JP2007102429A - Non-contact type data carrier inlet, non-contact type data carrier inlet roll, non-contact type data carrier, production method for non-contact type data carrier inlet, production method for non-contact type data carrier inlet roll, and production method for non-contact type data carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact type data carrier inlet, a non-contact type data carrier inlet roll and a non-contact type data carrier, allowing communication through an antenna circuit different from an antenna circuit causing communication impossibility even if the communication through the antenna circuit having a sensor becomes impossible, and to provide a production method for the non-contact type data carrier inlet, a production method for the non-contact data carrier inlet roll and a production method for the non-contact type data carrier. <P>SOLUTION: This non-contact type data carrier inlet has: a base material film P1; the antenna circuit 20a having an antenna coil A1 formed on the base material film P1, the sensor 100 electrically interposed in the antenna coil A1 in series, and an IC chip C1 transmitting/receiving information through the antenna coil A1; and the antenna circuit 20b having an antenna coil A2 formed on the base material film P1, and an IC chip C2 transmitting/receiving the information through the antenna coil A2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention includes a non-contact data carrier that includes a sensor and communicates information in a non-contact manner, a non-contact data carrier inlet that is a component of the non-contact data carrier, and a plurality of non-contact data carrier inlets The present invention relates to a non-contact type data carrier inlet roll provided on a substrate and a manufacturing method thereof.

  In the conventional non-contact type data carrier, there is a non-contact type data carrier provided with a sensor in order to detect an external factor change. This conventional non-contact type data carrier includes an antenna coil capable of communicating in a predetermined frequency band, an IC chip that transmits and receives information via the antenna coil, and a sensor connected to a part of the antenna coil. It is mainly composed.

  In the non-contact type data carrier provided with this conventional sensor, for example, there is one that uses a thermal fuse as a sensor, and the resonance frequency changes as the thermal fuse is cut and communicates at the changed resonance frequency (for example, , See Patent Document 1).

In addition, for example, there is a configuration in which a temperature fuse is used as a sensor, the temperature fuse is connected in series to a part of the antenna coil, and the antenna coil itself is disconnected when the temperature fuse is cut (for example, , See Patent Document 2).
JP 2005-135132 A JP 2005-157485 A

  However, in the case of using a non-contact type data carrier whose resonance frequency changes as the thermal fuse is cut as described above, for example, the communication distance corresponding to the resonance frequency that changes due to the cutting of the thermal fuse is investigated. If communication is not possible at the resonance frequency before or after the change, it is necessary to change the installation position of the reader / writer or the frequency to communicate according to the resonance frequency after the change. there were.

  Further, when a non-contact type data carrier having a configuration in which the antenna coil itself is disconnected along with the thermal fuse is cut, information in the IC chip cannot be read after the antenna coil is disconnected. Accordingly, for example, identification information such as a unique ID of the IC chip cannot be read, and it is difficult to say that it is preferable in terms of information management.

  Therefore, the present invention has been made to solve the above-described problems, and even if an antenna circuit including a sensor and an antenna circuit different from the antenna circuit are provided and communication is disabled via the antenna circuit including the sensor, Non-contact type data carrier inlet, non-contact type data carrier inlet roll, non-contact type data carrier, non-contact type data carrier inlet manufacturing method, non-contact type data carrier inlet roll manufacturing method capable of communicating via different antenna circuits Another object of the present invention is to provide a method for manufacturing a non-contact data carrier.

  In order to achieve the above object, a non-contact data carrier inlet according to the present invention includes a first antenna, a sensor electrically connected to the first antenna, and the first antenna on an electrically insulating substrate. A first antenna circuit having a first IC chip for transmitting and receiving information via one antenna, a second antenna on the substrate, and information via the second antenna. And a second antenna circuit that is provided with a second IC chip that performs transmission and reception.

  According to the non-contact type data carrier inlet, the first antenna circuit including the sensor and the second antenna circuit different from the first antenna circuit are provided on the substrate, and the sensor is disconnected, and information is transmitted via the first antenna circuit. Even if transmission / reception of the data becomes impossible, information can be transmitted / received via the second antenna circuit.

  The non-contact type data carrier inlet according to the present invention includes a first antenna, a sensor electrically connected to the first antenna, and the first antenna on an electrically insulating substrate. A first antenna circuit having an IC chip for transmitting / receiving information, and a second antenna having a second antenna for transmitting / receiving information to / from the IC chip on the substrate. And an antenna circuit.

  According to the non-contact type data carrier inlet, the first antenna circuit including the sensor and the second antenna circuit different from the first antenna circuit are provided on the substrate, and the sensor is disconnected, and information is transmitted via the first antenna circuit. Even if transmission / reception of the data becomes impossible, information can be transmitted / received via the second antenna circuit. Furthermore, since the circuit configuration includes one IC chip common to the first antenna circuit and the second antenna circuit, the number of manufacturing steps can be reduced in manufacturing a non-contact type data carrier inlet.

  The non-contact type data carrier inlet according to the present invention includes a first antenna and a sensor that is electrically connected to the first antenna on an electrically insulating substrate. An antenna circuit; and a second antenna circuit provided on the substrate with a second antenna and an IC chip that transmits and receives information via the second antenna. To do.

  According to this non-contact type data carrier inlet, when the sensor is cut off, the resonance frequency of the resonance circuit configured by the first antenna circuit changes, and even if the response of the resonance circuit at a predetermined frequency is lost, Information can be transmitted and received through the second antenna circuit.

  Alternatively, a non-contact type data carrier inlet roll may be configured by winding a sheet in a state where a plurality of the above non-contact type data carrier inlets are provided in a roll shape. Furthermore, you may comprise a non-contact-type data carrier by covering the above-mentioned non-contact-type data carrier inlet with an exterior.

  A method of manufacturing a non-contact type data carrier inlet according to the present invention includes an antenna forming step of forming a first antenna and a second antenna on one surface of an electrically insulating substrate, and an electrical connection between the first antenna and the first antenna. An IC chip mounting step of mounting the first IC chip by connecting to the second antenna and electrically connecting the second IC chip by connecting to the second antenna; and electrically connecting to the first antenna. And a sensor mounting process for mounting the sensor.

  According to the method for manufacturing the non-contact type data carrier inlet, the first antenna including the sensor and the second antenna different from the first antenna can be separately formed on the substrate. Even if information cannot be transmitted / received via the first antenna, a non-contact data carrier inlet that can transmit / receive information via the second antenna can be manufactured.

  Further, the non-contact type data carrier inlet manufacturing method according to the present invention includes an antenna forming step of forming a first antenna and a second antenna on one main surface of an electrically insulating substrate, and the first antenna. And an IC chip mounting step of mounting an IC chip electrically connected to both of the second antennas, and a sensor mounting step of mounting a sensor electrically connected to the first antennas. It is characterized by.

  According to this method for manufacturing a non-contact type data carrier inlet, the first antenna including the sensor and the second antenna different from the first antenna can be separately formed on the substrate, so that the temperature sensor is cut off. Even if information cannot be transmitted / received via the first antenna, a contactless data carrier inlet that can transmit / receive information via the second antenna can be manufactured. Furthermore, since a circuit configuration including one IC chip common to the first antenna and the second antenna can be obtained, the number of manufacturing steps can be reduced.

  According to another aspect of the present invention, there is provided a non-contact data carrier inlet manufacturing method comprising: an antenna forming step of forming a first antenna and a second antenna on one surface of an electrically insulating substrate; and the second antenna; An IC chip mounting process for mounting an IC chip by electrical connection and a sensor mounting process for mounting a sensor by electrical connection to the first antenna are provided.

  According to the method for manufacturing the non-contact type data carrier inlet, the first antenna including the sensor and the second antenna different from the first antenna can be separately formed on the substrate. Non-contact capable of transmitting and receiving information via the second antenna circuit even when the resonance frequency of the resonance circuit configured by the first antenna circuit changes and the response of the resonance circuit at a predetermined frequency is lost. A formula data carrier inlet can be made.

  Also, a non-contact type data carrier inlet roll is produced by winding a sheet with a plurality of non-contact type data carrier inlets manufactured by the above-described non-contact type data carrier inlet manufacturing method into a roll. May be. Furthermore, you may produce a non-contact-type data carrier by covering the contact-type data carrier inlet manufactured with the manufacturing method of the above-mentioned non-contact-type data carrier inlet with an exterior.

  Non-contact type data carrier inlet, non-contact type data carrier inlet roll, non-contact type data carrier, non-contact type data carrier inlet manufacturing method, non-contact type data carrier inlet roll manufacturing method, and non-contact type data carrier According to this manufacturing method, even if an antenna circuit including a sensor and an antenna circuit different from the antenna circuit are provided and communication is disabled via the antenna circuit including the sensor, communication can be performed via an antenna circuit different from the antenna circuit. .

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a plan view showing one surface side of a non-contact type data carrier inlet 10 according to an embodiment of the present invention, and FIG. 2 is a side view of one antenna circuit component in the non-contact type data carrier inlet 10. FIG. 3 is a plan view showing the other surface side of the non-contact type data carrier inlet 10. FIG. 4 is a block diagram functionally showing the configuration of the non-contact data carrier inlet 10. 5 is a plan view showing one surface side of the non-contact type data carrier 40 configured by covering the non-contact type data carrier inlet 10 according to the embodiment with an exterior, and FIG. 6 is a plan view of FIG. FIG. 4 is a cross-sectional view from the side of one antenna circuit component in the non-contact type data carrier 40. Here, an example of the non-contact type data carrier inlet 10 in which two antenna circuits 20a and 20b are arranged in parallel is shown.

  1 and 3, the conductor pattern including the antenna coils A1 and A2 is indicated by hatching, and the hatching inclination between the conductor pattern formed on the front surface and the conductor pattern formed on the back surface thereof is shown. Differentiate by changing direction.

  As shown in FIGS. 1 to 4, two antenna circuits 20 a and 20 b are arranged in parallel in one non-contact type data carrier inlet 10. The non-contact type data carrier inlet 10 includes a base film P1, an antenna coil A1 formed on the base film P1, and a pair of connection patterns 21a connected in parallel to the antenna coil A1 on the base film P1. , 21b, mounted on the base film P1, and connected to the IC chip C1 for transmitting and receiving information via the antenna coil A1, and the pair of connection patterns 21a, 21b, respectively, and paired via the base film P1. A plurality of capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, 25b and a sensor 100 such as a temperature sensor or an impact sensor, which are electrically connected in series to the antenna coil A1, are provided. Yes. Further, the non-contact type data carrier inlet 10 includes an antenna coil A2 formed on the base film P1, a pair of connection patterns 21c and 21d connected in parallel to the antenna coil A2 on the base film P1, and a base A plurality of electrostatic capacitors mounted on the material film P1 and connected to the IC chip C2 for transmitting and receiving information via the antenna coil A2 and the pair of connection patterns 21c and 21d, respectively, and paired via the base film P1. Capacity adjustment patterns 22c, 22d, 23c, 23d, 24c, 24d, 25c, and 25d are provided.

  The base film P1 is a base material having electrical insulating properties, and is made of, for example, PET (polyethylene terephthalate). In addition to this, for example, phenol resin, urea resin, melamine resin, polytetrafluoro It can also be composed of ethylene, polyethylene, polypropylene, polystyrene, polyethersulfone, polyphenylene sulfide, PBT, polyarylate, silicon resin, diallyl phthalate, polyimide, and the like. Here, although the base film P1 is formed in the rectangle, it is not restricted to this shape.

  The antenna coils A1 and A2 are separately provided on the one surface 26a of the base film P1, and are formed so as to circulate a plurality of times. In one antenna circuit 20a, the pair of connection patterns 21a and 21b are respectively connected to the antenna coil A1 on the base film P1, and extend on one surface 26a and the other surface 26b of the base film P1, respectively. Has been. Specifically, one end portion 27a of the antenna coil A1 is connected to the base end portion of one connection pattern 21a, and one of the connection bumps 28a of the IC chip C1 is further connected to this portion.

  Further, the other end portion 27b of the antenna coil A1 is connected to one end portion of a jumper wire (inter-terminal connection pattern) Y1 wired on the other surface 26b of the base film P1 via the crimping portion 29a, and The other end portion of the jumper line Y1 is connected to the base end portion of the wiring pattern 29c wired on the one surface 26a of the base film P1 through the crimping portion 29b. The other end of the connection bump 28a of the IC chip C1 is connected to the tip of the wiring pattern 29c. Furthermore, the other end portion of the jumper wire Y1 is connected to the base end portion of the connection pattern 21b on the other surface 26b of the base film P1.

  On the other hand, in the other antenna circuit 20b, the pair of connection patterns 21c and 21d are respectively connected to the antenna coil A2 on the base film P1, and are respectively formed on the one surface 26a and the other surface 26b of the base film P1. It is extended. Specifically, one end portion 27c of the antenna coil A2 is connected to the base end portion of one connection pattern 21c, and one of connection bumps (not shown) of the IC chip C2 is further connected to this portion. .

  Further, the other end portion 27d of the antenna coil A2 is connected to one end portion of a jumper wire (inter-terminal connection pattern) Y2 wired on the other surface 26b of the base film P1 via the crimping portion 29d, The other end portion of the jumper line Y2 is connected to the base end portion of the wiring pattern 29f wired on the one surface 26a of the base film P1 through the crimping portion 29e. The other end of the connection bump (not shown) of the IC chip C2 is connected to the tip of the wiring pattern 29f. Furthermore, the other end portion of the jumper wire Y2 is connected to the base end portion of the connection pattern 21d on the other surface 26b of the base film P1.

  The capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b are paired so as to face the one surface 26a and the other surface 26b with the base film P1 interposed therebetween. , Formed at each tip of the connection patterns 21a, 21b. Each of the pair of capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b is formed in a substantially circular shape, and functions as a capacitor pattern. 23, 24 and 25 function.

  Further, the capacitance adjustment patterns 22c, 22d, 23c, 23d, 24c, 24d, 25c, and 25d are paired so as to face the one surface 26a and the other surface 26b with the base film P1 interposed therebetween. The connection patterns 21c and 21d are formed at the tip portions. Each of the pair of capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b is formed in a substantially circular shape and functions as a capacitor pattern, and functions as a capacitor between them. To do.

  Here, the shape of each pair of capacitance adjustment patterns 22a, 22b, 22c, 22d, 23a, 23b, 23c, 23d, 24a, 24b, 24c, 24d, 25a, 25b, 25c, 25d is substantially circular. However, this shape is not particularly limited, and may be formed in a rectangular (quadrangle) shape or the like.

  The IC chip C1 includes a capacitor 30 and the like in addition to a rewritable nonvolatile memory and an RF circuit for wireless communication that do not require power supply backup (see FIG. 4a). The capacitor 30 represents an apparent capacitance between the antenna connection terminals of the IC chip, and has a value including various capacitances in the IC chip. Thus, the antenna coil A1, the capacitor 30 in the IC chip C1, and the capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b, which are respectively connected on the base film P1, are shown in FIG. As shown in FIG. 4, the resonance circuit of the entire antenna is configured.

  Here, as a form of the antenna circuit including the sensor 100, in addition to connecting the sensor 100 in series to the antenna coil A1 as shown in FIG. 4a, the sensor 100 is connected to the antenna coil A1 as shown in FIG. 4b. Are connected in parallel, a parallel coil 104 is added to the sensor 100 connected in series as shown in FIG. 4c, or a serial capacitor 105 is added to the sensor 100 connected in parallel as shown in FIG. 4d. This circuit can also be used. In the four circuits described above, when the electrical properties of the sensor 100 change (for example, disconnection) according to environmental changes, the resonance frequency of the antenna circuit 20a changes according to each circuit form. The change can be detected in a non-contact manner, and can be used as an antenna circuit including the sensor of the present invention. Hereinafter, description will be made based on the antenna circuit in the form of FIG. FIG. 4a shows an outline of the antenna circuit 20a including the sensor 100. However, the antenna circuit 20b does not include the sensor 100, and other configurations are the same as those shown in FIG. 4a. The same.

  Here, by removing at least one of the capacitance adjustment patterns 22a, 22b, 22c, 22d, 23a, 23b, 23c, 23d, 24a, 24b, 24c, 24d, 25a, 25b, 25c, 25d, Capacitance adjustment patterns 22a, 22b, 22c, 22d, 23a, 23b, 23c, 23d, 24a, 24b, 24c, 24d, 25a, 25b, 25c, and 25d can be removed as a capacitor. The electric capacity can be adjusted. Further, for example, the capacitance can be adjusted by removing a part of the connection patterns 21a, 21b, 21c, and 21d and disconnecting them. For example, when a part of the connection patterns 21a and 21b is removed and disconnected, the same effect as when all the capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b are removed is obtained. Is obtained. In the present embodiment, a mode in which a frequency approximate to 13.56 MHz, which is an example of the target value of the resonance frequency, is obtained without removing any set of capacitance adjustment patterns. Note that the set value of the resonance frequency is not limited to 13.56 MHz.

  Further, here, as the non-contact type data carrier inlet 10, the capacitance adjustment patterns 22a, 22b, 22c, 22d, 23a, 23b, 23c, 23d, 24a, 24b, 24c, 24d, 25a, 25b, 25c, 25d are used. The configuration including the above has been described as an example, but the configuration is not limited to this configuration. For example, the antenna coil A1, the IC chip C1 that transmits and receives information via the antenna coil A1, and the antenna coil A1 are electrically connected in series on the base film without the capacitance adjustment pattern. The antenna circuit 20a including the sensor 100, the antenna coil A2 provided together with the antenna coil A1, and the antenna circuit 20b including the IC chip C2 that transmits and receives information via the antenna coil A2 may be used. .

  Further, the antenna circuit 20a and the antenna circuit 20b may be configured with an antenna coil or the like so as to be able to communicate with each other in different frequency bands, or configured with an antenna coil or the like so as to be able to communicate with the same frequency band. However, it is set appropriately to suit the application.

  For example, the sensor 100 is a temperature sensor, and when a predetermined time (for example, 20 minutes) elapses in a state where the temperature reaches a predetermined temperature (for example, 40 ° C.), a part of the sensor 100 is cut. Consists of fuses and the like.

  As an example of the shape of the thermal fuse that functions as the sensor 100, as shown in FIG. 1, the terminal portions 101 and 102 that are electrically connected in series with the antenna coil A1, and the terminal portions 101 and 102, respectively, It is mainly comprised from the electroconductive connection part 103 connected, The surface is covered with the insulating film.

  As a more specific structure of this thermal fuse, for example, a conductive tube is filled in a shrinkable tube made of a resin that shrinks at a predetermined temperature according to the purpose of use of this thermal fuse to form a connecting portion 103, and both ends thereof For example, a structure in which the conductive terminal portions 101 and 102 electrically connected to each other are provided and the surface thereof is covered with an insulating film. In the thermal fuse having this configuration, when the temperature reaches a predetermined temperature, the contraction tube contracts, and the conductive paste filled therein is cut to irreversibly cut off the conduction. When the conduction of the thermal fuse electrically connected in series to a part of the antenna coil A1 is cut off, the conduction of a part of the antenna coil A1 is cut off, and information is transmitted / received via the antenna coil A1. Can not be. The configuration of the thermal fuse is not limited to this configuration, and any configuration may be used as long as the conduction is interrupted irreversibly (or the interruption is conducted) when the temperature reaches a predetermined temperature.

  An impact sensor can be used as another example of the sensor 100. 13a and 13b are cross-sectional views of the impact sensor. An impact sensor is a sensor that memorizes a state in which an impact of a predetermined level or more is applied by irreversibly changing a part of the sensor when an impact (acceleration) of a predetermined level or more is applied, thereby disconnecting electrical continuity. is there. Specifically, as shown in FIG. 13a, a pair of elastic plate-like electrodes 121 and 122 are fixed so as to face each other with an insulator 123, and the opposed electrodes 121 and 122 have conductivity. The impact detector 124 is sandwiched and held. The impact detector 124 is exemplified by a metal having a spherical shape, but can be designed in a suitable shape as necessary. The initial state of the impact sensor 120 is the state shown in FIG. 13 a, and the electrodes 121 and 122 are electrically connected via the held impact detector 124. When an impact of a predetermined level or more is applied to the impact sensor 120, the impact detector 124 is lost between the electrodes 121 and 122 (see FIG. 13b), and the electrodes 121 and 122 are electrically insulated. It is possible to electrically detect that an impact has been applied.

  Further, as shown in FIGS. 5 and 6, the non-contact type data carrier 40 is configured by covering the non-contact type data carrier inlet 10 with an exterior. In this embodiment, by using a pair of protective films 41a and 41b made of a rectangular vinyl chloride resin, a non-contact type data carrier inlet 10 is laminated (card) so as to be sandwiched from both sides, whereby a card-type non-sticking is performed. A contact data carrier 40 is configured.

  Here, in addition to the card-type form, for example, a pouch-type non-contact data carrier obtained by pouching, a label type provided with an adhesive layer obtained by labeling or a release paper covering it Non-contact type data carrier of high temperature resistance obtained by processing molded products using so-called engineering plastics such as PPS (polyphenylene sulfide) and PSF (polysulfone) Can also be configured.

  Next, a method for manufacturing the above-described non-contact type data carrier inlet 10 will be described with reference to FIGS. 7a to 7g, FIGS. 8a, 8b, 9, and 10. FIG. Here, the non-contact type data that does not form the capacitance adjustment patterns 22a, 22b, 22c, 22d, 23a, 23b, 23c, 23d, 24a, 24b, 24c, 24d, 25a, 25b, 25c, 25d. A method for manufacturing the carrier inlet 10 will be described.

  7a to 7g schematically show basic manufacturing steps of the non-contact type data carrier inlet 10, and FIGS. 8a, 8b and 10 show a manufacturing apparatus used in the manufacturing steps of FIGS. 7a to 7g. It is a figure shown roughly. FIG. 9 is a plan view showing the produced non-contact type data carrier inlet roll R3.

  First, as shown in FIG. 7a and FIG. 8a, for example, a PET base film P1 having a thickness of about 30 to 40 μm is rolled from a PET roll R1 wound in a roll shape by the unwinding roller 50 to form the base film P1. Starts continuous delivery.

  Subsequently, as shown in FIG. 7b and FIG. 8a, rolls 52a, 52b in which adhesive sheets S1, S2 are wound on both side surfaces of the fed base film P1 using application rollers 51a, 51b and The adhesive sheet and the metal sheet are pulled out from the rolls 53a and 53b around which the metal sheets K1 and K2 such as copper are wound, and the metal sheets K1 and K2 are attached via the adhesive sheets S1 and S2.

  Further, as shown in FIGS. 7c and 8a, a resist T is printed using rollers 54a and 54b at predetermined positions on the metal sheets K1 and K2 respectively attached to both surfaces of the base film P1. Here, the resist T is printed in correspondence with the formation of the antenna coils A1, A2, the wiring patterns 29c, 29f, and the like.

  Subsequently, as shown in FIGS. 7d and 8a, the base film P1 on which the resist T is printed on the metal sheets K1 and K2 is guided to the etching tank 55 and subjected to the etching process.

  Subsequently, as shown in FIGS. 7 e and 8 a, the resist T is cleaned and removed in the resist cleaning / drying chamber 56. As a result, as shown in FIG. 7e, antenna coils A1, A2, etc. are formed on one surface 26a, and jumper lines Y1, Y2 are formed on the other surface 26b.

  Subsequently, as shown in FIGS. 7f and 8a, the other ends 27b and 27d of the antenna coils A1 and A2 of the base film P1 on which the antenna coils A1 and A2 and the jumper wires Y1 and Y2 are formed by the caulking machine 57. Are connected to one end portions of jumper wires (inter-terminal connection patterns) Y1, Y2 wired on the other surface 26b of the base film P1 through crimping portions 29a, 29d. Further, the base end portions of the wiring patterns 29c and 29f of the base film P1 are connected to the other end portions of the jumper wires Y1 and Y2 through the crimping portions 29b and 29e.

  In this manner, the base film P1 in which the jumper wires Y1 and Y2 are connected to the predetermined portions of the antenna coils A1 and A2 is wound up by the winding roller 58 to form the antenna roll R2.

  Subsequently, as shown in FIGS. 7g and 8b, continuous feeding of the base film P1 in which the antenna coils A1 and A2 and the jumper wires Y1 and Y2 are conducted by the unwinding roller 59 from the antenna roll R2 is started. To do. Then, the IC chips C1 and C2 are arranged on the formed surface side of the antenna coils A1 and A2 on the fed base film P1 by the IC chip mounting device 60. Further, the sensor mounting device 61 disposes the sensor 100 at a predetermined position of the antenna coil A1 on the fed base film P1. Then, the IC chips C1 and C2 and the sensor 100 are crimped and mounted by the crimping device 62.

  Further, as shown in FIG. 8b, the base film P1 on which the IC chips C1 and C2 and the sensor 100 are mounted is wound up by a winding roller 63 to form a non-contact type data carrier inlet roll R3. At this time, the roll length of the formed non-contact type data carrier inlet roll R3 is, for example, about 5 to 500 m. In this manner, a non-contact type data carrier inlet roll R3 in which a plurality of non-contact type data carrier inlets 10 are arranged in the vertical and horizontal directions as shown in FIG. 9 is formed. The sensor 100 is disposed perpendicular to the winding direction of the non-contact type data carrier inlet roll R3. That is, the sensor 100 is disposed such that the longitudinal direction of the sensor 100 is the width direction of the base film P1. It is preferable. By disposing the sensor 100 in this way, it is possible to prevent the sensor 100 from being bent due to an external force and failing or being damaged.

  The manufacturing method of the non-contact type data carrier inlet roll R3 described above is an example, and is not limited thereto. For example, in the manufacturing method described above, the metal sheets K1 and K2 for forming the antenna coils A1 and A2 and the jumper wires Y1 and Y2 are attached to the base film P1 via the adhesive sheets S1 and S2. The metal sheets K1 and K2 may be bonded to the base film P1, or after forming a base by sputtering, a metal layer may be formed using a plating tank. Further, when forming the antenna coils A1, A2 and the jumper lines Y1, Y2, for example, a screen printing method for forming the antenna coils A1, A2 and the jumper lines Y1, Y2 on the base film P1 with a silver paste by silk printing Etc. may be adopted.

  Next, as shown in FIG. 10, continuous feeding of sheets in a state in which a plurality of non-contact type data carrier inlets 10 are arranged vertically and horizontally is started by the unwinding roller 70 from the non-contact type data carrier inlet roll R3. .

  Subsequently, the fed sheet is cut into a predetermined size by using a cutting device 71 with a predetermined position as a reference, and the non-contact type data carrier inlet 10 is manufactured. The sheet after the non-contact type data carrier inlet 10 is punched is wound up by the collection roller 72 and becomes the collection roll R4.

  Here, the non-contact type data carrier inlet that does not form the capacitance adjustment patterns 22a, 22b, 22c, 22d, 23a, 23b, 23c, 23d, 24a, 24b, 24c, 24d, 25a, 25b, 25c, 25d Although the manufacturing method 10 has been described, the capacitance adjustment patterns 22a, 22b, 22c, 22d, 23a, 23b, 23c, 23d, 24a, 24b, 24c, 24d, 25a, 25b, 25c, 25d and the connection patterns 21a, 21b, 21c, and 21d can be formed by the same method in the process of forming the antenna coils A1 and A2 and the jumper wires Y1 and Y2.

  As described above, according to the non-contact type data carrier inlet 10 and the non-contact type data carrier 40 of the embodiment, the sensor circuit 100 includes the antenna circuit 20a including the sensor 100 and the antenna circuit 20b different from the antenna circuit 20b. Even if information cannot be transmitted / received via the antenna circuit 20a, information can be transmitted / received via the antenna circuit 20b.

  For example, when the sensor 100 is configured with a temperature sensor and the antenna circuit 20a and the antenna circuit 20b are set to communicate with each other in the same frequency band, the sensor 100 is disconnected by exceeding a predetermined temperature, Even if information cannot be transmitted / received via the antenna circuit 20a, information can be transmitted / received via the antenna circuit 20b without changing the communication frequency in the reader / writer. Further, for example, the unique ID of the IC chips C1 and C2 can be determined on the reader / writer side that communicates with the non-contact type data carrier, thereby detecting only the communication from the IC chip C2 of the antenna circuit 20b. In such a case, it can be determined that the sensor 100 is disconnected and information transmission / reception is impossible via the antenna circuit 20a.

  For example, when the antenna circuit 20a and the antenna circuit 20b are set to communicate in different frequency bands, when the sensor 100 is disconnected due to exceeding a predetermined temperature, the communication frequency for the antenna circuit 20a Since it becomes impossible to transmit and receive information via the antenna circuit 20a, it can be recognized that the predetermined temperature has been exceeded. In this case, since information can be transmitted / received via the antenna circuit 20b, when information unique to the non-contact data carrier is stored in the IC chip C2 including the antenna circuit 20b, the information is Can be read.

  For example, the non-contact type data carrier 40 of one embodiment is suitable for use in, for example, foodstuff management that requires temperature management. For example, when there is a temperature that should not be exceeded for temperature management, the sensor 100 configured with the temperature sensor is set to be disconnected when the temperature reaches this temperature. It can be recognized that the temperature has exceeded. In addition, since the sensor 100 is configured to have irreversibility that does not return to the original state after being disconnected, even if the management temperature returns to a steady value, information is transmitted via the antenna circuit 20a including the sensor 100. Communication is not possible. As a result, it is possible to reliably recognize that the specified temperature has been exceeded, and also to prevent tampering such as resetting the memory.

  In the non-contact type data carrier inlet 10 and the non-contact type data carrier 40 according to the above-described embodiment, an example in which an antenna coil is used as an antenna is shown for both the antenna circuit 20a and the antenna circuit 20b including the sensor 100. However, it is not limited to this configuration. For example, when the antenna circuit 20b is configured to communicate in the microwave band, the antenna in the antenna circuit 20b includes a dipole antenna or a plane. A rectangular antenna is used.

  In the non-contact type data carrier inlet 10 and the non-contact type data carrier 40 of the above-described embodiment, an example in which the antenna circuit 20a and the antenna circuit 20b including the sensor 100 are arranged in parallel has been shown. The antenna circuit 20b may be provided inside the antenna circuit 20a.

  Furthermore, in the non-contact type data carrier inlet 10 and the non-contact type data carrier 40 of the above-described embodiment, an example in which an IC chip is provided in each of the antenna circuit 20a and the antenna circuit 20b is shown. By using this IC chip, it is possible to obtain a circuit configuration including one IC chip common to the antenna circuit 20a and the antenna circuit 20b. An example of a multi-frequency compatible IC chip is UCODE HSL manufactured by Philips, which corresponds to two frequency bands of 860 to 930 MHz UHF band and 2.45 GHz band. By using this multi-frequency IC chip, the number of IC chips can be reduced, and the manufacturing process can be reduced in manufacturing the non-contact data carrier inlet 10.

  Further, the other end portions 27b and 27d of the antenna coils A1 and A2 of the base film P1 on which the antenna coils A1 and A2 and jumper wires Y1 and Y2 are formed are wired on the other surface 26b of the base film P1. When connecting to one end of the jumper wire (inter-terminal connection pattern) Y1, Y2, or when connecting the base end of the wiring pattern 29c, 29f of the base film P1 to the other end of the jumper wire Y1, Y2. It is not limited to conducting by caulking. For example, a through hole is formed, and a conductive layer is formed on the inner wall surface of the through hole by sputtering or the like so that the one surface 26a side and the other surface 26b side of the base film P1 are electrically connected. Also good.

  Although the present invention has been specifically described above with reference to one embodiment, the present invention is not limited to these embodiments, and various modifications can be made without departing from the scope of the invention.

  For example, as an antenna, a dipole antenna that communicates in a microwave band such as 2.45 GHz may be provided in both the antenna circuit 20 a and the antenna circuit 20 b including the sensor 100.

  FIG. 11 is a plan view of a non-contact type data carrier inlet when a dipole antenna is used as the antenna for the antenna circuit 20a and the antenna circuit 20b including the sensor 100. FIG.

  As shown in FIG. 11, the sensor 100 is interposed in one antenna of the dipole antenna DA1 in the antenna circuit 20a including the sensor 100, and the sensor 100 is electrically connected to the one antenna in series.

  Here, by interposing a temperature sensor as the sensor 100 in one antenna of the dipole antenna DA1, the sensor 100 is disconnected when the temperature becomes a predetermined temperature or higher. Thereby, for example, the dipole antenna DA1 having a communication distance of about 1 to 3 m cannot communicate through this communication distance, and the information communication through the dipole antenna DA1 becomes practically impossible. The dipole antenna DA2 has a configuration in which the impedance for matching with the IC chip C2 is adjusted by conducting one antenna and the other antenna at a predetermined position by the conduction pattern 110.

  Even in this case, as in the case of the non-contact type data carrier inlet 10 and the non-contact type data carrier 40 described above, even if the sensor 100 is disconnected and information transmission / reception becomes impossible via the antenna circuit 20a, the antenna Information can be transmitted and received through the circuit 20b.

  FIG. 12 is a plan view showing an example in which a temperature sensor as the sensor 100 is interposed in a conduction pattern 110 for adjusting impedance when a dipole antenna is used as the antenna.

  As shown in FIG. 12, a sensor 100 is interposed in the conductive pattern 110 of the dipole antenna DA1 in the antenna circuit 20a, and this sensor 100 is electrically connected in series to the conductive pattern 110.

  In this case, when a temperature sensor is used as the sensor 100, when the sensor 100 is disconnected, the impedance changes and the communication frequency changes. Thereby, it can be recognized that the sensor 100 is disconnected.

  In the case where a dipole antenna is used as the antenna described above, an example in which an IC chip is provided for each of the antenna circuit 20a and the antenna circuit 20b is shown. However, by using an IC chip that supports multi-frequency, the antenna circuit 20a In addition, a circuit configuration including one IC chip common to the antenna circuit 20b may be employed.

  Furthermore, as shown in FIG. 14, instead of the first antenna circuit consisting of a sensor and a first IC chip that are electrically connected to the first antenna on the electrically insulating substrate P1, a coiled antenna A1 and this A sensor 100 electrically connected to the coiled antenna A1 and a first resonance circuit 80a (having a capacitor as necessary) are disposed, and the second antenna A2 and the second antenna A2 are disposed on the electrically insulating substrate P1. A non-contact data carrier inlet 80 or a non-contact data carrier having a second antenna circuit 20b provided with a second IC chip C2 that transmits and receives information via the antenna of .

  Even in the non-contact type data carrier inlet 80 or the non-contact data carrier having this configuration, the same effect as the non-contact type data carrier inlet of the present invention described above can be obtained. That is, when a temperature sensor is used as the sensor 100, when the environment exceeds a predetermined temperature and the temperature sensor is cut off, the resonance frequency of the first resonance circuit 80a changes, and the response of the resonance circuit at the predetermined frequency is changed. Even if it disappears, information can be transmitted and received through the second antenna circuit 20b. Therefore, since the unique information of the non-contact type data carrier stored in the IC chip C2 included in the antenna circuit 20b can be read and the presence of the non-contact type data carrier can be recognized, the first resonance circuit 80a having the sensor. It can be recognized that the resonance frequency has changed. Since the number of IC chips is one in the configuration of the non-contact data carrier having the sensor as described above, the configuration can be made at a lower price while having the same environment detection function.

The top view which shows one surface side of the non-contact-type data carrier inlet which concerns on one Embodiment of this invention. Sectional drawing from the side surface side of one antenna circuit structure part in the non-contact-type data carrier inlet of FIG. The top view which shows the other surface side of the non-contact-type data carrier inlet of FIG. The block diagram which shows the structure of a non-contact-type data carrier inlet functionally. The block diagram which shows the other structure of a non-contact-type data carrier inlet functionally. The block diagram which shows the other structure of a non-contact-type data carrier inlet functionally. The block diagram which shows the other structure of a non-contact-type data carrier inlet functionally. The top view which shows the one surface side of the non-contact-type data carrier comprised by covering the non-contact-type data carrier inlet of FIG. 1 with an exterior. Sectional drawing from the side surface side of one antenna circuit structure part in the non-contact-type data carrier of FIG. Sectional drawing for demonstrating the process for manufacturing a non-contact-type data carrier inlet. Sectional drawing for demonstrating the process for manufacturing a non-contact-type data carrier inlet. Sectional drawing for demonstrating the process for manufacturing a non-contact-type data carrier inlet. Sectional drawing for demonstrating the process for manufacturing a non-contact-type data carrier inlet. Sectional drawing for demonstrating the process for manufacturing a non-contact-type data carrier inlet. Sectional drawing for demonstrating the process for manufacturing a non-contact-type data carrier inlet. Sectional drawing for demonstrating the process for manufacturing a non-contact-type data carrier inlet. The figure for showing roughly the device for carrying out the manufacturing process shown in Drawing 7a-Drawing 7f. The figure for showing roughly the device for carrying out the manufacturing process shown in Drawing 7g. The top view which shows the produced non-contact-type data carrier inlet roll. The figure which shows schematically the apparatus for implementing the process of cutting a non-contact-type data carrier inlet. The top view of a non-contact-type data carrier inlet at the time of using a dipole antenna as an antenna. The top view of the non-contact-type data carrier inlet which interposed the temperature sensor in the conduction | electrical_connection pattern in the case of using a dipole antenna as an antenna. Sectional drawing of an impact sensor. Sectional drawing of an impact sensor. The block diagram which shows the other structure of a non-contact-type data carrier inlet functionally.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Non-contact-type data carrier inlet, 20a, 20b ... Antenna circuit, 21a, 21b, 21c, 21d ... Connection pattern, 22, 23, 24, 25, 30 ... Capacitor, 22a, 22b, 22c, 22d, 23a, 23b , 23c, 23d, 24a, 24b, 24c, 24d, 25a, 25b, 25c, 25d ... electrostatic capacity adjustment pattern, 26a ... one surface, 26b ... the other surface, 27a, 27c ... one end, 28a ... connection bump 29a, 29d ... crimping part, 40 ... non-contact data carrier, 41a, 41b ... protective film, 100 ... sensor, 101, 102 ... terminal part, 103 ... connecting part, A1, A2 ... antenna coil, C1, C2 ... Chip, P1 ... base film, Y1, Y2 ... jumper wire.

Claims (24)

A first antenna, a sensor that is electrically connected to the first antenna, and a first IC chip that transmits and receives information via the first antenna are disposed on an electrically insulating substrate. A first antenna circuit comprising:
And a second antenna circuit comprising a second antenna and a second IC chip that transmits and receives information via the second antenna on the substrate. Non-contact data carrier inlet. A first antenna, a sensor that is electrically connected to the first antenna, and an IC chip that transmits and receives information via the first antenna are disposed on an electrically insulating substrate. A first antenna circuit;
A non-contact type data carrier inlet comprising: a second antenna circuit having a second antenna disposed on the substrate for transmitting / receiving information to / from the IC chip. A first antenna circuit in which a first antenna and a sensor electrically connected to the first antenna are disposed on an electrically insulating substrate;
A non-contact type comprising: a second antenna circuit on which a second antenna and an IC chip that transmits and receives information via the second antenna are arranged on the substrate. Data carrier inlet.   The contactless data carrier inlet according to any one of claims 1 to 3, wherein the first antenna circuit and the second antenna circuit are arranged in parallel.   4. The non-contact type according to claim 1, wherein the first antenna includes an antenna coil, and the second antenna circuit is provided in the first antenna. 5. Data carrier inlet.   6. The non-contact type data carrier inlet according to any one of claims 1 to 5, wherein the sensor comprises an irreversible thermal fuse that is partially broken under a predetermined condition. The first antenna circuit, wherein the first antenna is an antenna coil,
A pair of terminals respectively connected to the first antenna and extending on one main surface of the substrate on which the first antenna is disposed and on the other main surface opposite to the one main surface A first connection pattern;
At least a part of the pattern formed on the one or other main surface and connected to the pair of first connection patterns, facing each other through the substrate, on the one and other main surfaces, Or a first capacitance adjustment pattern capable of adjusting capacitance adjustment by removing a part of the connection pattern. Contact data carrier inlet. The second antenna circuit, wherein the second antenna is an antenna coil,
A pair of terminals respectively connected to the second antenna and extending on one main surface of the substrate on which the second antenna is disposed and on the other main surface facing the one main surface A second connection pattern;
At least a part of the pattern formed on the one or other main surface, provided to be opposed to each other through the substrate and connected to the pair of second connection patterns on the one and other main surfaces, Or a second capacitance adjustment pattern capable of adjusting the capacitance adjustment by removing a part of the connection pattern. Contact data carrier inlet. The first antenna circuit, wherein the first antenna is an antenna coil,
A pair of terminals respectively connected to the first antenna and extending on one main surface of the substrate on which the first antenna is disposed and on the other main surface opposite to the one main surface A first connection pattern;
At least a part of a first capacitance adjustment pattern that is connected to the pair of first connection patterns on the one and other main surfaces and is opposed to each other through the substrate, or the first The non-contact type data carrier inlet according to claim 1, further comprising: a first tuning unit in which a part of the connection pattern is deleted. The second antenna circuit, wherein the second antenna is an antenna coil,
A pair of terminals respectively connected to the second antenna and extending on one main surface of the substrate on which the second antenna is disposed and on the other main surface opposite to the one main surface A second connection pattern;
At least a part of a second capacitance adjustment pattern connected to the pair of second connection patterns on the one main surface and the other main surface and facing each other through the substrate, or the second The non-contact type data carrier inlet according to claim 1, further comprising: a second tuning unit in which a part of the connection pattern is deleted.   The non-contact type data carrier inlet according to any one of claims 1 to 10, wherein the non-contact type data carrier inlet is configured to be able to communicate in the same frequency band via each antenna provided in each antenna circuit.   The non-contact type data carrier inlet according to any one of claims 1 to 10, wherein the non-contact type data carrier inlet is configured to be able to communicate in different frequency bands via each antenna provided in each antenna circuit.   A non-contact type data carrier comprising: a sheet in which a plurality of the non-contact type data carrier inlets according to any one of claims 1 to 12 are disposed; Inlet roll.   A non-contact type data carrier configured by covering the non-contact type data carrier inlet according to any one of claims 1 to 12 with an exterior. An antenna forming step of forming the first antenna and the second antenna on one surface of the electrically insulating substrate;
An IC chip mounting step of mounting the first IC chip electrically connected to the first antenna, and mounting the second IC chip electrically connected to the second antenna;
A non-contact type data carrier inlet manufacturing method comprising: a sensor mounting step of mounting a sensor by being electrically connected to the first antenna. An antenna forming step of forming the first antenna and the second antenna on one main surface of the electrically insulating substrate;
An IC chip mounting step of mounting an IC chip by being electrically connected to both the first antenna and the second antenna;
A non-contact type data carrier inlet manufacturing method comprising: a sensor mounting step of mounting a sensor by electrically connecting to the first antenna. An antenna forming step of forming the first antenna and the second antenna on one surface of the electrically insulating substrate;
An IC chip mounting step of mounting an IC chip electrically connected to the second antenna;
A non-contact type data carrier inlet manufacturing method comprising: a sensor mounting step of mounting a sensor by being electrically connected to the first antenna. The first antenna includes an antenna coil, and one end side is electrically connected to one end side of the first antenna on one main surface of the substrate on which the first antenna is disposed. An end side is extended, and one end side is electrically connected to the other end side of the first antenna via the substrate on the other main surface facing the one main surface, and the other end side is connected. A first connection pattern forming step that extends and forms a pair of first connection patterns;
A first capacitance adjustment that forms a first capacitance adjustment pattern on the one and other main surfaces so as to be connected to the pair of first connection patterns so as to face each other through the substrate. The method for producing a non-contact type data carrier inlet according to any one of claims 15 to 17, further comprising: a pattern forming step.   2. The method according to claim 1, further comprising a first tuning step of adjusting the capacitance by deleting at least a part of the first capacitance adjustment pattern or a part of the first connection pattern. 18. A method for producing a non-contact data carrier inlet according to 18. The second antenna includes an antenna coil, and one end side is electrically connected to one end side of the second antenna on one main surface of the substrate on which the second antenna is disposed. An end side is extended, and one end side is electrically connected to the other end side of the second antenna via the substrate on the other main surface facing the one main surface, and the other end side is connected. Extending a second connection pattern forming step for forming a pair of second connection patterns;
A second capacitance adjustment that forms a second capacitance adjustment pattern on the one and other main surfaces so as to be opposed to each other through the substrate by being connected to the pair of second connection patterns, respectively. The method of manufacturing a non-contact type data carrier inlet according to any one of claims 15 to 18, further comprising a pattern forming step.   2. The method according to claim 1, further comprising a second tuning step of adjusting the capacitance by deleting at least a part of the second capacitance adjustment pattern or a part of the second connection pattern. 20. A method for producing a non-contact data carrier inlet according to 20.   The method of manufacturing a non-contact type data carrier inlet according to any one of claims 15 to 21, wherein the temperature sensor comprises an irreversible temperature fuse that is partially broken under a predetermined condition.   A non-contact type produced by winding a sheet having a plurality of non-contact type data carrier inlets manufactured by the method according to any one of claims 15 to 22 in a roll shape. Manufacturing method of data carrier inlet roll.   23. A method of manufacturing a non-contact type data carrier, wherein the non-contact type data carrier inlet manufactured by the method according to claim 15 is covered with an exterior.

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