WO2015135448A1

WO2015135448A1 - Radio frequency identification tag and manufacturing method therefor

Info

Publication number: WO2015135448A1
Application number: PCT/CN2015/073853
Authority: WO
Inventors: 徐良衡; 杨凯; 肖松涛; 何晓栋
Original assignee: 上海天臣防伪技术股份有限公司
Priority date: 2014-03-10
Filing date: 2015-03-09
Publication date: 2015-09-17
Also published as: CN103839099B; CN103839099A

Abstract

Disclosed are a radio frequency identification tag and a manufacturing method therefor. The tag comprises a surface mark layer, an upper adhesion layer, a fragile radio frequency identification layer and a lower adhesion layer that are sequentially and mutually combined. The fragile radio frequency identification layer comprises a release layer, a radio frequency identification antenna, a chip, an isolating layer and a conducting layer. The isolating layer is provided with a chip hole and a vertically through bridge hole. The antenna is arranged on one side of the isolating layer, the conducting layer is located on the other side of the isolating layer, the chip is arranged in the chip hole, and the isolating layer is provided with small holes communicated with the chip hole and the bridge hole. The conducting layer penetrates through the bridge conducting hole and is connected to the antenna, and the chip is adhered to the radio frequency identification antenna by means of a conductive adhesive. The tag has good anti-fake performance and is free of the problem that conducting is affected by material rebounding and the like, so that the rate of finished products is greatly increased, and product cost is reduced.

Description

Radio frequency identification tag and preparation method thereof

Technical field

The invention relates to a radio frequency identification electronic tag and a preparation method thereof.

Background technique

Radio Frequency Identification (RFID) technology automatically recognizes target objects and acquires relevant data through radio frequency signals. The identification work requires no manual interference, can work in various environments, and can identify multiple tags at the same time, and the operation is quick and convenient. After 2004, RFID technology has developed vigorously and has broad application potential in the fields of warehousing logistics, product anti-counterfeiting, product circulation and product maintenance tracking. In the application of anti-counterfeiting products, RFID is called the new generation of "electronic guardian god" because of its safety, high efficiency, fast, large storage capacity and freely changed storage information.

At the same time, the radio frequency identification technology is unique because the UID code of the chip is global, the information is stable, the imitation is very high, can store a large amount of information, and can be easily read and written, so that the consumer can easily identify through the special identification device provided by the merchant. The identity of the goods, and can be used to achieve full tracking in the circulation of goods.

At present, radio frequency identification tags on the market, especially high-frequency radio frequency identification electronic tags, are mostly produced by using polyester film as a substrate, especially the currently widely used aluminum-etched radio frequency identification tag, in view of its aluminum etching process. The antenna cross-bridge conduction process and the chip bonding process are limited, and the prepared radio frequency identification electronic tags are processed by using a polyester material as a substrate. The polyester substrate provides good processability and stability for use in radio frequency identification electronic tags. However, due to the material properties of the polyester material, it has a certain resilience. The antenna prepared according to the conventional antenna bridge-pass conduction process After the passage of time or a certain external force, the antenna conduction point tends to decrease the conduction rate due to the rebound effect of the polyester material, which directly affects the yield of the high frequency radio frequency identification tag. This problem has always been an intractable problem in the industry.

In addition, radio frequency tags based on traditional polyester materials are difficult to be destroyed and are easily transferred and reused. The illegal elements can completely remove the radio frequency identification tags on the genuine goods without destroying their physical physics and chemistry. Structure, the label can still be read, and then attached to the counterfeit goods, it is difficult to distinguish from the real product, it loses its significance as anti-counterfeiting and logistics management.

Summary of the invention

It is an object of the present invention to provide a radio frequency identification tag and a method of fabricating the same that overcomes the above-discussed deficiencies of the prior art.

The radio frequency identification tag of the present invention comprises a face label layer, an upper bonding layer, a fragile radio frequency identification layer and a lower bonding layer which are sequentially combined with each other;

The fragile radio frequency identification layer includes a release layer, a radio frequency identification antenna, a chip, an isolation layer, and a conduction layer;

The isolation layer is provided with a chip hole and a bridge hole penetrating up and down, the radio frequency identification antenna is disposed at one side of the isolation layer, the conduction layer is located at the other side of the isolation layer, and the chip is disposed at In the hole of the chip, the isolation layer is provided with a small hole communicating with the hole of the chip and the hole of the bridge;

The conductive layer is connected to the antenna through the via via to form a closed loop, and the chip is bonded to the RFID antenna through a conductive adhesive.

Since the wireless identification tag of the present invention does not contain a support material that is difficult to break, the layers are easily broken, and therefore have good fragile properties, and cannot be reused when the label is pasted on the product. With good anti-counterfeiting performance.

At the same time, the present invention abandons the traditional bridge conduction process, and instead uses a printed conductive ink or a conductive resin to conduct the high-frequency radio frequency identification tag. Since the isolation layer of the present invention has a corresponding hole, the The printed conductive ink or conductive resin can be easily turned on with the etched antenna, and there is no problem that the material rebounds and the like affect the conduction, which greatly improves the product yield and reduces the product cost.

DRAWINGS

FIG. 1 is a schematic structural diagram of a radio frequency identification tag.

2 is a schematic structural view of a fragile radio frequency identification layer.

Figure 3 is a top plan view of a fragile radio frequency identification layer.

detailed description

Referring to FIG. 1, the radio frequency identification tag of the present invention comprises a surface standard layer 1, an upper bonding layer 71, a fragile radio frequency identification layer 2 and a lower bonding layer 72 which are sequentially combined with each other;

Referring to FIG. 2 and FIG. 3, the fragile radio frequency identification layer 2 includes a release layer 8, a radio frequency identification antenna 3, a chip 4, an isolation layer 5, and a conduction layer 6;

The isolation layer 5 is provided with a chip hole 10 and upper and lower through-

hole holes

91 and 92; the radio frequency identification antenna 3 is disposed at one side of the isolation layer 5, and the conduction layer 6 is located at the isolation layer On the other side of the chip 5, the chip 4 is disposed in the chip hole 10, and the upper portion thereof may be higher than the chip hole 10 or lower than the chip hole 10. The isolation layer is provided with the chip hole 10 and the bridge. The holes of the

holes

91 and 92 communicate with each other, the thickness of the isolation layer is 10 to 100 micrometers; the area of the chip holes 10 is 1 to 100 mm ² ; the area of the

bridge holes

91 and 92 is generally 1 to 200 mm ² ;

The conductive layer 6 completely or partially covers the

bridge holes

91 and 92, and is connected to the antenna 3 through the bridge via

holes

91 and 92 to form a closed loop. The chip 4 passes the conductive adhesive and the radio frequency. Identifying the antenna 3 to be bonded;

The radio frequency identification antenna 3 may be an aluminum etched antenna, a copper etched antenna, a conductive silver paste printed antenna, a conductive polymer printed antenna, an electroless copper plated antenna or a vacuum copper plated or a vacuum aluminized antenna;

The material of the isolation layer 5 is selected from an insulating polyester material, such as melamine alkyd resin, amino alkyd resin, epoxy resin, phenolic resin or rubber;

The material of the conductive layer 6 is conductive ink or conductive resin, and CATITON-801, 824 conductive silver paste, YH-CCI-601CA conductive ink, and B-3008 of Xinshengfeng Technology Co., Ltd. can be selected by Shengtian Electrochemical Co., Ltd. 3009 conductive silver paste, CCI-305 conductive silver paste from Chiyoda Electronic Technology Co., Ltd., FY-5600, 6600 conductive silver paste from Fuyin Electronic Technology Co., Ltd., Korea Changxing Paron-910 conductive silver paste;

The conductive adhesive is selected from a thermosetting conductive adhesive such as XH9850 of NAMIMS, 6998 of UNIONWELL or TB3373C of Sanken Company, or other commonly used thermosetting conductive adhesives, and has no special requirements. ;

The material of the face label layer can be made of paper or fragile paper, and the surface can be printed with graphic information or composite anti-counterfeiting technology, such as infrared anti-counterfeiting, ultraviolet anti-counterfeiting, directional retroreflective anti-counterfeiting, laser holographic anti-counterfeiting, thermal anti-counterfeiting, Polymer holographic anti-counterfeiting, etc.;

The material of the upper bonding layer 71 may be an acrylic adhesive, a urethane adhesive or an epoxy adhesive;

The material of the lower bonding layer 72 may be a pressure sensitive adhesive or a hot melt pressure sensitive adhesive or the like;

The material of the release layer 8 may be selected from a material having a low adhesion strength to the support layer, such as a silicone release agent, polystyrene, polymethyl methacrylate or the like;

The method for preparing a radio frequency identification tag according to the present invention includes the following steps;

(1) Coating a release material on a support material such as a polyester material to form a release layer 8, drying at 80 to 120 ° C for 1 to 5 minutes, preferably by infrared drying, and then preparing a wireless on the release layer 8 Radio frequency identification antenna 3;

The radio frequency identification antenna 3 can adopt "study of screen printing process parameters of smart tag antenna", "electronic tag RFID conductive ink and printed antenna technology", "three manufacturing methods of RFID antenna", and "gravure etching method to manufacture RFID antenna" 》, “Principles, Applications and Prospects of Electroless Plating”, “Introduction to Vacuum Aluminizing Process” and other methods reported in the literature;

(2) printing the isolation layer 5 on the radio frequency identification antenna 3 obtained in the step (1), and at the same time, the printed isolation layer 5 is provided with small holes communicating with the chip hole 10 and the

bridge holes

91 and 92;

(3) Printing a conductive layer 6 on the other side of the spacer layer 5, the conductive layer 6 completely or partially covering the

via holes

91 and 92 on the spacer layer 5, and the

via holes

91 and 92 and the isolation layer 5 The other side of the radio frequency identification antenna 3 is connected, and can be printed and printed by the printing method in the literature report of "Intelligent Label Antenna Screen Printing Process Parameters", "Electronic Label RFID Conductive Ink and Printed Antenna Technology" Layer 6;

(4) Bonding the chip to the radio frequency identification antenna 3 through a conductive adhesive, conductive adhesive The bonding agent is selected from thermosetting conductive adhesives such as XH9850 of Japan NAMICS, 6998 of UNIONWELL or TB3373C of Sanken Company, or other commonly used thermosetting conductive adhesives, without special requirements; heat curing temperature 120 to 200 ° C;

(5) Then, the material of the upper bonding layer 71a is applied on the side of the label layer to form the upper bonding layer 71, and then composited with the conductive layer 6, and the polyester material for supporting is peeled off after compounding, and finally The lower part of the release layer 8 is coated with the material of the adhesive 72, and after die-cutting, the radio frequency identification tag is obtained;

Alternatively, the material of the adhesive 72 is applied to the side of the conductive layer, and then the polyester material for support is peeled off, and the material of the adhesive layer 71 is applied on the side of the surface mark layer to form an upper paste. The junction layer 71 is then composited with the release layer 8, and after compounding, is die cut to form the final RFID tag with anti-transfer function.

Example 1

(1) coating the release material polystyrene with polyester material PET (polyethylene terephthalate) as the support layer, drying at 110 ° C for 3 minutes, using infrared drying to form the release layer 8, and then An aluminum etched antenna is prepared by etching on the surface of the release layer 8, and a preparation method reported in the literature such as "Manufacture of RFID antenna by gravure etching" may be employed;

(2) On the etched antenna formed in the step (1), the insulating layer melamine alkyd resin having an insulating property is printed to have a thickness of 30 μm; and the printed isolation layer has a chip hole 10 not covered and a bridge not covered. The holes of the

holes

91 and 92; the area of the chip hole 10 is larger than the chip area, which is 50 mm ² ; the area of the

bridge holes

91 and 92 is 30 mm ² ; the isolation layer covers the

bridge holes

91, 92 and the chip holes 10 The remaining antenna sections;

(3) printing a conductive layer 6 on the other side of the isolation layer. The material of the conductive layer 6 is FY-5600 conductive silver paste of Fuyin Electronic Technology Co., Ltd., and the conductive layer partially covers the bridge hole 91A on the isolation layer. And 92B; the conductive layer can be printed by a printing method in a literature report such as "Study on Screen Printing Process Parameters of Smart Label Antenna", "Electronic Label RFID Conductive Ink and Printed Antenna Technology";

(4) Bonding the chip to the etched antenna through a conductive adhesive, the bonding point of the bonding point on the isolation layer is within the chip hole 10; the conductive adhesive is selected from the thermosetting conductive adhesive Japan NAMICS company's XH9850; heat curing temperature is 160 ° C;

(5) Then, the material of the adhesive layer 71 is applied on one side of the surface layer printed with the graphic information, the polyurethane adhesive is selected to form the upper bonding layer 71, and then composited with the conductive layer 6, and then After the polyester material for support is peeled off, the lower adhesive layer 72 is applied to the lower part of the release layer, and a pressure sensitive adhesive is selected, which is die-cut to form a final radio frequency identification tag having an anti-transfer function.

Example 2

(1) Using polyester material PET (polyethylene terephthalate) as the support layer, coating the release material silicone release agent, drying at 120 ° C for 5 minutes, using infrared drying to form the release layer 8 Then, the printed antenna is prepared by screen printing on the surface of the release layer, and the preparation method reported in the literature such as "Electronic Label RFID Conductive Ink and Printed Antenna Technology" can be used;

(2) On the formed printed antenna of the step (1), an insulating layer epoxy resin having an insulating property is printed to have a thickness of 40 μm; and the printed isolation layer has a chip hole 10 not covered and a bridge not covered. The holes of the

holes

91 and 92; the area of the chip hole 10 is larger than the chip area, which is 30 mm ² ; the area of the bridge holes 91 and 92 is 40 mm ² ; the isolation layer covers the rest except the bridge holes 91, 92 and the chip hole 10. Antenna section

(3) printing a conduction layer on the other side of the isolation layer, the conductive layer material is selected from Korea Changxing Paron-910 conductive silver paste, and the conduction layer completely covers the hole of the bridge conduction point exposed on the isolation layer. 91 and 92; the conductive layer can be printed by a printing method in a literature report such as "Study on Screen Printing Process Parameters of Smart Tag Antenna", "Electronic Label RFID Conductive Ink and Printed Antenna Technology";

(4) Bonding the chip to the etched antenna through a conductive adhesive, the bond point on the isolation layer is exposed within the chip hole 10; the conductive adhesive is selected from the thermosetting conductive adhesive Japan NAMICS The company's XH9850; heat curing temperature is 160 ° C;

(5) Finally, in the same manner as in Embodiment 1, a radio frequency identification tag having an anti-transfer function is obtained.

Example 3

(1) Coating the release material polymethyl methacrylate with polyester material PET (polyethylene terephthalate) as the support layer, drying at 80 ° C for 5 minutes, using infrared drying to form release Layer 8, and then copper plating antenna is prepared by electroless copper plating on the surface of the release material, and the preparation method reported in the literature such as "Principles, Applications and Prospects of Electroless Copper Plating" can be used;

(2) Printing a barrier phenolic resin having an insulating property on the formed copper-plated antenna of the step (1) to a thickness of 50 μm; and simultaneously printing the insulating layer without covering the chip hole 10 and not covering the bridge hole 91. And the small hole of 92; the area of the chip hole 10 is larger than the chip area, which is 70 mm ² ; the area of the

bridge hole

91 and 92 is 80 mm ² ; except for the

bridge hole

91, 92, the chip hole 10, the isolation layer covers the remaining antenna section;

(3) printing a conductive layer on the other side of the isolation layer, the conductive layer material is selected from Korea Changxing Paron-910 conductive silver paste, and the conduction layer completely covers the over-bridge conduction point exposed on the isolation layer. Bridge holes 91 and 92; the conductive layer can be printed by the printing method in the literature report such as "Study on Screen Printing Process Parameters of Smart Tag Antenna", "Electronic Label RFID Conductive Ink and Printed Antenna Technology";

(4) Bonding the chip to the etched antenna through a conductive adhesive, the bonding point of the bonding point on the isolation layer is within the chip hole 10; the conductive adhesive is selected from the thermosetting conductive adhesive UNINWELL 6998; heat curing temperature is 180 ° C;

(5) Then, the preparation was carried out in the same manner as in Example 1, in which the face label layer was printed with graphic information and combined with ultraviolet anti-counterfeiting technology to obtain a product.

Example 4

(1) coating the release material polystyrene with polyester material PET (polyethylene terephthalate) as the support layer, drying at 110 ° C for 3 minutes, forming the release layer 8 by infrared drying, and then The surface of the release material is prepared by etching to form an aluminum etched antenna, and the preparation method reported in the literature such as "Manufacture of RFID antenna by gravure etching method" can be used;

(2) printing an insulating layer aminoalkyd resin having an insulating property on the formed etched antenna of the step (1) to a thickness of 60 μm; and the printed isolation layer has a hole not covering the chip 10 and not covering the bridge hole The holes of the 91 and 92; the area of the chip hole 10 is larger than the chip area, which is 60 mm ² ; the areas of the

holes

91 and 92 are both 40 mm ² ; the isolation layer covers the remaining antennas except for the bridge holes 91, 92 and the chip chip hole 10. section;

(3) printing a conductive layer on the other side of the isolation layer, the conductive layer material is selected from YH-CCI-601CA conductive ink of Shengtian Electrochemical Co., Ltd., and the conductive layer partially covers the isolation layer at the same time. Through the bridge holes 91 and 92; the conductive layer can be printed by the printing method in the literature report such as "Study on Screen Printing Process Parameters of Smart Label Antenna", "Electronic Label RFID Conductive Ink and Printed Antenna Technology";

(4) bonding the chip to the etched antenna through a conductive adhesive, the bonding point is located in the chip bonding point chip hole 10 exposed on the isolation layer; the conductive adhesive is selected from the thermosetting conductive adhesive UNNIWELL 6998; heat curing temperature is 180 ° C;

(5) Applying the adhesive 72 to the side of the above-mentioned conductive layer, selecting a material of the pressure-sensitive adhesive, and then peeling off the PET material for supporting, and applying the adhesive on the side of the surface layer. The bonding material is selected from a polyurethane adhesive and then composited with the release layer. After compounding, it is die-cut to form the final RFID tag with anti-transfer function. The surface layer is printed with graphic information and composite laser holography. Anti-counterfeiting technology.

Example 5

(1) Coating the release material polystyrene with polyester material PET (polyethylene terephthalate) as the support layer, drying at 110 ° C for 3 minutes, using infrared drying, and then using on the surface of the release material. The aluminum etching antenna is prepared by etching, and the preparation method reported in the literature such as "grid etching method for manufacturing RFID antenna" can be used;

(2) printing an insulating layer amino alkyd resin having an insulating property on the formed etched antenna of the step (1) to a thickness of 100 μm; and simultaneously printing the insulating layer without covering the chip hole 10 and not covering the bridge hole The aperture of the chip hole 10 is larger than the chip area, which is 80 mm ² ; the area of the

bridge hole

91 and 92 is 70 mm ² ; except for the bridge hole 91A, 92B, the chip hole 10, the isolation layer covers the rest Antenna section

(3) printing a conduction layer on the other side of the isolation layer, the conductive layer material is selected from the CATITON-801 conductive silver paste of Shengtian Electrochemical Co., Ltd., and the conduction layer completely covers the bridge conduction point exposed on the isolation layer at the same time.

Holes

91 and 92; can be printed with "smart label antenna screen printing process parameters", "electronic label RFID conductive ink and printed antenna technology" and other printing methods in the literature printed conductive layer;

(4) bonding the chip to the etched antenna through a conductive adhesive, the bonding point is located in the chip hole 10 on the isolation layer; the conductive adhesive is selected from the thermosetting conductive adhesive UNNIWELL 6998; the heat curing temperature is 180 ° C;

(5) Then, the preparation was carried out in the same manner as in Example 4, wherein the material of the lower adhesive 72 was a hot melt pressure sensitive adhesive, and the surface mark layer was printed with graphic information and composite laser holographic anti-counterfeiting technology.

Claims

a radio frequency identification tag, comprising: a face label layer (1), an upper bonding layer (71), a fragile radio frequency identification layer (2) and a lower bonding layer (72) which are sequentially combined with each other;

The fragile radio frequency identification layer (2) includes a release layer (8), a radio frequency identification antenna (3), a chip (4), an isolation layer (5), and a conduction layer (6);

The isolation layer (5) is provided with a chip hole (10) and a through-hole via hole (91) and (92); the radio frequency identification antenna (3) is disposed on one side of the isolation layer (5). The conductive layer (6) is located on the other side of the isolation layer (5), and the chip (4) is disposed in the chip hole (10). The isolation layer is provided with a chip hole (10) and a bridge hole. (91) and (92) communicating small holes, the conduction layer (6) is connected to the antenna (3) through the bridge via holes (91) and (92), and the chip (4) is electrically conductive The adhesive is bonded to the RFID antenna (3).
The line radio frequency identification tag according to claim 1, wherein the chip (4) is disposed in the chip hole (10), and an upper portion thereof is higher than the chip hole (10) or lower than the chip hole (10) 10).
A line radio frequency identification tag according to claim 1 wherein said conductive layer (6) completely or partially covers the bridge holes (91) and (92).
The line radio frequency identification tag according to claim 1, wherein the isolation layer has a thickness of 10 to 100 μm; the chip hole (10) has an area of 1 to 100 mm 2 ; and the bridge holes (91) and (92) The area is 1 to 200 mm 2 .
The line radio frequency identification tag according to claim 1, wherein the radio frequency identification antenna (3) is an aluminum etched antenna, a copper etched antenna, a conductive silver paste printed antenna, a conductive polymer printed antenna, and an electroless copper plating. Antenna or vacuum copper or vacuum aluminized antenna.
The line radio frequency identification tag according to claim 1, characterized in that the material of the separating layer (5) is made of an insulating polyester material.
The line radio frequency identification tag according to any one of claims 1 to 6, characterized in that the material of the release layer (8) is selected from a silicone release agent, polystyrene or polymethyl methacrylate.
The line radio frequency identification tag according to claim 1, wherein the material of the conductive layer (6) is a conductive ink or a conductive resin;

The conductive adhesive is selected from a thermosetting conductive adhesive;

The material of the face label layer is made of paper or fragile paper, and the surface can be printed with graphic information or composite anti-counterfeiting technology;

The material of the upper bonding layer may be an acrylic adhesive, a polyurethane adhesive or an epoxy adhesive;

The material of the lower bonding layer is a pressure sensitive adhesive or a hot melt pressure sensitive adhesive.
The method for preparing a radio frequency identification tag according to any one of claims 1 to 8, comprising the following steps:

(1) coating a release material on the support material, forming a release layer, baking at 80 to 120 ° C for 10 to 5 minutes, and then preparing a radio frequency identification antenna on the release layer;

(2) printing the isolation layer on the radio frequency identification antenna obtained in the step (1), and at the same time, the printed isolation layer is provided with a small hole communicating with the chip hole and the bridge hole;

(3) printing a conductive layer on the other side of the isolation layer, the conduction layer completely or partially covering the bridge hole on the isolation layer, and is connected to the radio frequency identification antenna passing through the bridge hole and the other side of the isolation layer ;

(4) bonding the chip to the RFID antenna through a conductive adhesive,

(5) then coating the material of the bonding layer on the side of the label layer to form an upper bonding layer, and then compounding with the conductive layer, and then peeling off the polyester material for supporting, and finally in the The lower part of the release layer is coated with a binder material, and after die-cutting, the radio frequency identification tag is obtained;

Or coating the material of the adhesive on the side of the conductive layer, then peeling off the polyester material for supporting, and coating the material of the adhesive layer on the side of the surface mark layer to form an upper adhesive layer. It is then composited with the release layer and composited and die cut to form the final RFID tag with anti-transfer function.