JP2008143589A - Package with ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package with an IC tag that can invalidates the IC tag without a consumer's intention when the package is opened, and thereby preventing data inside the IC tag from being read. <P>SOLUTION: An IC tag 13 provided with perforations 15 for cutting the IC tag is applied on a package 1 with an opening means 11 such as perforations so as to overlap both the perforations. By cutting the IC tag 13 along the perforations 15 for cutting the IC tag as the package 1 is opened, an antenna pattern 21 inside the IC tag 13 is cut off. Read/write of the information inside the IC tag 13 is disabled thereby, and the IC tag 13 is invalidated. The perforations 15 for cutting the IC tag are formed by an etching blade when a half-cut is performed to cut a multilayered sheet containing a plurality of the IC tags into the individual IC tags. Depths and shapes of the perforations 15 are designed so that an antenna layer for an inlet 35 forming the IC tag is not damaged. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a packaging package with an IC tag, and more particularly to a packaging package with an IC tag that can invalidate the IC tag when the packaging package is opened and cannot read data in the IC tag.

RFID (Radio), which is an identification method using wireless technology, is accompanied by the progress of wireless technology.
A product management system using Frequency Identification has been developed and is being used. In the IC tag, information related to products and the like is recorded by wireless communication with an external IC tag writer, and information recorded in the IC tag is read by wireless communication with an external IC tag reader. Information recorded on the IC tag enables product quality management, inventory management, sales management, logistics management, and the like.

  The IC tag has a layer structure such as a base material, an inlet including an antenna circuit and an IC chip, and a sealing material for protecting the inlet, and information to be written / read is accumulated in a memory of the IC chip. .

  Information recorded in the IC tag is normally read for the intended purpose such as quality management, inventory management, sales management, logistics management, etc. If there is an IC tag reader, the information in the IC tag is read. Is easy to read, and the information read and read intentionally by a third party may be misused. This is a big problem from the viewpoint of personal information protection and privacy protection.

  In response, the Ministry of Internal Affairs and Communications and the Ministry of Economy, Trade and Industry jointly formulated the “Privacy Protection Guidelines for Electronic Tags” in June 2004, and IC tags can be attached to products even after the products have been delivered to consumers. In this case, it is desirable to establish rules that are desirable to be handled by business operators handling IC tags and products.

As shown in this guideline, even when a specific individual cannot be identified only by information recorded on the IC tag, the personal information database stored in the computer or the like and the information recorded on the IC tag are linked. In some cases, a specific individual can be identified by use, and in such a case, the personal information protection law is handled, and the handling of the IC tag is very important.
This can be personal information indicating the personal condition and preferences in the fields of medical care, food, medicine, etc., so it is necessary to disable reading of the IC tag information and invalidate the IC tag as necessary. There is.

Therefore, after the sale of the product with the IC tag is completed and the initial purposes such as quality control, inventory management, sales management, and distribution management are achieved, the IC tag is peeled off from the product and the function of the IC tag. Destruction and invalidation of the communication function of the IC tag are being studied (Patent Document 1, Patent Document 2, and Patent Document 3).
JP 2001-14442 A Utility Model Registration No. 3105286 JP 2002-102310 A

  However, when IC tags are peeled off from products or IC tag functions are destroyed, the IC tag communication function must be invalidated by the consumer or the seller with the intention of invalidating the IC tag at the time of sale. If not, there is a problem that the privacy protection problem of the IC tag cannot be solved.

  In addition, there is a problem that a dedicated device is required to invalidate the communication function of the IC tag.

  The present invention has been made in view of such problems. The purpose of the present invention is to invalidate the IC tag when the packaging package is opened, even if the consumer is unaware of the invalidation of the IC tag. To provide a packaging package with an IC tag capable of making it impossible to read data in the tag.

  The present invention for solving the above-described problems is a packaging package with an IC tag, the packaging package having an opening means that enables the package to be opened, and the IC tag includes an antenna in the IC tag. A disabling unit that disables reading of data in the IC tag by dividing at least a part of the pattern, and the disabling unit includes a dividing line for dividing the antenna pattern as at least a part of the opening unit. A packaging package with an IC tag, wherein the packaging is provided so as to overlap and the IC tag is invalidated by opening the packaging package.

  When the user opens the packaging package by the opening means, the disabling means cuts the dividing line provided on the IC tag, and the antenna pattern is cut, thereby invalidating the IC tag.

Here, the dividing line is a perforation formed by a cut portion and a connection portion or a cut formed by only a cut portion, and the cut portion damages the antenna pattern at a depth that does not reach the antenna pattern layer in the IC tag. It is desirable not to be provided.
Further, the length of the cut portion and the length of the connection portion may be set so as not to completely cut the coil wire forming the antenna pattern.
Further, the connecting portion may be formed so as to straddle the coil wire that forms the antenna pattern, and the cut portion may be formed between the coil wires.

  On the other hand, the opening means is one or two perforations provided in the packaging package, or a string or tape, and the invalidating means is configured to connect the dividing line according to the opening means of the packaging package, It is desirable to provide one or two.

According to the present invention, even if the consumer is unaware of the invalidation of the IC tag, the IC tag can be invalidated when the packaging package is opened, and the data in the IC tag cannot be read. It is possible to provide a package with a package.
According to the present invention, the invalidation of the IC tag can be easily performed, and the process can be shortened. In addition, personal information can be protected.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an external view showing an example of a package 1 with an IC tag according to the present invention.

As shown in FIG. 1A, the IC tag-attached package 1 is a package made of, for example, hard paper. In FIG. 1, the shape of the package is a rectangular parallelepiped, but the shape is not limited to this, and may be another shape such as a cylindrical shape.
A perforation 11 for opening the package is formed at the opening of the package 1 with the IC tag. As shown in FIG. 1B, for example, the package can be opened by pulling up from the opening start portion 17 along the perforation in the upper direction of the package.

The IC tag 13 is mounted so as to cover a part of the package opening perforation 11. As will be described later, the IC tag 13 is also provided with a perforation 15 for cutting the IC tag. As shown in FIG. 1B, by opening the package along the perforation 11 for opening the package, The tag 13 is also cut along the IC tag cutting perforation 15 to invalidate the IC tag 13 and make it impossible to read information recorded in the IC tag 13.
Here, by making the positions of the perforation 15 for cutting the IC tag and the perforation 11 for opening the package overlap, it is possible to easily open the package and cut the IC tag 13.

  Next, an IC tag cutting perforation formed on the IC tag 13 will be described. FIG. 2 is a diagram illustrating an example of the IC tag 13. FIG. 2A is a plan view, and FIG. 2B is a cross-sectional view seen from the direction AA. In FIG. 2A, the upper part of the IC tag is usually covered with a plastic film or paper material, and the antenna pattern 21 and the IC chip 25 are not visible. However, for easy understanding, the antenna pattern 21 and the IC chip 25 are shown. The IC tag is shown in a transparent state.

Here, the structure of the IC tag 13 will be described.
As shown in FIGS. 2B and 2C, the IC tag has a multilayer structure. In the manufacturing process of the IC tag, first, the antenna pattern 21, the IC chip 25, and the like are formed on the adhesive layer 2 (37) on one side of the base film 39 provided with the adhesive layer 1 (41) and the adhesive layer 2 (37) on both sides. The formed inlet 35 is pasted.

  Here, the base film 39 is PET (polyethylene terephthalate), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer). Polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polyethylene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane and the like.

On the other hand, the inlet 35 is obtained by printing or photo-etching the antenna pattern 21, the conductive path 27, and the contacts 23a and 23b on the inlet base film, and joining the IC chip 25 to both ends of the contacts 23a and 23b.
The antenna pattern 21 has a coil shape as shown in FIG. One end (inner side) of the coil is connected to the contact 23 b, and the other end (outer side) is connected to the contact 23 a via the conduction path 27. The conduction path 27 is provided on the back surface of the surface on which the antenna pattern 21 of the inlet base film is printed.
The IC chip 25 includes a wireless transmission / reception unit, a control unit, and a storage unit for recording information.

The adhesive layer 1 (41) and the adhesive layer 2 (37) are formed by sticking a double-sided tape to each surface of the base film 39. The inlet 35 is affixed to the surface of the adhesive layer 2 (37) from which the release paper has been peeled off.
Next, the release paper of the double-sided tape of the adhesive layer 2 (41) is peeled off, and the release paper 43 is attached. The release paper 43 is for peeling off the IC tag 13 when it is attached to the product, exposing the adhesive layer 1 (41), and attaching it to the product.

  Next, the upper paper 31 with the adhesive layer 3 (33) is pasted on the top of the inlet 35. The upper paper 31 has a role of protecting the inlet 35.

The above is the structure of the IC tag 13.
At the time of manufacture, the base film 39, the inlet 35, and the upper paper 31 are, for example, sheets having a width of 7 cm and are wound in a roll shape. By laminating and laminating these materials in the order described above, a roll-shaped multilayer sheet including a plurality of IC tags 13 is manufactured.
In order to divide into individual IC tags, a multilayer sheet including a plurality of IC tags is half-cut from the upper paper 31 to the adhesive layer 1 (41) by a magnet cylinder or the like. After the half-cutting, by removing the parts other than the IC tag 13, a roll-shaped sheet in which the plurality of IC tags 13 are stuck on the release paper is manufactured.

  In the above manufacturing process, the perforation 15 for cutting the IC tag is formed on the IC tag 13 at the same time as half cutting using the corroding blade of the magnet cylinder.

  As shown in FIG. 2A, the antenna pattern portion 21 is provided with a cutting portion 29 (IC tag cutting perforation 15). When the IC tag 13 is cut by the cutting unit 29, the antenna pattern 21 is cut, so that the information stored in the IC chip 25 of the IC tag 13 cannot be read, and the IC tag 13 can be invalidated. Become.

As shown in FIG. 2 (b), the cutting part 29 (IC tag cutting perforation 15) is cut by the depth of the upper paper 31 and the adhesive layer 3 (33) that does not reach the layer of the inlet 35. Provided.
In this case, since it does not reach the layer of the inlet 35, the cut portion 29 may be a broken line perforation or a straight cut.

  The IC tag 13 is affixed on the package so that the package opening perforation 11 shown in FIG. 1 (a) and the cutting portion 29 (IC tag cutting perforation 15) overlap with each other. The tag 13 is cut along the cutting unit 29 and invalidated.

Another method of forming the cutting portion 29 (IC tag cutting perforation 15) is a method of cutting a layer deeper than the layer of the inlet 35 as shown in FIG. The depth may reach the pressure-sensitive adhesive layer 1 (41), or may be a depth reaching the base film 39, the pressure-sensitive adhesive layer 2 (37), or the inlet 35.
Since the cutting part 29 is formed deeper than the above-described FIG. 2B, the IC tag 13 can be cut more easily than in the case of FIG.

  However, in the case of providing the deep cutting portion 29 (IC tag cutting perforation 15) as shown in FIG. 2C, the layer of the inlet 35 is cut, so care must be taken in the method of forming the perforation 15. .

  FIG. 3 is an explanatory diagram of the perforation when the deep cutting portion 29 (IC tag cutting perforation 15) is provided. For example, the two methods shown in FIGS. 3A and 3B are conceivable. Both figures are explanatory views in which a part of the antenna pattern 21 is enlarged.

  In FIG. 3A, the cut portion (cut) of the perforation 15 is formed so as not to damage the antenna pattern 21. A perforated cut portion is provided between the antenna patterns, and the antenna portion forms a perforated connection portion.

On the other hand, FIG. 3B shows a method in which a part of the antenna pattern 21 is a cut portion of the perforation 15. By shortening the cut portion of the perforation 15 and lengthening the connection portion, the perforation is formed so as not to cut all the coils of the antenna pattern 21.
In this case, the coil of the antenna pattern 21 is cut, but not all is cut off, so that the antenna pattern 21 can sufficiently function as an antenna.

  FIG. 4 is a diagram illustrating an example of a method for forming the cutting portion 29 (IC tag cutting perforation 15).

  As described above, in the manufacturing process of the IC tag 13, a roll-shaped multilayer sheet is first manufactured. The cutting part 29 (IC tag cutting perforation 15) can be formed at the same time as the half-cut process for cutting into individual IC tags 13.

FIG. 4B is an explanatory diagram when the shallow cutting portion 29 of FIG. The corrosion blade 51 shows the cross section.
The multilayer sheet including a plurality of IC tags 13 has a multilayer structure of an upper paper 31, an adhesive layer 3 (33), an inlet 35, an adhesive layer 2 (37), a base film 39, an adhesive layer 1 (41), and a release paper 43 from above. It is.
This multilayer sheet is half-cut with the corrosion blade 51. The blades on both sides of the corrosion blade 51 (IC tag cutting blade 55) are blades for forming cuts for cutting the IC tag 13, and the middle blade (perforation blade 53) is the IC tag. It is a blade for forming the perforation 15 for cutting (cutting part 29).
The perforation blade 53 is designed so that the depth of the blade does not reach the layer of the inlet 35.

  FIG. 5 shows a plan view of the corroding blade 51 of FIG. A peripheral blade forms an IC tag cutting blade 55, and a perforation blade 53 is provided therein. When forming the shallow cutting portion 29 of FIG. 2 (b), the blade may be formed in a broken line consisting of a cut portion and a connecting portion as shown in the figure, or a straight blade having only the cut portion may be formed. It may be formed.

FIG. 4C is an explanatory diagram in the case where the deep cutting portion 29 (perforation 15) of FIG. The blade depth of the IC tag cutting blade 55 is the same as that of FIG. 4B, but the depth of the perforation blade 53 is deeper than that of FIG. Layer, adhesive layer 2 (37), base film 39, and adhesive layer 1 (41).
Although the plan view of the corrosion blade 51 in this case is not shown, the shape of the IC tag cutting blade 55 may be the same as that in FIG. The perforation blade 53 forms, for example, a blade having a connection portion and a cut portion as shown in FIG. 3A or 3B so as not to damage the coil of the antenna pattern 21 of the inlet 35.

  The IC tag 13 having the IC tag cutting perforations 15 formed by the above-described method is mounted so as to overlap the package opening perforations 11, thereby opening the IC tag-attached package 1. The antenna pattern 21 is cut off, communication with the IC card reader / writer becomes impossible, and the IC tag 13 can be invalidated.

  6 and 7 are external views of an example of a package with an IC tag having a different opening method from the package with an IC tag 1 of FIG.

FIG. 6A shows an example in which a package opening perforation 11 composed of two perforations is formed in the package. The user opens the package along the two perforations from the opening start portion 17.
In this case, two IC tag cutting perforations 15 provided in the IC tag 13 may be provided. By mounting the IC tag 13 so that the two perforations 11 for opening the package overlap with the perforations for cutting the IC tag, the antenna pattern 21 of the IC tag 13 is divided when the package 1 is opened, and the IC tag is invalidated. Can be

FIG. 6B shows an example of a package such as a cigarette or a music CD. In these products, caramel wrapping with a plastic film or the like is made on a box, and can be opened by pulling a tape or string from the end of the film.
The end of the tape or string is the opening start portion 17, and the tape or string is provided at the portion of the package opening perforation 11.
In such a case, the IC tag 13 is provided with two IC tag cutting perforations 15 in the width of the tape or string so that when the package 1 is opened by pulling the tape or string, the IC tag 13 is attached to the IC tag 13. The IC tag 13 can be invalidated by cutting along the perforation 15 for cutting.

  FIG. 7 shows an example of a bag-like package. When a notch 57 for facilitating opening is included in the bag, the IC tag 13 may be mounted so that the IC tag cutting perforation 15 comes on the extension of the notch 57. When the bag-shaped package is opened so as to break from the notch 57, the IC tag 13 is also divided, and the IC tag 13 can be invalidated.

  As described above, by mounting the IC tag 13 with perforations or the like on packages of various shapes having an opening means, the antenna pattern 21 of the IC tag 13 is simultaneously cut when the package is opened. It becomes possible to invalidate the tag.

  The present invention is not limited to the embodiment described above, and various modifications are possible, and these are also included in the technical scope of the present invention.

External view showing a package with an IC tag according to the present embodiment Illustration of IC tag The figure explaining the formation method of the perforation which does not damage the antenna pattern 21 The figure explaining the formation method of the perforation 15 for IC tag cutting | disconnection Top view of corrosion blade External view showing examples of packages with IC tags External view showing examples of packages with IC tags

Explanation of symbols

1 ......... Package with IC tag 11 ......... Perforation for opening the package 13 ......... IC tag 15 ......... Perforation for cutting the IC tag 21 ......... Antenna pattern 25 ... …… IC chip 31 ......... Top Paper 35 ……… Inlet 39 ……… Base film 33, 37, 41 ……… Adhesive layer 43 ……… Release paper 51 ……… Corrosion blade

Claims (5)

A packaging package with an IC tag,
The packaging package has an opening means that enables opening of the package;
The IC tag has invalidating means for disabling reading of data in the IC tag by dividing at least a part of the antenna pattern in the IC tag,
The invalidation means provides a dividing line for dividing the antenna pattern so as to overlap at least a part of the opening means, and the IC tag is invalidated by opening the packaging package.   The dividing line is a perforation formed by a cut portion and a connection portion or a cut formed by only a cut portion, and the cut portion does not damage the antenna pattern at a depth that does not reach the antenna pattern layer in the IC tag. The packaging package with an IC tag according to claim 1, wherein the packaging package is provided.   The dividing line is a perforation composed of a cut portion and a connection portion, and the length of the cut portion and the length of the connection portion are set so as not to completely cut the coil wire forming the antenna pattern. The packaging package with an IC tag according to claim 1.   The dividing line is a perforation including a cut portion and a connection portion, the connection portion is formed so as to straddle a coil wire forming an antenna pattern, and the cut portion is formed between the coil wires. Item 1. A packaging package with an IC tag according to Item 1. The opening means is one or two perforations provided on the packaging package, or a string or tape,
2. The packaging package with an IC tag according to claim 1, wherein the invalidating means provides one or two of the dividing lines according to the opening means of the packaging package.

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