JP6979851B2 - How to make a combination card - Google Patents

Description

The present invention relates to a method for manufacturing a combination card.

The combination card includes both an IC module equipped with a contact communication means and an internal contact terminal for non-contact communication, and an antenna for non-contact communication, and exchanges data with an external device both in contact and non-contact. It is an IC card that can be used.

As a method for manufacturing a combination card, Patent Document 1 describes
An antenna forming step of forming a loop antenna on a predetermined layer sheet of a card having at least a two-layer structure,
An antenna terminal forming step of forming a terminal at the end of the loop antenna,
A card forming step of forming a card having at least a two-layer structure including the predetermined layer,
A first drilling step of drilling a hole of a predetermined depth for accommodating a hybrid module in a predetermined area on the surface side of the card on which the terminal is formed.
A second drilling step of drilling a counterbore hole at the substantially center of the terminal and reaching the substantially center in the height direction of the terminal.
A conductive adhesive filling step of filling the counterbore hole with a conductive adhesive,
A method of manufacturing a hybrid card comprising a hybrid module joining step of inserting a predetermined hybrid module into the hole is described, and further described.
It is described that the terminal at the end of the loop antenna is formed by providing the silver paste in a hemispherical shape.

In Patent Document 2,
Antenna forming process to form an antenna on the card base material for antenna,
A step of forming a conductive material printing layer by printing on the connection terminal of the antenna, and a step of forming the conductive material printing layer.
A card base material forming step of laminating one side or both sides of the card base material for an antenna on which the antenna is formed with a card material to form a card base material having at least a two-layer structure.
A first drilling step of forming a first hole for accommodating the IC module in a predetermined area of the card base material,
A second drilling step of forming a second hole leading to the conductive material printing layer at a position on the connection terminal of the antenna.
A method for manufacturing a combination card is described, which comprises an IC module joining step of filling the second hole with a conductive adhesive, accommodating the IC module in the first hole, and joining the IC module.

Japanese Unexamined Patent Publication No. 11-149540 JP-A-2007-249780.

According to Patent Document 2, in the combination card manufactured by the method of Patent Document 1, since the antenna terminal is hemispherical, the contact area for conduction with the IC module via the conductive adhesive is limited. If it is desired to increase this contact area, it is necessary to make a counterbore hole near the interface between the conductive adhesive and the antenna wiring, so that there is a high possibility that the antenna wiring will be damaged, which causes a manufacturing defect.

In this respect, according to Patent Document 2, it is possible to reliably connect the antenna terminal and the IC module by a method having excellent workability and high yield. However, in the method of Patent Document 2, some problems may occur because it is necessary to form the conductive material printing layer on the card base material (inlet) for an antenna on which the antenna is formed.

Since the base material for the antenna card in the inlet is usually only about 50 μm thick, there are certain restrictions on the printing method that can be applied when printing on the inlet, and there may be a problem in mass productivity, for example. Further, when printing is performed on the inlet, if the degree of printing deviation is large, it is necessary to discard the entire inlet after the antenna circuit is formed, which may cause a problem in manufacturing cost.

The present invention has been made in view of the above. An object of the present invention is to make a reliable connection between the antenna terminal and the IC module by a method having excellent workability and high yield, and the degree of freedom in selecting an applicable printing method is large, so that printing deviation occurs. It is to provide a method for manufacturing a combination card, which is less costly to be wasted by disposal even if it occurs.

The present invention is as follows.

[1] A method for manufacturing a combination card including an IC module and a non-contact communication antenna.
The IC module includes an external contact terminal for contact communication and an internal contact terminal for non-contact communication.
The non-contact communication antenna is in electrical contact with the internal contact terminal, and the method is:
Preparing a core sheet substrate and a first core sheet having a conductive layer on a partial region of the core sheet substrate.
Preparing an antenna substrate, and an inlet having an antenna circuit and an antenna terminal on the antenna substrate,
The first core sheet and the inlet are laminated so that the conductive layer of the first core sheet and the antenna terminal of the inlet face each other to prepare a card base material having a multilayer structure. including,
How to make a combination card.
[2] To form the conductive layer by applying a conductive paste on a part of the core sheet base material.
The conductive layer is formed by laminating a conductive foil on a part of the core sheet base material, or the conductive layer is formed on a part of the core sheet base material by a thin-film deposition method. The method according to [1], wherein the first core sheet is produced by the above-mentioned method.
[3] The method according to [2], wherein the conductive paste is applied onto the core sheet base material by printing.
[4] The card base material further has a second core sheet having a core sheet base material.
The method according to any one of [1] to [3], wherein the card base material is produced by laminating the first core sheet, the inlet, and the second core sheet in this order. ..
[5] The method according to any one of [1] to [4], wherein the core sheet base material constituting the first core sheet has a multilayer structure.
[6] The method according to [4], wherein the core sheet base material constituting the second core sheet has a multilayer structure.
[7] After producing the card base material having the multi-layer structure,
To form a first hole through the first core sheet in the card substrate for accommodating the IC module.
A second hole in the card base material that penetrates the core sheet base material of the first core sheet and reaches at least the conductive layer at a position where the antenna terminal and the conductive layer are laminated. To form,
The second hole is filled with a conductive material, and the IC module is housed in the first hole, and the internal contact terminal and the antenna terminal of the IC module are at least the second hole. Further comprises making electrical contact through the conductive material filled in the.
The method according to any one of [1] to [6].
[8] Filling the second hole with the conductive material,
The method according to [7], wherein the second hole is filled with a conductive paste or the second hole is filled with solder.
[9] The formation of the second hole is performed so as to penetrate the core sheet base material of the first core sheet and the conductive layer to reach the antenna terminal of the inlet, [7] or [8]. ] The method described in.
[10] A core sheet for use as the first core sheet in the method for manufacturing a combination card according to any one of [1] to [9].
The core sheet has a core sheet base material and a conductive layer on a partial region of the core sheet base material.
Core sheet.

According to the present invention, it is possible to make a reliable connection between the antenna terminal and the IC module by a method having excellent workability and high yield, and the degree of freedom in selecting an applicable printing method is large, and further, printing deviation is achieved. Provided is a method for manufacturing a combination card, which is less costly to be wasted due to disposal even if the problem occurs.

FIG. 1 is a process explanatory view showing a method for manufacturing a combination card of the present invention. FIG. 2 is a schematic plan view showing the structure of the inlet in the present invention together with the planned storage area of the IC module and the planned formation area of the conductive layer. FIG. 3 is an enlarged cross-sectional view of an aspect of region A in FIG. 1 (h). FIG. 4 is an enlarged cross-sectional view of another aspect of the region A of FIG. 1 (h). FIG. 5 is a schematic cross-sectional view for explaining the layer structure of the card base material in the combination card manufactured in the embodiment.

The present invention
A method for manufacturing a combination card equipped with an IC module and a non-contact communication antenna.
The IC module includes an external contact terminal for contact communication and an internal contact terminal for non-contact communication.
The non-contact communication antenna is in electrical contact with the internal contact terminal, and the method is:
Preparing a first core sheet having a core sheet base material and a conductive layer on a part of the core sheet base material (core sheet preparation step).
Preparing an antenna base material, and an inlet having an antenna circuit and an antenna terminal on the antenna base material (inlet preparation step).
The first core sheet and the inlet are laminated so that the conductive layer of the first core sheet and the antenna terminal of the inlet face each other to prepare a card base material having a multilayer structure. (Card base material manufacturing process)
including,
Regarding the manufacturing method of combination cards.

The method for manufacturing the combination card of the present invention is as follows.
After the card substrate manufacturing process,
Forming a first hole penetrating the first core sheet in the card base material for accommodating the IC module (first hole forming step).
A second hole that penetrates the core sheet base material of the first core sheet and reaches at least the conductive layer at a position where the antenna terminal and the conductive layer are laminated in the card base material. (Second hole forming step),
Filling the second hole with a conductive material (conductive material filling step), accommodating the IC module in the first hole, and connecting the internal contact terminal and the antenna terminal of the IC module. , At least electrical contact via the conductive material filled in the second hole (IC module mounting step).
May further be included.

In the present embodiment, the first hole forming step and the second hole forming step may be performed in no particular order.

According to the method of the present invention, unlike the technique of Patent Document 2, it is not necessary to print the conductive layer on the inlet. Normally, the inlet is as thin as about 50 μm, it is difficult to transport the sheet during printing, and curls, wrinkles, etc. may occur in the inlet during printing, thereby improving the yield of the conductive layer forming process. Is not easy.

On the other hand, in the method of the present invention, since the difficulty caused by printing the conductive layer on the inlet is eliminated, the conductive layer can be formed with a high yield by a general-purpose printing method.

<Manufacturing method of combination card>
FIG. 1 shows a process explanatory diagram of the method for manufacturing the combination card of the present embodiment.

[Core sheet preparation process]
In the core sheet preparation step, the core sheet base material 11 and the first core sheet 10 having the conductive layer 12 on a partial region of the core sheet base material 11 are prepared (FIG. 1A).

The first core sheet 10 may be manufactured by, for example, any of the following methods.
(1) Applying a conductive paste on a part of the core sheet base material 11 to form the conductive layer 12.
(2) To form the conductive layer 12 by laminating a conductive foil on a part of the core sheet base material 11.
(3) Forming a conductive layer 12 on a partial region of the core sheet base material 11 by a thin-film deposition method, etc.

The thickness of the core sheet base material 11 may be 100 μm or more from the viewpoint of facilitating the formation of the conductive layer 12 by printing, for example, 120 μm or more, 140 μm or more, 160 μm or more, 180 μm or more, or 200 μm or more. It may be there. On the other hand, from the viewpoint of not excessively increasing the total thickness of the obtained combination cards, the thickness of the core sheet base material 11 is, for example, 300 μm or less, 280 μm or less, 260 μm or less, 240 μm or less, 220 μm or less, or 200 μm or less. May be.

The core sheet base material 11 may have a single layer or a multi-layer structure. When the core sheet base material 11 has a multilayer structure, the number of layers may be, for example, 2 or more, 3 or more, or 4 or more, and for example, 6 or less, 5 or less, or 4 or less. It may be there.

When the core sheet base material has a multi-layer structure, a conductive layer is formed on a part of the core sheet base material which is the innermost layer of the multi-layered laminate to obtain a core sheet base material with a conductive layer. Later, a core sheet containing the core sheet base material having a multi-layer structure may be produced by further laminating another layer on the core sheet base material with the conductive layer.

Further, after obtaining a core sheet base material with a conductive layer by using a part of the layers constituting the core sheet base material, the core sheet base material with a conductive layer can be used as another core sheet. The card base material may be formed by laminating with a base material, an inlet, or the like. In this case, the laminated portion of the core sheet base material with a conductive layer and another core sheet base material in the obtained card base material constitutes the first core sheet.

When the first core sheet has a multilayer structure, the thickness of each of the core sheet base materials constituting the first core sheet may be, for example, 80 μm or more, 90 μm or more, 100 μm or more, or 120 μm or more, for example. , 250 μm or less, 230 μm or less, or 200 μm or less.

The materials constituting the core sheet base material 11 include, for example, PVC (polyvinyl chloride), PET (polyethylene terephthalate), PET-G (terephthalic acid-ethylene glycol-cyclohexanedimethanol copolyester), PET-G and PC. It may be a polymer alloy or the like.

The conductive paste used to form the conductive layer in the core sheet preparation step may be, for example, a paste in which metal particles, conductive carbon material particles, or the like are dispersed in a resin. .. The metal particles may be particles containing, for example, gold, silver, copper, platinum, nickel and the like. The conductive carbon material particles may be particles containing, for example, carbon black, graphite, or the like. The resin may be, for example, an epoxy resin or the like. A paste in which copper particles are dispersed in an epoxy resin is preferable.

The coating of the conductive paste on a partial region of the core sheet base material 11 may be carried out by a known appropriate method, for example, by printing. The printing may be, for example, offset printing, silk screen printing (silk printing), or the like.

The conductive foil used in the core sheet preparation step may be, for example, a metal foil, and specifically, for example, a foil containing gold, silver, copper, platinum, nickel, or the like.

The vapor deposition method in the core sheet preparation step may be either a physical vapor deposition method (PVD) or a chemical vapor deposition method (CVD).

The conductive layer 12 on a partial region of the core sheet base material 11 may be a layer having a substantially uniform thickness and a significant area. Since the conductive layer 12 is a layer having a significant area, a wide contact area can be secured even if a processing error occurs when the second hole described later is formed by, for example, milling. Therefore, the IC module. It is possible to suppress poor connection between the antenna terminal and the antenna terminal.

On the other hand, the forming range of the conductive layer 12 is such that the antenna terminal 2a is viewed from a direction perpendicular to the obtained combination card surface in order to maximize the function of the antenna and obtain good communication characteristics. It may be a range that does not overlap with the antenna circuit to be excluded.

The forming range of the conductive layer 12 covers the conductive region between the antenna terminal 2a and the internal contact terminal of the IC module when viewed from the direction perpendicular to the obtained combination card surface from the viewpoint of obtaining good communication characteristics. It may be included, and may be a range slightly larger than this.

The thickness of the conductive layer 12 may be, for example, 2 μm or more or 10 μm or more, and may be, for example, 50 μm or less or 60 μm or less.

[Inlet preparation process]
In the inlet preparation step, the antenna base material 21, and the inlet 20 having the antenna circuit (not shown) and the antenna terminal 2a on the antenna base material 21 are prepared (FIG. 1 (b)).

According to the method of the present embodiment, it is not necessary to print on the inlet having the antenna circuit and the antenna terminal, so that the thickness of the antenna base material used in this step may be relatively thin. The thickness of the antenna base material may be, for example, 150 μm or less, 130 μm or less, 110 μm or less, 90 μm or less, or 70 μm or less. On the other hand, since it is necessary to secure a thickness that can withstand the processing in the subsequent process, the thickness of the antenna base material may be, for example, 40 μm or more, 45 μm or more, or 50 μm or more.

The material constituting the antenna base material 21 may be, for example, PET (polyethylene terephthalate), PET-G (terephthalic acid-ethylene glycol-cyclohexanedimethanol copolyester), PEN (polyethylene naphthalate) and the like.

The antenna circuit and the antenna terminal may be made of the same kind or different kinds of conductive materials, respectively. The conductive material constituting the antenna circuit and the antenna terminal may be, for example, metal, and specifically, for example, copper, aluminum, or the like.

The inlet 20 may be made by, for example, any of the following methods.
(1) A method of laminating a foil made of a conductive material on an antenna base material 21 and removing a part of the foil by etching to form an etching antenna.
(2) A method of printing a conductive material in a predetermined pattern on the antenna base material 21.
(3) A method of arranging a wound antenna in which a thin wire made of a conductive material is wound in a predetermined antenna shape on an antenna base material 21.
(4) A method of forming a foil made of a conductive material into a predetermined pattern shape in advance and then transferring the foil onto the antenna base material 21.

[Card base material manufacturing process]
In the card base material manufacturing process,
The first core sheet 10 and the inlet 20 are laminated so that the conductive layer 12 of the first core sheet 10 and the antenna terminal 2a of the inlet 20 face each other (FIG. 1 (c)) to form a multilayer structure. The card base material 50 is manufactured (FIG. 1 (d)).

The card base material 50 may be a laminate of the core sheet 10 and the inlet 20, or as shown in FIG. 1 (c), further has a second core sheet 30 made of the core sheet base material. It may be a laminate having a first core sheet 10, an inlet 20, and a second core sheet 30 in this order.

The second core sheet 30, which is optionally used, has a core sheet base material. The core sheet base material may be appropriately selected from the configurations exemplified above for the core sheet base material in the first core sheet 10, except that the core sheet base material does not have a conductive layer. Therefore, the core sheet base material constituting the second core sheet 30 may have a single layer or a multi-layer structure. When the core sheet base material has a multi-layer structure, the number of layers may be, for example, 2 or more, 3 or more, or 4 or more, and for example, 6 or less, 5 or less, or 4 or less. It may be there.

The core sheet base material in the second core sheet 30 may be the same as or different from the core sheet base material in the first core sheet 10.

The card substrate may be further populated with overlay substrate on at least one, typically both, of the outside of the first core sheet and, if present, the outside of the second core sheet. good.

The material constituting the overlay base material may be, for example, PVC, PET, PET-G, a polymer alloy of PET-G and PC, or the like.

The thickness of the overlay substrate may be, for example, 40 μm or more, 45 μm or more, 50 μm or more, or 55 μm or more, and may be, for example, 75 μm or less, 70 μm or less, 65 μm or less, or 60 μm or less.

As shown in FIG. 1 (c), the card base material 50 may have a configuration in which an appropriate spacer 40 is arranged so as to surround the side surface of the inlet 20.

The material constituting the spacer 40 arbitrarily used may be composed of the same material as the core sheet base material in the first and second core sheets. The thickness of the spacer 40 may be substantially the same as the thickness of the antenna base material 21 constituting the inlet 20.

Lamination in the card substrate manufacturing step may be performed by, for example, a method of thermocompression bonding in a state where each layer is stacked.

In the card base material manufacturing process, the layers constituting the card base material may be thermocompression-bonded in a state of being stacked in a single layer, or a plurality of layers of a part of the layers constituting the card base material may be thermocompression-bonded in advance. However, the obtained thermocompression bonding material may be thermocompression bonded in a state of being overlapped with the remaining layers.

A core sheet base material with a conductive layer, an inlet, and a second core sheet are thermocompression bonded in a state where they are laminated to obtain an inlet laminate, and then the inlet laminate and another layer are laminated again. It is also a preferred embodiment in the present embodiment that thermocompression bonding is performed to obtain a card base material having a multi-layer structure. More specifically, for example, a core sheet base material with a conductive layer, an inlet, and a second core sheet are thermocompression bonded in a state of being stacked to obtain an inlet laminate, and an overlay base material, a first core sheet, and the like. Examples thereof include a case where a card base material having a multi-layer structure is obtained by performing thermocompression bonding again in a state where the inlet laminate and the second core sheet having one or two layers are laminated.

[First hole forming step and second hole forming step]
In the method for manufacturing the combination card of the present embodiment, the first hole forming step and the second hole forming step may be performed in no particular order. Hereinafter, a case where the second hole is formed after the first hole is formed will be described.

In the first hole forming step, the card base material 50 is formed with a first hole h1 penetrating the first core sheet 10 for accommodating the IC module (FIG. 1 (e)). The first hole h1 is formed at a place where the IC module is mounted.

The first hole h1 has a shape and a depth corresponding to the outer shape of the IC module to be mounted. As an example, in the case of FIG. 1 (e), a hole having a “T” -shaped cross section is formed for mounting an IC module having a substrate portion and a sealing portion. Here, the portion of the first hole h1 corresponding to the "T" -shaped vertical bar penetrates the first core sheet 10. When the card base material contains the second core sheet, as shown in FIG. 1 (e), the portion of the first hole h1 corresponding to the "T" vertical bar is further an inlet. It may penetrate 20 and reach the second core sheet. The portion of the first hole h1 corresponding to the “T” -shaped horizontal bar may have a depth that remains at the portion of the core sheet base material of the first core sheet.

The first hole may be formed by a known method, for example milling.

In the second hole forming step, the antenna terminal 2a of the card base material 50 and the conductive layer 12 are laminated at a position where the antenna terminal 2a and the conductive layer 12 are laminated, and the core sheet base material 11 of the first core sheet 10 is penetrated and at least conductive. A second hole h2 leading to the sex layer 12 is formed (FIG. 1 (f)). The second hole h2 may penetrate not only the core sheet base material 11 of the first core sheet 10 but also the conductive layer 12 to reach the antenna terminal 2a of the inlet 20.

The second hole h2 may be formed by a known method, for example milling.

[Conductive material filling process]
In the conductive material filling step, the conductive material 9 is filled in the second hole h2 (FIG. 1 (g)).

The filling of the conductive material 9 in the second hole h2 may be performed by, for example, the following method.
(1) A method of filling the second hole with a conductive paste,
(2) A method of filling the second hole with solder, etc.

The conductive paste used in this step may be, for example, a paste in which metal particles, conductive carbon material particles, or the like are dispersed in a resin. The metal particles may be particles made of, for example, gold, silver, copper, platinum, nickel or the like. The conductive carbon material particles may be, for example, carbon black, graphite, or the like. The resin may be, for example, an epoxy resin or the like.

The solder used in this step may be composed of a known solder alloy.

[IC module mounting process]
In the IC module mounting step, the IC module 60 is housed in the first hole h1, and the internal contact terminal 60a and the antenna terminal 2a of the IC module 60 are filled with at least the conductive material 9 filled in the second hole h2. It is electrically contacted through the device (FIG. 1 (h)).

In order to bond the IC module 60 and the card base material 50, the IC module 60 may be accommodated in the first hole h1 after a thermoplastic or thermosetting adhesive tape is attached to the IC module 60. This is a preferred embodiment of this step. At this time, the adhesive tape may be attached on the surface on which the internal contact terminal 60a of the IC module 60 protrudes so as to avoid the internal contact terminal 60a.

The IC module 60 may have a substrate portion and a sealing portion. In the cross section of the IC module cut in a vertical plane with the substrate portion on the upper side and the sealing portion on the lower side, the IC module 60 has a substantially T-shaped shape in which the substrate portion is larger than the sealing portion. May be shown.

The board portion of the IC module may have, for example, a module board, an external contact terminal, and an internal contact terminal. The external contact terminal exists on the surface of the module board opposite to the sealing portion, and functions as a contact communication means for performing contact communication. The internal contact terminal exists on the same surface side as the sealing portion of the module board and is connected to the antenna terminal of the inlet, which contributes to non-contact communication.

The sealing portion of the IC module may have an IC chip connected to the external contact terminal and the internal contact terminal of the substrate portion, and a sealing resin for sealing the IC chip.

In order to electrically contact the internal contact terminal 60a of the IC module 60 and the antenna terminal 2a via the conductive material 9, for example, the second hole h2 is filled with the conductive paste and then the first one is used. This may be done by accommodating the IC module 60 in the hole h1. It is also a preferred embodiment of the present embodiment that the conductive paste is heated at a predetermined temperature after the IC module 60 is housed in the first hole h1 to cure the paste.

[Regarding the positions of the conductive layer, the first hole, and the second hole]
Next, the positions of the conductive layer, the first hole, and the second hole in this embodiment will be described.

FIG. 2 shows the configuration of the inlet 20 in an embodiment of the present invention together with the storage position of the IC module and the position of the conductive layer. The inlet 20 of FIG. 2 has an antenna circuit 2 having an antenna terminal 2a on the antenna base material 21. In the obtained combination card, the substrate portion of the IC module is housed in the region corresponding to the reference numeral 6, and the sealing portion of the IC module is housed in the region corresponding to the reference numeral 6a.

The range occupied by the conductive layer 12 in the first core sheet 10 may be a region surrounded by reference numeral 4 in FIG. Since the conductive layer 12 occupies a certain area in this region, the antenna terminal 2a and the internal contact terminal 60a of the IC module 60 can be reliably electrically contacted via the conductive material 9. .. Further, by keeping the existing range of the conductive layer 12 within this region, even if some printing misalignment occurs when the conductive layer 12 is formed by printing, for example, the conductive layer 12 and the antenna circuit 2 can be separated from each other. Duplication can be avoided and the function of the antenna is not impaired.

In FIG. 2, of the first hole, the region of reference numeral 6a in which the sealing portion of the IC module is housed penetrates the first core sheet. Therefore, in this region, the core sheet base material and the conductive layer constituting the first core sheet are removed. Here, in FIG. 2, the region of reference numeral 4 indicating the existence range of the conductive layer is divided into two by the region of reference numeral 6a in the first hole, and the conduction between the two is cut off. By setting the conductive layer and the first hole in such a relative position, the two antenna terminals 2a can avoid conduction by the conductive layer, and the function of the antenna is not impaired.

The region of reference numeral 6b in FIG. 2 indicates the position of the second hole. As described above, the second hole is formed at a position where the antenna terminal 2a and the conductive layer are laminated. The region of reference numeral 6b in FIG. 2 occupies a part of the region where the antenna terminal 2a and the region of reference numeral 4 indicating the existence range of the conductive layer are laminated.

<Combination card>
According to another aspect of the present invention, the combination card manufactured by the method for manufacturing the combination card of the present invention is provided.

The combination card of this embodiment is
A combination card equipped with an IC module and a non-contact communication antenna.
The IC module includes an external contact terminal for contact communication and an internal contact terminal for non-contact communication, and is mounted in a card substrate.
The card base material is at least a card base material having a multilayer structure in which a core sheet base material, a conductive layer, and an inlet are laminated in this order.
The conductive layer is laminated on a part of the region of the core sheet base material, and is laminated.
The inlet has an antenna base material and an antenna circuit and an antenna terminal on the antenna base material.
The conductive layer and the inlet are laminated so that the conductive layer and the antenna terminal of the inlet are in electrical contact with each other.
The card base material is
A first hole penetrating the core sheet base material for accommodating the IC module, and
The card base material has a second hole that penetrates the core sheet base material and reaches at least the conductive layer at a position where the antenna terminal and the conductive layer are laminated.
The conductive material is contained in the second hole, the IC module is contained in the first hole, and the internal contact terminal of the IC module is at least the conductive material in the second hole. Electrically in contact with the antenna terminal via
It is a combination card.

In the combination card of the present embodiment, for example, the following two modes are exemplified as the mode of electrical contact between the internal contact terminal of the IC module and the antenna terminal of the inlet.

That is, the second hole penetrates the core sheet base material and reaches the conductive layer, but does not penetrate the conductive layer, and the internal contact terminal of the IC module is conductive in the second hole. The first aspect in which the antenna terminal is electrically in contact with the material and the conductive layer, and the second hole penetrates the core sheet base material and the conductive layer and reaches the antenna terminal, and The second aspect is in which the internal contact terminal of the IC module is in electrical contact with the antenna terminal via the conductive layer filled in the second hole.

FIG. 3 shows an enlarged cross-sectional view of a region A shown by a broken line in FIG. 1 (h) for the first aspect of the combination card of the present embodiment.

In FIG. 3, the internal contact terminal 60a of the IC module 60 housed in the first hole constitutes the inlet 20 via both the conductive material 9 and the conductive layer 12 in the second hole. The form in which the antenna terminal 2a on the antenna base material 21 is in electrical contact with the antenna terminal 2a is illustrated.

FIG. 4 shows an enlarged cross-sectional view of the region A shown by the broken line in FIG. 1 (h) for the second aspect of the combination card of the present embodiment.

In FIG. 4, the internal contact terminal 60a of the IC module 60 housed in the first hole is an antenna terminal on the antenna base material 21 constituting the inlet 20 via the conductive material 9 in the second hole. A form in which it is in electrical contact with 2a is shown. Here, the conductive material 9 is also in electrical contact with the conductive layer 12. Since the conductive layer 12 is in electrical contact with the antenna terminal 2a, the total area contributing to the electrical contact between the internal contact terminal 60a and the antenna terminal 2a is expanded. Such a second aspect is preferable from the viewpoint of improving the bending resistance of the combination card.

In the combination card of the present invention, a pattern printing layer may be provided between arbitrary layers. As an example in that case, between the overlay base material arranged outside the first core sheet and the first core sheet, and between the overlay base material arranged outside the second core sheet and the second core sheet. An embodiment in which a pattern printing layer is provided on at least one of the core sheets, typically both of them, can be mentioned.

<Core sheet>
According to still another aspect of the present invention, there is provided a core sheet used in the method for manufacturing a combination card of the present invention.

The core sheet of this embodiment is
A core sheet for use as the first core sheet in the method for manufacturing a combination card of the present invention.
It has a core sheet base material and a conductive layer on a part of the core sheet base material.

<Example 1>
The multi-layered card base material shown in FIG. 5 was prepared as follows, and a combination card was prepared using this and evaluated.

(1) Preparation of Card Substrate An inlet having the configuration shown in FIG. 2 was prepared. The inlet 20 of the first embodiment is formed by etching an antenna circuit 2 having an antenna terminal 2a on an antenna base material 21 made of PET having a thickness of 50 μm. In FIG. 2, the range of reference numeral 6 surrounded by a broken line is a region in which the substrate portion of the IC module is housed in a later step, and the range of reference numeral 6a is a region in which the sealing portion of the IC module is housed. ..

On one side of the core sheet base material made of PET-G having a thickness of 200 μm, the region where the contact with the antenna terminal 2a is planned, that is, the region where the contact with the region of reference numeral 4 in FIG. 2 is planned is As a conductive layer, a copper paste layer having a thickness of 25 μm was formed by silk screen printing to obtain a core sheet with a conductive layer. The silk screen printing at this time had good transportability of the core sheet base material, and could be performed without any problem without damaging the base material.

The core sheet base material composed of the core sheet with the conductive layer, the inlet, and PET-G having a thickness of 150 μm is formed in this order, and the conductive layer of the core sheet with the conductive layer and the antenna terminal 2a on the inlet are formed in this order. Thermocompression bonding was performed in a state of being laminated so as to be in contact with each other to obtain an inlet laminated body. At this time, a spacer made of PET-G having a thickness of 50 μm was placed around the inlet, and then thermocompression bonding was performed.

A core sheet base material made of PET-G having a thickness of 150 μm and an overlay base material made of PET-G having a thickness of 50 μm are laminated and sandwiched in this order on both sides of the inlet laminate obtained above, respectively, and the entire layer is sandwiched. After bonding by a hot press, it was die-cut to obtain a card substrate having a multi-layer structure.

(2) Formation of a first hole and a second hole Next, a first hole for mounting a COT (Chip on Tape) type IC module 60 is formed on the front side (that is, on the core sheet side with a conductive layer). It was formed by excavation from the outermost layer). At this time, the region corresponding to the reference numeral 6 in FIG. 2 was excavated to a depth that can accommodate the substrate portion of the IC module, and the region corresponding to the reference numeral 6a was excavated to a depth that can accommodate the IC module sealing portion. Next, a second hole was formed by excavation in the region corresponding to the reference numeral 6b in FIG. The excavation of the second hole was carried out through the core sheet base material and the copper paste layer of the core sheet with the conductive layer until the antenna terminal 2a was reached.

(3) Preparation of Combination Card The second hole was filled with silver paste as the conductive material 9. A thermoplastic welding film containing nitrile rubber and a phenol resin was attached onto the surface of the IC module 60 on which the internal contact terminal 60a protrudes so as to avoid the internal contact terminal 60a. The IC module 60 is housed so that the internal contact terminal 60a of the IC module 60 and the antenna terminal 2a are joined via a silver paste, and the IC module 60 and the card substrate are in contact with each other via a thermoplastic welding film. did. Then, the whole was heated to cure the silver paste, and the thermoplastic welding film was melted to bond the IC module 60 and the card base material to prepare a combination card.

(4) Dynamic flexural strength test For the combination card manufactured above, the minimum deflection in the long side direction is 2.00 mm, the maximum deflection is 20.00 mm, and the short side direction is in accordance with JIS X6305-1: 2010 5.8. A dynamic flexural strength test was performed with strokes of 1.00 mm minimum deflection and 10.00 mm maximum deflection. In the test, the front side is convex in the long side direction, the back side is convex in the long side direction, the front side is convex in the short side direction, and the back side is convex in the short side direction. The bending was performed by repeating 250 times each, and the presence or absence of the communication function of the card was examined after each bending of 1,000 times (the above-mentioned repeated bending of one cycle).

As a result, it was confirmed that in the combination card of Example 1, the communication function was impaired when the number of bendings was 8,000, and the communication function was not impaired until the number of bendings was 7,000.

<Example 2>
A combination card was produced in the same manner as in Example 1 except that the thickness of the conductive layer formed on the core sheet substrate was 50 μm, and its dynamic bending strength test was performed.

As a result, it was confirmed that in the combination card of Example 2, the communication function was impaired when the number of bends was 11,000, and the communication function was not impaired up to the number of bends of 10,000.

<Comparative Example 1>
A combination card was prepared in the same manner as in Example 1 except that the conductive layer was not formed on the core sheet base material, and its dynamic bending strength test was performed.

As a result, in the combination card of Comparative Example 1, the communication function was impaired when the number of bendings was 3,000.

From the above results, the combination cards of Examples 1 and 2 produced by forming the conductive layer on the core sheet base material are the same as the cards of Comparative Example 1 in which the conductive layer was not formed on the core sheet base material. In comparison, it was confirmed that the bending resistance was high. It is presumed that this is a result of the electrical contact between the terminal of the IC module and the antenna terminal being improved by the conductive layer on the first core sheet.

<Comparative Example 2>
The conductive layer is not formed on the core sheet base material, and instead, the conductive layer is formed in the region corresponding to the reference numeral 4 surrounded by the alternate long and short dash line in FIG. 2 on the antenna circuit of the inlet similar to that of the first embodiment. Attempts were made to form a copper paste layer by offset printing. However, with the thickness of the antenna base material used for this inlet of 50 μm, offset printing could not be performed because it was too thin to carry.

<Comparative Example 3>
The conductive layer is not formed on the core sheet base material, and instead, the conductive layer is formed in the region corresponding to the reference numeral 4 surrounded by the alternate long and short dash line in FIG. 2 on the antenna circuit of the inlet similar to that of the first embodiment. The copper paste layer was formed by silk screen printing. However, curls, wrinkles, etc. were generated on the antenna base material after printing, and it was not possible to obtain an inlet that could be used for card production. It is considered that the thickness of the antenna base material of 50 μm was too thin to apply the printing method.

<Comparative Example 4>
FIG. 2 on an inlet wound antenna in which a conductive layer is not formed on the core sheet base material and instead a copper wound antenna is provided on a PET-G antenna base material having a thickness of 200 μm. A copper paste layer as a conductive layer was formed by offset printing in the region corresponding to the reference numeral 4 surrounded by the alternate long and short dash line. However, due to damage to the antenna during printing and a large number of samples that could not communicate normally, it was not possible to produce a card that could perform an effective dynamic bending strength test.

2 Antenna circuit 2a Antenna terminal 4 Conductive material layer formation range 6 IC module substrate storage area 6a IC module encapsulation storage area 6b Second hole formation area 9 Conductive material 10 First core sheet 11 Core sheet base material 12 Conductive layer 20 Inlet 21 Antenna base material 30 Second core sheet 40 Spacer 50 Card base material 60 IC module 60a Internal contact terminal of IC module h1 First hole h2 Second hole

Claims (9)

A method for manufacturing a combination card equipped with an IC module and a non-contact communication antenna.
The IC module includes an external contact terminal for contact communication and an internal contact terminal for non-contact communication.
The non-contact communication antenna is in electrical contact with the internal contact terminal, and the method is:
Preparing a core sheet substrate and a first core sheet having a conductive layer on a partial region of the core sheet substrate.
Preparing an antenna substrate, and an inlet having an antenna circuit and an antenna terminal on the antenna substrate,
The first core sheet and the inlet are laminated so that the conductive layer of the first core sheet and the antenna terminal of the inlet face each other to prepare a card base material having a multilayer structure. ,
To form a first hole through the first core sheet in the card substrate for accommodating the IC module.
A second hole in the card base material that penetrates the core sheet base material of the first core sheet and reaches at least the conductive layer at a position where the antenna terminal and the conductive layer are laminated. To form,
Filling the second hole with a conductive material, as well as
The IC module is housed in the first hole, and the internal contact terminal and the antenna terminal of the IC module are electrically contacted with each other via at least the conductive material filled in the second hole. it is including <br/>,
How to make a combination card. To form the conductive layer by applying a conductive paste on a part of the core sheet base material.
The conductive layer is formed by laminating a conductive foil on a part of the core sheet base material, or the conductive layer is formed on a part of the core sheet base material by a thin-film deposition method. The method according to claim 1, wherein the first core sheet is manufactured by the above-mentioned method. The method according to claim 2, wherein the conductive paste is applied onto the core sheet substrate by printing. The card substrate further comprises a second core sheet having a core sheet substrate.
The method according to any one of claims 1 to 3, wherein the card base material is produced by laminating the first core sheet, the inlet, and the second core sheet in this order. The method according to any one of claims 1 to 4, wherein the core sheet base material constituting the first core sheet has a multilayer structure. The method according to claim 4, wherein the core sheet base material constituting the second core sheet has a multilayer structure. Filling the second hole with the conductive material,
The method according to any one of claims 1 to 6, wherein the second hole is filled with a conductive paste or the second hole is filled with solder. Any one of claims 1 to 7, wherein the formation of the second hole is performed so as to penetrate the core sheet base material of the first core sheet and the conductive layer to reach the antenna terminal of the inlet. The method described in the section. A core sheet for use as the first core sheet in the method for manufacturing a combination card according to any one of claims 1 to 8.
The core sheet has a core sheet base material and a conductive layer on a partial region of the core sheet base material.
Core sheet.

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