CN202472709U - High temperature resistant acid and alkali resistant flexible electronic tag - Google Patents
High temperature resistant acid and alkali resistant flexible electronic tag Download PDFInfo
- Publication number
- CN202472709U CN202472709U CN2012200107202U CN201220010720U CN202472709U CN 202472709 U CN202472709 U CN 202472709U CN 2012200107202 U CN2012200107202 U CN 2012200107202U CN 201220010720 U CN201220010720 U CN 201220010720U CN 202472709 U CN202472709 U CN 202472709U
- Authority
- CN
- China
- Prior art keywords
- glue
- high temperature
- line
- flexible electronic
- temperature resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The utility model relates to a high temperature resistant acid and alkali resistant flexible electronic tag, comprising an RFID chip, a bearing base material, an etching layer, a first glue layer, a release paper, a second glue layer, a polyimides film and a resin ink layer, wherein the etching layer is formed by a copper foil or an aluminium foil through etching, the RFID chip, the bearing base material and the etching layer together form a core assembly, the bearing base material is connected with a release paper through the first glue layer, and the RFID chip is connected orderly with the polyimides film and the resin ink layer through the second glue layer. The high temperature resistant acid and alkali resistant flexible electronic tag has the characteristics of being high temperature resistant and acid and alkali resistant, in particular, is resistant to a high temperature of 280 DEG C and a strong acid strong alkali PH value from 1 to 14 for 24 hours or more, thereby being resistant to chemical solvent wiping.
Description
Technical field
The utility model relates to the RFID of Internet-of-things field, relates to a kind of high temperature resistant antiacid alkali flexible electronic label in particular.
Background technology
Electronic tag is claimed RFID tag and RF tag again, mainly is made up of the extensive integrated circuit chip and the dual-mode antenna that have cognizance code, is mainly passive type at present, and the electric energy during use is taken from the radio wave energy that dual-mode antenna receives; This electronic tag specifically is that and radio frequency identification read-write equipment and corresponding information service system is realized intercommunication mutually, such as the networking of advancing to deposit pin system etc.This electronic tag and traditional bar code (Barcode) technology compare each other, and that electronic tag has is long than multicapacity, communication distance as holding, be difficult to duplicate, environmental change is had higher suffertibility and can read advantage such as a plurality of labels simultaneously.
Electronic Tag Structure consists essentially of radio frequency chip, antenna and encapsulating material, and wherein packing forms and encapsulating material are the factors of decision electronic tag range of application and performance performance most critical.Current; The flexible electronic label of common packing forms generally all is to adopt to encapsulate like materials such as papery, PET, silica gel, ABS engineering plastics, PVC, PPS plastics and flax; Be that it is unable to cope with like strong acid such as high temperature, laundry, highly basic rugged surroundings, thereby have the narrow defective of applicable surface.
In view of this, the inventor has this case to produce to the above-mentioned defective further investigation of existing electronic tag then.
The utility model content
The purpose of the utility model is to provide a kind of high temperature resistant antiacid alkali flexible electronic label, can't the cope with bad environment to solve in the prior art electronic tag, thus have the narrow defective of applicable surface.
In order to reach above-mentioned purpose, the solution of the utility model is:
A kind of high temperature resistant antiacid alkali flexible electronic label; Wherein, Comprise RFID chip, supporting substrate, etch layer, first glue-line, release liners, second glue-line, Kapton and resin ink lay; This etch layer is that Copper Foil or aluminium foil are through etch process and moulding; This RFID chip, supporting substrate and etch layer constitute the core material assembly together, and this supporting substrate also is connected with release liners through first glue-line, and this RFID chip then links to each other with Kapton and resin ink lay through second glue-line successively.
What further, this first glue-line adopted is pressure sensitive adhesive; This second glue-line is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel; This supporting substrate is selected from PI film or PET film.
After adopting said structure, a kind of high temperature resistant antiacid alkali flexible electronic label that the utility model relates to because it has adopted supporting substrate, glue-line and aluminium foil or Copper Foil in making forming process, thereby has been guaranteed the implementation condition of etch process; Simultaneously owing to having adopted the mode that forms photosensitive type compound substance and exposure to realize line transitions; Then again through etched technology, the so feasible etching accuracy tolerance that is formed on circuit on the etch layer on supporting substrate and the glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm; Moreover the utility model is also through being provided with second glue-line, Kapton and resin ink lay, thereby makes the characteristics that the utlity model has high temperature resistant and resistance to acids and bases.
Description of drawings
The cut-open view of a kind of high temperature resistant antiacid alkali flexible electronic label that Fig. 1 relates to for the utility model.
Among the figure:
Etch layer 13 first glue-lines 2
Embodiment
In order further to explain the technical scheme of the utility model, come the utility model is set forth in detail through specific embodiment below.
A kind of high temperature resistant antiacid alkali flexible electronic label 100 as shown in Figure 1, that the utility model relates to comprises RFID chip 11, supporting substrate 12, etch layer 13, first glue-line 2, release liners 3, second glue-line 4, Kapton 5 and resin ink lay 6; More specifically, also on supporting substrate 12, be coated with one deck glue before this supporting substrate 12 combines with etch layer 13, thereby play the effect that both are bonded together.
This etch layer 13 for Copper Foil or aluminium foil through the etch process moulding; This RFID chip 11, supporting substrate 12 and etch layer 13 constitute core material assembly 1 together; This supporting substrate 12 also is connected with release liners 3 through first glue- line 2, and 11 of this RFID chips pass through second glue-line 4 and link to each other successively with Kapton 5 and resin ink lay 6.What more specifically, this first glue-line 2 adopted is pressure sensitive adhesive; This second glue-line 4 is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel; 12 of this supporting substrates are selected from PI film or PET film.
Can be open for the high temperature resistant antiacid alkali flexible electronic label 100 that lets the utility model relate to by fully, the utility model also provides a kind of manufacturing process of high temperature resistant antiacid alkali flexible electronic label 100, sets forth in detail with its preferred embodiment below.
Embodiment one:
This manufacturing process comprises the steps:
1., to select thickness be the aluminium foil of 9～38um, and is coated with above that behind the glue-line that to be that the supporting substrate 12 of 12～200um carries out compound with thickness, and forms composite base material; Concrete, this glue-line can be selected one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue for use;
2., form the photosensitive type compound substance at the aluminium foil of composite base material or above the Copper Foil; This photosensitive type composite material by adopting photosensitive type dry film material, it can also be substituted by photosensitive type wet film material or photosensitive type dielectric ink material certainly;
3., need process film egative film by etched antenna pattern, adopt exposure method, above wire portion line transitions to photosensitive type compound substance, form etching antenna;
4., RFID chip 11 is fixed on above the etching antenna and forms core material assembly 1; Specifically it is to carry out through the mode of a glue and binding;
5., on core material assembly 1, coat second glue-line 4, and on compound on second glue-line 4 Kapton 5;
6., on Kapton 5, form one deck resin ink lay 6 in coating;
7., supporting substrate on electronic tag 100 materials of above-mentioned coated resin ink lay 6 12 one side is coated with first glue-line 2, and the compound release liners 3 that goes up.
Need to prove that in the present embodiment, this supporting substrate 12 can be selected from PI film or PET film; What this first glue-line 2 adopted is pressure sensitive adhesive; This second glue-line 4 is selected from one or more in modified resin, polyacrylate, inferior gram glue or the silica gel.
Embodiment two:
The step of the present embodiment and first embodiment is basic identical, and its difference is to adopt Copper Foil to substitute the aluminium foil among first embodiment.
Embodiment three:
In the present embodiment; It can adopt whole schemes of first embodiment and second embodiment; But it is in order to reach the purpose of enhancing productivity, and 3. 2. it all improve with abovementioned steps abovementioned steps, concrete; Formation between the 2. middle photosensitive type compound substance of this step and aluminium foil or the Copper Foil adopts volume to volume to fit, and the 3. middle exposure of this step then is to adopt the volume to volume exposure machine to make public.
In sum, a kind of high temperature resistant antiacid alkali flexible electronic label 100 and manufacturing process thereof that the utility model relates to because it has adopted supporting substrate 12, glue-line and aluminium foil or Copper Foil in making forming process, thereby have been guaranteed the implementation condition of etch process; Simultaneously owing to having adopted the mode that forms photosensitive type compound substance and exposure to realize line transitions; Then again through etched technology, so make the etching accuracy tolerance that is formed on circuit on the etch layer 13 on supporting substrate 12 and the glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm; Moreover the utility model is also through being provided with second glue-line 4, Kapton 5 and resin ink lay 6; Thereby make the characteristics that the utlity model has high temperature resistant and resistance to acids and bases; Concrete its can anti-280 ℃ of high temperature; And can reach more than the 24h by strong alkali-acid resistance pH value 1～14, thereby can the chemically-resistant solvent wiping.
Product form of the foregoing description and graphic and non-limiting the utility model and style, the those of ordinary skill of any affiliated technical field all should be regarded as not breaking away from the patent category of the utility model to its suitable variation or modification of doing.
Claims (2)
1. high temperature resistant antiacid alkali flexible electronic label; It is characterized in that; Comprise RFID chip, supporting substrate, etch layer, first glue-line, release liners, second glue-line, Kapton and resin ink lay; This etch layer is that Copper Foil or aluminium foil are through etch process and moulding; This RFID chip, supporting substrate and etch layer constitute the core material assembly together, and this supporting substrate also is connected with release liners through first glue-line, and this RFID chip then links to each other with Kapton and resin ink lay through second glue-line successively.
2. a kind of high temperature resistant antiacid alkali flexible electronic label as claimed in claim 1 is characterized in that, what this first glue-line adopted is pressure sensitive adhesive; This second glue-line is selected from a kind of in modified resin, polyacrylate, inferior gram glue or the silica gel; This supporting substrate is selected from PI film or PET film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200107202U CN202472709U (en) | 2012-01-11 | 2012-01-11 | High temperature resistant acid and alkali resistant flexible electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200107202U CN202472709U (en) | 2012-01-11 | 2012-01-11 | High temperature resistant acid and alkali resistant flexible electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202472709U true CN202472709U (en) | 2012-10-03 |
Family
ID=46920853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200107202U Expired - Lifetime CN202472709U (en) | 2012-01-11 | 2012-01-11 | High temperature resistant acid and alkali resistant flexible electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202472709U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938086A (en) * | 2012-01-11 | 2013-02-20 | 厦门英诺尔电子科技股份有限公司 | High temperature and acid-base resistant flexible electronic label and manufacturing process thereof |
-
2012
- 2012-01-11 CN CN2012200107202U patent/CN202472709U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938086A (en) * | 2012-01-11 | 2013-02-20 | 厦门英诺尔电子科技股份有限公司 | High temperature and acid-base resistant flexible electronic label and manufacturing process thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100770193B1 (en) | Ic card | |
| US9218558B2 (en) | High-frequency fragile RFID electronic tag with anti-transfer function and preparation method therefor | |
| CN102339402B (en) | Method for manufacturing radio frequency tags with hot and cold stamping technology | |
| JP3908549B2 (en) | RFID tag manufacturing method | |
| CN103246918B (en) | A kind of paper substrate easily tears false proof ultra-high frequency RFID label and manufacture method thereof | |
| CN103839099B (en) | Radio frequency identification label and manufacturing method thereof | |
| CN102449846B (en) | Wireless IC device and production method thereof | |
| CN103295057B (en) | One easily tears high-frequency RF ID antifalsification label and manufacture method thereof | |
| CN105893890A (en) | Production method of paper RFID hot stamping label | |
| WO2010013810A1 (en) | Rfid tag and manufacturing method therefor, impedance-adjusting method and resin sheet and manufacturing method therefor | |
| CN102938086A (en) | High temperature and acid-base resistant flexible electronic label and manufacturing process thereof | |
| CN102999777A (en) | Radio frequency identification electronic tag and method for manufacturing same | |
| CN102918549B (en) | RFID label tag internally-arranged type inlay with comprise its card and the manufacture method of RFID label tag internally-arranged type inlay | |
| CN202523097U (en) | Washable flexible electronic label | |
| CN202472709U (en) | High temperature resistant acid and alkali resistant flexible electronic tag | |
| CN102938088A (en) | Washable flexible electronic label and manufacturing process thereof | |
| CN105811085A (en) | Flexible RFID antenna, POS machine device employing same and electronic device employing same | |
| CN102938499A (en) | Ultrahigh frequency radio frequency identification (RFID) etching antenna and manufacturing technique thereof | |
| CN106515245A (en) | Transfer film having radio frequency identification function and manufacturing method thereof | |
| CN202632333U (en) | High frequency RFID frangible electronic label | |
| CN102693447A (en) | Manufacturing method for ultrahigh-frequency electronic tag and ultrahigh-frequency electronic tag | |
| Ramade et al. | Thin film HF RFID tag deposited on paper by thermal evaporation | |
| CN215816385U (en) | Electronic tag antenna structure and electronic tag | |
| CN110569952B (en) | RFID tag of silver paste antenna process and chip packaging method | |
| CN102945503A (en) | Fragile high-frequency RFID electronic label and manufacturing technology of electronic label |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121003 |