged at first to cut unit 2 and second and cut unit 3 downstream, the base board unit 100 excised is carried or direction adjustment.
For completing corresponding technique, pan feeding assembly 1, first cut unit 2, second cut unit 3, discharge component 4 respectively corresponding " motherboard para-position ", " cutting first ", " secondary cuts ", " take sheet step first and again take sheet step ".Wherein, the first discharge component 4a and the second discharge component 4b correspondence respectively take sheet step first and again take sheet step.
First cuts unit 2 is mainly used in motherboard 10 is cut into some daughter boards, including the first cutting assembly 2a and the first sliver assembly 2b, first cutting assembly 2a therein includes top cutter and bottom knife, is respectively cut formation cutting line for the correspondence position on the two sides of motherboard 10；First sliver assembly 2b is staking punch, completes to cut for applying stamping press at corresponding cutting line place.Wherein, top cutter, bottom knife, staking punch can be all multiple, it is possible to work raising cutting efficiency simultaneously.
Second cuts unit 3 is mainly used in excision first and cuts after unit 2 cuts, the color filter portion that part daughter board protrudes above, including the second cutting assembly 3a and secondary fissure chip module 3b, second cutting assembly 3a is bottom knife, for cutting color filter portion unnecessary on daughter board, drawing cutting line bottom it, secondary fissure chip module 3b is staking punch, cuts for completing colored filter at corresponding cutting line place applying stamping press.It is understood that the blade of the first cutting assembly 2a, the second cutting assembly 3a can also be the emery wheel of high speed rotating.
Discharge component 4 includes the first discharge component 4a and the second discharge component 4b, first discharge component 4a is positioned at by the first sliver assembly 2b, and the qualified base board unit 100 after the first sliver assembly 2b punching press can be rotated by the first discharge component 4a by the particular demands in downstream or carry；Second discharge component 4b is positioned at by secondary fissure chip module 3b, secondary fissure chip module 3b cut after base board unit 100 all rotated by the second discharge component 4b by the particular demands in downstream or carry.Here, discharge component 4 can be rotating disk, transfer roller, conveyer belt etc..
During cutter sweep work, the motherboard 10 sent into is after the machinery para-position of pan feeding assembly 1 place, first formed the profile of multiple daughter board in the line of the two sides of motherboard 10 by the first cutting assembly 2a, and cut into some daughter boards by the first sliver assembly 2b, being cut out threeth cutting line corresponding with array base palte border on the colored filter that daughter board protrudes above by the second cutting assembly 3a again, the second last sliver assembly 3b removes the color filter portion protruded along the 3rd cutting line Y1.
The present invention is by completing the cutting process of substrate with two procedures, and motherboard forms some daughter boards after cutting first, secondary cuts and can ensure that waste material is cut out with a snap, it is to avoid cutting waste material in process remains in the phenomenon of end.
The above is only the detailed description of the invention of the application; it should be pointed out that, for those skilled in the art, under the premise without departing from the application principle; can also making some improvements and modifications, these improvements and modifications also should be regarded as the protection domain of the application.
Claims (10)
1. the cutting method of a substrate, it is characterised in that including:
Motherboard para-position step: place motherboard (10) along predetermined reference object；
Cut first: described motherboard (10) is cut into some daughter boards continuously, wherein, the width of the array base palte of all daughter boards cuts by first size (L), width near the colored filter of the string daughter board of described predetermined reference object cuts by the second size (l), except the width of the colored filter of other daughter boards except the string daughter board of described predetermined reference object cuts by described first size (L), make the waste material size (L-l) that the described colored filter of corresponding daughter board staggers predetermined with described array base palte；
Secondary cuts: by except other daughter board epireliefs except the string daughter board of described predetermined reference object are for the colored filter excision of the predetermined waste material size (L-l) of array base palte.
2. the cutting method of substrate according to claim 1, it is characterised in that described cutting first includes:
First cuts and crosses step: cut described motherboard (10) along the first direction (X) intersected and second direction (Y), at the upper formation the first cutting line (X0) along described first direction (X) of described motherboard (10) and the second cutting line (Y0) along described second direction (Y)；
First sliver step: described motherboard (10) is cut into some daughter boards along described first cutting line (X0) and described second cutting line (Y0).
3. the cutting method of substrate according to claim 2, it is characterised in that described secondary cuts and includes:
Second cuts and crosses step: the daughter board that colored filter protrudes from array base palte is chosen, and its colored filter protrudes from the part cutting of array base palte, forms threeth cutting line corresponding with array base palte border on corresponding colored filter；
Second sliver step: removed by color filter portion unnecessary for the corresponding daughter board chosen along described 3rd cutting line (Y1), forms the base board unit (100) that less colored filter is stacked on bigger array base palte to form.
4. the cutting method of substrate according to claim 2, it is characterised in that described first direction (X) is vertical with described second direction (Y).
5. the cutting method of substrate according to claim 2, it is characterised in that also include taking sheet step first, for peeling off daughter board without waste wood after described first sliver step process and be carried to ad-hoc location.
6. the cutting method of substrate according to claim 2, it is characterised in that the described sheet step that takes first also includes to rotate to specific direction without the daughter board of waste wood after described first sliver step process.
7. the cutting method of substrate according to claim 5, it is characterised in that also include again taking sheet step, for peeling off the described base board unit (100) after described second sliver step process and be carried to ad-hoc location.
8. the cutting method of substrate according to claim 5, it is characterised in that the described sheet step that again takes includes also rotating the daughter board after described second sliver step process to specific direction.
9. the cutting method according to the arbitrary described substrate of claim 3-8, it is characterised in that described first sliver step and/or the splinter method in described second sliver step fracture for applying blanking pressure at corresponding cutting line place.
10. the cutter sweep of a substrate, it is characterized in that, including pan feeding assembly (1), first cut unit (2) and second and cut unit (3), the motherboard (10) sent into is after described pan feeding assembly (1) place's machinery para-position, first cut unit (2) by described first and cut into several daughter boards, then cut the colored filter of redundance in unit (3) excision daughter board by described second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610347153.2A CN105785615A (en) | 2016-05-23 | 2016-05-23 | Substrate cutting method and substrate cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610347153.2A CN105785615A (en) | 2016-05-23 | 2016-05-23 | Substrate cutting method and substrate cutting device |
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| CN105785615A true CN105785615A (en) | 2016-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610347153.2A Pending CN105785615A (en) | 2016-05-23 | 2016-05-23 | Substrate cutting method and substrate cutting device |
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| CN (1) | CN105785615A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108107617A (en) * | 2016-11-25 | 2018-06-01 | 三星钻石工业股份有限公司 | Substrate disconnects system |
| CN113942128A (en) * | 2021-12-20 | 2022-01-18 | 河北鼎瓷电子科技有限公司 | Half cutting die of potsherd array |
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| CN1439926A (en) * | 2002-02-20 | 2003-09-03 | Lg.菲利浦Lcd株式会社 | Liquid-crystal display panel cutting method |
| CN101134639A (en) * | 2006-08-29 | 2008-03-05 | 精工爱普生株式会社 | Method of scribing stuck mother substrate and method of dividing stuck mother substrate |
| JP2009175307A (en) * | 2008-01-23 | 2009-08-06 | Seiko Epson Corp | Manufacturing method of electrooptical device, and electrooptical device |
| CN102057313A (en) * | 2008-06-17 | 2011-05-11 | 三星钻石工业股份有限公司 | Method for processing substrate of mother board |
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2016
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| CN1436642A (en) * | 2002-02-07 | 2003-08-20 | Lg.菲利浦Lcd株式会社 | Device for cutting liquid crystal display screen and method for cutting by the same device |
| CN1439926A (en) * | 2002-02-20 | 2003-09-03 | Lg.菲利浦Lcd株式会社 | Liquid-crystal display panel cutting method |
| CN101134639A (en) * | 2006-08-29 | 2008-03-05 | 精工爱普生株式会社 | Method of scribing stuck mother substrate and method of dividing stuck mother substrate |
| JP2009175307A (en) * | 2008-01-23 | 2009-08-06 | Seiko Epson Corp | Manufacturing method of electrooptical device, and electrooptical device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108107617A (en) * | 2016-11-25 | 2018-06-01 | 三星钻石工业股份有限公司 | Substrate disconnects system |
| CN108107617B (en) * | 2016-11-25 | 2023-01-03 | 三星钻石工业股份有限公司 | Substrate disconnection system |
| CN113942128A (en) * | 2021-12-20 | 2022-01-18 | 河北鼎瓷电子科技有限公司 | Half cutting die of potsherd array |
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