JP2007026239A - Shipping method for non-contact ic tag, and non-contact ic tag product - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shipping method for a non-contact IC tag in which a non-contact IC tag with a defect in function is not mixed, and a non-contact IC tag product. <P>SOLUTION: The shipping method for the non-contact IC tag according to the present invention is characterized in that: function inspection is carried out in non-contact IC tag units in a stage after manufacture of an antenna sheet; when a function defect is detected, non-contact IC tags 1 in the unit where the defect is detected are marked and the non-contact IC tags in the one group are manufactured as final products as they are; function inspection is performed again in the state of the final products; the non-contact IC tag in the unit where the function defect is detected, non-contact IC tags which are previously marked, and portions of IC chip 3 parts or antenna patterns 2 of both the IC tags are punched to form a perforation 8; and they are shipped as products while the defective among completed articles is discriminatingly specified. The non-contact IC tag product 1R according to the present invention is a product whose defective can visually be discriminated immediately by punching the non-contact IC tag with the function defect. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a non-contact IC tag shipping method and a non-contact IC tag product. More specifically, the present invention relates to a method of clearly shipping defective products when shipping a non-contact IC tag as a product in a continuous winding shape or a connecting unit of several sheets, and a non-contact IC tag product by the method.
The technical field of the present invention relates to the manufacture and use of non-contact IC tags, and the main fields of use are fields such as product quality control, inventory control, transportation and distribution, and factory process control.

Non-contact IC tags record and hold information and can exchange information with external devices in a non-contact manner, so they are often used as recognition media in transportation and logistics, or for various purposes such as product quality control and inventory management. It is becoming.
However, when non-contact IC tags are widely used in this way, if a malfunctioning product is mixed in the shipped non-contact IC tags, information cannot be written or read. This results in losing the trust of the system that uses the non-contact IC tag.

  When manufacturing non-contact IC tags, an IC chip and an antenna are joined to manufacture an inlet (antenna sheet), and then processing is performed according to the required final product form. The intermediate product checked as defective may recover its function for some reason in the subsequent process. In such a case, there is a risk that the product will eventually be shipped as a non-defective product. However, the IC tag that has been detected to have a malfunction once in this manner remains structurally defective and often reoccurs in the course of use in the market.

An object of the present invention is to prevent such a functionally unstable contactless IC tag from being shipped. If the non-contact IC tag is a single product, it will not cause a problem if it is removed when a defect is detected. However, the non-contact IC tag is manufactured in a continuous winding shape or connected body. In this case, there is a problem that the process becomes discontinuous or is interrupted and smooth production cannot be performed if a process of cutting and removing is performed each time a defective product is detected.
In view of this, the present invention proposes a method for reliably indicating defective products in a manner that does not interfere with the production process.

As a related prior art document, Patent Document 1 discloses that in a manufacturing process of a semiconductor package, an IC chip is provided at a portion excluding a step of providing a defect identification mark at a defective portion of a circuit board and a portion provided with the defect identification mark. The manufacturing process including the process of mounting is proposed.
Japanese Patent Laid-Open No. 2004-228688 inspects whether or not an IC normally operates when an IC chip is manufactured in an IC card manufacturing method, writes specific data to an IC memory whose inspection result is normal, and finally It describes that the contents of the IC chip internal memory are read in the process to determine whether or not the product is an NG product.
However, it is conceivable that the identification cannot be performed simply by adding a mark as in Patent Document 1 due to dropping or abrasion of the mark. In the case of Patent Document 2, even if it is recorded in the memory, it cannot be immediately discriminated visually, so it may be shipped as a final product or an NG product may be used.

JP 2001-338933 A JP 2002-42093 A

In the conventional non-contact IC tag shipping method, the final inspection result is emphasized, and there is a situation in which the inspection result of the intermediate process is not reliably reflected in the shipping product. However, an IC tag in which a defect is detected in an intermediate process often leaves structural defects and is preferably not included in the final product.
Therefore, in the present invention, an IC tag whose malfunction is detected in the inspection after the manufacturing of the antenna sheet of the non-contact IC tag is visually removed by removing a part of the IC chip portion or the antenna coil in the final product. By clarifying that it is a defective product, the problem is to be solved.

  In the first aspect of the present invention, an IC chip having a processing function, a storage function, and an input / output function is coupled to an antenna pattern formed on a base film, and the antenna pattern of the base film is further covered with a plastic film or a paper substrate. In the process of manufacturing a group of non-contact IC tags having the same structure, in the stage after the manufacture of the antenna sheet in which the IC chip is coupled to the antenna pattern, a function test is performed for each non-contact IC tag unit to detect a malfunction. If it is, mark the non-contact IC tag of the unit in which the defect is detected, manufacture a group of non-contact IC tags in the state of the final product, and perform the function inspection again in the state of the final product. The non-contact IC tag of the unit in which the malfunction was detected, the non-contact IC tag previously marked, and the I of both non-contact IC tags A non-contact IC tag shipping method, wherein a chip part or a part of an antenna pattern is punched and removed to provide a perforation, and the product is shipped in a state where a defective non-contact IC tag in a finished product can be clearly indicated; It is in.

  According to a second aspect of the present invention, an IC chip having a processing function, a storage function, and an input / output function is coupled to an antenna pattern formed on a base film, and the antenna pattern of the base film is further covered with a plastic film or a paper substrate. In the process of manufacturing a group of non-contact IC tags having the same structure, in the stage after the manufacture of the antenna sheet in which the IC chip is coupled to the antenna pattern, a function test is performed for each non-contact IC tag unit to detect a malfunction. In the case where the defect is detected, the IC chip part of the non-contact IC tag of the unit in which the defect is detected or a part of the antenna pattern is punched out and a perforation is provided, and the non-contact IC tag is manufactured as a final product in that state. The IC chip of the non-contact IC tag of the unit in which the functional test is performed again in the state of the final product and the malfunction is detected A non-contact IC tag shipping method, characterized in that a part or antenna pattern is punched and removed to provide a hole, and the product is shipped in a state where a defective non-contact IC tag in a finished product can be clearly indicated. is there.

  In the above, the malfunction may be a case where contactless communication is completely impossible and a case where the communication distance of contactless communication does not satisfy the standard. This is because it is not practical unless both criteria are met.

  A third aspect of the present invention is a group of non-contact IC tag rolled-up or concatenated products, and the unit of non-contact IC in which a malfunction is detected in the manufacturing process in the group of non-contact IC tags. A non-contact IC tag product, wherein an IC chip portion of the tag is punched and removed.

  A fourth aspect of the present invention is a group of non-contact IC tag rolled-up or connected products, and a unit of non-contact IC in which a malfunction is detected in the manufacturing process in the group of non-contact IC tags. A non-contact IC tag product in which a part of the antenna pattern of the tag is punched and removed.

In the non-contact IC tag shipping method of the present invention, two functional tests of the intermediate process and the final process are passed, and the results can be clearly shown visually, and the non-contact IC tag cannot be used. Therefore, the non-contact IC tag whose function is unstable at the shipping destination is not erroneously used, and only a good non-contact IC tag can be used with confidence.
In the non-contact IC tag product of the present invention, the IC chip part of the non-contact IC tag or a part of the antenna pattern of the unit in which the malfunction is detected in the manufacturing process and the final product is punched and punched. The non-defective product is visually clear and can be reliably excluded from use at the shipping destination.

The present invention relates to a non-contact IC tag shipping method and a non-contact IC tag product. First, the invention related to a non-contact IC tag product will be described with reference to the drawings.
FIG. 1 is a diagram showing a first embodiment of the non-contact IC tag product of the present invention, FIG. 2 is a diagram showing the second embodiment, and FIG. 3 is a flowchart showing a manufacturing process of the non-contact IC tag product, FIG. 4 is a diagram showing a general form of a non-contact IC tag.

4A and 4B are diagrams showing a general form of the non-contact IC tag 1, in which FIG. 4A is a plan view, and FIG. 4B is a cross-sectional view through the IC chip 3 portion of FIG. 4A. is there.
As shown in FIG. 4A, the non-contact IC tag 1 has an antenna pattern 2 formed on a base film 11 and IC chips 3 are mounted on both ends 2a and 2b of the antenna pattern 2. The IC chip 3 is a normal one having a processing function, a storage function, and an input / output function.
In FIG. 4, the antenna pattern 2 is a flat coil shape, but may be composed of two pieces of patch antennas or bipolar antennas. Usually, it consists of a pattern in which a metal foil laminated on the base film 11 is photo-etched or printed with conductive ink.

4B, the surface of the antenna pattern 2 and the IC chip 3 is covered with the surface protective sheet 4 with the adhesive layer 5 interposed therebetween. For the surface protection sheet 4, the same substrate as the base film 11, another plastic film, a paper substrate, or the like is used.
In the figure, there is a gap between the antenna pattern 2 and the adhesive layer 5, but the antenna pattern 2 and the adhesive layer 5 are actually in close contact. When the non-contact IC tag 1 is used as a label, an adhesive layer 6 is provided on the surface of the base film 11 on the adherend side. The pressure-sensitive adhesive layer 6 is protected by a release paper 7 having a release surface, and the release paper 7 is removed before use. The above configuration is the same as that of a normal non-contact IC tag.

In the case of FIG. 4, the unit is a non-contact IC tag. However, in the non-contact IC tag product of the present invention, a group of non-contact IC tags that are two or more units of non-contact IC tags are wound or connected. There is a feature configured as a product of the body. One group means that two or more non-contact IC tags are connected in a winding shape or in a row, or in a vertical and horizontal matrix. In the case of a wound form, it is a unit of several tens or several hundreds, but in the case of an articulated body, it is often a group of about 3 to 30 groups.
In general, the separation lines 12 are formed by perforations or the like so that the non-contact IC tags of individual units can be easily cut (see FIG. 1).

  FIG. 1 shows a first embodiment of the non-contact IC tag product of the present invention, and shows a case where five single-row connecting bodies 1R are used. The feature of the non-contact IC tag product of the first embodiment is that the IC chip 3 portion of the non-contact IC tag 1 in which a malfunction is detected is completely removed by punching. Since the punched portions 8a and 8b are formed in the punched portion, it can be visually identified as a defective product, and it is not used and stuck to the product.

The punching of the IC chip 3 part includes, for example, both the hole 8a by the functional inspection immediately after the manufacture of the antenna sheet and the hole 8b by the functional inspection performed at the final product stage. When a defect is detected in the state of the antenna sheet, there are a case where punching is performed immediately in the state of the antenna sheet, and a case where punching is performed after a mark is provided for the final product. In the case of punching immediately, the surface protective sheet 4 and the release paper 8 are provided also in the perforated portion. Therefore, in the case of the opaque surface protective sheet 4, the position of the perforated 8 may not be known. In the case of punching with the final product, since it is in a penetrating state, the perforations 8 can always be visually confirmed.
As shown in FIG. 1, up to two of the five are usually not defective, but are shown as examples.

  FIG. 2 shows a second embodiment of the non-contact IC tag product of the present invention, and similarly shows a case where five single-row connecting bodies 1R are formed. A feature of the non-contact IC tag product 1R of the second embodiment is that a part of the antenna pattern 2 of the non-contact IC tag 1 in which a malfunction is detected is completely removed by punching. Similarly, a perforation 8c is formed in the punched portion. A part of the antenna pattern and the IC chip 3 part may be punched together. Of course, a mark indicating a defect may be attached at the same time.

Next, a method for manufacturing a non-contact IC tag product will be described.
FIG. 3 is a flowchart showing a manufacturing process of a non-contact IC tag product. Although there are various manufacturing methods, a process of manufacturing an antenna pattern by photoetching is shown.
S <b> 1 of the manufacturing process is a preparation process of the base film 11. In this step, the base film 11 is prepared by laminating a metal foil as a base material. Various materials described later can be used for the base film 11, but those having a thickness of about 20 μm to 100 μm are preferably used. As the metal foil, a copper foil or aluminum foil having a thickness of about 8 μm to 10 μm is usually used.

  S <b> 2 of the manufacturing process is a process of forming the antenna pattern 2. In this step, a photosensitive solution is applied to the metal foil surface and exposed using a photomask to form an antenna resist pattern. Next, the antenna pattern 2 is left by photoetching. Both end portions 2a and 2b of the antenna pattern 2 are formed simultaneously.

  S <b> 3 of the manufacturing process is a bonding process of the IC chip 3. In this step, the IC chip 3 is attached to both ends 2a and 2b of the antenna pattern 2 using a conductive adhesive or the like. A process of electrically connecting one end of the antenna pattern 2 to the end portion 2a of the antenna pattern 2 through the back surface of the base film 11 is also performed. Thereby, an inlay (antenna sheet) is completed.

S4 of the manufacturing process is a first function inspection of the non-contact IC tag. This inspection is performed in the state of an inlay (antenna sheet). The functional inspection satisfies standards such as JIS and other manufacturing standards, but is generally not regarded as malfunctioning if it satisfies practical standards.
A typical example of a malfunction is when contactless communication is completely impossible. This is often caused by a case where the IC chip itself is defective and a connection failure between the IC chip 3 and the antenna pattern 2. The cause is not clear, but it also includes the case where no response occurs even when a certain standard electromagnetic wave is applied.

Another example of a malfunction is when the contactless communication distance does not meet the criteria. In the proximity type IC card (the same applies to the IC tag) having an operating range of 70 cm or less, the minimum operating magnetic field strength (H _min ) is set to 150 mA / m rms (JISX6323-2, 6.2 operating magnetic field strength). For this test, it is tested that reading and writing can be performed at a distance of 30 cm using a commercially available reader / writer. An inspection reader / writer may be used.
A proximity IC card (operation range of 10 cm or less) is tested for performance at a shorter distance.

Moreover, you may include the operation | movement test after receiving an alternating magnetic field, an alternating electric field, static electricity, and a static magnetic field. This inspection standard is defined in JISX6323-1 (proximity IC card).
If the above-mentioned inspection does not satisfy a predetermined standard, the IC chip portion or a part of the antenna pattern is punched and removed as a malfunction. In order to perform punching collectively after the final inspection, a mark may be added to the malfunctioning portion.

  S5 of the manufacturing process is a surface protection sheet laminating process. The surface protection sheet 4 protects the antenna pattern 2 and the IC chip 3 of the non-contact IC tag 1, and various materials described later can be used. Usually, a base material that is equal to or thinner than the base film 11 is laminated and used. Since water resistance is often required, it is preferable to use a plastic film.

  S6 of the manufacturing process is a coating process of the pressure-sensitive adhesive layer 6. In this step, a process of applying the adhesive layer 6 to the lower surface of the base film 11 is performed. Usually, an adhesive is applied to the release paper 7 and integrated with the base film 11.

S7 of the manufacturing process is a shipping inspection as a final product. It also serves as the second function test. This is because problems may occur in the process of processing the antenna sheet into a final product. The non-contact IC tag does not receive the high pressure of the hot press like the manufacturing process of the IC card, but it may be bent during the process of press laminating or moving between rollers in the web shape, which may cause problems. .
The inspection is performed on the first function inspection item and items to be added to it if necessary, and the malfunctioning non-contact IC tag punches and removes a part of the IC chip 3 or the antenna pattern 2 to provide a hole 8. The formation of the predetermined unit of cutting and the separation line 12 in the case of forming a group of connected bodies is performed thereafter.

Embodiments relating to materials (1) Base film A wide variety of plastic films can be used, and the following single films or composite films thereof can be used.
Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.

(2) Surface protection sheet A wide variety of plastic films and paper substrates can be used. As the plastic film, those mentioned in the above base film can be used, and as the paper substrate, high-quality paper, coated paper, craft paper, glassine paper, synthetic paper, latex, melamine-impregnated paper, and the like can be used. For printer printing on the surface, fine paper, coated paper, etc. are particularly preferred.

(3) Adhesive, pressure-sensitive adhesive In the present specification, the term adhesive refers to various types such as a solvent type, a polymerization type, an ultraviolet curable type, an emulsion type, and a heat-melt type. Shall be included. In either case, the purpose can be achieved by bonding the two materials.
Further, in the present specification, the term “adhesive” refers to an adhesive that keeps an intermediate tack state indefinitely without a significant increase in viscosity.
Various resin compositions such as natural rubber, nitrile rubber, epoxy resin, vinyl acetate emulsion, acrylic, acrylate copolymer, polyvinyl alcohol, phenol resin, etc. Material can be used.

Hereinafter, actual embodiments will be described using examples.
As a base film 11 for an IC tag product, a substrate obtained by dry laminating a 10 μm thick aluminum foil on a 38 μm thick transparent biaxially stretched polyethylene terephthalate (PET) film is coated with a photosensitive resist. A photomask having After exposure and development, photoetching was performed to complete an inlet (antenna sheet) having an antenna pattern 2 as shown in FIG. One antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.

  The IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm was attached to the antenna pattern both ends 2a and 2b of the inlet base film 11 by applying heat pressure in a face-down state. A process of conducting one end of the antenna pattern 2 to the end 2a of the antenna pattern 2 through the back surface of the base film 11 was also performed.

  When the inlet (antenna sheet) was completed, the first functional test was performed. For this, a commercially available IC tag reader / writer ("RCT-200-01" manufactured by Weltcat Co., Ltd .; 13.56 MHz) is used, and a response is obtained from the target non-contact IC tag at a distance of 30 cm from the reader / writer. Whether or not it was inspected. Since the inlet (antenna sheet) is wound up, it is necessary to inspect the surrounding non-contact IC tag so that a response can be obtained from one target. When no response was obtained, a mark was given.

  Next, a surface protective sheet (PET film) 4 having a thickness of 32 μm was laminated through a polyester hot melt adhesive and laminated by hot pressing. Finally, the back surface of the base film 11 is subjected to an adhesive processing in which a release paper 7 is laminated via an adhesive layer 6 having a thickness of 20 μm, and one unit of a 54 mm × 86 mm non-contact IC tag has 5 units in a row. The non-contact IC tag product 1R with the release paper 7 was completed. Processing to provide a separation line 12 between the non-contact IC tags of the unit was also performed.

  After the final product was completed, functional inspection was performed under the same conditions as after the inlet (antenna sheet) was completed. For the malfunctioning non-contact IC tag detected in the subsequent inspection stage and the previous inspection, the IC chip 3 portion was punched out to provide a hole 8.

It is a figure which shows 1st Embodiment of the non-contact IC tag product of this invention. It is a figure which shows the 2nd Embodiment. It is a flowchart which shows the manufacturing process of a non-contact IC tag product. It is a figure which shows the general form of a non-contact IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC tag 1R Non-contact IC tag connection body, non-contact IC tag product 2 Antenna pattern 3 IC chip 4 Surface protection sheet 5 Adhesive layer 6 Adhesive layer 7 Release paper 8, 8a, 8b, 8c Perforation 11 Base film 12 Cut line

Claims (5)

An IC chip having a processing function, a storage function, and an input / output function is coupled to an antenna pattern formed on a base film, and the antenna pattern of the base film is further covered with a plastic film or a paper substrate. In the manufacturing process of the contact IC tag, in the stage after the manufacture of the antenna sheet in which the IC chip is bonded to the antenna pattern, a function test is performed for each non-contact IC tag unit, and if a malfunction is detected, the defect is detected. A non-contact IC tag is detected in the unit in which it is detected, and a group of non-contact IC tags are manufactured in the final product state in that state, and a functional test is performed again in the final product state to detect a malfunction. Unit of non-contact IC tag, non-contact IC tag previously marked, and IC chip portion of both non-contact IC tags or The part of the antenna pattern, the perforations provided in punching removed, ready to demonstrate defective non-contact IC tag in the finished product, the non-contact IC shipment how the tag, characterized in that the product shipment. An IC chip having a processing function, a storage function, and an input / output function is coupled to an antenna pattern formed on a base film, and the antenna pattern of the base film is further covered with a plastic film or a paper substrate. In the manufacturing process of the contact IC tag, in the stage after the manufacture of the antenna sheet in which the IC chip is bonded to the antenna pattern, a function test is performed for each non-contact IC tag unit, and if a malfunction is detected, the defect is detected. The IC chip part of the non-contact IC tag or the part of the antenna pattern of the unit in which the detection is detected is punched out to provide a perforation, and in that state, the non-contact IC tag is manufactured in a final product state. The functional test is performed again, and the IC chip portion or antenna of the contactless IC tag of the unit in which the malfunction is detected is A part of the pattern, the perforations provided in punching removed, ready to demonstrate defective non-contact IC tag in the finished product, the non-contact IC shipment how the tag, characterized in that the product shipment. 3. The contactless IC tag according to claim 1, wherein the malfunction is when contactless communication is completely impossible and when the communication distance of contactless communication does not satisfy the standard. shipping method. A group of non-contact IC tag rolled-up or connected products, in which the IC chip portion of the unit of the non-contact IC tag in which a malfunction is detected in the manufacturing process is punched out of the group of non-contact IC tags A non-contact IC tag product that is removed. A part of a non-contact IC tag antenna pattern in a group of non-contact IC tags that are rolled up or connected to each other and in which a malfunction is detected in the manufacturing process. Is a non-contact IC tag product characterized by being punched and removed.

Images