JP2005182392A - Method and apparatus for manufacturing inlet for contactless ic card, and inlet for contactless ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing apparatus that perform optimal processing for an inlet in which a plurality of communication members each comprising an IC chip and a contactless transmission coil are fixed in succession in a flexible sheet, if a malfunction is detected. <P>SOLUTION: The manufacturing method of an inlet for a contactless IC card first fixes a plurality of communication members each comprising the IC chip 1 and the contactless transmission coil 2, between nonwoven fabrics 3 in succession at predetermined intervals, then tests the operation of the communication members fixed between the nonwoven fabrics 3, and if the test determines that operation of a communication member is abnormal, punches the IC chip 1 or contactless transmission coil 2 of the communication member found abnormal. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a non-contact type IC card inlet in which a plurality of communication members for a non-contact type IC card composed of at least an IC chip and a non-contact transmission coil are continuously fixed to a flexible sheet at predetermined intervals. The present invention relates to a manufacturing method and a manufacturing apparatus.

  Non-contact type information carriers such as non-contact type IC cards are being considered for use as substitutes for commuter passes, driver's licenses, telephone cards, cash cards, etc. Increasing productivity and lowering unit price is one of the most important technical issues.

  The applicant of the present application has proposed a flexible IC module capable of enhancing the productivity of information carriers in Patent Document 1. Since the flexible IC module disclosed in Patent Document 1 is integrated by sandwiching a connection body of an IC chip and a coil between two non-woven fabrics having self-compression bonding, the protective effect of the connection body is enhanced, The handling of an IC chip that is easily destroyed and the handling of a low-rigidity coil are facilitated, and the productivity of the information carrier can be increased. In addition, since the substrate is made of non-woven fabric, it has great flexibility and can be used not only as a component of a flat information carrier but also as an information carrier attached to a curved part or a part that undergoes repeated deformation. Can do.

  Furthermore, the applicant of the present application has proposed a coil winding device that can form a spacing coil having a constant spacing between lines in Patent Document 2 and can prevent the coil from being disturbed or deformed. In the winding device disclosed in Patent Document 2, since a plurality of sets of needles having different protrusion amounts are implanted on different radial positions on one side of the needle holding plate, the needle holding plate or the like is driven, and a wire is provided for each needle group. By sequentially winding, it is possible to form an interval winding coil having a line interval of a constant interval.

Further, by fixing the end of the wire to the wire chuck, the shape of the wound coil can be maintained as it is, so that in this state, the input / output terminals of the IC chip and both ends of the coil are joined together. Further, it is possible to prevent coil winding disturbance during chip bonding. Furthermore, since the needle is implanted in the needle holding plate and the coil is wound around the needle, the needle can be inserted into the nonwoven fabric, and the coil wound around the needle can be directly transferred to the flexible substrate. In addition, it is possible to prevent deformation of the coil during conveyance.
JP 2001-325579 A JP 2002-342730 A

  However, in the above-mentioned Patent Document 1 and Patent Document 2, as to what should be processed when a malfunction is found as a result of the operation check test of the contactless IC card inlet in the manufacturing process, Not proposed.

  The present invention relates to a non-contact IC card in which a plurality of communication members for a non-contact IC card composed of an IC chip and a non-contact transmission coil are continuously fixed to a flexible sheet at predetermined intervals. It is an object of the present invention to provide a manufacturing method and a manufacturing apparatus that perform optimal processing when a malfunction is found in an inlet.

  A non-contact IC card inlet manufacturing method according to the present invention includes a flexible sheet in which a plurality of communication members each including at least an IC chip and a non-contact transmission coil connected to the IC chip are continuously provided at predetermined intervals. And the step of testing the operation of the communication member fixed to the flexible sheet, and the communication member determined to be abnormal when it is determined that the operation of the communication member is abnormal as a result of the test. And a process of punching out the IC chip. According to such a method, since the IC chip is removed from the inlet, since the IC chip cannot be image-recognized in the step of image recognition and resin sealing of the IC chip of the inlet, the wasteful resin sealing step Will not be performed. As a result, the cost can be reduced, and security measures can be taken by collecting defective IC chips.

  In addition, according to another method of manufacturing an inlet for a non-contact type IC card according to the present invention, a plurality of communication members each including at least an IC chip and a non-contact transmission coil connected to the IC chip are continuously provided at predetermined intervals. And fixing to the flexible sheet; testing the operation of the communication member fixed to the flexible sheet; and determining that the communication member operation is abnormal as a result of the test And a step of punching out a part of the contactless transmission coil of the communication member. According to such a method, since the non-contact transmission coil does not function as an antenna, it is reliably treated as a defective product in the inspection and test processes using the reader / writer and the like thereafter.

  Here, it is preferable that the step of punching out the non-contact transmission coil punches out the non-contact transmission coil in the vicinity of the central portion in the width direction of the flexible sheet. Thereby, since the distance between the punched holes and the both end portions is substantially uniform, the durability of the inlet against the tensile stress in the longitudinal direction is improved. At this time, even if the step of punching out the non-contact transmission coil punches out a portion of the non-contact transmission coil perpendicular to the width direction of the flexible sheet, the same effect can be obtained.

  A non-contact IC card inlet manufacturing apparatus according to the present invention is a flexible sheet in which a plurality of communication members each including at least an IC chip and a non-contact transmission coil connected to the IC chip are continuously provided at predetermined intervals. And means for testing the operation of the communication member fixed to the flexible sheet, and the communication member determined to be abnormal when it is determined that the operation of the communication member is abnormal as a result of the test. Means for punching out the IC chip. If manufactured by such an apparatus, the IC chip is removed from the inlet, and therefore the IC chip cannot be image-recognized in the process of recognizing the image of the IC chip of the inlet and sealing the resin. No process is performed. As a result, the cost can be reduced, and security measures can be taken by collecting defective IC chips.

  Another non-contact IC card inlet manufacturing apparatus according to the present invention includes a plurality of communication members each including at least an IC chip and a non-contact transmission coil connected to the IC chip at predetermined intervals. Means for fixing to the flexible sheet; means for testing the operation of the communication member fixed to the flexible sheet; and as a result of the test, it is determined that there is an abnormality in the operation of the communication member. And means for punching out a part of the non-contact transmission coil of the communication member. According to such a method, since the non-contact transmission coil does not function as an antenna, it is reliably treated as a defective product in the inspection and test processes using the reader / writer and the like thereafter.

  Here, it is preferable that the means for punching the non-contact transmission coil punches the non-contact transmission coil in the vicinity of the central portion in the width direction of the flexible sheet. Thereby, since the distance between the punched holes and the both end portions is substantially uniform, the durability of the inlet against the tensile stress in the longitudinal direction is improved. At this time, even if the means for punching out the non-contact transmission coil punches out a portion of the non-contact transmission coil perpendicular to the width direction of the flexible sheet, the same effect can be obtained.

  An inlet for a non-contact type IC card according to the present invention is a flexible sheet in which a plurality of communication members each including at least an IC chip and a non-contact transmission coil connected to the IC chip are fixed continuously at predetermined intervals. The non-contact type IC card inlet is formed by punching an IC chip of a communication member that is determined to be abnormal in operation by a test.

  In another non-contact type IC card inlet according to the present invention, a plurality of communication members each including at least an IC chip and a non-contact transmission coil connected to the IC chip are fixed continuously at predetermined intervals. An inlet for a non-contact type IC card made of a flexible sheet, in which a part of a non-contact transmission coil of a communication member that is determined to be abnormal in operation by a test is punched out.

  Here, it is preferable that the non-contact transmission coil of the communication member that is determined to be abnormal in operation by the test is punched in the vicinity of the central portion in the width direction of the flexible sheet. Thereby, since the distance between the punched holes and the both ends is substantially uniform, the durability of the inlet against the tensile stress in the longitudinal direction is high. At this time, the non-contact transmission coil of the communication member that is determined to be abnormal in operation by the test is the same even if a portion perpendicular to the width direction of the flexible sheet is punched out of the non-contact transmission coil. The effect of.

  According to the present invention, a non-contact type IC card in which a plurality of non-contact type IC card communication members composed of at least an IC chip and a non-contact transmission coil are continuously fixed to a flexible sheet at predetermined intervals. It is possible to provide a manufacturing method and a manufacturing apparatus that perform an optimal process when an operation failure is found for a commercial inlet.

  A non-contact IC card inlet according to the present invention will be described. In such an inlet, a plurality of communication members including an IC chip and a non-contact transmission coil are continuously fixed at a predetermined interval to a long flexible sheet such as a nonwoven fabric in a line. An IC module is formed by cutting the inlet for each communication member. Such an IC module is sealed with a resin to form a non-contact IC card.

  FIG. 1 is a top view showing the structure of the IC module, and FIG. 2 is a cross-sectional view showing the structure of the IC module. FIG. 1 shows the IC module with one of the nonwoven fabrics removed. The inlet is a long member in which a plurality of IC modules shown in FIGS. 1 and 2 are connected.

  As shown in FIG. 1, in such an IC module, the IC chip 1 is disposed in the central region of the nonwoven fabric 3. The non-contact transmission coil 2 is directly connected to the input / output terminals (pads) of the IC chip 1. The non-contact transmission coil 2 receives power supply from a reader / writer (not shown) to the IC chip 1 in a non-contact manner and transmits data to / from the reader / writer in a non-contact manner.

  The IC chip 1 and the non-contact transmission coil 2 are sandwiched and fixed by two nonwoven fabrics 3a and 3b, as shown in FIG.

  As the IC chip 1, any IC chip mounted on a non-contact type IC card can be used. However, in order to reduce the thickness of the non-contact type IC card, the total thickness is 300 μm or less, preferably It is desirable to use one that is thinned to 200 μm or less. In particular, in order to be applied to a thin card, it is preferable to use a thin IC chip 1 having a total thickness of about 50 μm to 150 μm, and to prevent IC chip cracking due to external force as necessary. A reinforcing plate such as a thin metal plate is formed on the back surface of the IC chip with an adhesive.

  On the other hand, as for the non-contact transmission coil 2, a coil made of a wire made by covering a core made of a highly conductive metal material such as copper or aluminum with an insulating layer such as a resin is used. In order to facilitate direct connection, it is also possible to use a wire made of a wire material in which a bonding metal layer such as gold or solder is coated around the core wire, and an insulating layer is coated around the bonding metal layer. .

  The diameter of the wire constituting the non-contact transmission coil 2 is 20 μm to 200 μm. In order to ensure the connection between the IC chip 1 and the non-contact transmission coil 2, an input / output terminal 1 a provided on the IC chip 1. Those smaller than the length of one side are selectively used. The non-contact transmission coil 2 is formed by turning a wire having a required diameter and having a required diameter several times to several tens of times according to the characteristics of the IC chip.

  As a direct connection system between the IC chip 1 and the non-contact transmission coil 2, wedge bonding, soldering or welding is particularly suitable.

  The nonwoven fabric 3 is an example of a so-called flexible sheet, and can be substituted with a synthetic resin sheet such as polyethylene terephthalate (PET). As the non-woven fabric 3, any known non-woven fabric can be used. However, since the thermo-compression bonding property with the IC chip 1 and the non-contact transmission coil 2 is good, it has a self-compression bonding property or an appropriate amount. It is preferable that the resin is provided with self-compression bonding by impregnating the synthetic resin, and particularly, since the handling is easy and the thermocompression bonding is excellent, the periphery of the polyethylene terephthalate (PET) core material is amorphous. It is preferable to use one made of a fiber coated with polyethylene terephthalate (PET-G). Further, in order to be able to determine the position of the IC chip 1 sandwiched between the nonwoven fabrics 3 by the image processing apparatus, it is necessary to have transparency that allows the IC chip 1 to be determined. If the thickness of the non-woven fabric 3 is made too thin in order to increase transparency, the strength becomes weak, and therefore it is necessary to realize transparency within a range in which a predetermined strength is maintained. In addition, when using the nonwoven fabric 3 with high intensity | strength, you may make it fix the IC chip 1 and the coil 2 for non-contact transmission on one surface.

  FIG. 3 shows a schematic external view of a non-contact IC card as a final product. In this example, the non-contact IC card 100 is used as an employee ID card. Therefore, a photo area 101 and a character area 102 are formed on the surface of the non-contact IC card 100. Since both the photograph area 101 and the character area 102 are printed after being manufactured as a non-contact IC card, it is preferable that these areas 101 and 102 are not located on the IC chip 1 having a certain thickness. When printing is performed on the IC chip 1, printing defects are likely to occur, and the possibility that the IC chip 1 itself is damaged increases. Therefore, the IC chip 1 must be accurately positioned in the non-contact IC card 100.

  Here, the winding process of the non-contact transmission coil in the non-contact IC card inlet will be briefly described. The winding step can be performed using a winding device having a configuration equivalent to that of the winding device disclosed in Patent Document 2.

  The winding device shown in FIGS. 4 and 5 includes a needle holding plate 200 and an IC holding unit 204 provided near the center of the needle holding plate 200. Furthermore, a joining portion (not shown) for joining the coil 2 and the IC chip 1 held by the IC holding portion 204, a feed nozzle (not shown), and a coil shaping member (not shown) are provided.

  On the upper surface of the needle holding plate 200, a first needle group 201 composed of five needles 201a to 201e with the smallest protrusion amount from the upper surface, and four needles 202a with the second smallest protrusion amount from the upper surface. The second needle group 202 consisting of ~ 202d and the third needle group 203 consisting of five needles 203a to 203e with the third smallest protrusion from the upper surface are implanted.

  The feed nozzle is a device that feeds out the wire that is the source of the coil 2 and is configured to move in a three-dimensional direction with respect to the needle holding plate 200, while applying a certain tension to the wire. A fixed amount of wire is fed out, and the wire is wound around each needle implanted in the needle holding plate 200 in a predetermined order. The coil shaping member shapes a solid coil wound around each needle into a planar shape.

  The operation of the winding device will be briefly described. At the start of winding of the coil 2, the feed nozzle is lowered to the position closest to the needle holding plate 200, and the coil shaping member is raised to the position farthest from the needle holding plate 200. Further, the joint between the coil 2 and the IC chip 1 is retracted to a position where the needle planting surface of the needle holding plate 200 is not opposed. Furthermore, the IC chip 1 supplied from an IC transport unit (not shown) is set in a predetermined direction on the chip holder of the IC holding unit 204.

  When the coil 2 is wound, first, a predetermined amount of wire is fed out from the supply nozzle, and its tip is chucked on a predetermined wire chuck. Next, the feeder nozzle is driven in a plane parallel to the needle planting surface of the needle holding plate 200, and the wire is wound around the needle 201a. Thereafter, the feeder nozzle is moved to a portion not facing the needle holding plate 200. Next, the needle holding plate 200 is rotated, and the wires are sequentially wound around the other needles 201b to 201e constituting the first needle group 201.

  Thereafter, the feeder nozzle is raised to a height between the first needle group 201 and the second needle group 202, and a wire is wound around the needles 202 a to 202 d constituting the second needle group 202. Similarly, after the winding of the wire around the predetermined needle is completed, the supply nozzle is sequentially raised to the height between the second needle group 202 and the third needle group 203 and wound around the needle 203e. Turn. Next, the coil shaping member is lowered to a position closest to the needle planting surface of the needle holding plate 200, and the coil 2 wound in a three-dimensional shape is shaped into a planar coil 2. Finally, the winding end of the coil 2 is chucked to a predetermined wire chuck and the surplus portion is cut to finish the winding of the desired interval winding coil 2. Next, the coil 2 and the IC chip 1 held by the IC holding unit 204 are directly connected.

  By such a process, as shown in FIG. 6, a flexible sheet 400 is formed in which the IC chip 1 and the non-contact transmission coil 2 are fixed between two long nonwoven fabrics. On the flexible sheet 400, the long side of the IC module is arranged in the longitudinal direction of the flexible sheet 400. The flexible sheet 400 has a width of, for example, 70 mm, is usually wound in a roll shape, and is attached to the manufacturing apparatus 300 shown in FIG. More specifically, the flexible sheet 400 wound in a roll shape is rotatably attached to the manufacturing apparatus 300 shown in FIG.

  FIG. 7 is a schematic diagram of the manufacturing apparatus 300. The manufacturing apparatus 300 shown in this figure is a trimming apparatus that mainly performs trimming. In the manufacturing apparatus 300, an article to be manufactured such as a flexible sheet 400 is intermittently conveyed by a conveyance mechanism (not shown). In addition, the manufacturing apparatus 300 may be configured to be continuously manufactured by being integrated with a communication module manufacturing apparatus, an IC card resin sealing apparatus, or the like.

  The long flexible sheet discharged from the roll body 301 is conveyed to the right side in the figure by a conveyance mechanism such as a roller or a motor (not shown). The laminating table 302 is a heat sealer that is used when seaming the flexible sheet 400 when it is interrupted. Usually, the joining process by the bonding table 302 is executed by the user's hand.

  The image processing device 303 is a device that detects the position of the IC chip 1 in the flexible sheet 400 using an image recognition technique. The image processing apparatus 303 includes, for example, a CCD camera, images the flexible sheet 400, and acquires image data. Then, the image processing device 303 extracts the position of the IC chip 1 and / or the non-contact transmission coil 2 from the image data, and transmits the position information as the extraction result to the control device 313. The position information is stored in storage means (not shown) in the control device 313.

  The laser device 304 is a laser cutter that removes unnecessary portions at both ends from the flexible sheet 400. The removal of unnecessary portions is called trimming. In this example, since the side edge of the flexible sheet 400 is cut, it is particularly referred to as side trimming. By side trimming, for example, the flexible sheet 400 having a width of 70 mm is cut into a width of 46 mm.

  The cutting position of the flexible sheet 400 by the laser device 304 is determined by the control device 313 based on the position information of the IC chip 1 and / or the non-contact transmission coil 2. More specifically, the flexible sheet is formed so that the distance from the IC chip 1 or the non-contact transmission coil 2 to the both side ends of the inlet is constant in the inlet 5 after the unnecessary portions on both side ends are cut by the laser device 304. The control device 313 determines 400 cutting positions and transmits them to the laser device 304. The laser device 304 cuts the flexible sheet 400 based on the cutting position information.

  The roll body 305 a and the roll body 305 b are rollers that wind up unnecessary portions cut from the flexible sheet 400 by the laser device 304. Of the long unnecessary portions cut out by the cutting operation, one unnecessary portion is wound around the roll body 305a, and the other unnecessary portion is wound around the roll body 305b.

  The reader / writer 306 is an operation confirmation device for confirming the operations of the IC chip 1 and the non-contact transmission coil 2 in the inlet 5. Specifically, the reader / writer 306 supplies power to the IC chip 1 via the non-contact transmission coil 2 and transmits a predetermined signal. Further, the reader / writer 306 receives a signal output from the IC chip 1 via the non-contact transmission coil 2 in accordance with a signal supplied to the IC chip 1. The reader / writer 306 performs a predetermined process on the received signal and then outputs it to the control device 313. The control device 313 determines whether or not the IC chip 1 and the non-contact transmission coil 2 that have confirmed the operation perform a normal operation according to a signal from the reader / writer 306.

  The punching device 307 determines the IC chip 1 to be determined or the non-contact when the IC chip 1 and the non-contact transmission coil 2 whose operation has been confirmed by the control device 313 are not operating normally, that is, are defective. A part of the transmission coil 2 is punched out by pressing. Thereby, it can process so that a defective product may not operate | move completely. The punching device 307 will be described in detail later.

The lead bonding table 308 is a table for bonding the leads 6 to the inlet 5. FIG. 8 shows the inlet 5 after the lead 6 is bonded. The leads 6 are bonded to the front and rear of the inlet 5 having, for example, m ₂ = about 500 m, and have lengths m ₁ = about 1.5 m and m ₂ = about 1.5 m, respectively. The lead 6 is wound around a roll body 309 and is taken out at any time and fixed to the inlet 5.

  Similar to the reader / writer 306, the reader / writer 311 is an operation confirmation device for confirming the operation of the IC chip 1 and the non-contact transmission coil 2 in the inlet 5.

  The roll body 312 is shipped after the inlet 5 is finally wound and removed. After shipping, a well-known resin sealing process, printing process, etc. are performed to finally manufacture a non-contact IC card.

  Next, the trimming process will be described in detail with reference to FIGS. FIG. 9 shows an example of the cutting position in the trimming process. In FIG. 9, the flexible sheet 400 moves in the direction of the white arrow, the part to which the IC chip 1a is fixed is processed first, and the part to which the IC chip 1b is fixed is processed after that.

  As shown in FIG. 9A, the relative position of the IC chip 1 with respect to the long flexible sheet 400 is not constant and may vary. In this example, two continuous IC chips 1a and 1b are shifted by x in the width direction (short direction of the flexible sheet 400). In this case, the cutting position by the laser device is determined based on the position of each IC chip 1a, 1b. Specifically, the cutting position is determined so that the distance from the IC chip to the cutting line is constant.

  In the example shown in FIG. 9B, the distance between the IC chip 1a and the cutting line 41a is equal to the distance between the IC chip 1b on the same side and the cutting line 43a. Further, the distance between the IC chip 1a and the cutting line 41b is equal to the distance between the IC chip 1b on the same side and the cutting line 43b.

  When cutting along the cutting line shown in FIG. 9B, first, the cutting lines 41a and 41b located on both sides of the IC chip 1a are first cut by the laser device. The cutting lines 41 a and 41 b are substantially parallel to the longitudinal direction of the flexible sheet 400. The lengths of the cutting lines 41a and 41b are both longer than the length in the long side direction of the IC module after cutting, which is accommodated in the non-contact IC card. In the cutting process, for example, it is desirable to ensure cutting by irradiating the same position with a laser beam a plurality of times.

  Next, the cutting line 42a and the cutting line 42b substantially perpendicular to the longitudinal direction of the flexible sheet 400 are cut by a laser device. The lengths of the cutting line 42a and the cutting line 42b are the tolerance in the width direction that indicates how far the flexible chip 400 is allowed to deviate with respect to the position where the IC chip 1 is fixed on the flexible sheet 400. It is determined according to the range. Specifically, the lengths of the cutting line 42a and the cutting line 42b are set longer than the allowable range in the width direction.

  Further, the cutting lines 43a and 43b located on both sides of the IC chip 1b are cut by a laser device. By cutting the flexible sheet 400 at a cutting position as shown in FIG. 9B, it is possible to manufacture an inlet having the same distance from the IC chip 1 to both ends. By manufacturing a non-contact IC card using such an inlet, it is possible to obtain a non-contact IC card in which an IC chip is arranged at an accurate position. In particular, in a non-contact IC card in which printing is performed on the front surface, it is possible to prevent printing defects due to IC chip position shift.

  In FIG. 9B, the position of the cutting line is determined based on the IC chip 1, but both the IC chip 1 and the non-contact transmission coil 2 may be used as a reference, and the non-contact transmission coil. Only 2 may be used as a reference. By accurately positioning the non-contact transmission coil 2, disconnection during the manufacturing process can be prevented.

  It is also possible to cut the cutting position shown in FIG. Also in this case, the above-described effects can be combined.

  However, in the case of cutting along the cutting line shown in FIG. 9B and the cutting line shown in FIG. 9C, there is a problem that a cut remains in a part of the inlet. Cuts remain in region A in FIG. 9B and region B in FIG. 9C. Such an incision is not only poor in appearance when the inlet is shipped, but when a tensile stress is applied to the inlet, the cutting area is expanded from the incised portion, and the inlet itself may be cut. .

  In order to solve such problems, the cutting line as shown in FIGS. 10 and 11 is cut. FIG. 10 is a top view showing a part of the cutting line of the flexible sheet 400, and FIG. 11 is an enlarged top view in which a region C shown in FIG. 10 is enlarged.

  As shown in FIG. 10, the cutting lines 41a and 41b corresponding to the IC chip 1a are bent inwardly and further outwardly in the connection region with the cutting lines 42a and 42b corresponding to the IC chip 1b.

  This will be described in more detail with reference to FIG. The cutting lines 41 are linearly positioned at both ends of the flexible sheet 400. The cutting position is determined so that the distance from the IC chip 1a is a predetermined distance. Then, at the bending point 411 in the connection region with the cutting line corresponding to the adjacent IC chip 1b, the flexible sheet 400 is bent in the inner direction. The cutting line 41 advances from the bending point 411 toward the inside of the flexible sheet 400, and is folded back toward the outside of the flexible sheet 400 at a vertex 412 inside the bending point 411 by a predetermined distance L1. Then, the cutting line 41 turned back at the vertex 412 further extends to the end point 413 outside the position where the bending point 411 is located. Here, the end point 413 is located inside the bending point 411 by a distance L2. The distance L1 and the distance L2 are determined according to the positioning accuracy of the IC chip 1 in the flexible sheet 400. Usually, since the allowable range of the positional deviation of the IC chip 1 in the width direction of the flexible sheet 400 with respect to the reference is determined to be equal, the distance L1 and the distance L2 are equal. For example, when the allowable range of displacement of the IC chip 1 is 0.5 mm on the inside and 0.5 mm on the outside, the distance L1 and the distance L2 are 2 to 3 mm.

  The end point 421 of the cutting line 42 adjacent to the IC chip 1a and corresponding to the IC chip 1b to be subsequently cut is located on the IC chip 1b side with respect to the bending point 411, but on the IC chip 1a side with respect to the end point 413. Yes. That is, the end point 421 is located closer to the IC chip 1a than the line connecting the vertex 412 and the end point 413. Therefore, the cutting line 41 and the cutting line 42 intersect at an intersection 422 on a line segment connecting the vertex 412 and the end point 413 of the cutting line 41. At this intersection 422, the cutting line 41 and the cutting line 42 are connected and cut continuously.

  In the example illustrated in FIG. 11, a cutout is generated by a cutting line connecting the end point 421 of the cutting line 42 and the intersection 422 and a cutting line connecting the end point 413 of the cutting line 41 and the intersection 422. However, these notches are generated in unnecessary portions cut out from the flexible sheet 400, and are not generated in the inlet after being cut out. Therefore, it is possible to prevent the problem of weakening the strength of the inlet.

  FIG. 12 shows another example of the cutting line. In this example, there is a cutting line that connects the bending point 411 and the vertex 412, and the vertex 412 and the end point 413 in a substantially straight line. The end point 421 of the cutting line 42 adjacent to the IC chip 1a and corresponding to the IC chip 1b to be subsequently cut is located on the IC chip 1b side with respect to the bending point 411, but on the IC chip 1a side with respect to the end point 413. Yes. That is, the end point 421 is located closer to the IC chip 1a than the line connecting the vertex 412 and the end point 413. Therefore, the cutting line 41 and the cutting line 42 intersect at an intersection 422 on a line segment connecting the vertex 412 and the end point 413 of the cutting line 41. At this intersection 422, the cutting line 41 and the cutting line 42 are connected and cut continuously.

  Also in the example shown in FIG. 12, the notch is generated in an unnecessary portion cut out from the flexible sheet 400 as in the example shown in FIG. 11, and does not occur in the inlet after being cut out. Therefore, it is possible to prevent the problem of weakening the strength of the inlet. Further, in this example, since cutting is performed linearly, it is particularly suitable for cutting using a blade instead of laser light.

  In the examples shown in FIG. 10 to FIG. 12, the cutting lines 41a and 41b corresponding to the IC chip 1a that is subjected to the cutting process first are bent inward and then folded, and then the cutting corresponding to the IC chip 1b that is subjected to the cutting process. The lines 42a and 42b were formed in a straight line intersecting the cutting lines 41a and 41b. However, the present invention is not limited to this configuration, and the cutting lines 41a and 41b corresponding to the IC chip 1a may be linear and bent after being bent inward at the cutting lines 41a and 41b corresponding to the IC chip 1b. Further, the cutting lines 41a and 42a on one side are bent after the cutting line 41a is bent inward, and the cutting line 42a is linear, and the cutting lines 41b and 42b on the other side are linear. The cutting line 42b may be folded after being bent inward. Similarly, for the cutting lines 41a and 42a on one side, the cutting line 41a is linear, bent after the cutting line 42a is bent inward, and turned on the cutting lines 41b and 42b on the other side. After bending, it may be turned back to make the cutting line 42b linear.

  Furthermore, each of the pair of cutting line 41a / cutting line 42a and the pair of cutting line 41b / cutting line 42b only needs to have a cutting line that turns back after either one is bent inward. The other need not be linear. A curved line or a bending point may be included as long as it is a shape that intersects on a line segment that has been bent inward. For example, a cutting line 423 indicated by a dotted line in FIG.

  Next, the punching device 307 will be described. As described above, the punching device 307 determines that the IC chip 1 or non-contact to be determined when the IC chip 1 and the non-contact transmission coil 2 that have been confirmed by the control device 313 are not operating normally. A part of the contact transmission coil 2 is punched out by pressing. As a result, the defective product can be processed so as not to operate completely, and the defective IC chip can be collected.

  FIG. 13 shows a position where the punching device 307 punches. In this example, punching is performed in two regions indicated by D1 and D2 in the drawing. The region D1 is a region including the IC chip 1. Since the IC chip 1 is removed from the inlet 5 by punching out the region D1, the IC chip 1 in the inlet 5 cannot be image-recognized in the process of image recognition and resin sealing. A useless resin sealing step is not performed. Thereby, cost reduction can be realized.

  The region D2 is a region including a part of the non-contact transmission coil 2. By punching out the region D2, the non-contact transmission coil 2 does not function as an antenna, so that it is reliably treated as a defective product in subsequent inspection and test processes using a reader / writer or the like. In this example, the region D2 is set in the vicinity of the center portion in the width direction of the inlet 5 in particular. If the region D2 is set in the vicinity of the end of the inlet 5, the distance between the punched hole generated in the region D2 and both ends with respect to the tensile stress in the longitudinal direction is not uniform. Cracks are likely to occur. On the other hand, in this example, a punched hole is generated near the center and the distance to both ends is uniform, so that durability against tensile stress in the longitudinal direction is improved.

  The punching by the punching device 307 may be performed in both the region D1 and the region D2, or one of them may be performed.

  The processing flow in the control device 313 and the punching device 307 will be described with reference to FIG. First, the control device 313 performs a test of the IC chip 1 flowing continuously by the reader / writer 306 (S101).

  As a result of the test, when an error is detected regarding the operation of the IC chip 1 (S102), the control device 313 instructs the punching device 307 to perform punching processing on the IC chip 1 that has detected the error. The punching device 307 executes the punching process of the IC chip 1 that has detected the error in response to the command (S103). If the end of the inlet is not detected (S104), the next test (S101) of the IC chip 1 is further executed.

  On the other hand, if no error is detected regarding the operation of the IC chip 1 as a result of the test (S102) and no termination is detected (S104), the next test (S101) of the IC chip 1 is further executed. If the end is detected (S104), the process ends.

  The inlet 5 is wound and shipped as a roll body 312. After the shipment, the position of the IC chip is recognized and further cut between adjacent inlets by a laser device or the like. FIG. 15 shows cutting lines 51 and 52. At this time, since the inwardly curved portion is located between the cutting lines 51 and between the cutting lines 52, it is cut off and is not used in the subsequent manufacturing process.

In the above example, the laser device is used for trimming. However, the present invention is not limited to this, and a blade may be used.
In the above example, the communication member, which is a combination of the IC chip and the non-contact transmission coil, is mounted on the non-woven fabric, which is a flexible sheet. Instead, it is preliminarily printed on a resin sheet such as PET by a printing technique or the like. An inlet having a structure in which a coil is formed and an IC chip is mounted on the coil for electrical connection may be used.
When performing side trimming on the inlet having the above structure, it is not necessary to consider the deviation between the resin sheet and the coil. Therefore, the position of the IC chip is detected in consideration of the deviation when the IC chip is mounted. Trim both ends.
In the above-mentioned example, the combination member in which the non-contact transmission coil is directly mounted on the IC chip is used as the communication member. However, the present invention is not limited to this, and the IC chip is formed on the back surface opposite to the circuit formation surface of the IC chip. By connecting a reinforcing plate such as a slightly larger metal thin film with an adhesive or mounting an IC chip on a thin substrate and connecting the substrate and the antenna, the antenna and the IC chip are electrically connected via the thin substrate. It can also be applied to a module having a structure to be connected.
When performing side trimming in the embodiment, the position of the IC chip is detected, and the position of trimming is determined based on this position information. However, in the module having the above structure, the position of the reinforcing plate or the thin substrate is detected and this is used. It is also possible to perform trimming based on the IC chip position.

It is a top view which shows the structure of IC module. Sectional drawing which shows a part of structure of IC module It is an external appearance schematic diagram of a non-contact IC card. It is a top view which shows a part of winding apparatus for manufacturing the inlet concerning this invention. It is sectional drawing which shows a part of winding apparatus for manufacturing the inlet concerning this invention. It is a top view which shows a part of flexible sheet for manufacturing the inlet concerning this invention. It is a schematic diagram of the manufacturing apparatus which manufactures the inlet concerning this invention. It is a figure which shows the inlet concerning this invention. It is a figure which shows an example of the trimming flow in this invention. It is a figure which shows an example of the trimming flow in this invention. It is a figure which shows an example of the trimming flow in this invention. It is a figure which shows an example of the trimming flow in this invention. It is a figure which shows the punching process position in this invention. It is a flowchart which shows the punching process in this invention. It is a figure which shows the cutting position of the inlet in this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC chip 2 Non-contact transmission coil 3 Non-woven fabric 5 Inlet 6 Lead 41 Cutting line 42 Cutting line 43 Cutting line 51 Cutting line 52 Cutting line 100 Non-contact IC card 200 Needle holding plate 300 Manufacturing apparatus 304 Laser apparatus 305 Roll body 306 Reader / writer 307 Punching device 310 Reader / writer 311 Roll body 312 Control device 400 Flexible sheet 411 Bending point 412 Vertex 413 End point 421 End point 422 Intersection 423 Cutting line

Claims (12)

Fixing a plurality of communication members composed of at least an IC chip and a non-contact transmission coil connected to the IC chip to a flexible sheet continuously at predetermined intervals;
Testing the operation of the communication member fixed to the flexible sheet;
A method of manufacturing an inlet for a non-contact type IC card, comprising: a step of punching out an IC chip of a communication member that is determined to be abnormal when it is determined that the operation of the communication member is abnormal as a result of the test. Fixing a plurality of communication members composed of at least an IC chip and a non-contact transmission coil connected to the IC chip to a flexible sheet continuously at predetermined intervals;
Testing the operation of the communication member fixed to the flexible sheet;
A contactless IC card inlet comprising a step of punching a part of a contactless transmission coil of a communication member that is determined to be abnormal when it is determined that the operation of the communication member is abnormal as a result of the test Manufacturing method.   3. The method of manufacturing an inlet for a non-contact type IC card according to claim 2, wherein the step of punching out the coil for non-contact transmission punches out the coil for non-contact transmission near the central portion in the width direction of the flexible sheet.   3. The contactless IC card inlet according to claim 2, wherein the step of punching the contactless transmission coil includes punching a portion of the contactless transmission coil perpendicular to the width direction of the flexible sheet. Production method. Means for continuously fixing a plurality of communication members composed of at least an IC chip and a non-contact transmission coil connected to the IC chip to the flexible sheet at predetermined intervals;
Means for testing the operation of the communication member fixed to the flexible sheet;
An apparatus for manufacturing an inlet for a non-contact type IC card, comprising: means for punching out an IC chip of a communication member that is determined to be abnormal when it is determined that the operation of the communication member is abnormal as a result of the test. Means for continuously fixing a plurality of communication members composed of at least an IC chip and a non-contact transmission coil connected to the IC chip to the flexible sheet at predetermined intervals;
Means for testing the operation of the communication member fixed to the flexible sheet;
Inlet for non-contact type IC card comprising means for punching out a part of a non-contact transmission coil of a communication member that is determined to be abnormal when it is determined that the operation of the communication member is abnormal as a result of the test Manufacturing equipment.   7. The non-contact type IC card inlet manufacturing apparatus according to claim 6, wherein the means for punching the non-contact transmission coil punches the non-contact transmission coil in the vicinity of the central portion in the width direction of the flexible sheet.   7. The contactless IC card inlet according to claim 6, wherein the means for punching out the contactless transmission coil punches out a portion of the contactless transmission coil perpendicular to the width direction of the flexible sheet. manufacturing device. A non-contact IC card inlet comprising a flexible sheet in which a plurality of communication members composed of at least an IC chip and a non-contact transmission coil connected to the IC chip are continuously fixed at predetermined intervals,
An inlet for a non-contact type IC card in which an IC chip of a communication member that is determined to be abnormal in operation is punched. A non-contact IC card inlet comprising a flexible sheet in which a plurality of communication members composed of at least an IC chip and a non-contact transmission coil connected to the IC chip are continuously fixed at predetermined intervals,
An inlet for a non-contact type IC card in which a part of a non-contact transmission coil of a communication member that has been determined to be abnormal in operation is punched.   11. The non-contact type IC card according to claim 10, wherein the non-contact transmission coil of the communication member determined to have an abnormality in operation is punched in the vicinity of the central portion in the width direction of the flexible sheet. Inlet for. A non-contact transmission coil of a communication member that is determined to be abnormal in operation by a test is characterized in that a portion perpendicular to the width direction of the flexible sheet is punched out of the non-contact transmission coil. The inlet for a non-contact type IC card according to claim 10.

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