JP2004318303A - Ic card manufacturing method and ic card manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent disposing of an expensive IC inlet by stopping enclosing of the IC inlet on a part with failure surface record. <P>SOLUTION: The web style IC inlet 5 delivered from a delivery means is carried and cut into a predetermined size by a cutting means 13. A plurality of sheet style IC inlets 3 made into a sheet style by cutting are held by a sheet carrying means and they are positioned and aligned/placed inside a tray 35. One of the sheet style IC inlets 3 aligned inside the tray 35 is held and carried to predetermined positions of a first base material 1 and a second base material 2. The sheet style IC inlet 3 is interposed between the first base material 1 and the second base material 2 and adhered by an adhering means. Before adhering of the first base material 1 and the sheet style IC inlet 3, carrying of the sheet style IC inlet 3 is stopped according to failure information of the first base material 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and an apparatus for manufacturing an IC card, and particularly to a method for conveying a sheet-like IC inlet comprising an IC chip and a coil wound in a web, and interposing a first base material and a second base material between the first base material and the second base material. The present invention relates to a method and an apparatus for manufacturing an IC card to be interposed and bonded.
[0002]
[Prior art]
The IC card is used, for example, for certifying an individual's identity, such as an employee ID card, a student ID card, or an entry ID card. Such an IC card includes a sheet-shaped IC inlet having an IC chip and a coil (antenna), a first base having a face image and written information, and a second base having written matters and notes. Some are formed by being sealed, and then pressurized, heated and bonded.
[0003]
The IC card production method described in Patent Document 1 relates to the production of an IC web composed of a top sheet, an IC chip enclosed in a back sheet, and an antenna, and is continuous between the top web of the top sheet and the bottom web of the back sheet. An IC card in a roll state is enclosed, transported, subjected to pressurization, heating, and bonding, and then cut to produce an IC card (paragraph numbers 0092 to 0095, and FIG. 3).
[0004]
Further, in this continuous conveyance method, a continuous IC web is bonded to a top sheet and a back sheet, cut and formed into a sheet, and if a printing failure occurs, it is removed after the cutting process.
[0005]
In the method for manufacturing an IC card described in Patent Document 2, an IC unit is taken out and inserted one by one at a position where the first sheet material and the second sheet material face apart from each other (paragraph number). 0030 and FIGS. 3 to 5).
[0006]
[Patent Document 1]
JP-A-11-216973
[0007]
[Patent Document 2]
JP 2000-20668 A
[0008]
[Problems to be solved by the invention]
In the IC card production method described in Patent Literature 1, an original web in a roll state is supplied, cut and formed into a sheet, sealed in a top sheet and a back sheet, and defective printing portions are eliminated after lamination. .
[0009]
Such IC cards are subjected to fine printing such as digital watermark printing and holograms for the purpose of preventing forgery and falsification. However, such printing may cause defective products, and the IC unit is enclosed. Then, the IC card is discarded after bonding, and there is a problem that the cost is increased.
[0010]
In the method of manufacturing an IC card described in Patent Literature 2, the IC units are taken out one by one and inserted between the first sheet material and the second sheet material. Not suitable for production.
[0011]
The present invention has been made in view of the above problems, and has as its object to provide an IC card manufacturing method and an IC card manufacturing apparatus which stably achieve high-speed production of a large amount of IC cards.
[0012]
Further, the present invention stops the encapsulation of the IC unit when it is detected that there is defect information on the surface recording image or the special print, and prevents the expensive IC unit from being discarded, thereby reducing the production cost. It is an object of the present invention to provide an IC card manufacturing method and an IC card manufacturing apparatus which can reduce the number of IC cards.
[0013]
[Means for Solving the Problems]
The present invention is achieved by an IC card manufacturing method and an IC card manufacturing apparatus having the following configurations.
[0014]
(1) A method for manufacturing an IC card in which a sheet-like IC inlet composed of an IC chip and a coil wound in a web is interposed between a first base material and a second base material and bonded to each other, A plurality of the sheet-shaped IC inlets are formed into a continuous elongated web-shaped IC inlet, and the web-shaped IC inlet is sent out by a sending-out means from a main winding, and the web-shaped IC inlet sent out from the sending-out means is removed. The web-shaped IC inlet is conveyed by a web conveying means and stopped at a predetermined position, the web-shaped IC inlet is cut to a predetermined size by a cutting means, and the plurality of cut sheet-shaped IC inlets are gripped by a sheet conveying means. It is positioned and placed in a tray, and the one sheet-shaped IC inlet aligned in the tray is gripped and It is conveyed to predetermined positions of a first base material and a second base material, and the sheet-shaped IC inlet is interposed between the first base material and the second base material, and bonded by a bonding means. IC card manufacturing method.
[0015]
(2) An IC card manufacturing apparatus for bonding a sheet-like IC inlet composed of an IC chip and a coil wound in a web between a first base material and a second base material, and bonding the sheet-shaped IC inlet, An original winding in which a web-shaped IC inlet formed by forming a plurality of the sheet-shaped IC inlets into a continuous elongated shape in a roll shape, an original winding shaft for suspending a core of the original winding, and Sending means for sending out the web-shaped IC inlet, web transferring means for transferring the web-shaped IC inlet sent from the sending means and stopping at a predetermined position, cutting means for cutting the web-shaped IC inlet to a predetermined size, A tray for accommodating the cut sheet-shaped IC inlets in a plurality of receiving portions and arranging and mounting the sheet-shaped IC inlets, and a plurality of the cut sheet-shaped IC inlets Sheet conveying means for gripping the IC-shaped inlet and conveying it into the tray for positioning, tray moving means for moving the tray, and holding the sheet-shaped IC inlet aligned in the tray for the first An IC card manufacturing apparatus, comprising: a sticking means for transporting and sticking to a predetermined position on one of the base material and the second base material.
[0016]
(3) An IC card manufacturing apparatus for bonding a sheet-like IC inlet composed of an IC chip and a winding coil enclosed in a web between a first base material and a second base material, and An original winding in which a plurality of the sheet-shaped IC inlets are formed into a continuous elongated web-shaped IC inlet, a feeding means for feeding the web-shaped IC inlet from the original winding, and a feeding means; A web transport means for transporting the web-shaped IC inlet and stopping the web-shaped IC inlet at a predetermined position; and a transport direction orthogonal to a transport direction and a transport direction of a protection plate formed integrally with the IC chip provided in the web-shaped IC inlet. Web by detecting means for detecting the width direction, and positioning means for conveying and positioning the web-shaped IC inlet sent from the main winding. An IC card manufacturing apparatus, comprising: a stop command to said feeding means by detecting the position of a web-shaped IC inlet; and control means for checking whether or not the positioning state of the web-shaped IC inlet is proper.
[0017]
(4) An IC card manufacturing apparatus for bonding a sheet-like IC inlet composed of an IC chip sealed in a web and a coil wound between a first base material and a second base material, An original winding in which a plurality of the sheet-shaped IC inlets are formed into a continuous elongated web-shaped IC inlet, a feeding means for feeding the web-shaped IC inlet from the original winding, and a feeding means; A web transport means for transporting the web-shaped IC inlet and stopping it at a predetermined position; and transporting the sheet-shaped IC inlet, which has been cut to a predetermined size by the cutting means, to a plurality of receiving portions of a tray. Sheet conveyance means for positioning by means of the first base material and the defect information obtained by the base material information reading means arranged near each take-out portion of the second base material. Control means for controlling the transfer of the corresponding sheet-shaped IC inlet to the web transport means, and drive means for supplying the sheet-shaped IC inlet only to a position to be supplied based on the defect information obtained by the control means An IC card manufacturing apparatus, comprising:
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a method and an apparatus for manufacturing an IC card according to the present invention will be described in detail with reference to the drawings.
[0019]
[IC card]
FIG. 1 shows an employee card as an example of an IC card according to the present invention. FIG. 1A is a front view of the IC card, and FIG. 1B is an exploded perspective view of the IC card. 2A is an exploded sectional view of the IC card, FIG. 2B is a sectional view of the IC card, and FIG. 2C is a front view of a sheet-like IC inlet of the IC card.
[0020]
The IC card A is bonded by interposing a sheet-like IC inlet (hereinafter also referred to as an inlet) 3 between a first base material (also referred to as a top sheet) 1 and a second base material (also referred to as a back sheet) 2. It is manufactured by bonding with an agent.
[0021]
On the front side of the first base material 1, personal information B1, such as a personal identification number, a name, an address, a date of birth, etc. of the card holder, face photo information B2 of the card holder, date of card issuance, Character information B3 such as a term and personal identification information B4 such as digital watermark printing and hologram are formed.
[0022]
A writing layer or a printing layer is formed on the front side of the second base material 2.
The support of the first base material 1 and the support of the second base material 2 are formed of a resin material such as polyethylene terephthalate (PET) having a thickness of 50 to 250 μm.
[0023]
The inlet 3 is formed by interposing an IC chip 3C, a winding coil 3D and a protective plate 3E between a first nonwoven fabric 3A and a second nonwoven fabric 3B made of an insulating sheet, and heating and sealing with resin.
[0024]
The inlet 3 is formed between an adhesive layer (hot melt layer) 4A applied to the back side of the first base material 1 and an adhesive layer (hot melt layer) 4B applied to the back side of the second base material 2. It is manufactured by laminating by hot-melt treatment with the inlet 3 interposed.
[0025]
The outer shape of the inlet 3 is formed smaller than the outer shape of the IC card A, and the peripheral area between the outer circumference of the inlet 3 and the outer shape of the IC card A is firmly bonded by the adhesive layers 4A and 4B.
[0026]
The hot melt adhesive forming the adhesive layers 4A and 4B is preferably a reactive hot melt adhesive. The reactive hot melt adhesive has high durability and is suitable for application at a low temperature. Therefore, when the surface of the image receiving layer is a material which is easily damaged at a high temperature, the damage can be reduced.
[0027]
When a resin film is used instead of the first nonwoven fabric 3A and the second nonwoven fabric 3B, the outer shape of the resin film is formed to be larger than the outer shape of the IC card A, and after the laminating process, cutting is performed together with the IC card A. The IC card A having a predetermined size may be formed.
[0028]
[IC card manufacturing process]
The manufacturing process of the IC card will be described with reference to the schematic diagram of FIG.
[0029]
<First substrate supply step (1)>
In the supply step (1) of the first base material 1, a feeding unit (not shown) is formed from a storage box in which 100 to 2000 sheets of the first base material aggregate sheet 1 </ b> A having a plurality of first base materials 1 are stacked. To separate and supply them one by one. The upper surface of the first base material assembly sheet 1A is detected and maintained constant, and is held and taken out by a suction pad (not shown). In this case, it is preferable to have a mechanism for removing the electricity, blowing air between layers, scraping off with a separation claw or the like, and raising the suction pad at the same time as suction called soccer so that one sheet can be reliably separated.
[0030]
In addition, two sets of storage boxes for depositing the first base material aggregate sheet 1A are provided, and when the first base material aggregate sheet 1A runs out in one storage box, the supply is automatically switched to the supply of the other storage box and the line is stopped. It is preferred not to let it.
[0031]
<Adhesive coating process for first substrate (2)>
In the step (2) of applying the adhesive to the first base material aggregate sheet 1A, a hot melt adhesive is applied to the first base material aggregate sheet 1A at a predetermined thickness. As a coating method, a normal method such as a die method, a gravure method, or a roll method can be adopted, but a die method is preferable in the following points.
[0032]
In the die method, since the adhesive is sealed until it is applied to the first base material aggregate sheet 1A, temperature control is easy even at a high temperature such as a hot melt adhesive. In particular, in the case of a reactive hot melt adhesive, This is advantageous because it does not come into contact with humid outside air. In addition, there is no foreign matter and bubbles are hardly generated.
[0033]
The adhesive dissolved in the heating tank is supplied to the die 21 through a hose by a pump, and is discharged from a slit outlet 21a of the die 21.
[0034]
As a method of holding the first base material aggregate sheet 1A, there is a method of gripping and holding the head, tail and both edges of the base material, and a method of suction-holding the entire surface of the first base material aggregate sheet 1A by the suction roll 22 is used. This is preferable because the margin of the outer edge of the first base material aggregate sheet 1A is small and the yield is good.
[0035]
<Sheet IC inlet supply process (3)>
In the supply step (3) of the inlet 3, an intermediate station 30 for placing the inlet 3 on the first base material assembly sheet 1A is provided, and the inlet 3 is arranged here, and these are collectively sucked and held, and adhered. It is placed on the first base material aggregate sheet 1A coated with the agent. Although the positioning of the inlets 3 is performed one by one before being taken out from the intermediate station 30, it is more preferable to position the first base material aggregate sheet 1A based on the edge or the printing.
[0036]
When arranging in the intermediate station 30, it is arranged not to be located at the position based on the reading of the defect position information given to the first base material aggregate sheet 1A and the information on the online defect inspection. When there is no defect information, the inlet 3 is fed out from the roll-shaped original winding by one piece and cut, and is sequentially sent to the intermediate station 30. When there is defect information, the feed is performed at the corresponding timing of only the corresponding column. Abort. The capacity is improved by arranging a plurality of roll-shaped original windings and simultaneously processing them in multiple rows. In addition, the defective inlet 3 known in advance is removed before being placed on the first base material aggregate sheet 1A, or is removed later by providing defect information to the first base material aggregate sheet 1A.
[0037]
When placing the inlet 3 on the first base material aggregate sheet 1A, there is a method in which the first base material aggregate sheet 1A is temporarily stopped, but it is synchronized with the first base material aggregate sheet 1A conveyed at a constant speed. It is preferable to mount. Also, the IC chip 3C is placed while being squeezed from one side so that air does not enter, or the IC chip 3C is pushed into the hot melt adhesive. Further, the hot melt adhesive is heated and kept warm by a heating / warming means 23 such as a heater before the placement to maintain fluidity and tackiness.
[0038]
As a conveyance method from the supply of the first base material aggregate sheet 1A to the bonding, there is a method using a suction conveyor or the like.
[0039]
<Second base material supply step (4)>
In the supply step (4) of the second base material 2, a long second base material aggregate sheet 2A in which a plurality of second base materials 2 are gathered and wound into a roll is fed, and in this feeding, the tension and the edge position are adjusted. Detect and control to constant.
[0040]
In addition, two types of feeding means are provided, an accumulator is provided, and the replacement and joining of the web-shaped IC inlet (hereinafter also referred to as the original winding inlet) 5 are performed without stopping the line.
[0041]
<Step of applying adhesive to second base material (5)>
In the step (5) of applying the adhesive to the second base material aggregate sheet 2A, the second base material aggregate sheet 2A held and held by the nipple rolls 42 in a die manner similarly to the first base material aggregate sheet 1A. Intermittent coating is performed on the upper surface by a die 40.
[0042]
The second base material aggregate sheet 2A is intermittently coated according to the first base material aggregate sheet 1A, which is a single-sheet sheet, and is not coated at a position where the sheet is cut into a sheet shape after bonding, so that the second base material aggregate sheet 2A can be cut into a blade. Of the adhesive can be prevented. Reactive hot melts are particularly effective because they do not cure immediately.
[0043]
<Lamination process 6>
In the bonding step (6), the first base material aggregate sheet 1A in the form of a single sheet on which an adhesive is applied and the inlet 3 is placed, and the second base material aggregate sheet 2A on which the adhesive is applied are nip rolls 42. , 43 and nip. The nip roll 42 may also serve as a roll for coating the second base material aggregate sheet 2A, or may be provided separately.
[0044]
The nip rolls 42 and 43 may be metal-to-metal or rubber-coated on one side. The nip rolls 42 and 43 may be provided with a total thickness or an adhesive by setting a gap, setting a pressing force, or a combination thereof. The inlet 3 is embedded to improve smoothness.
[0045]
Therefore, the hot-melt adhesive is heated and kept warm by the heating-warming means 41 immediately before bonding the first base material gathering sheet 1A and the second base material gathering sheet 2A together. On the other hand, the heating medium is circulated inside the nip roll 42 via a temperature controller on the surface side of the first base material assembly sheet 1A and the second base material assembly sheet 2A, and the roll temperature information of the temperature sensor and the heat medium temperature of the temperature sensor The temperature controller is driven by the control unit based on the information, and the temperature is kept so as not to exceed a certain temperature (for example, 60 ° C.).
[0046]
The first base material aggregate sheet 1A, which is in the form of a single sheet, is fed at a constant pitch and is bonded to the second base material aggregate sheet 2A. Is always an integral multiple of the card feed pitch so that Further, a minimum space is provided between the first base material aggregate sheets 1A so that no debris is generated when the sheets are cut into a sheet after the lamination.
[0047]
The tension of the second base material aggregate sheet 2A and the first base material aggregate sheet are taken into consideration so as not to cause curl or the like due to residual stress between the first base material aggregate sheet 1A and the second base material aggregate sheet 2A after bonding. Set 1A sheet tension.
[0048]
<Conveyor heating and pressurizing process 7>
In the conveyor heating and pressurizing step (7), the total thickness and smoothness are further improved by heating and pressurizing the bonded product of the first base material aggregate sheet 1A and the second base material aggregate sheet 2A for a certain period of time. The smoothness of the convex portion of the chip 3C is adjusted.
[0049]
The pressurization by the conveyor heating and pressurization is performed by the conveyor 50 in which a plurality of plates sandwiching the upper and lower sides of the bonded product of the first base material aggregate sheet 1A and the second base material aggregate sheet 2A are circulated.
[0050]
As a heating method, there is a method in which the conveyor 50 is directly radiantly heated by infrared rays or a method in which the conveyor 50 is conductively heated by a heater. However, the method in which the conveyor 50 is provided in an atmosphere in which hot air is circulated has a stable temperature.
[0051]
<Conveyor cooling and pressurizing process (8)>
In the conveyer cooling and pressurizing step (8), the bonded product immediately after heating and pressurizing is easily deformed at high temperature, and the smoothness may deteriorate over time due to residual stress. However, it is preferable to perform cooling while pressurizing with the conveyor 60 as in the case of heating and pressurizing.
[0052]
<Sheet cutting process (9)>
In the sheet cutting step (9), the bonded product of the first base material aggregate sheet 1A and the second base material aggregate sheet 2A cannot be wound, and is cut into a sheet shape by the cutter unit 70. The cutting is performed without bending the bonded IC card A.
[0053]
In addition, the cutting position is cut at an interval provided between the first base material aggregate sheets 1A at the time of lamination so that there is no waste. Since the uncoated portion has no adhesive, it does not adhere to the blade.
[0054]
<Accumulation storage process>
In the accumulation storage step, a predetermined number of cut bonded products are accumulated. It is preferable that the stacking of the bonded products is performed in two sets of storage systems, and the stacking can be performed without stopping the line.
[0055]
<Carding process>
In the carding step, the bonded product of the first base material aggregate sheet 1A and the second base material aggregate sheet 2A is cut to a predetermined size by cutting four sides based on the edge or printing of the first base material aggregate sheet 1A. After that, fixed printing is performed on the second base material aggregate sheet 2A side by the printing machine 80, and the card is punched by the punching machine 90. The fixed-form printing on the second base material aggregate sheet 2A side may be performed for each card after punching.
[0056]
[Web-shaped IC inlet]
<Retention of web-shaped IC inlet>
FIG. 4A is a perspective view of a main winding inlet 5 in which a plurality of inlets 3 are formed in a continuous coil shape.
[0057]
The form of the manufacturing process of the main winding inlet 5 is such that a long web of one row is wound in a roll shape, but the IC chip 3C and the protection plate 3E have convex portions, so that the winding should be loosely wound. Is preferred.
[0058]
The winding form of the original winding inlet 5 is wound around the winding core 5A such that the IC chip 3C of the inlet 3 is on the front side.
[0059]
FIG. 4B is a perspective view of the main winding inlet 5 held on the flanged reel 6 and the support means.
[0060]
The main winding inlet 5 is held on a flanged reel 6. The reel 6 is rotatably supported by a main winding shaft 7A provided on the apparatus main body side. After the reel 6 is fitted into the original winding shaft 7A and brought into contact with the abutment plate 7B on the apparatus body side, it is fixed by the holding plate 7C and the screw 7D.
[0061]
The reel 6 is rotated by sending-out means described below, which comes into contact with the outer peripheral portion of the flange of the reel 6.
[0062]
FIG. 4C is a perspective view showing another embodiment of the feeding means of the main winding inlet 5.
[0063]
A core 5A of the main winding inlet 5 is rotatably supported by a main winding shaft 7E provided on the apparatus main body side, and is fixed by an abutting plate 7F, holding plates 7G, 7H, and screws 7I. The main winding shaft 7E is rotatable by a feeding means provided on the apparatus main body side.
[0064]
<Sending means of the original winding inlet>
FIG. 5 is a front view showing the feeding means of the main winding inlet 5, and FIG. 6 is a perspective view.
[0065]
The two original winding shafts 7A1 and 7A2 are rotatably supported near both ends of the swing arm 8. The center of the swing arm 8 is swingably supported by the rotation shaft 8A.
[0066]
While the main winding inlet 5 supported by one main winding shaft 7A1 is being sent out by the feeding means, the spare main winding inlet 5 is suspended on the other main winding shaft 7A2 to be in a standby state. When it is detected by the sensor S1 such as an ultrasonic sensor or an optical sensor that the main winding inlet 5 supported by the main winding shaft 7A1 is sent out and has a predetermined outer diameter or less, the swing arm 8 is swung. Then, the main winding inlet 5 in the standby state is sent out by the feeding means 9 from the other main winding shaft 7A2.
[0067]
The feeding means 9 is composed of a belt or a roller which rotates while being in contact with the outer peripheral surface of the reel 6 suspended on the original winding shaft 7A1, and rotates and feeds the original winding inlet 5 having the original winding shape.
[0068]
The main winding inlet 5 is loosened between the feeding means 9 for feeding the main winding inlet 5 in the form of the main winding and the web conveying means 10 for conveying the main winding inlet 5 sent from the feeding means 9 and stopping at a predetermined position. A free loop a is formed. The sensor S2 detects a free loop a of the main winding inlet 5. The control means intermittently drives the feeding means 9 based on the detection signal from the sensor S2, and controls the driving so that the free loop a is always maintained at a constant amount.
[0069]
The driving rotation of the feeding means 9 for rotating the main winding inlet 5 in contact with the reel 6 or the feeding means (not shown) for rotating the main winding inlet 5 held on the main winding shaft 7E provided on the apparatus main body side is downstream. It is controlled so as to synchronize with the transport speed of the web transport means 10 provided on the side. Also,
The static elimination means 11 was arranged near the delivery portion of the main winding inlet 5 suspended on the main winding shaft 7A1. The static eliminator 11 is, for example, an electrostatic air blower that discharges a negative ion flow, and sprays an electrostatic flow toward the vicinity of a location where the static electricity is drawn out of the original winding portion of the original winding inlet 5 and separated. The static electricity generated at the time of separation of 5 is removed.
[0070]
<Transport and cutting of web-shaped IC inlet>
The web transport means 10 provided on the downstream side of the free loop a includes a transport belt 13 on the upstream side of the cutting means (cutter unit) 12, a transport belt 14 on the downstream side, and a suction means 15 disposed inside the transport belt 13. , And suction means 16 arranged inside the conveyor belt 14.
[0071]
The transport belt 13 around which the pair of rollers is wound is rotated via the belt by driving the motor M1. The transport belt 14 around which a pair of rollers is wound is rotated via the belt by driving the motor M2.
[0072]
FIG. 7A is a plan view of the inlet 3 which is mounted on the rotating transport belt 14 and transported.
[0073]
The transport belt 13 having the suction means 15 of the web transport means 10 is transported so as not to suck the IC chip portion of the original winding inlet 5. Further, the transport belt 14 having the suction means 16 is transported so as not to suck the portion of the inlet 3 where the IC chip 3C is located.
[0074]
FIG. 7B is a sectional view of the conveyance guide plate 17 and the inlet 3. The web transfer means 10 has a recess 17a in the transfer guide plate 17 so as not to come into contact with the arrangement position of the IC chip 3C of the original winding inlet 5 and the inlet 3.
[0075]
The sensor S3 disposed near the conveyor belt 13 detects passage of the rear end of the original inlet 5 to be conveyed. The sensor S4 detects an edge of the original inlet 5 to be conveyed. The sensor S5 detects the position of the original winding inlet 5 to be conveyed.
[0076]
FIG. 7C is a plan view of the detecting means for detecting the cutting position of the original winding inlet 5 and the shift position in the width direction.
[0077]
The detecting means 18A detects the leading end in the traveling direction of the protection plate 3E for protecting the IC chip 3C. The control means stops the driving of the conveyor belts 13 and 14 based on the detection signal, stops the original winding inlet 5 at a predetermined position, performs a cutting process by the cutting means 12, and forms the sheet into a predetermined length.
[0078]
The detecting means 18B detects a position of the conveyed inlet 5 shifted in the width direction. The control means controls the movement of the conveying belt 14 in the width direction based on the detection signal, and regulates the meandering of the main winding inlet 5.
[0079]
By detecting the position of the main winding inlet 5 by the positioning means for transporting and positioning the main winding inlet 5 sent from the main winding, the control means determines whether a stop command to the feeding means 9 and the positioning state of the main winding inlet 5 are proper. Check whether or not. When the detection means detects a displacement in the width direction of the main winding inlet 5, the control means controls the drive for moving the web transport means in the width direction.
[0080]
<Transport of inlet>
FIG. 8 is a front view showing the conveying means of the inlet 3.
[0081]
The original winding C inlet 5 conveyed by the sending-out means 9 and the conveying belts 13 and 14 is cut by the cutting means 12 to form a sheet and the inlet 3 is formed.
[0082]
The inlet 3 is transported by the transport belt 31 and is stopped at a predetermined position. If a defective portion is detected in advance in the long original winding inlet 5, the inlet 3 after the cutting process is continuously transported by the transport belt 31 to be dropped, and is located below the downstream side of the transport belt 31. The non-defective product is stored in the non-defective product storage box 32, and only the non-defective product is transported and aligned and stored in the receiving portion 35a of the tray 35.
A transmission type sensor S6 is disposed above the defective product storage box 32, and detects that the defective inlet 3 is full.
[0083]
Above the sensor S7, a transmission type sensor S7 is arranged to confirm that the defective inlet 3 has been discharged out of the transport path.
[0084]
Above the stop position of the inlet 3, a sheet conveying means having a suction means 33 for sucking the inlet 3 and a moving means 34 for moving the suction means 33 in the conveying direction is arranged.
[0085]
The suction unit 33 is formed as a unit including a plurality of suction units 331 for sucking the sheet-shaped IC inlet, a support table 332 that supports the suction unit 331, and a rotation unit 333 that drives the support table 332 to rotate.
[0086]
FIG. 9 is a plan view showing a position where a plurality of (three in the drawing) suction units 331 of the suction unit 33 suck the inlet 3.
[0087]
The plurality of suction parts 331 suck at least two positions of the arrangement position of the IC chip 3C and the protection plate 3E of the inlet 3 and the winding coil 3D.
[0088]
The moving unit 34 includes a lifting unit 341 that drives the unitized suction unit 33 up and down, and a horizontal moving unit that horizontally moves the lifting unit 341 in the transport direction along the guide rail 342.
[0089]
The inlet 3 conveyed by the conveyor belt 31 and stopped at a predetermined position is sucked by the suction unit 331 of the suction unit 33 which is lowered by the driving of the elevating unit 341, and is subsequently suction-conveyed upward by the driving up of the elevating unit 341. You. Further, the inlet 3 is horizontally rotated by 90 degrees by the rotating means 333 while being sucked by the suction section 331, and then horizontally moved in the transport direction shown by the arrow along the guide rail 342 by the moving means 34 (FIG. 11).
[0090]
FIG. 10 is a plan view illustrating conveyance of the tray 35 and the inlet 3.
The inlet 3 rotated 90 degrees by the rotating means 333 and further horizontally moved by the moving means 34 is suction-conveyed in the horizontal direction, and is a predetermined receiving part of the plurality of receiving parts 35a of the tray 35 movably installed. After reaching the upper part 35a, it is lowered by the drive of the elevating means 341 and is accommodated in the receiving part 35a and fixed. Thereafter, the suction means 33 releases the suction, moves up, and returns to the initial position by the moving means 34.
[0091]
The tray 35 has a plurality of receiving portions 35a. The receiving portions 35a are composed of, for example, fifty pieces arranged orthogonally in five rows and ten columns as shown. The number of the receiving portions 35a is not limited to the number of rows and the number of columns.
[0092]
FIG. 11A is a front view showing another embodiment of the conveying means of the inlet 3, and FIG. 11B is a plan view of the suction plate 334. Note that, with respect to the reference numerals used in FIG. 11A, parts having the same functions as those in FIG. 8 are given the same reference numerals. Further, points different from the above embodiment will be described.
[0093]
The inlet 3 is transported by the transport belt 31 and is stopped at a predetermined position.
Above the stop position of the inlet 3, a sheet conveying means having a suction means 33 for sucking the inlet 3 and a moving means 34 for moving the suction means 33 in the conveying direction is arranged.
[0094]
The suction means 33 is formed as a unit including a suction plate 334 for sucking the sheet-shaped IC inlet, a hollow chamber 335 for holding the suction plate 334, a slide shaft 336 for supporting the chamber 335, and a spring 337 for urging the chamber 335. Have been.
[0095]
The suction plate 334 is made of an elastic member, for example, silicone rubber, and has a plurality of suction holes 334a. The suction hole 334a communicates with the hollow suction chamber of the chamber 335, and further communicates with suction means such as a blower (not shown) via a suction pipe 338.
[0096]
The moving means 34 includes a horizontal moving means 344 for horizontally moving the unitized suction means 33 in the transport direction along the guide rail 343, and a vertical movement along a column 345 on which the guide rail 343 is fixed upright. And a lifting means 346 for driving.
[0097]
The inlet 3 conveyed by the conveyor belt 31 and stopped at a predetermined position is sucked by the suction plate 334 of the suction unit 33 which is lowered by the descent of the elevating unit 341, and subsequently sucked and conveyed upward by the ascent and descent of the elevating unit 341. Is done. Further, the inlet 3 is horizontally moved along the guide rail 343 by the horizontal moving means 344 in the transport direction shown by the arrow while being sucked by the suction plate 334.
[0098]
FIG. 12A is a plan view of the receiving portion 35a, and FIG. 12B is a cross-sectional view.
A needle-like projection member (movement suppressing member) 35b is protruded from the bottom of the receiving portion 35a. The protrusion member 35b penetrates through the first nonwoven fabric 3A and the second nonwoven fabric 3B of the inlet 3 housed in the receiving portion 35a, and locks the inlet 3 placed in the receiving portion 35a.
[0099]
FIG. 12C is a cross-sectional view showing another embodiment of the movement suppressing member.
A weak adhesive piece (movement suppressing member) 35c was attached to the bottom of the receiving portion 35a. The weak adhesive piece 35c weakly adheres to the first nonwoven fabric 3A or the second nonwoven fabric 3B of the inlet 3 accommodated in the receiving portion 35a, and locks the inlet 3 placed in the receiving portion 35a.
[0100]
<Lamination process>
FIG. 13 is a schematic view showing a step of bonding the first base material aggregate sheet 1A, the second base material aggregate sheet 2A, and the inlet 3.
[0101]
In the sheet-like IC inlet supply step (3), the tray 35 accommodating the plurality of inlets 3 is conveyed by conveying means (not shown) and stopped at the standby position 301.
[0102]
On the other hand, the first base material aggregate sheets 1A are taken out one by one from the storage box in the first base material supply step (1) and stopped at the standby position 101. At the standby position 101, two back surface barcodes of the first base material aggregate sheet 1A are taken out, and base material information reading means such as front and back surface detection, zero-sheet detection, and positioning detection are performed.
[0103]
Thereafter, the tray 35 located at the standby position 301 is conveyed and stopped at the take-out position 302. Almost at the same time, the first base material aggregate sheet 1A is conveyed, and the hot melt adhesive is applied in the adhesive application step (2).
[0104]
Next, the first base material aggregate sheet 1A is conveyed and stopped at a predetermined position of the intermediate station 30, and the inlets 3 in the tray 35 are sequentially sucked and held at a predetermined position on the surface of the first base material aggregate sheet 1A. And are joined.
[0105]
In the previous step, when the base material information reading unit detects that the first base material aggregate sheet 1A has a defective portion, the control unit controls the transfer of the inlet 3 corresponding to the defective information to the sheet conveying unit. The inlet 3 is supplied only to the position to be supplied based on the defect information.
[0106]
In the bonding step (6), a sheet-like first base material assembling sheet 1A on which an adhesive is applied and the inlet 3 is placed, and a web-like second base material assembling sheet 2A on which an adhesive is applied Paste.
[0107]
【The invention's effect】
According to the present invention, the following effects can be obtained.
[0108]
According to the invention as set forth in claims 1 and 2, the sheet-shaped IC inlet is interposed between the sheet-shaped first base material and the web-shaped second base material, and the IC card is stuck at an accurate position to form an IC card. Created.
[0109]
According to the third to seventh aspects of the present invention, the web-shaped IC inlet can be smoothly fed from the original winding.
[0110]
According to the eighth and ninth aspects of the present invention, the original winding can be efficiently suspended from the original winding shaft and sent out.
[0111]
According to the tenth to thirteenth aspects, it is possible to stably and smoothly feed from the original winding suspended on the original winding shaft.
[0112]
According to the present invention, the web-shaped IC inlet can be smoothly sent out and transported without damaging the web-shaped IC inlet.
[0113]
According to the invention described in claims 18 to 21, the sheet-like IC inlet can be smoothly sent out without being damaged, and can be conveyed to the cutting process.
[0114]
According to the invention described in claims 22 and 23, the web-shaped IC inlet can be stably conveyed by the control means.
[0115]
According to the inventions described in claims 23 to 25, when a defect such as dust, dust, or a scratch is generated on the surface recording of the first base material, the defect is detected and the enclosing of the sheet-shaped IC inlet is stopped. Therefore, it is possible to prevent the expensive sheet-shaped IC inlet from being discarded, which is effective for reducing the production cost.
[Brief description of the drawings]
FIG. 1 is a front view and an exploded perspective view of an IC card according to the present invention.
FIG. 2 is an exploded cross-sectional view, a cross-sectional view, and a front view of a sheet-like IC inlet of the IC card.
FIG. 3 is a schematic view showing a manufacturing process of the IC card.
FIG. 4 is a perspective view of a web-shaped IC inlet, a perspective view of a web-shaped IC inlet and a supporting means held on a flanged reel, and a perspective view showing another embodiment of a web-shaped IC inlet feeding means.
FIGS. 5A and 5B are a front view and a perspective view showing a web-like IC inlet feeding means; FIGS.
FIG. 6 is a perspective view showing a web-like IC inlet sending means.
FIG. 7 is a plan view of a conveyance belt and a sheet-shaped IC inlet, a cross-sectional view of a conveyance guide plate and a sheet-shaped IC inlet, and a plan view of a web-shaped IC inlet detecting means.
FIG. 8 is a front view showing a sheet IC inlet conveying means.
FIG. 9 is a plan view showing positions of a plurality of suction portions of the suction means and a sheet-like IC inlet.
FIG. 10 is a plan view showing conveyance of a tray and an inlet.
FIG. 11 is a front view showing another embodiment of the inlet conveying means, and a plan view of a suction plate.
FIG. 12 is a plan view and a sectional view of a receiving portion.
FIG. 13 is a schematic view showing a step of bonding a first base material, a second base material, and a sheet-like IC inlet.
[Explanation of symbols]
1 First substrate (top sheet)
1A First base material assembly sheet
2 Second base material (back sheet)
2A Second base material assembly sheet
3 sheet IC inlet (inlet)
3A First nonwoven fabric
3B Second nonwoven fabric
3C IC chip
3D winding coil (antenna)
3E Protection plate
5 Web-shaped IC inlet (source winding inlet)
10 Web transport means
101 Standby position
11 Static elimination means
12 Cutting means (cutter unit)
13, 14 conveyor belt
15, 16 suction means
17 Transport guide plate
18A, 18B detecting means
30 Intermediate station
301 Standby position
302 Removal position
31 Conveyor belt
33 suction means
34 Transportation
35 trays
35a receiving part
35b Projection member (movement suppressing member)
35c weak adhesive piece (movement suppressing member)
A IC card

Claims (24)

A method of manufacturing an IC card in which a sheet-like IC inlet composed of an IC chip and a coil wound in a web is interposed between a first base material and a second base material and bonded to each other,
A web-shaped IC inlet is sent out by a sending-out means from an original winding in which a long web-shaped IC inlet in which a plurality of the sheet-shaped IC inlets are formed in a continuous shape is sent out,
The web-shaped IC inlet sent from the sending means is transported by web transport means and stopped at a predetermined position,
The web-shaped IC inlet is cut to a predetermined size by cutting means,
A plurality of the sheet-shaped IC inlets cut into sheets are gripped by sheet conveying means, positioned in a tray, and aligned and placed,
Gripping one sheet-like IC inlet arranged in the tray and transporting the sheet-like IC inlet to predetermined positions of the first base material and the second base material;
An IC card manufacturing method, characterized in that the sheet-shaped IC inlet is interposed between the first base material and the second base material and bonded by a bonding means. An IC card manufacturing apparatus for bonding a sheet-shaped IC inlet including an IC chip and a coil wound in a web between a first base material and a second base material, and bonding the sheet-shaped IC inlet,
An original winding in which a web-shaped IC inlet in which a plurality of the sheet-shaped IC inlets are formed in a continuous elongated shape is wound in a roll shape;
An original winding shaft for suspending the core of the original winding,
Sending means for sending out the web-shaped IC inlet from the main winding;
Web transport means for transporting the web-shaped IC inlet sent from the sending means and stopping at a predetermined position;
Cutting means for cutting the web-shaped IC inlet to a predetermined size;
A tray for accommodating the cut sheet-shaped IC inlets in a plurality of receiving portions and aligning and placing the sheet-shaped IC inlets;
Sheet conveying means for gripping the plurality of cut sheet-shaped IC inlets and conveying the sheet-like IC inlet into the tray for positioning;
Tray moving means for moving the tray,
Sticking means for holding the sheet-shaped IC inlet aligned in the tray, transporting the sheet-shaped IC inlet to a predetermined position of any one of the first base material and the second base material, and bonding
An IC card manufacturing apparatus, comprising: 3. The IC card manufacturing apparatus according to claim 2, wherein the original winding is held by a flanged reel, and the reel is rotatably supported by an original winding shaft provided on the apparatus main body side. The core of the original winding is rotatably supported by a main winding shaft provided on the apparatus main body side, and the reel is rotatable by a driving unit that contacts an outer peripheral portion of the flange. The IC card manufacturing apparatus according to claim 2. The core of the original winding is rotatably supported by a main winding shaft provided on the apparatus main body side, and the core is rotatable by driving means connected to the main winding shaft provided on the apparatus main body side. 4. The IC card manufacturing apparatus according to claim 2, wherein: The IC card manufacturing apparatus according to claim 2, wherein the winding form of the original winding is wound around the winding core such that the web-shaped IC inlet is on the front side. The main winding shaft is exchangeably disposed at a plurality of locations, and when the web-shaped IC inlet is being fed by the feeding means from a main winding suspended on one of the main winding shafts, the other main winding shaft is 3. The IC card manufacturing apparatus according to claim 2, wherein the subsequent main winding is suspended to be in a standby state. 8. The IC card manufacturing apparatus according to claim 2, wherein a static eliminator is disposed near a feed portion of the main winding suspended on the main winding shaft. 3. The method according to claim 2, wherein a driving rotation of the feeding unit that rotates while contacting the reel holding the original winding is controlled so as to be synchronized with a transport speed of the web transport unit provided on a downstream side. The IC card manufacturing apparatus according to any one of claims 1 to 4. 3. The device according to claim 2, wherein the feeding means of the main winding held on the main winding shaft provided on the apparatus main body side is controlled so as to synchronize with the transfer speed of the web transfer means provided on the downstream side. 7. The IC card manufacturing apparatus according to any one of claims 1, 5, and 6. The web-shaped IC inlet is loosened between the feeding means for feeding the web-shaped IC inlet from the main winding and the web feeding means for feeding the web-shaped IC inlet sent from the feeding means and stopping at a predetermined position. 3. The IC card manufacturing apparatus according to claim 2, wherein a free loop is formed. The sending means for rotating the reel, or the sending means connected to the original winding shaft, detects a buffer amount of a free loop for loosening the web-shaped IC inlet by a detecting means, and detects a buffer amount of the web transport means provided on the downstream side. 7. The IC card manufacturing apparatus according to claim 2, wherein the IC card manufacturing apparatus is controlled so as to synchronize with a transport speed. 3. The IC card manufacturing apparatus according to claim 2, wherein the web transport unit has a transport belt and a suction unit. 3. The IC card manufacturing apparatus according to claim 2, wherein the web transport unit has a transport roller driven by a servomotor and a suction unit. 3. The IC card manufacturing apparatus according to claim 2, wherein the web transport means has a concave portion in the transport guide plate so as not to contact an IC chip portion of the web-shaped IC inlet. 3. The IC card manufacturing apparatus according to claim 2, wherein the transport belt having the suction means of the web transport means does not suck the IC chip portion of the sheet-like IC inlet. A sheet conveying unit that conveys the sheet-shaped IC inlet cut into sheets by the cutting unit to a predetermined position on the tray; a suction unit that sucks the sheet-shaped IC inlet; and a suction unit that moves the suction unit in a conveying direction. 3. The IC card manufacturing apparatus according to claim 2, further comprising a moving means for moving. 18. The IC card manufacturing apparatus according to claim 2, wherein the suction unit suctions at least two positions of an IC chip arrangement position of the sheet-like IC inlet and a winding coil. 3. The IC according to claim 2, wherein a movement suppressing member is arranged in a receiving portion of the tray, and the sheet-shaped IC inlet accommodated in the receiving portion is locked in the receiving portion by the movement suppressing member. Card manufacturing equipment. The IC card manufacturing apparatus according to claim 2, wherein the tray has a plurality of receiving portions, and each of the receiving portions can accommodate the cut sheet-shaped IC inlet. . An IC card manufacturing apparatus for bonding a sheet-shaped IC inlet including an IC chip and a coil wound in a web between a first base material and a second base material, and bonding the sheet-shaped IC inlet,
An original winding in which a web-shaped IC inlet in which a plurality of the sheet-shaped IC inlets are formed in a continuous elongated shape is wound in a roll shape;
Sending means for sending out the web-shaped IC inlet from the main winding;
Web transport means for transporting the web-shaped IC inlet sent from the sending means and stopping at a predetermined position;
Detecting means for detecting a transport direction of the protection plate integrally formed with the IC chip contained in the web-shaped IC inlet and a width direction orthogonal to the transport direction;
By detecting the position of the web-shaped IC inlet by the positioning means for transporting and positioning the web-shaped IC inlet sent from the main winding, a stop command to the sending-out means and whether or not the positioning state of the web-shaped IC inlet is proper. Control means for confirming
An IC card manufacturing apparatus, comprising: 22. The IC card manufacturing according to claim 21, wherein when the detecting means detects a displacement in the width direction of the web-shaped IC inlet, the control means controls a drive for moving the web transport means in the width direction. apparatus. An IC card manufacturing apparatus for bonding a sheet-shaped IC inlet including an IC chip and a coil wound in a web between a first base material and a second base material, and bonding the sheet-shaped IC inlet,
An original winding in which a web-shaped IC inlet in which a plurality of the sheet-shaped IC inlets are formed in a continuous elongated shape is wound in a roll shape;
Sending means for sending out the web-shaped IC inlet from the main winding;
Web transport means for transporting the web-shaped IC inlet sent from the sending means and stopping at a predetermined position;
Sheet transporting means for transporting and positioning the sheet-shaped IC inlet cut into sheets by a predetermined size into a plurality of receiving portions of a tray,
Control means for controlling the transfer of the sheet-shaped IC inlet corresponding to the defect information obtained by the base material information reading means arranged near each take-out portion of the first base material and the second base material to the web transfer means. When,
A driving unit that supplies the sheet-shaped IC inlet only to a position to be supplied based on the defect information obtained by the control unit;
An IC card manufacturing apparatus, comprising: The web transporting means is arranged upstream and downstream of the cutting means, and a determining means for determining whether the sheet-shaped IC inlet cut by the cutting means is good or bad is arranged near the web transporting means, When a defect of the IC inlet occurs, the holding of the sheet-shaped IC inlet by the sheet conveying means is stopped, and the sheet-shaped IC inlet is conveyed by a suction belt of the web conveying means disposed downstream of the cutting means. 24. The IC card manufacturing apparatus according to claim 23, wherein only the non-defective products are ejected to the outside, and the non-defective products are gripped and conveyed and aligned and accommodated in a receiving portion of the tray.

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