JP2002366916A - Composite tag and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compound tag which is easily manufactured and is inexpensive and its manufacturing method. SOLUTION: This compound tag is configured by providing a plurality of tags on the same surface on an insulation substrate. This method for manufacturing the composite tag is a method for manufacturing a compound tag by providing a plurality of tags on the same surface on an insulation substrate and is to simultaneously perform forming processes such as conductive layers and insulation layers common to each of the tags.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite tag having a plurality of tags and a method for manufacturing such a composite tag.

[0002]

2. Description of the Related Art In recent years, non-contact IC tags and resonance tags have been used for various processes such as personal authentication, product management, physical distribution processing, and theft prevention. Then, these two types of IC tags and resonance tags may be given to the same article.

For example, in the case of a product, an IC tag storing product information is directly or indirectly provided for product management, and a resonance tag is also directly or indirectly provided for theft prevention. At the time of sale, a reader for the IC tag reads the information of the IC tag and performs processing such as product management. On the other hand, when the product is taken out without permission (theft), a resonance tag provided near the entrance or the like is used. The notification leader responds and performs the notification process.

As described above, in order to make it easy to attach two types of tags to the same article, it has already been possible to form a composite tag by bonding independently manufactured IC tags and resonance tags. Proposed.

[0005]

However, in the conventional composite tag, two types of tags are separately manufactured and bonded, and a manufacturing process and a manufacturing apparatus are required for each type of tag. In addition to the problem,
There was a problem that a bonding step was also required. As described above, since the manufacturing process and the manufacturing apparatus are different for each type of tag, the price of the finally manufactured composite tag is also high.

[0006] As for articles having a plurality of tags, there are a commuter pass described in JP-A-6-243307 and an application sticker described in JP-A-2000-207513. An article simply has a plurality of tags and does not constitute a composite tag.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to provide a composite tag which can be easily manufactured at a low price and a method of manufacturing the same.

[0008]

According to a first aspect of the present invention, there is provided a composite tag comprising a plurality of tags provided on the same surface of an insulating substrate. .

[0009] The composite tag according to the second aspect of the present invention is the first aspect.
Wherein at least a part of the plurality of tags is an IC tag.

[0010] The third aspect of the present invention is a composite tag according to the first aspect.
Or 2) wherein at least a part of the plurality of tags is a resonance tag.

According to a fourth aspect of the present invention, there is provided a composite tag according to the third aspect.
, Characterized in that it comprises invalidating means for invalidating or facilitating the invalidation of each resonance tag.

According to a fifth aspect of the present invention, there is provided the composite tag according to the first aspect.
In any one of the above-mentioned items 4, it is characterized in that there is provided a separation enabling means for separating at least a part of the tags.

According to a sixth aspect of the present invention, there is provided a composite tag manufacturing method for manufacturing a composite tag including a plurality of tags provided on the same surface of an insulating substrate, wherein the conductive layer is common to the tags. And a step of forming an insulating layer and the like are performed simultaneously.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (A) First Embodiment A first embodiment of a composite tag and a method for manufacturing the same according to the present invention will be described below with reference to the drawings.

(A-1) Configuration of Composite Tag of First Embodiment FIG. 1 is an explanatory view of a composite tag of the first embodiment, in which a cover on the front side of the composite tag is not provided. That is, it is a schematic plan view in a state where an internal electric wiring pattern and the like are formed and exposed as it is. FIG. 1 shows a state in which an IC chip described later is not mounted.

FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIG. 3 is a sectional view taken along line BB of FIG. Note that FIG.
3 is an image diagram in which the cross-sectional configuration is easily understood, and the number of loops of the planar coils 21 and 31 described later, the distance between each element, and the like are different from those in FIG.

As shown in FIG. 1, the composite tag 1 of the first embodiment has an IC tag (hereinafter, referred to as an IC tag portion) on the same surface of an insulating substrate 4 made of a plastic resin such as polyethylene terephthalate or polycarbonate. ) 2 and a resonance tag (hereinafter, referred to as a resonance tag portion) 3.

The IC tag portion 2 includes a planar coil 21, a jumper portion 22, an IC chip mounting portion (two mounting electrodes) 2
3. It has an IC connection line 24.

The planar coil 21 mainly plays an antenna function of the IC tag portion 2, and is made of a conductive material such as a metal foil such as a copper foil or an aluminum foil, or a conductive ink such as a silver paste. Is continuously wound in a spiral shape. In the case of the first embodiment, the planar coil 2
An end located outside the spiral shape is connected to an IC chip (not shown) via one electrode of the IC chip mounting portion 23.
Is directly connected to one of the terminals. The end located inside the spiral shape of the planar coil 21 is connected to one end of the jumper 22.

The jumper section 22 changes the electrical characteristics (eg, potential) of the inner end of the planar coil 21 by changing the electrical characteristics of the planar coil 21.
And is insulated from each loop of the planar coil 21. As shown in FIG. 3, the jumper portion 22 includes a conductive layer 22A made of the above-described conductive material and an insulating layer 22B made of a synthetic resin such as an acrylic resin, a polyester resin, or a polyurethane resin.

The IC chip mounting section 23 is an IC (not shown)
It consists of a pair of electrodes for mounting a chip, and is formed of the above-mentioned conductive material.

The IC connection line 24 is made of the above-described conductive material, and is connected to the outer end of the jumper portion 22 and the IC chip mounting portion 2.
3 and the other terminal of the IC chip (not shown) is connected to this mounting electrode.

An IC chip (not shown) stores data such as a code unique to the IC tag portion 2, and stores the data by receiving an interrogation radio wave from an IC tag reader (not shown). The data transmission operation is performed.

In the IC tag portion 2, the radio frequency to be used for communication is defined by the L component of the planar coil 21 and the C component of an IC chip (not shown). Selected for different frequencies.

On the other hand, the resonance tag portion 3
1, a jumper section 32 and a capacitor section 33.

The planar coil 31 is a main element constituting a resonance circuit together with the capacitor section 33.
Is formed by continuously winding the above-described conductive material in a rectangular spiral shape, and the capacitor unit 33 is formed of a similar conductive material in a planar manner. In the case of the first embodiment, the end located inside the spiral shape of the planar coil 31 is connected to one electrode (the lower electrode 3) of the capacitor section 33.
3C: see FIG. 2). One end (upper electrode 33) of the capacitor section 33 is connected to an end of the planar coil 31 located outside the spiral shape via a jumper section 32.
A: see FIG. 2).

The jumper section 32 changes the electrical characteristics (eg, potential) of the outer end of the planar coil 31 by changing
, And is insulated from each loop of the planar coil 31. The jumper part 32 is similar to the jumper part 22 of the IC tag part 2,
Although not shown in the cross-sectional view, it is composed of a conductive layer 32A made of the above-described conductive material and an insulating layer 32B made of a synthetic resin such as an acrylic resin, a polyester resin, or a polyurethane resin. In FIG. 1, a coil portion 31 a for connecting an end located inside the spiral shape of the planar coil 31 to the lower electrode 33 C of the capacitor portion 33.
And the jumper portion 32 are displayed so as to have different positions on the plane coordinates with respect to the conductive layer 32A. However, the positions on the plane coordinates are common (however, the lengths are different), and the positions in the vertical direction are different. , There is a vertical positional relationship. Since the coil portion 31a is located below the conductive layer 32A of the jumper portion 32, it is present in an invisible place. However, in the plan view of FIG.
It is shown to clarify the existence of 1a.

The capacitor section 33 is a main element constituting a resonance circuit together with the planar coil 31, and includes an upper electrode (conductive layer) 33A, a dielectric layer (insulating layer) 33B, and a lower electrode (conductive layer) 33C. It has a layered structure. The upper electrode 33A and the lower electrode 33C are formed of the conductive material described above, and the dielectric layer 33B is naturally formed of an insulating material.

The resonance tag portion 3 resonates with a radio wave of a predetermined frequency from a reader (not shown) for the resonance tag, and reflects and radiates the radio wave of that frequency.
This notifies the reader that the self (resonance tag portion 3) is present in the vicinity.

The insulating substrate 4 may be composed of only the substrate body 4A, but may be one having an adhesive layer 4B as shown in FIGS.

FIG. 4 shows a surface view of the composite tag 1 of the first embodiment after it has been completed. In addition, depending on the coating material on the surface side (such as various synthetic films and paper),
Although the internal wiring pattern and the like may be visible, FIG. 4 shows that the inside is not visible.

In the composite tag 1 as a finished product, an IC tag portion 2 and a resonance tag portion 3 (see FIG. 1) can be separated while the electrical characteristics of the IC tag portion 2 and the resonance tag portion 3 are secured. An enabling means 5 is provided.
As the separation enabling means 5, a perforation that penetrates or is partially deepened can be applied, and a linear groove that is not perforated can be applied.

Further, the composite tag 1 as a finished product has invalidating means 6 for invalidating the resonance tag portion 3 or facilitating the invalidation. Here, disabling the resonance tag portion 3 means that a state in which resonance is not possible even when a radio wave of a predetermined frequency arrives from a reader (not shown) for the resonance tag. The invalidating means 6 prints a cutting line (a part or all of the loop of the planar coil 31 is cut) indicating a position at which cutting with a scissor or a cutter is performed, or a punching position with a punching jig ( It is possible to apply printing or a concave portion indicating that a part or all of the loops of the planar coil 31 are cut).

(A-2) Method of Manufacturing Composite Tag of First Embodiment Next, a method of manufacturing the composite tag 1 of the first embodiment will be described with reference to FIG.
The process will be described with reference to FIGS.

Step 1: On an insulating substrate 4 made of a plastic resin such as polyethylene terephthalate or polycarbonate, a planar coil 21 of an IC tag portion 2, an IC chip mounting portion (two mounting electrodes) 23, and an IC connecting wire 24
Conductive layer and the planar coil 3 of the resonance tag portion 3
1. A conductive layer to be the lower electrode 33C of the coil portion 31a and the capacitor portion 33 is simultaneously formed.

The conductive layer is formed by bonding a copper foil or an aluminum foil on the insulating substrate 4 via the adhesive layer 4B, or forming a metal layer on the insulating substrate 4 by ion plating or vapor deposition. Any forming method such as an etching process performed on the metal layer later, printing using a metal paste such as a silver paste, or attaching a metal foil having a predetermined shape may be applied, and the type of the conductive material is also limited. Not something.

Depending on the method of forming the conductive layer, the adhesive layer 4B may be formed in advance on the substrate body 4A as the insulating substrate 4.

Step 2: Jumper part 2 of IC tag part 2
2, the dielectric layer 33B of the capacitor part 33 and the insulating layer 3 of the jumper part 32 of the resonance tag part 3.
An insulating layer serving as 2B is simultaneously formed.

As the method of forming the insulating layer, any existing method may be applied, and the type of insulating material is not limited. Since the formed area is small,
Screen printing is easy to apply.

Step 3: Jumper part 2 of IC tag part 2
The second conductive layer 22A, the upper electrode 33A of the capacitor portion 33 of the resonance tag portion 3, and the conductive layer serving as the conductive layer 32A of the jumper portion 32 are simultaneously formed.

For forming the conductive layer, any forming method such as printing using a metal paste or sticking of a metal foil may be applied, and the type of the conductive material is not limited.

As described above, the step of forming the conductive layer and the insulating layer common to the IC tag portion 2 and the resonance tag portion 3 is completed.

Step 4: A predetermined IC chip is mounted on the IC chip mounting portion (two mounting electrodes) 23 of the IC tag portion 2. Here, the IC chip may be mounted after a mounting material such as solder, an anisotropic conductive material, or a conductive adhesive is attached to the IC chip mounting portion 23 in advance.

Step 5: When the formation and mounting of the electric circuit elements are completed, the skin is covered with various films or papers and the like, and a composite tag having an arbitrary shape and format such as a card shape, a label shape and a seal shape is formed. Make it.

Step 6: For the produced composite tag, the above-described separation enabling means 5 and invalidating means 6 are provided by printing or printing processing to complete the composite tag 1 of the first embodiment.

Referring to FIG. 5, the number of steps is compared with the conventional manufacturing method. In the related art, since the IC tag and the resonance tag are individually prepared, four steps and three steps of the IC tag and the resonance tag are required for each of steps 1 to 4 in FIG. In one embodiment, as described above, only four steps are required.

(A-3) Example of Composite Tag of First Embodiment (Experimental Example) The composite tag of the first embodiment was manufactured, and its manufacturing method and characteristics will be described.

First, a polyethylene terephthalate film having a thickness of 50 μm was used as the insulating substrate 4.
A copper foil having a thickness of 35 μm having an adhesive layer having a thickness of 0 μm is attached to one surface of the insulating substrate 4, and etching is performed.
Planar coil 21 of C tag part 2 (line width 0.2 mm), I
A conductive layer serving as a C chip mounting portion 23 and an IC connection line 24;
Further, the planar coil 31 (line width 0.3) of the resonance tag portion 3
mm), and a conductive layer to be the lower electrode 33C (10 mm × 20 mm) of the coil portion 31a and the capacitor portion 33 was simultaneously formed.

Next, an acrylic resin-based insulating resist agent (trade name "ML25089" manufactured by Acheson Japan Co., Ltd.)
And an insulating layer 22B (line width 2 mm) of the jumper part 22 of the IC tag part 2 by screen printing, and
The dielectric layer 33B of the capacitor part 33 of the resonance tag part 3 and the insulating layer (thickness: 20 μm) to be the insulating layer 32B (line width: 2 mm) of the jumper part 32 were simultaneously formed.

Next, using a silver paste (manufactured by Toyobo Co., Ltd., trade name "DW250L-1"), a conductive layer 22A (line width 1 mm) of the jumper portion 22 of the IC tag portion 2, and
The upper electrode 33A of the capacitor part 33 of the resonance tag part 3 and the conductive layer (thickness 15 μm) to be the conductive layer 32A (line width 1 mm) of the jumper part 32 were simultaneously formed.

Then, the IC chip (Philips Co., Ltd.) is mounted on the IC chip mounting portion 23 of the IC tag portion 2 via an anisotropic conductive film (trade name “FP2322D” manufactured by Sony Chemical Co., Ltd.) as a mounting material. ) Product name "I-
CODE ”).

Thereafter, a pressure-sensitive adhesive film having a pressure-sensitive adhesive layer having a thickness of 30 μm provided on the back surface of a white polypropylene film having a thickness of 80 μm was attached to the insulating substrate 4 on which the circuit was formed, and the skin was covered.

Then, a nullifying means 6 as shown in FIG. 4 was provided by printing, and a perforation was formed as the separating enabling means 5 to produce a composite tag.

The IC tag function and the resonance tag function of the composite tag manufactured as described above were measured as follows.

(IC Tag Function) As a reader (interrogator), the communication distance was measured using a trade name “ICODE reader ICW90F” manufactured by Marantz Japan. The communicable distance was 4 cm.

(Resonance tag function) A coaxial cable was connected to the product name “Network Analyzer 8712ET｝” manufactured by Agilent Co., Ltd., and a loop-shaped jig having a diameter of 5 cm was attached to the end thereof. The measurement mode was set to “LOGMAG, S11”. The jig was measured close to the composite tag. The resonance frequency was 8.2 MHz (Q value: 50).

Even if the composite tag was separated into the IC tag part 2 and the resonance tag part 3 at the perforation of the separating enabling means 5, the respective functions did not change.

When the printed portion of the invalidating means 6 was cut with scissors, the resonance tag function was invalidated.

(A-4) Example of Method of Using Composite Tag of First Embodiment Next, an example of a method of using the composite tag 1 of the first embodiment will be described.

Since the composite tag 1 of the first embodiment has an IC tag function and a resonance tag function, it is used by attaching it to an article or the like that requires both functions.

For example, as described above, the composite tag 1 may be attached to a product, the product may be managed by the IC tag function, and unauthorized removal (theft) may be monitored by the resonance tag function. Further, for example, the compound tag 1 may be attached to a book in a library, lending management may be performed by an IC tag function, and unauthorized removal (theft) may be monitored by a resonance tag function. In addition, a compound tag is attached to an admission card at an amusement park, etc., and the number of visitors at each attraction is counted using the resonance tag function, and the user's usage fee is also used to appropriately update based on data from the IC tag function it can.

Here, if the surface area of the article on which the composite tag 1 of the first embodiment is to be provided is small and it is difficult to provide the composite tag 1 as it is, the detachable means 5 allows the IC to be separated. Tag part 2 and resonance tag part 3
Are separated from each other and provided individually on the target article. Installation is performed by sticking using an adhesive or an adhesive.

Further, the composite tag 1 of the first embodiment can be separated and the IC tag portion 2 and the resonance tag portion 3 can be separated by the enabling means 5 or the composite tag 1 can be separated and the back side at the position of the enabling means 5. Bend to contact, IC
By bonding the back surfaces of the tag portion 2 and the resonance tag portion 3 to each other, the composite tag 1 having the IC tag portion 2 on one side and the resonance tag portion 3 on the other side is formed again.

For example, when the product is provided with the composite tag 1 and the product is purchased, the resonance tag portion 3 is separated from the composite tag 1 by using the enabling means 5 and removed. Alternatively, the notification operation when passing through the anti-theft gate may not be performed, and the notification operation when passing through the anti-theft gate is performed by invalidating the resonance tag portion 3 using the invalidation means 6. It may not be executed.

(A-4) Effects of First Embodiment As described above, according to the first embodiment, it is possible to obtain a composite tag that can exhibit two functions of an IC tag function and a resonance tag function. .

Further, a composite tag having an IC tag (part) and a resonance tag (part) can be manufactured by simultaneously performing many of the manufacturing steps of the IC tag and the resonance tag, which simplifies the manufacturing and makes the manufacturing easier. As for the device, it is not necessary to prepare a separate device for each of the IC tag and the resonance tag.

It is expected that the cost of the formed composite tag will be reduced by reducing the size of the equipment and the number of steps.

(B) Other Embodiments The material of the planar coil, the jumper, the capacitor, the insulating substrate, and the like, and the method of forming them are not limited.
Anything can be applied.

In the first embodiment, the type of each tag constituting the composite tag is an IC tag and a resonance tag. However, the combination of tag types constituting the composite tag is not limited to this. is not. For example, a combination of resonance tags having different communication frequencies with the reader may be used, or a combination of IC tags having different communication frequencies may be used.

The number of tags mounted on the composite tag is not limited to two as in the first embodiment, but may be three or more.

In the first embodiment, the IC tag (portion) and the resonance tag (portion) are arranged side by side. However, the arrangement is not limited to the juxtaposition. For example, as shown in the image plan view of FIG.
The other tag 2Y may be provided in a vacant area in the center of X (the center space of the planar coil as an antenna element).

Although the technical idea of the present invention is to provide a plurality of tags on the same surface of an insulating substrate, it does not prevent some elements from being provided on another surface. For example, as a modification of the first embodiment, it is difficult to provide the jumper portion 22 of the IC tag portion 2 and the jumper portion 23 of the resonance tag portion 3 on the back surface of the insulating substrate 4 using a through hole or the like. is not.

The method for manufacturing a composite tag according to the present invention is a method for manufacturing a tag distributed as a composite tag. However, from the beginning, the method is applied to the simultaneous production of an IC tag and a tag distributed such as a resonance tag. can do. That is, at the manufacturer, from the manufactured composite tag,
The present invention can also be applied to a case where an IC tag, a resonance tag, and the like are separated and sold. The term “method of manufacturing a composite tag” according to the present invention includes the manufacturing method in such a case.

[0074]

As described above, since the composite tag of the present invention is formed by providing a plurality of tags on the same surface on the insulating substrate, the production is easy and the price can be reduced.

The method of manufacturing a composite tag according to the present invention relates to a method of manufacturing a composite tag in which a plurality of tags are provided on the same surface of an insulating substrate. Since the process of forming is performed at the same time,
The composite tag can be easily manufactured, and the price of the composite tag can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing circuit elements and the like of a composite tag according to a first embodiment.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a sectional view taken along line BB of FIG. 1;

FIG. 4 is a plan view (image) of a completed product of the composite tag of the first embodiment.

FIG. 5 is an explanatory diagram of a manufacturing process of the composite tag according to the first embodiment.

FIG. 6 is an explanatory diagram of a positional relationship between a plurality of tags according to another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Composite tag 2 ... IC tag (IC tag part) 3 ... Resonance tag (resonance tag part) 4 ... Insulating substrate 5 ... Separation enabling means 6 ... Invalidation means

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[Procedure amendment]

[Submission date] June 7, 2001 (2001.6.7)

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] Fig. 1

[Correction method] Change

[Correction contents]

FIG.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Naoki Hasegawa 3-6 Maruyama, Kamifukuoka-shi, Saitama (72) Inventor Katsuhisa 4-22 Gamo-Higashicho, Koshigaya-shi, Saitama F-term (reference) 5B035 AA04 AA13 BA05 BB09 BB11 BB12 CA01 CA23 5C084 AA03 AA09 AA13 AA19 BB21 BB40 CC35 DD26 EE07 FF27 GG07 GG09 GG52

Claims (6)

[Claims] 1. A composite tag comprising a plurality of tags provided on the same surface of an insulating substrate. 2. The method according to claim 1, wherein at least a part of the plurality of tags is an IC.
The composite tag according to claim 1, wherein the composite tag is a tag. 3. The composite tag according to claim 1, wherein at least a part of the plurality of tags is a resonance tag. 4. The composite tag according to claim 3, further comprising invalidating means for invalidating each of the resonance tags or facilitating the invalidation. 5. The composite tag according to claim 1, further comprising a separation enabling means for enabling at least a part of the tag to be separated. 6. A composite tag manufacturing method for manufacturing a composite tag including a plurality of tags provided on the same surface of an insulating substrate, the method including forming a conductive layer and an insulating layer common to the tags. A method for manufacturing a composite tag, wherein the steps are performed simultaneously.