JP2001043338A - Ic card and method for using same and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card, which can be produced by a uniform process and can prevent the mixing of a defective article, without complicating a production process by providing resonance circuit which has a specified resonance frequency, to be invalidated when decided as a defective article in the middle of production. SOLUTION: Concerning an IC card 10, the prescribed number of antenna coils 11a are formed on an antenna sheet 11. The coil 11a is provided with pads for mounting an IC 30 at both ends and constitutes the resonance circuit by connecting a capacitor 11b for resonance. The antenna sheet 11 is laminated with a protecting sheet and punched into card size later. The punched card is irradiated with electromagnetic waves including the specified resonance frequency from a dedicated reader and the presence/absence of resonance to this radiation is detected. The card resonated to react to the electromagnetic waves is defined as a non-defective article. The card of no reaction is defined as a defective article and discarded.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for improving the efficiency of production by facilitating the selection of defective products generated in the production process.
The present invention relates to a C card, a method of using the C card, and a method of manufacturing the C card.

[0002]

2. Description of the Related Art Conventionally, in the manufacture of an IC card, an IC chip is often mounted in a final stage after a card base material is completed. The reason for this is that IC chips are expensive, but are vulnerable to loads such as bending and heat, and cannot be removed once mounted on the card base. After completion, the IC chip is mounted in the final stage.

FIG. 13 is a diagram showing an example of a conventional method for manufacturing a card base material of an IC card. The IC card 10
Conventionally, it is manufactured by the following method. (1) An antenna coil 11a formed by subjecting a copper foil to photoetching or the like is disposed on a resin sheet, or the antenna coil 1a is directly applied to the resin sheet with conductive ink.
The antenna sheet 11 is manufactured by printing 1a (FIG. A). Antenna sheet 11 thus manufactured
Is supplied as one large sheet-like sheet having a plurality of antenna coils 11a, or is supplied as a roll-shaped sheet in which one or more rows of antenna coils 11a are arranged.

(2) The sheet-shaped or roll-shaped antenna sheet 11 prepared in (1) is replaced with an adhesive sheet or PE.
It is sandwiched between resin sheets 12 and 13 such as T and PVC (FIG. B).

(3) The antenna sheet 11 sandwiched in (2) is heated and pressurized and press-laminated to produce a base sheet 20 (FIG. C).

(4) The base sheet 20 prepared in (3) is punched into a large card to complete the IC card 10 (FIG. D). If a defect occurs in some of the antenna coils 11a during manufacture of the IC card 10 and the antenna coil 11a becomes defective, a visual marking such as a punched hole or coloring is performed. Defective products are discriminated to prevent elements such as the IC 30 from being mounted on defective products (FIG. E).

[0007]

However, the above-described conventional method for manufacturing an IC card has the following problems. That is, conventionally, the plurality of coils 1 of the antenna sheet 11 are
In the case where a defect occurs during manufacture of only a part of the coils in 1a and becomes defective, visual marking such as punch holes or coloring is performed, and then another resin sheet 12 is attached to the antenna sheet 11. , 13 are superimposed to form the base sheet 20, so that the marking for identification attached to the antenna sheet 11 cannot be seen. Therefore, conventionally, in order to identify this defect after the production of the base material sheet 20, a visual marking is again performed on the resin sheet corresponding to the outermost layer of the card, or the position of the defective product is recorded on a separate sheet. Defective products were removed while watching. For this reason, the manufacturing process becomes complicated, resulting in the mixing of defective products,
The cost was to rise.

It is an object of the present invention to provide an IC card which can be manufactured in a uniform process without complicating the manufacturing process, and which can prevent mixing of defective products, and a method of using and manufacturing the same. .

[0009]

The present invention solves the above-mentioned problems by the following means. In addition, in order to make it easy to understand, description is given with reference numerals corresponding to the embodiment of the present invention, but the present invention is not limited to this. In order to solve the above-mentioned problem, the invention according to claim 1 includes a coil (1).
1a, 14a) and a capacitor (11b, 14b) and a resonance circuit (11b, 14b) which has a specific resonance frequency and is invalidated when it is determined to be defective during manufacture.
d, 14).

According to a second aspect of the present invention, there is provided the IC according to the first aspect.
The card is an IC card characterized in that the coil also serves as an antenna coil (11a) for exchanging data without contact with an external device.

[0011] The invention of claim 3 is claim 1 or claim 2.
Wherein the resonance circuit (11d, 11d,
The IC card according to claim 1, further comprising a protection sheet (12, 13) formed to cover the resonance circuit (11d, 14) for protecting the resonance circuit (11d, 14).

According to a fourth aspect of the present invention, there is provided the first to third aspects.
The method of using an IC card according to any one of the preceding claims, wherein when the antenna coil is determined to be defective by an inspection during manufacture of the antenna coil, the resonance circuit (11d, 14) is turned off. Disabled, then
If the resonance circuit (11d, 14) resonates when irradiating an electromagnetic wave of a specific frequency, the antenna coil is determined to be good, and if it does not resonate, it is determined to be defective. This is a characteristic method of using an IC card.

[0013] The invention of claim 5 is the invention according to claims 1 to 3.
The method of manufacturing an IC card according to any one of the preceding claims, wherein the resonance circuit (11d, 1) resonates at a specific frequency.
4) forming a resonance circuit (# 101), and the resonance circuit (11) in the resonance circuit forming step (# 101).
d, 14), the antenna coil is inspected,
If the antenna coil is determined to be defective,
An inspection step (# 102) for disabling the resonance circuit (11d, 14), and after inspecting the antenna coil in the inspection step (# 102), irradiating an electromagnetic wave of a specific frequency to the resonance circuit (11d, 14). , 14) resonates,
The antenna coil is determined to be non-defective, and if it does not resonate, the defective coil is determined to be defective (# 1).
04). A method of manufacturing an IC card, comprising:

According to a sixth aspect of the present invention, there is provided an IC according to the fifth aspect.
A method for manufacturing a card, wherein the resonance circuit forming step (#
101. A method of manufacturing an IC card, further comprising a protective sheet laminating step (# 103) of laminating protective sheets (12, 13) for concealing and protecting the resonance circuit (11d, 14) formed in 101). .

[0015] The invention of claim 7 is the invention of claim 5 or claim 6.
3. The method of manufacturing an IC card according to claim 1, wherein only the non-defective products determined in the defective product determination step (# 104)
An IC card manufacturing method further comprising an IC mounting step (# 105) for mounting (30).

[0016]

Embodiments of the present invention will be described below in more detail with reference to the drawings. (First Embodiment) FIG. 1 is a perspective view showing a first embodiment of an IC card according to the present invention. In the figure, (A) is a diagram showing an antenna sheet during manufacture, and (B) is an enlarged view of the antenna sheet. Note that the same reference numerals are given to portions that perform the same functions as in the above-described conventional example. IC card 10
Includes an antenna sheet 11 and protection sheets 12 and 13 (see FIG. 4).

The antenna sheet 11 is a sheet having an antenna coil 11a for exchanging data without contacting an external device and connecting an IC 30 for storing the exchanged data. The antenna sheet 11 has an antenna coil 11a and a capacitor 11b. The antenna sheet 11 is made of a generally used resin material (for example, polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl alcohol (PVAL), polyvinyl chloride (P
VC), polycarbonate (PC), acrylonitrile / butadiene / styrene copolymer (ABS), acrylonitrile / styrene copolymer (AS), polymethyl methacrylate (PMMA), cellulose acetate butyrate (CAB), cellulose propionate (CP) )) Can be used.

The antenna coil 11a is a part for exchanging data without contacting an external device, and is formed by subjecting a copper foil to photo-etching or the like, or by printing a conductive ink directly on the antenna sheet 11. be able to. The antenna coil 11a, together with the capacitor 11b, forms a resonance circuit that resonates with an electromagnetic wave having a specific frequency. On both ends of the antenna coil 11a, pads (electrodes) 11d for mounting the IC 30 are formed (see FIG. 2). The capacitor 11b forms a resonance circuit with the antenna coil 11a. The two electrodes of the capacitor 11b are formed on the front surface (shown by a solid line in the drawing) and the back surface (shown by a dotted line in the drawing) of the antenna sheet 11.

The protection sheets 12, 13 are sheets for protecting the antenna sheet 11, and are formed on the antenna sheet 11 (see FIG. 4). The protection sheets 12 and 13 are formed of the same resin material as the antenna sheet 11.

The IC 30 is a part for storing data exchanged with an external device, and is arranged on the antenna sheet 11.
It is connected to the antenna coil 11a via the pad 11c.

(Manufacturing Method) FIGS. 2 to 5 are views showing a manufacturing method of the first embodiment of the IC card according to the present invention.
The IC card 10 is manufactured as follows. (# 101: Resonance Circuit Forming Step) A predetermined number of antenna coils 11a are formed on the antenna sheet 11, and a capacitor 11b is connected to the antenna coil 11a to form a resonance circuit 11d (FIG. 2). In the embodiment shown in FIG.
A total of 9 antenna coils 1 in 3 rows and 3 rows per sheet
1a are arranged. The antenna coil 11a has, at both ends,
A resonance circuit 11d is provided by providing a pad (electrode) 11c for mounting the IC 30 and connecting a capacitor 11b for resonance.

(# 102: Inspection Step) An inspection is performed on the antenna coil 11a formed in # 101 (FIG. 3). If it is determined by this inspection that the specific antenna coil 11a cannot be used due to a defect of the antenna coil 11a such as disconnection or peeling, or that the sheet is dirty or flawed, the antenna coil 11a which is defective is determined. Marking is performed by punching out a pattern connecting the capacitor 11b and disconnecting it. Accordingly, at this time, it is possible to visually determine a defective product and a non-defective product based on the presence or absence of punching.

(# 103: protective sheet laminating step) # 10
On the antenna sheet 11 inspected in 2, opaque protective sheets 12 and 13 on which pattern printing and the like are applied are laminated (FIG. 4A) and press-laminated (FIG. 4A).
(B)), punching out to a card size (FIG. 4 (C)).

(# 104: Defective Product Judgment Step) An electromagnetic wave including a resonance frequency is radiated from the dedicated reading device to the card punched in # 103, and the presence or absence of resonance with respect to this radiation is read, and the card is electrically connected. (FIG. 5). At this time, a card that resonates and reacts to the electromagnetic wave is determined to be good, and a card that does not react is determined to be defective.

(# 105: IC mounting step) Of the cards determined in # 104, those cards determined to be defective are discarded without mounting the IC 30, and only those cards determined to be non-defective are used. , IC30
The C card 10 is completed.

According to this embodiment, the defective antenna coil 11a is visually good before laminating the protective sheets 12 and 13 depending on the presence or absence of a circuit cut or the presence or absence of a mark such as a seal or conductive ink. , Defective products can be distinguished, and after lamination, by examining the presence or absence of resonance of the card, non-defective products can be
Defective products can be determined. In other words, even if the antenna sheet 11 is laminated with the opaque protective sheets 12 and 13 in the next process of the card processing, and the visual marking is covered, it becomes impossible to visually distinguish a good product from a defective product. Since the internal resonance circuit 11d of the antenna sheet is invalidated, it is possible to determine whether or not the antenna coil 11a is defective by examining the presence or absence of resonance at a frequency unique to the resonance circuit.

(Second Embodiment) FIG. 6 is a diagram showing an I-mode according to the present invention.
It is a perspective view showing a 2nd embodiment of a C card. In the figure,
(A) is a diagram showing an antenna sheet during manufacture, and (B) is an enlarged view of the antenna sheet. In the following embodiments, portions that perform the same functions as those in the above-described first embodiment will be denoted by the same reference numerals, and redundant description will be omitted as appropriate. The IC card 10 includes an antenna sheet 1 having a resonance circuit 14 formed separately from the antenna coil 11a.
1 and protective sheets 12 and 13 (see FIG. 9).

The resonance circuit 14 includes a resonance coil 14a and a resonance capacitor 14b. The resonance coil 14a
Along with the antenna coil 11a, a copper foil is formed by photo-etching or the like, or a conductive ink is directly printed on the antenna sheet 11 to form. Resonant capacitor 14
The two electrodes b are on the surface of the antenna sheet 11 (in the figure,
Shown by solid lines. ) And a back surface (indicated by a dotted line in the figure).

(Manufacturing Method) FIGS. 7 to 10 show a method of manufacturing an IC card according to a second embodiment of the present invention. The IC card 10 is manufactured as follows. (# 101: Resonant Circuit Forming Step) A predetermined number of antenna coils 11a are formed on the antenna sheet 11, and a resonance capacitor 14b is connected to both ends of a resonance coil 14a separate from the antenna circuit 11a, thereby forming a resonance circuit. Circuit 1
4 (FIG. 7). In the embodiment shown in FIG. 2, a single sheet has three rows and three rows, that is, a total of nine antenna coils 11a.
And the resonance circuit 14 are arranged side by side. The antenna coil 11a has pads (electrodes) 11c for mounting the IC 30 at both ends.

(# 102; Inspection Step) An inspection is performed on the antenna coil 11a formed in # 101 (FIG. 8). If it is determined by this inspection that the specific antenna coil 11a cannot be used due to a defect of the antenna coil 11a such as disconnection or peeling, or that the sheet is dirty or flawed, the defective resonance coil 14a
The marking is performed by punching out the pattern connecting the and the resonance capacitor 14b and disconnecting it. Thus, at this time, a defective product and a good product can be visually distinguished based on the presence or absence of punching.

(# 103; protective sheet laminating step) # 10
On the antenna sheet 11 inspected in 2, opaque protective sheets 12 and 13 on which pattern printing and the like are applied are laminated (FIG. 9A) and press-laminated (FIG. 9A).
(B)), punching out to a card size (FIG. 9 (C)).

(# 104: Defective Product Judgment Step) An electromagnetic wave including a resonance frequency is radiated from the dedicated reader to the card manufactured in # 103, and the presence or absence of resonance with respect to this radiation is read, and the card is electrically connected. (FIG. 10). At this time, a card that resonates and reacts to the electromagnetic wave is determined as a good card, and a card that does not react is determined to be defective.

(# 105; IC mounting step) Of the cards determined in # 104, those cards determined to be defective are discarded without mounting the IC 30, and only those cards determined to be non-defective are provided. , IC30
The C card 10 is completed.

According to the present embodiment, the resonance coil 14a
Is formed separately from the antenna coil 11a, so that the resonance frequency of the resonance circuit 14 can be freely adjusted.

(Modifications) Various modifications and changes are possible without being limited to the above-described embodiments, and these are also within the equivalent scope of the present invention. For example, as a method of disabling the resonance circuit, in addition to the method of disconnecting by punching out the wiring pattern of the resonance circuit as in the above-described embodiment, the resonance circuit is physically cut by cutting, cutting, or the like. There is a method of disabling, or a method of disabling the resonance circuit by short-circuiting a part of the circuit with a conductive seal, conductive ink, or the like (FIGS. 11 and 12).

[0036]

As described above in detail, according to the first aspect of the present invention, a specific resonance frequency including a coil and a capacitor is provided, and invalidated when it is determined that the product is defective during manufacturing. Because it is equipped with a resonant circuit, by examining the presence or absence of resonance, good products without visual means,
Defective products can be determined.

According to the second aspect of the present invention, since the coil also serves as the antenna coil, it can be manufactured at low cost.

According to the third aspect of the present invention, the protective circuit is further provided, and the resonant circuit is concealed, so that the resonant circuit can be used particularly effectively.

According to the fourth aspect of the present invention, when it is determined by the inspection during manufacture that the product is defective, the resonance circuit is invalidated, and thereafter, the electromagnetic wave of a specific frequency is irradiated to resonate the resonance circuit. Non-defective products and defective products are determined based on the presence or absence, so that non-defective products and defective products can be determined without using any visual means.

According to the fifth aspect of the invention, a resonance circuit forming step of forming a resonance circuit that resonates at a specific frequency, an inspection step of invalidating a defective resonance circuit, and irradiation of an electromagnetic wave of a specific frequency are performed. Since the resonance circuit includes a defective product determination step of determining whether or not the card base material is non-defective based on the presence or absence of resonance, non-defective products and defective products can be determined without taking any visual means.

According to the sixth aspect of the present invention, since the method further includes a protective sheet laminating step, the resonance circuit can be concealed and protected.

According to the seventh aspect of the present invention, only the non-defective product has an IC.
Is further provided, so that the manufacturing cost of the IC card can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of an IC card according to the present invention.

FIG. 2 is a diagram illustrating a method of manufacturing an IC card according to a first embodiment of the present invention (a method of forming a resonance circuit).

FIG. 3 is a diagram showing a manufacturing method (marking method) of the first embodiment of the IC card according to the present invention.

FIG. 4 is a diagram showing a method for manufacturing an IC card according to the first embodiment of the present invention (card manufacturing method).

FIG. 5 is a diagram showing a manufacturing method (defective judgment method) of the first embodiment of the IC card according to the present invention.

FIG. 6 is a perspective view showing a second embodiment of the IC card according to the present invention.

FIG. 7 is a diagram showing a method of manufacturing an IC card according to a second embodiment of the present invention (method of forming a resonance circuit).

FIG. 8 is a diagram showing a manufacturing method (marking method) of the second embodiment of the IC card according to the present invention.

FIG. 9 is a diagram showing a method of manufacturing an IC card (card manufacturing method) according to a second embodiment of the present invention.

FIG. 10 is a view showing a manufacturing method (defective judgment method) of an IC card according to a second embodiment of the present invention.

FIG. 11 is a perspective view showing another embodiment of the IC card according to the present invention.

FIG. 12 is a perspective view showing another embodiment of the IC card according to the present invention.

FIG. 13 is a view showing an example of a conventional method for manufacturing a card base material of an IC card.

[Explanation of symbols]

 Reference Signs List 10 IC card 11 Antenna sheet 11a Antenna coil 11b Capacitor 11c Pad 11d Resonant circuit 12, 13 Protection sheet 14 Resonant circuit 14a Resonant coil 14b Resonant capacitor 20 Base sheet 30 IC

Claims (7)

[Claims] 1. An IC card having a specific resonance frequency including a coil and a capacitor, and including a resonance circuit which is invalidated when it is determined to be defective during manufacture. 2. The IC card according to claim 1, wherein the coil also serves as an antenna coil for exchanging data without contacting an external device. 3. The IC card according to claim 1, further comprising a protection sheet formed on the resonance circuit and concealing and protecting the resonance circuit. 4. One of claims 1 to 3
The method of using an IC card according to claim 1, wherein the resonance circuit is disabled when the antenna coil is determined to be defective by an inspection during the manufacture of the antenna coil, and then the specific frequency is reduced. When the resonance circuit resonates, the antenna coil is determined to be good, and when not resonating, it is determined to be defective. . 5. The method according to claim 1, wherein:
The method of manufacturing an IC card according to any one of the preceding claims, further comprising: forming a resonance circuit that resonates at a specific frequency; and forming the resonance circuit in the resonance circuit forming step.
Inspection of the antenna coil, when it is determined that the antenna coil is defective, an inspection step of disabling the resonance circuit, After inspecting the antenna coil in the inspection step, irradiating electromagnetic waves of a specific frequency When the resonance circuit resonates, the antenna coil is determined to be non-defective, and when it does not resonate, a defective product determination step of determining that the antenna coil is defective is provided. Production method. 6. The method for manufacturing an IC card according to claim 5, further comprising a protective sheet laminating step of laminating a protective sheet for covering and protecting the resonance circuit formed in the resonance circuit forming step. Manufacturing method of an IC card. 7. The method for manufacturing an IC card according to claim 5, further comprising an IC mounting step of mounting an IC only on a non-defective product determined in the defective product determining step. A method for manufacturing an IC card.