JPH11149540A - Manufacture of hybrid card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the reliability of electric connection between a hybrid module and a loop antenna by precisely exposing the antenna terminal of a loop antenna buried in a card. SOLUTION: When two drills 13 and 13 connected through a power source 14 and a resistance 15 are brought into contact with antenna terminals 12 and 12 in an area in which the antenna terminals of a card substrate to which the first drilling working is operated are buried, those two drills 13 and a loop antenna 11 are electrically connected through the power source 14. The decrease of a voltage at that time is detected by a voltage detecting part 16, and drilling is ended so that the antenna terminals 12 of the loop antenna 11 can be precisely exposed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an IC card and a method of exposing an antenna terminal, and more particularly to a method of manufacturing a hybrid card that can be used for both contact and non-contact data exchange with an external device.

[0002]

2. Description of the Related Art Conventionally, a hybrid card is generally constructed by providing a loop antenna narrowly between a plurality of plastic sheets. In a method of manufacturing a hybrid card having a general configuration as Conventional Example 1, for example, a counterbore corresponding to the thickness of a module is formed in a card base material formed by heat fusion, and contact terminals are exposed at the bottom. Then, the module is bonded in the counterbore hole so that the contact portion of the module and the contact terminal are aligned.

Japanese Patent Application Laid-Open No. 8-52968 discloses a non-contact card manufacturing method and a non-contact card as a second conventional example similar in technical field to the present invention. Then, a step of forming a cavity in the card body to expose the contact terminals of the antenna and a step of subsequently installing an electronic module in the cavity of the card body are configured.

[0004]

However, the thickness of commercially available plastic sheets varies. For example, a variation value is 10 μm or the like in terms of thickness with a manufacturing error of about 5%. For this reason, when using a plastic sheet having this error to form a multi-layer card, forming a contacted part inside the layer, and digging the contacted part with a counterbore etc., the depth of the counterbore hole is fixed. When mass-produced as such, there is a problem that the contact terminal is not exposed, and the contact portion and the contact terminal are not electrically connected and may be defective.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing a hybrid card in which an antenna terminal is reliably exposed irrespective of a thickness error of the card and the reliability of electrical connection between the hybrid module and the loop antenna is improved. And

[0006]

In order to achieve the above object, a method of manufacturing a hybrid card according to the present invention comprises: an antenna forming step of forming a loop antenna on a sheet of a predetermined layer of a card having at least a two-layer structure; An antenna terminal forming step of forming a terminal at an end of the antenna, a card forming step of forming a card having at least a two-layer structure including a predetermined layer, and a hybrid module accommodated in a predetermined area on a surface side of the card where the terminal is formed A first drilling step of drilling a hole of a predetermined depth, and a second drilling of a counterbored hole substantially at the center of the terminal and substantially at the center in the height direction of the terminal.
, A conductive adhesive filling step of filling the counterbored hole with a conductive adhesive, and a hybrid module joining step of inserting a predetermined hybrid module into the hole.

The above-mentioned card having at least a two-layer structure has a layer A of an overlay film, a layer B of a foamed vinyl chloride sheet, and a predetermined layer C of a vinyl chloride resin sheet.
It is preferable to have a four-layer structure of a layer and an E layer of an overlay film, or a five-layer structure in which a D layer of a foamed vinyl chloride sheet is added to the four layers.

Further, the terminal is formed by providing a silver paste in a hemispherical shape, and the loop antenna is formed by any one of a method of etching, a method of printing, and a method of arranging a metal wire on a sheet. A method may be used.

The second drilling step comprises two drilling means for drilling a card connected via a power supply, or a drilling means connected via a power supply to a metal member in contact with a terminal of a loop antenna. However, it is preferable that when the change in the voltage generated when the terminal comes into contact with the terminal provided at the end of the loop antenna is detected by the voltage detecting means, the punching of the card by the punching means is terminated.

[0010] In the second drilling step, the drilling means for drilling a hole in the card detects a change in the rotational force of the drilling means which occurs when the card contacts the terminal of the loop antenna. Drilling of the card by the means may be terminated.

In the second drilling step, the hole detecting means connected to the metal plate on which the card is mounted via a power supply detects a change in a current flowing in a path generated when the hole contacts the terminal of the loop antenna. Upon detection, it is preferable to terminate the punching of the card by the punching means.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a method for manufacturing a hybrid card according to the present invention will be described in detail with reference to the accompanying drawings. 1 to 11 show an embodiment of a method for manufacturing a hybrid card according to the present invention.
1 of these figures is a conceptual diagram of a cross-sectional structure of a hybrid card, FIG. 2 is a diagram of a layer structure of a card base material, FIG. 3 is a plan view of a loop antenna, and FIGS. 4 to 7 are methods of drilling in a second drilling step. FIG. 8 is a flowchart showing an example of a manufacturing procedure, and FIGS. 9 to 11 are exploded views of the manufacturing procedure.

<Description of Configuration> FIG. 1 shows an example of a configuration of a hybrid card manufactured based on the method of manufacturing a hybrid card according to the present embodiment. The hybrid card shown in FIG. 1 includes a card base 1 and a hybrid module 2. A loop antenna 11 is disposed on the card base 1 of this component, and the loop antenna 11
Terminal 1 made of an adhesive such as silver paste
2 and 12 are formed. The hybrid module 2 is formed with loop contacts 21 for making electrical contact with the terminals 12.

A first hole having a depth corresponding to the outer shape of the hybrid module 2, particularly corresponding to the thickness of the hybrid module 2, is formed in the card base 1 having the above-described structure by counterbore processing. In the present embodiment, the first convex shape
Is formed, and a second hole is formed so that the antenna terminal is exposed in a region where the terminal of the loop antenna is buried. The second hole is filled with a conductive adhesive, and the first hole is filled. A hybrid card is configured by inserting the hybrid module 2 into the hole. In FIG. 1,
Although the terminals 12, 12 and the loop contacts 21, 21 are shown at a distance, the state in which they are joined is a completed state.

FIG. 2 is a diagram for explaining a configuration example of the card base material. In FIG. 2, the card substrate 1 of the present embodiment has a five-layer structure of A layer, B layer, C layer, D layer, and E layer, or a four-layer structure of A layer, B layer, C layer, and E layer. Be composed.

The card substrate 1 composed of the above layers is
For example, it is constituted by the following members. Layer A: 50 μm overlay film Layer B: 200 μm foamed vinyl chloride sheet C layer: 300 μm vinyl chloride resin sheet Layer D: 200 μm foamed vinyl chloride sheet E layer: 50 μm overlay film

Generally, the upper surface of the layer B, the lower surface of the layer D or the layer C is a printing surface, and the layer A and the layer E are transparent.

The C layer is used as a core sheet, and a loop antenna 11 and terminals 12 and 12 are formed on the C layer. The formation of the loop antenna 11 includes a: a method by etching, b: a method by printing, and c: a method of arranging a thin wire on a card base material.

Examples of the formation of the loop antenna 11 in the three methods a, b, and c will be listed. a: The etching method is a method in which a copper or aluminum sheet (about 20 μm) is formed on a 300 μm vinyl chloride resin sheet.
.mu.m) and etching to form a pattern. b: According to the printing method, a silver paste is printed on a 300 μm vinyl chloride resin sheet in a predetermined pattern with a thickness of about 10 μm by silk printing. c: The method of arranging the fine wire on the card base is such that the fine wire covered with the non-conductive film is slightly embedded in the resin sheet in a spiral shape while applying pressure along the edge of the 300 μm vinyl chloride resin sheet. I do. The thin wire thus provided is pressed against a vinyl chloride sheet. Alternatively, when arranging the fine wire on the vinyl chloride sheet, the thin wire is attached with an adhesive. It is necessary to peel off the non-conductive film from the thin wire at the portion where the terminal is formed (both ends of the loop antenna).

FIG. 3 shows an example of the external shape of the loop antenna 11 formed on the C layer. For example, the loop antenna 11 is formed in a predetermined pattern by silk printing with a thickness of about 10 μm. Further, terminals 12 and 12 made of silver paste are formed on the ends of the loop antenna 11. The terminals 12, 12 are provided, for example, in a form having a height of about 50 μm and a diameter of about 3 mm using silver paste. When the diameter of the terminal is increased, the terminal can be exposed even if the position of the second hole is slightly shifted.

Each of the above layers is formed into a card by thermocompression bonding. In the case of a five-layer structure, for example, the thickness of the card after thermocompression bonding is about 780 μm. However, an example of the manufacturing conditions is as follows. (B) Pressure: from ^{15Kg / cm 2 25Kg / cm 2} ( ii) Temperature: 120 ° C. from 140 ° C. (c) bonding time: 15 to 20 minutes

A first drilling process is performed on the periphery of the terminal of the loop antenna 11 of the card base material configured as described above,
Further, a second drilling process is performed so that the antenna terminal is exposed in a region where the terminal of the loop antenna is embedded, and the second hole is filled with a conductive adhesive, and the hybrid module 2 is housed. By this housing processing, the hybrid module 2 and the loop antenna 11 of the card base material are electrically connected and mechanically integrated. The integrated card is a single I / O of only the data I / O part due to non-contact by the loop antenna 11, or a contact type I / O formed on the upper surface of the hybrid module 2.
A card having two sets of I / O parts is formed with the parts.

Next, a description will be given of a second drilling method for drilling a hole in the area of the card base material on which the first drilling has been performed, in which the antenna terminal is embedded, and exposing the antenna terminal.

The card base material in which the loop antenna is sandwiched between the plastic sheets has a variation in the thickness of the plastic sheet. Therefore, if the drilling process for exposing the antenna terminal of the loop antenna is performed with a constant hole depth,
An antenna terminal is not exposed and a defective one is produced. A method for preventing such a problem and accurately exposing the antenna terminal of the loop antenna will be described below.

The first method is a two-axis drill short detection method. In this method, as shown in FIG. 4, two-axis drills 13, 13 for making holes are connected via a power supply 14 connected in series and a resistor 15, and both the two-axis drills contact the antenna terminal. In this method, a change in voltage that occurs at this time is detected by the voltage detection unit 16 provided in parallel with the power supply and the resistor, and it is confirmed that the antenna terminal is exposed.

As shown in FIG. 4, a biaxial drill 13,
Milling is performed by arranging 13 in a region where the antenna terminals 12 and 12 of the card base 1 on which the first drilling process has been performed are embedded. Two drills 13, 13 are antenna terminals 1
When the two drills 13 and 13 come into contact with each other, the two-axis drills 13 and 13 and the loop antenna 11 are electrically connected via a power supply. At this time, a back electromotive force is generated, and the voltage of the circuit decreases.
By detecting the change in the voltage by the voltage detector 16 connected in parallel to the power supply and the resistor, the exposure of the antenna terminal can be confirmed.

As a modification of the above-described two-axis drill chute detection method, as shown in FIG. 5, one of the drills may be replaced with a wire 17 for milling. By making the wire contact one of the antenna terminals and performing the milling, the voltage detector 16 can detect that the drill has contacted the other antenna terminal.

The second method is a torque fluctuation detecting method. In this method, as shown in FIG. 6, a change in the rotational force (torque) of the drill 13 for drilling a hole is detected by the torque detector 1.
8 to confirm that the antenna terminal is exposed.

The drill 13 is arranged in a region where the antenna terminal of the card base having the first hole shown in FIG. When the drill comes into contact with the antenna terminal, the member to be milled changes from a plastic sheet to a metal paste, causing a change in the torque of the drill. The antenna terminal can be exposed by detecting the change in the torque by the torque detector 18 and ending the milling.

The third method is a capacitance detection method. According to this method, as shown in FIG. 7, a metal plate 20 on which a card base material is placed and a drill 13 for making a hole are connected via a power supply 19 (an AC power supply is shown in FIG. 7). Drill 13 and power supply 1 by grounding the metal plate side
The change in the current flowing in the path connecting
This is a method of detecting the exposure of the antenna terminal and detecting the exposure of the antenna terminal.

The drill is placed in the area where the antenna terminal is buried in the card base on which the first drilling shown in FIG. 7 has been performed, and milling is performed. Before the drill 13 contacts the antenna terminal 12, a capacitor is formed by the drill 13 and the metal plate 20. However, when the drill 13 contacts the antenna terminal 12, a capacitor is formed by the loop antenna 11 and the metal plate 20. And
The plate area of the capacitor increases, and the capacitance of the capacitor increases. Therefore, the current flowing through this circuit increases. By detecting the change in the current by the current detection unit 22 and ending the milling by the drill, the antenna terminal can be exposed.

In the area where the antenna terminal of the loop antenna is buried in the card base material provided with the inverted convex first hole,
By performing milling using any one of the above-described three methods, the antenna terminal of the loop antenna can be accurately exposed. Therefore, the hole where the antenna terminal is exposed is filled with a conductive adhesive, and the hybrid module is inserted into the first hole, whereby the loop antenna of the card base and the hybrid module are easily brought into electrical contact. It becomes possible.

<Example of Manufacturing Procedure> An example of the manufacturing procedure will be described below with reference to the flowchart of FIG. 8 and the exploded views of FIGS. In step S1, a loop antenna 11 is formed on a predetermined layer constituting the card base material 1 by silk printing. In this embodiment, it is formed on the C layer. The shape and form of the loop antenna 11 to be formed are described in FIG. Further, terminals 12 and 12 made of silver paste are formed at the ends of the loop antenna 11. For example, terminal 12
Has a height of about 50 μm and a diameter of about 3 mm.

In step S2, a plurality of layer materials are laminated and a large card is formed by thermocompression bonding. In this embodiment, it is formed in a five-layer configuration. For example, layer A (50 μm overlay film), layer B (200 μm foamed vinyl chloride sheet), predetermined layer C (300 μm vinyl chloride resin sheet), layer D (200 μm foamed vinyl chloride sheet), E Layers (50 μm overlay film). The production conditions, for example, and (b) 25 Kg / cm ² from 15 Kg / cm ² pressure, (b) Temperature 140 ° C. from 120 ° C. for 20 minutes to 15 between (c) pressurization. In this step, a large-sized card base material, which is eventually made into several tens of cards, is formed.

In step S3, the large-sized card formed as described above is cut into a predetermined size to obtain a plurality of single-unit cards.

A first hole (milling) of a predetermined position, a predetermined size, and a predetermined shape is performed on each of the single cards using an end mill (S4). The first hole in this step is for accommodating the hybrid module 2 in a predetermined portion of the card. The processing dimensions are, for example, for the card substrate after pressure-forming having a thickness of about 780 μm and the hybrid module 2 having a thickness d of 100 μm.
The depth D is 120 μm.

A second drilling process of a predetermined depth is performed on the silver paste portion (S5). The second drilling process in this process
A loop contact 21 of the hybrid module 2;
This is for electrically connecting the terminal 12 of the loop antenna 11. For example, milling is performed by arranging the biaxial drills 13 and 13 shown in FIG. 4 in a region where the antenna terminals 12 and 12 of the card on which the first drilling is performed are embedded. The voltage detector 1 detects a change in voltage generated when the two-axis drills 13 contact the antenna terminals.
6, when the milling by the drills 13 and 13 is completed, the antenna terminals can be accurately exposed.

The conductive adhesive 123 is applied to the second hole 121 (S6), and the hybrid module is inserted into the first hole having a predetermined shape (S7), and the terminals 12, 12 and the loop contacts 21, 21 are inserted. And are electrically connected. This electrical connection is performed by filling the second hole 121 with the conductive adhesive 123 and ensuring conduction between the terminals 12, 12 and the loop contacts 21, 21. Further, the hybrid module 2 is adhesively bonded to the card base material to complete the hybrid card.

In the above embodiment, a conductive paste portion having a height of about 50 μm is provided in advance on the contact terminal of the loop antenna 11 embedded in the substrate of the card base material. Then, the paste portion is milled by using any of the three milling devices described above. Thereby, even if the thickness of the plastic sheet varies, the depth of the first hole can be made constant according to the thickness of the module. In other words, even if materials such as films, vinyl sheets, resin sheets, etc. of each layer constituting the card have thickness variations,
The position of the second hole with respect to the terminal 12 is ensured, and the electrical connection is ensured. Therefore, there is no defect and mass production becomes possible.

The above embodiment is an example of a preferred embodiment of the present invention. However, it is not limited to this.
Various modifications can be made without departing from the spirit of the present invention.

[0041]

As is clear from the above description, the method for manufacturing a hybrid card according to the present invention comprises forming a loop antenna on a sheet of a predetermined layer of a card having at least a two-layer structure, and forming a terminal at an end of the loop antenna. And forming a card having at least a two-layer structure including a predetermined layer, making a first hole of a predetermined depth for accommodating the hybrid module in a predetermined area on the side of the card on which the terminals are formed, A second hole is formed at the center and substantially at the center in the height direction of the terminal, a conductive adhesive is filled in the second hole, a predetermined hybrid module is inserted into the first hole, and a hybrid is inserted. The terminals of the I / O section of the module and the terminals of the loop antenna are electrically connected with a conductive adhesive. According to the manufacturing method of this configuration, even if the thickness of the plastic sheet varies, the depth of the hole can be made constant in accordance with the thickness of the module, the occurrence of poor connection is eliminated, and mass production becomes possible.

Further, by forming a terminal in which a silver paste is provided in a hemispherical shape at the end of the loop antenna, the second hole which is located substantially at the center of the terminal and substantially at the center in the height direction of the terminal can be easily formed. Can be opened.

Further, by using any one of a method of etching, a method of printing, and a method of arranging metal wires on a sheet to form a loop antenna, a desired loop antenna can be easily formed on a card base material. Can be formed.

Further, two perforating means for perforating a card connected via a power supply, or a perforating means connected via a power supply to a metal member in contact with a terminal of the loop antenna are provided on the other side of the loop antenna. When the change in the voltage generated when the terminal comes into contact with the terminal provided at the end is detected by the voltage detecting means, the antenna terminal can be reliably exposed by ending the piercing of the card by the piercing means.

[0045] In addition, a means for making a hole in the card is
When the rotational force detecting means detects a change in the rotational force of the drilling means caused by contact with the terminal of the loop antenna, the antenna terminal is surely exposed even in the method of terminating the drilling of the card by the drilling means. be able to.

When the current detecting means detects a change in the current flowing through the path generated when the metal plate on which the card is placed and the metal plate are connected via the power supply, the current detecting means detects the change. However, the antenna terminal can be surely exposed even in the method of ending the drilling of the card by the method.

[Brief description of the drawings]

FIG. 1 shows a configuration example of a hybrid card manufactured based on an embodiment of a method for manufacturing a hybrid card of the present invention.

FIG. 2 is a diagram illustrating a configuration example of a card base material.

FIG. 3 is a diagram showing an example of an external shape of a loop antenna formed on a C layer.

FIG. 4 is a diagram for explaining a drilling method in a second drilling step.

FIG. 5 is a diagram for explaining a drilling method in a second drilling step.

FIG. 6 is a diagram for explaining a drilling method in a second drilling step.

FIG. 7 is a view for explaining a drilling method in a second drilling step.

FIG. 8 is a flowchart showing an example of a manufacturing procedure.

FIG. 9 is a conceptual diagram 1 showing an example of a manufacturing procedure.

FIG. 10 is a conceptual diagram 2 showing an example of a manufacturing procedure.

FIG. 11 is a conceptual diagram showing an example of a manufacturing procedure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Card base material 2 Hybrid module 11 Loop antenna 12 Terminal 13 Drill 14 Power supply 15 Resistance 16 Voltage detection unit 17 Wire 18 Torque detection unit 19 Power supply 20 Metal plate 21 Loop contact 22 Current detection unit

Claims (7)

[Claims] 1. An antenna forming step of forming a loop antenna on a sheet of a predetermined layer of a card having at least a two-layer structure; an antenna terminal forming step of forming a terminal at an end of the loop antenna; A card forming step of forming a card having at least a two-layer structure; a first punching step of punching a hole of a predetermined depth for housing a hybrid module in a predetermined region on a side of the card on which the terminal is formed; A second drilling step of drilling a counterbore substantially at the center of the terminal and substantially at the center in the height direction of the terminal; and a conductive adhesive filling step of filling the counterbore with a conductive adhesive. A hybrid module joining step of inserting a module into the hole. 2. The card having at least a two-layer structure, wherein the layer A is an overlay film, the layer B is a foamed vinyl chloride sheet, and the predetermined layer C is a vinyl chloride resin sheet.
The method for producing a hybrid card according to claim 1, wherein the hybrid card has a four-layer structure of a layer, an E layer of an overlay film, or a five-layer structure obtained by adding a D layer of a foamed vinyl chloride sheet to the four layers. 3. The hybrid card manufacturing method according to claim 1, wherein the terminal is formed by providing a hemispherical silver paste at an end of the loop antenna. 4. The method according to claim 1, wherein the loop antenna is formed by any one of a method by etching, a method by printing, and a method of arranging a metal wire on the sheet. A method for manufacturing the hybrid card according to any one of the preceding claims. 5. The method according to claim 5, wherein the second drilling step comprises: two drilling means for drilling a hole in the card connected via a power supply; or a metal member brought into contact with the terminal of the loop antenna via a power supply. Ending the piercing of the card by the piercing means when the performed piercing means detects a change in voltage generated when the piercing means contacts the terminal provided at the end of the loop antenna by the voltage detecting means. The method for manufacturing a hybrid card according to any one of claims 1 to 4, wherein: 6. The second perforating step, wherein the perforating means for perforating the card detects a change in the rotating force of the perforating means caused when the perforating means contacts the terminal of the loop antenna. The method of manufacturing a hybrid card according to any one of claims 1 to 4, wherein the punching of the card by the punching means is completed when the punching is performed. 7. The second drilling step includes: detecting a change in a current flowing in a path generated when a drilling means connected to a metal plate on which the card is mounted via a power supply contacts the terminal of the loop antenna. The method for manufacturing a hybrid card according to any one of claims 1 to 4, wherein when the current detecting means detects the current, the punching of the card by the punching means is completed.