JP2005074936A - Device for producing laminate sheet as ic card intermediate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently carry out a cutting process for cutting, in a high quality, a rolled sheet encapsulating the IC inlets of a plurality of IC cards into a laminate sheet having a predetermined dimension. <P>SOLUTION: The laminate sheet as the IC card intermediate is produced by applying an adhesive on a first substrate sheet, placing the inlets of a plurality of IC modules on the predetermined positions, laminating a second long substrate sheet on the first substrate sheet via the adhesive to form the rolled sheet, and cutting the rolled sheet again in the predetermined dimension every first substrate sheet to produce a laminate sheet as a sheet-fed IC card intermediate. In this case, a conveying means B for the rolled sheet in an upstream side adjacent to a cutting means and a conveying means C for the rolled sheet in the downstream side are synchronized with each other in conveyance speed with respect to a conveying means A in the upstream side of the means B and with respect to the means B, respectively, by a minute speed increase torque control, and are driven so that the cut laminate sheet is minutely increased in speed immediately after cutting. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an apparatus for manufacturing a laminate sheet as an IC card intermediate body in the course of manufacturing an IC card incorporating an IC chip or an IC module inlet having an antenna or the like.

  An IC card is used to prove an individual's identity such as an employee ID card or student ID card. For example, such an IC card contains an IC unit having an IC chip and an antenna, and a face image and written information on the surface. In some cases, the back side is provided with a writing layer that can be filled in with a writing tool or the like and printed according to the card.

  As a means for producing such an IC card, means based on a heat bonding method, an adhesive bonding method and an injection molding method are known. For example, in an adhesive bonding method, an adhesive layer is formed in advance. An IC inlet having an IC chip and an antenna is placed and bonded between the upper and lower long web-like or sheet-like sheet-like base materials, and then heat and pressure are applied to the IC via an adhesive. An inlet is embedded, and then the bonded product is punched to form an IC card.

  For such IC cards, for example, for the purpose of preventing forgery and alteration, watermark printing, printing for preventing forgery and alteration such as holograms and fine patterns, etc. are employed. When applied, the printing is a precise printing used to prevent special counterfeiting and alteration, and defective printing is likely to occur. When printing failure occurs, the entire IC card that has been made through many processes is discarded, and there is a problem that costs increase.

  Therefore, as shown in Patent Document 1, such fine printing is performed in advance on one of the first base sheets in advance, and an adhesive is applied thereon to correctly place the IC inlet. The second base sheet was laminated, and after the lamination was finished, a fixed-form printing was performed on the second base sheet, and then a means for punching into each card was taken.

  As a result, the decrease in yield due to poor printing could be considerably reduced.

  Further, as also shown in Patent Document 1, the first base sheet is made into a single sheet, a plurality of IC inlets corresponding to a plurality of IC cards are placed thereon, and a second adhesive sheet is formed thereon with an adhesive. When the base sheet is laminated using a roll-shaped long roll sheet, there is an advantage that it is easier to handle than when using the second base sheet of a single wafer, and there is an advantage that the manufacturing efficiency is improved. There was an irregularity in speed balance, misalignment at the time of lamination, and generation of wrinkles due to this, and stable high quality IC cards were not necessarily produced.

In addition, the cutting means for sealing a plurality of IC inlets in the first base sheet and laminating the long base sheet 2 is cut again for each first base sheet in terms of quality and production speed. It was not always satisfactory, and the yield of IC card production in the subsequent process was sometimes lowered.
JP 2003-30618 A

  The present invention eliminates the problems and disadvantages of the prior art as described above, enables efficient production, and does not cause displacement or wrinkle between the first base sheet and the second base sheet. Improve the cutting process for cutting the laminate sheet for each base sheet so that high-quality IC cards can be produced efficiently, and stabilize the production efficiency of the laminate sheet as an intermediate of a plurality of IC cards. This is the purpose.

  This object is achieved by any one of the following technical means (1) to (9).

(1) A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and further supplied from a long roll Laminating means for laminating the second base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Transport based on roll sheet transport means for transport, detection means for detecting a sign for determining the cutting position of the roll sheet that is continuously transported, and detection signal for the sign of the roll sheet that is transported continuously Cutting means for cutting the roll sheet into a predetermined size for each first base sheet while synchronizing with the speed, and single sheet conveyance for conveying the laminated sheet that has become a single sheet An apparatus for producing a laminated sheet as IC card intermediate with stage and, a defective product collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The upstream-side roll sheet B conveying means adjacent to the cutting means performs a slightly increasing torque control on the upstream-side roll sheet A conveying means to synchronize the conveying speed, and the cutting means Immediately after cutting the roll sheet, the C conveying means for the downstream roll sheet adjacent to the sheet performs fine acceleration torque control on the B conveying means for the upstream roll sheet adjacent to the cutting means to synchronize the conveying speed. An apparatus for producing a laminate sheet as an IC card intermediate, which is driven so as to be slightly increased in speed.

(2) A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and further supplied from a long roll Laminating means for laminating the second base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Transport based on roll sheet transport means for transport, detection means for detecting a sign for determining the cutting position of the roll sheet that is continuously transported, and detection signal for the sign of the roll sheet that is transported continuously Cutting means for cutting the roll sheet into a predetermined size for each first base sheet while synchronizing with the speed, and single sheet conveyance for conveying the laminated sheet that has become a single sheet An apparatus for producing a laminated sheet as IC card intermediate with stage and, a defective product collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting means of the roll sheet uses the reference edge constituting the tip of the first base sheet as the marker and detects it with a photoelectric sensor at a position away from the reference edge by a certain distance. In addition, the second base sheet is cut into a predetermined dimension which is a normal cutting pitch interval at a position not related to the preceding first base sheet, and the first base sheet is omitted without being supplied. In the case, an apparatus for producing a laminate sheet as an IC card intermediate, which cuts into a predetermined dimension which is a normal cutting pitch interval of the second base sheet.

(3) A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a long roll. Laminating means for laminating the second base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Transport based on roll sheet transport means for transport, detection means for detecting a sign for determining the cutting position of the roll sheet that is continuously transported, and detection signal for the sign of the roll sheet that is transported continuously Cutting means for cutting the roll sheet into a predetermined size for each first base sheet while synchronizing with the speed, and single sheet conveyance for conveying the laminated sheet that has become a single sheet An apparatus for producing a laminated sheet as IC card intermediate with stage and, a defective product collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting means of the roll sheet is provided with a reference mark as the mark at a predetermined position of the first base sheet, and the reference mark is detected by an image sensor so that the reference mark is separated from the reference mark by a certain distance. In addition, the second base sheet is cut into a predetermined dimension which is a normal cutting pitch interval at a position not related to the preceding first base sheet, and the first base sheet is removed without being supplied. If it is, an apparatus for producing a laminate sheet as an IC card intermediate body, which cuts into a predetermined dimension which is a normal cutting pitch interval of the second base sheet.

(4) A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a long roll. Laminating means for laminating the second base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Transport based on roll sheet transport means for transport, detection means for detecting a sign for determining the cutting position of the roll sheet that is continuously transported, and detection signal for the sign of the roll sheet that is transported continuously Cutting means for cutting the roll sheet into a predetermined size for each first base sheet while synchronizing with the speed, and single sheet conveyance for conveying the laminated sheet that has become a single sheet An apparatus for producing a laminated sheet as IC card intermediate with stage and, a defective product collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting means has a built-in sheet clamp mechanism, and the unit of the cutting means is pulled and moved by the driving force of the roll sheet conveying means and the single sheet conveying means, so that the first base sheet is completely synchronized. An apparatus for producing a laminate sheet as an IC card intermediate, wherein the roll sheet is cut while removing the sheet.

(5) A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and further supplied from a long roll Laminating means for laminating the second base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Transport based on roll sheet transport means for transport, detection means for detecting a sign for determining the cutting position of the roll sheet that is continuously transported, and detection signal for the sign of the roll sheet that is transported continuously Cutting means for cutting the roll sheet into a predetermined size for each first base sheet while synchronizing with the speed, and single sheet conveyance for conveying the laminated sheet that has become a single sheet An apparatus for producing a laminated sheet as IC card intermediate with stage and, a defective product collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
An IC card having a built-in sheet clamping mechanism in the cutting means and cutting the roll sheet by moving the cutting means with a cylinder while taking electrical synchronization by reading the conveyance speed of the roll sheet with an encoder. An apparatus for producing a laminate sheet as an intermediate.

(6) A mounting fixing means for applying an adhesive onto the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and further supplied from a long roll Laminating means for laminating the second base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Transport based on roll sheet transport means for transport, detection means for detecting a sign for determining the cutting position of the roll sheet that is continuously transported, and detection signal for the sign of the roll sheet that is transported continuously Cutting means for cutting the roll sheet into a predetermined size for each first base sheet while synchronizing with the speed, and single sheet conveyance for conveying the laminated sheet that has become a single sheet An apparatus for producing a laminated sheet as IC card intermediate with stage and, a defective product collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting means has a built-in sheet clamping mechanism, and detects the conveyance speed of the roll sheet by the rotation speed of a contact that rotates by conveyance of the roll sheet, and the rotation speed is detected by a gear, belt drive, chain drive, cam drive, etc. An apparatus for producing a laminate sheet as an IC card intermediate, characterized in that the roll sheet is cut while being transmitted to the base of the cutting means via the wire and moved mechanically.

(7) A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and further supplied from a long roll Laminating means for laminating the second base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Transport based on roll sheet transport means for transport, detection means for detecting a sign for determining the cutting position of the roll sheet that is continuously transported, and detection signal for the sign of the roll sheet that is transported continuously Cutting means for cutting the roll sheet into a predetermined size for each first base sheet while synchronizing with the speed, and single sheet conveyance for conveying the laminated sheet that has become a single sheet An apparatus for producing a laminated sheet as IC card intermediate with stage and, a defective product collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting blade of the cutting means has a mechanism that moves in the sheet width direction with a knife blade having a blade width of 1 to 2 mm, or a mechanism that moves in the sheet width direction with a rotary blade having a blade width of 0.5 to 1 mm; An apparatus for producing a laminate sheet as an IC card intermediate, characterized in that it has a mechanism for rotating a blade, a guillotine blade having a blade width of 0.5 to 1 mm, or a press blade.

(8) A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and further supplied from a long roll Laminating means for laminating the second base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Transport based on roll sheet transport means for transport, detection means for detecting a sign for determining the cutting position of the roll sheet that is continuously transported, and detection signal for the sign of the roll sheet that is transported continuously Cutting means for cutting the roll sheet into a predetermined size for each first base sheet while synchronizing with the speed, and single sheet conveyance for conveying the laminated sheet that has become a single sheet An apparatus for producing a laminated sheet as IC card intermediate with stage and, a defective product collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting means has a built-in sheet clamping mechanism, and the distance between the cutting means blade and the roll sheet clamping position and the distance between the blade and the sheet clamping position are 0 to 5 mm, respectively. An apparatus for producing a laminate sheet as an IC card intermediate.

(9) Placement fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and further supplied from a long roll Laminating means for laminating the second base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Transport based on roll sheet transport means for transport, detection means for detecting a sign for determining the cutting position of the roll sheet that is continuously transported, and detection signal for the sign of the roll sheet that is transported continuously Cutting means for cutting the roll sheet into a predetermined size for each first base sheet while synchronizing with the speed, and single sheet conveyance for conveying the laminated sheet that has become a single sheet An apparatus for producing a laminated sheet as IC card intermediate with stage and, a defective product collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The defective sheet collecting means in the defective product collecting means guides the laminated sheet of defective products to a collection box by switching the pass line of the sheet conveying means. Manufacturing equipment.

  According to the first invention of the present invention, the roll sheet is cut into a laminate sheet having a predetermined length while being transported while maintaining an appropriate tension without being loosened and without slipping between the roll means. After that, the sheet is transported with a sufficient separation between the sheets, so that the collection of non-defective products and the removal of defective products can be performed smoothly, and a laminated sheet as an IC intermediate can be stably produced, and the IC card in the subsequent process can be collected. It has become possible to produce products in a stable and efficient manner.

  According to the second and third aspects of the present invention, the determination and detection of the cutting criterion for the roll sheet can be performed easily and accurately and stably, and the meter cutting can be performed accurately.

  According to the fourth, fifth and sixth inventions of the present invention, the cutting means holds the roll sheet sufficiently by the clamping mechanism and continuously moves the roll sheet while moving at the same speed as the conveying speed of the roll sheet. Since it can be cut while being transported, a laminate sheet as an IC intermediate is stably produced without increasing the cutting accuracy even if the production speed is increased, and the IC card in the subsequent process is stably produced with high yield. It became possible to produce.

  As a seventh invention in the present invention, in the case of adopting a means for moving the knife in the width direction of the roll sheet in the cutter of the cutting means, a means for slightly increasing the blade thickness and a means for moving the rotary blade in the width direction of the roll sheet as well. In the case of adopting it, it is possible to cut the roll sheet smoothly and accurately in a straight line without making the roll sheet wavy by operating with a thin blade thickness. In addition, when using a guillotine blade as the upper blade with respect to the lower blade, the blade thickness of the upper blade is reduced, and when using a push cutting blade that does not use the lower blade, a straight blade is cut correctly. I was able to confirm.

  As an eighth aspect of the present invention, by setting the distance between the clamping position of the roll sheet and the cutting position in the cutting means to be 5 mm or less, the flatness in the vicinity of the cutting position of the roll sheet is stably secured and the cutting is more accurate. It came to be done.

  As a ninth aspect of the present invention, it is possible to easily guide a defective laminate sheet to a collection box simply by switching the pass line of the sheet transporting means up and down, thereby reducing the space of the defective collection box. Efficient process arrangement is realized because there is no need to take a large amount.

  Hereinafter, an embodiment of a manufacturing apparatus for a laminate sheet as an intermediate body of a plurality of IC cards according to the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment.

  First, FIG. 1 is a plan view of a first base sheet in which a contour line on which an IC card is to be punched is also written, and FIG. 5 is manufactured by an apparatus for manufacturing a laminate sheet as an intermediate body of a plurality of IC cards. FIG. 5 also shows the outline of the IC card in which each IC inlet is enclosed. 2 to 4 show a finished IC card manufactured in the next step from the laminate sheet, FIG. 2 is a plan view of the IC card, FIG. 3 is a sectional view of the IC card, and FIG. It is sectional drawing of embodiment.

  The IC card is manufactured by laminating an IC inlet 3 composed of components including an IC chip 3 a and an antenna 3 b between the first base sheet 1 and the second base sheet 2 with an adhesive 4.

  The first base sheet 1 has a total thickness of, for example, 50 to 250 μm using PET as a support, and is provided with an image receiving layer on the card surface side. For example, for the purpose of preventing counterfeiting, watermark printing, holograms, strips, etc. Printing for preventing counterfeiting such as forgery, etc., or regular printing of frames, characters, symbols, etc. necessary for IC cards is performed.

  The inner surface of the card of the first base sheet 1 is subjected to an easy adhesion treatment for improving the coating property of the hot melt adhesive as the adhesive 4, and an antistatic layer is provided on both sides. The form of the first base sheet 1 is a sheet-like sheet, and the dimensions are, for example, width 200 × length 200 mm (card width 2 rows × length 3 rows can be taken) to width 500 × length 650 mm (card width 5 rows × length). 10 rows can be taken) or even larger. Further, the image receiving layer and printing defects are inspected in advance, and the position information 15A is given by a barcode or the like as shown in the plan view of FIG.

  The second base sheet 2 has a total thickness of, for example, 50 to 250 μm using PET as a support, has a writing layer on the card surface side, and is not subjected to regular printing after being bonded. Similar to the first base sheet 1, the inner surface of the card is subjected to an easy adhesion treatment for improving the coating property of the hot melt adhesive as the adhesive 4, and an antistatic layer is provided on both sides. . The form of the second base sheet 2 is a long web, and the width is preferably matched to the horizontal dimension of the first base sheet 1 or shorter by 5 to 20 mm.

  It is preferable to select a material that is small in thermal shrinkage and its variation for both the base sheet 1 and the second base sheet 2, and printing is performed with a standard print size that allows for thermal shrinkage. In addition, it is preferable that both base materials have a thickness and a configuration in which the heat shrinkage rate is the same in consideration of the difference in heat history in the manufacturing process so that curling or the like due to the difference in heat shrinkage rate does not occur. .

  The IC inlet 3 is composed of components including an IC chip 3a and an antenna 3b, and as shown in FIG. 3, both sides of the IC chip 3a and the antenna 3b of the winding are bonded and stored with a nonwoven fabric 3c. In addition, as shown in FIG. 4, the one in which the IC chip 3a is mounted on the film 3d provided with the circuit of the antenna 3b by printing, etching, or the like, and the chip part and the whole are previously sealed with resin are also used. it can.

  As the form of the IC inlet 3, a roll of a long web for one row is used. However, since there is a convex portion of the IC chip, it is preferable to wind it loosely. Moreover, the sheet-like sheet shape or long web-like shape arranged in a plurality of lengths and widths, or those cut out one by one from them can be adopted. The size when cut into one is preferably smaller than the outer shape of the card so as not to adversely affect the cutting during card punching.

  The adhesive 4 is, for example, a hot melt adhesive, and a reactive hot melt adhesive is particularly preferable. Reactive hot melt adhesive is a type of adhesive that melts and bonds the resin, then absorbs moisture and cures the resin. Later, the softening temperature increases, so it has excellent durability and is suitable for coating at low temperatures. With normal hot melt adhesives, the coating temperature is the same as the softening temperature of the resin, so the heat resistance does not exceed the coating temperature. Therefore, when high heat resistance is required, a high coating temperature is required. Become. On the other hand, since the reactive hot melt adhesive is cured after coating, the heat-resistant temperature becomes several tens of degrees Celsius higher than the coating temperature. Therefore, if the surface of the image receiving layer is a material that is easily damaged at high temperatures, the damage is reduced. be able to.

  Next, an apparatus for producing a laminate sheet as an intermediate body of such a plurality of IC cards will be described with reference to FIGS. 6 is a perspective view showing a flow of a manufacturing process of a laminate sheet 100 as an intermediate body of an IC card and a manufacturing process of an IC card following the downstream side, FIG. 7 is a diagram showing a structure of heating and heating, FIG. Fig. 9 is a view showing the structure of pressurizing with a conveyor, Fig. 9 (a) is a cross-sectional view showing the structure of an uncoated portion of a roll-shaped laminate sheet, and Fig. 9 (b) is an enlarged view of a portion surrounded by a circle in Fig. 9 (a). FIG. 10 and FIG. 10 are views showing the plate mounting structure.

  In the supply process A of the first base sheet 1, the sheets are separated and fed one by one from the stacked sheets. The level of the upper surface of the sheet is detected and maintained at a constant height, and is held and taken out by the suction pad. In this case, it is preferable to have a mechanism that removes static electricity, blows air between layers, scrapes off with a nail or the like, and raises the suction pad at the same time as suction, so as to ensure separation of one sheet.

  Further, it is preferable that the number of loading apparatuses is two, and the line is automatically stopped when one of them disappears and the line is not stopped.

  In the adhesive application process B to the first base sheet 1, a hot melt adhesive is applied to the first base sheet 1 with a predetermined thickness. As a coating method, a normal method such as a die method, a gravure method, or a roll method can be adopted, but the die method is preferable in the following points.

  In the die method, since the adhesive is sealed until it is applied to the first substrate sheet, temperature control is easy even at a high temperature such as a hot melt adhesive. It is advantageous because it does not come into contact with the outside air. Moreover, no foreign matter is mixed in and bubbles are hardly generated.

  In addition, the coating amount is determined by the pump feed amount and the first base sheet speed, and since there is little change in the liquid physical properties such as viscosity, it is advantageous for ensuring the coating thickness accuracy.

  The adhesive dissolved in the heating tank is fed to the die through a hose by a pump, and is discharged from the slit outlet 10 a of the die 10. It is preferable to heat the hose and the die so as to keep the temperature constant. The pump feed amount is determined by the pump volume, the rotation speed, and the feed efficiency associated with the pressure loss, and the coating thickness is further determined by the gap between the tip of the die called the lip and the first substrate 1 and the substrate speed. In the case of a reactive hot melt adhesive, it is preferable to purge the heating tank or the like with dry air or nitrogen.

  The first base sheet 1 is a single sheet, and is generally coated on a table, but the long sheet web is used in the present invention by holding the single sheet on a roll. A coating method is preferred in the same manner as described above. As a method for holding the first base sheet 1, there is a method of gripping and holding the head, tail and both edges of the base sheet 1, but a method of sucking and holding the entire base sheet by the suction roll 11 is a single wafer. This is preferable because the margin of the outer edge of the sheet is small and the yield is good. The base sheet sent one by one is positioned, set on a roll at a constant pitch, and coated.

  In addition, it is preferable that the coating is intermittently performed while avoiding the head and tail of the sheet. Intermittent coating is performed by turning on / off the pump that feeds the adhesive to the die or turning on / off the valve provided on the die to temporarily stop the discharge of the adhesive. Since the response is delayed, the valve method is preferable. In that case, the coating thickness tends to increase due to the accumulation of the pump pressure at the top of the coating. Therefore, the pressure is accumulated by using a pump ON / OFF together or by providing a circuit that returns the adhesive to the heating tank. It is preferable to prevent this. Also, at the end of coating, even if the valve is turned off, the adhesive remaining at the tip of the die is pulled out and may adhere to the base material. Therefore, when turning off the valve generally called suck back, the adhesive is put into the die. It is preferable to employ a retracting valve mechanism. Further, it is preferable to rotate the roll at a constant speed at least during coating.

  In the IC inlet supply step C, an intermediate station 20 is provided before placing on the first base sheet 1, the IC inlet 3 is disposed here, and these are moved while adsorbed and held together. The adhesive is applied and placed on the first base sheet 1 conveyed at a constant speed in synchronization. The IC inlets 3 are positioned one by one before being taken out from the intermediate station 20, but it is more preferable to position the first base sheet 1 with reference to edges and printing.

  When placing in the intermediate station 20, based on the reading of the defect position information given to the first base sheet 1 as shown in FIG. To do. If there is no defect information, the IC inlet 3 is fed out from the roll winding and cut and sent to the intermediate station 20 in sequence, but if there is defect information, the feeding is stopped at the corresponding timing of only the corresponding column. . Capability is improved by arranging a plurality of rolls and simultaneously processing them in multiple rows. In addition, it is preferable that the defective IC inlet that is known in advance is removed before being placed on the first base sheet 1 or is removed after imparting defect information to the first base sheet 1.

  In addition, as another means, it is conceivable that a tray-like jig on which the IC inlets 3 are arranged is loaded, held by suction from there, and placed on the first base material 1. However, in order to stop the supply of the defective portion, it is necessary to take measures such as not placing the defective portion in advance at the corresponding position of the tray, not sucking and holding the tray, and removing it before sucking and holding.

  When placing the IC inlet 3 on the first base sheet 1, as described above, the first base sheet 1 is synchronized with the base sheet to be transported at a constant speed without taking any means for temporarily stopping it. It is necessary to place it. In addition, it is preferable to place the IC chip while squeezing from one side so that air does not enter, or to place the convex part of the IC chip into the hot melt adhesive. Furthermore, it is preferable to maintain the fluidity and tackiness by heating and keeping the hot melt adhesive by heating and keeping means 21 such as a heater before placing.

  As a conveying means between the supply of the first base sheet 1 and the laminating, a means using a suction conveyor, a suction holding moving means, a tray jig moving means, and the like can be considered.

  In the supplying process D of the second base sheet 2, a long web wound in a roll shape is fed out. In this feeding, the tension and edge position are detected and controlled to be constant.

  Moreover, it is preferable to use two sets of feeding devices, further provide an accumulator, and replace and join the windings without stopping the line.

  In the adhesive coating process E on the second base sheet 2, the die base is used in the same manner as the first base sheet 1, and the second base sheet 2 held on the roll 30 is continuously held by the die 31. Or apply intermittently.

  The coating thickness is preferably the same as the coating thickness of the first base sheet 1 so as not to cause curling due to imbalance between the card front and back surfaces, and further, the first base sheet 1 and the second base sheet. 2 or more preferably in consideration of asymmetry due to the IC inlet 3.

  The second base sheet 2 is a long web and can be continuously coated. However, the second base sheet 2 is intermittently applied to the first base sheet 1 that is a single-wafer sheet, and then cut into a sheet after being laminated. It is preferable that the position to be coated be uncoated because adhesion of the adhesive to the blade can be prevented. A reactive hot melt is particularly preferable because it does not cure immediately.

  In the laminating step F, the first base sheet 1 in the form of a single wafer sheet on which the adhesive is applied and the IC inlet 3 is placed, and the second base sheet 2 on which the adhesive is applied are transferred by rolls 30 and 40. Nip and stick together. Secondly, the nip roll 30 may be used as a roll for coating the base sheet 2 or may be provided separately.

  The nip rolls may be metal-to-metal or rubber-coated, and the total thickness may be adjusted or the IC inlet embedded in the adhesive by setting the gap of the nip roll, pressing force setting, or a combination thereof. Improve smoothness.

  Therefore, it is preferable that the hot melt adhesive is heated and kept warm by the heating and warming means 41 immediately before the first base sheet 1 and the second base sheet 2 are bonded together, but the surface of the base material is easily damaged by the high temperature. Therefore, as shown in FIG. 7, on the hot melt adhesive side, the control unit 42 drives the heat and heat retaining means 41 such as an infrared heater based on the hot melt adhesive temperature information of the temperature sensor S1, and heats and maintains the temperature. On the other hand, the base sheet side circulates a heat medium in the roll 30 via a temperature controller 43, and the controller 44 controls the temperature controller 43 based on the roll temperature information of the temperature sensor S2 and the heat medium temperature information of the temperature sensor S3. It is preferable to keep the temperature so as not to exceed a certain temperature (for example, 60 ° C.) by driving.

  The first base sheet 1 in the form of a single sheet is fed at a constant pitch and bonded to the second base sheet 2, and this pitch is such that the conveyor pitch and the card pitch in the subsequent process always match. The integer multiple of the card pitch is preferable. Moreover, it is preferable to provide a minimum interval between the first base sheets 1 so that no debris is generated when the sheet is cut into a sheet after being bonded.

  In consideration of curling due to residual stress of the first base sheet 1 and the second base sheet 2 after bonding, the tension of the second base sheet 2 and the sheet of the first base sheet 1 It is preferable to set the tension.

  In the conveyor heating and pressurizing step G, the bonded product is heated and pressed for a certain period of time, thereby adjusting the total thickness and smoothness, and particularly adjusting the smoothness of the convex portions of the IC chip.

  In this conveyor heating and pressurization, the pressurization time is preferably 10 to 60 seconds, particularly preferably 20 to 30 seconds, and the applied pressure is preferably 19.6 to 98 kPa, particularly 39.2 to 58.8 kPa. The heating temperature is preferably 50 to 100 ° C., particularly 50 to 70 ° C., since it can prevent adverse effects on the image receiving layer, but is appropriately determined depending on the physical properties of the adhesive, the pressure resistance of the IC chip, the heat resistance of the surface of each substrate sheet, and the like. be able to.

  Further, as shown in FIG. 8, the pressurization is performed by a conveyor 51 in which a plate 50 sandwiching the upper and lower sides of the bonded product of the first base sheet 1 and the second base sheet 2 circulates.

  Since the plate 50 has insufficient rigidity due to thickness restrictions, it is preferable that the plate 50 be backed up by the receiving roller 52 to compensate.

  Ideally, the gap between the plates 50 should be zero, but this is not possible in reality, and the gaps cannot be pressurized, convex, and poor in smoothness, so this part does not appear on the card product. Thus, as shown in FIG. 9, it is preferable to make the conveyance direction pitch of the plate 50 the same as the pitch of the card size of the IC card.

  Furthermore, the thickness accuracy can be improved by intentionally setting the interval so that excess adhesive flows into the lost interval portion.

  Further, as another countermeasure, as shown in FIG. 8, it is conceivable to provide an endless belt 53 on the outer side of the conveyor 51 in which the plate 50 circulates. The endless belt 53 corresponds to A conveying means described later.

  In addition to applying a constant load by a hydraulic cylinder or the like, a method of pressing may be a method of fixing a gap (gap) between the upper and lower plates sandwiching the bonded product. In this case, the conveyor outlet 54a is connected to the conveyor. It is preferable to prevent a large pressure from being applied to the IC chip at the inlet by gradually widening the inlet 54b side.

Further, as a method of attaching the plate 50 to the chain of the conveyor 51 in order to circulate the plate 50, there are those shown in FIGS. 10 (a), 10 (b) and 10 (c). As shown in FIG. Is fixed to the chain 60 by the plate support shaft 61, the plate 50 that circulates while being pressurized starts to sandwich the bonded product 70 at the conveyor entrance and when it is opened at the exit, the plate 50 is linear. Circulates in the shape of a curve (arc), part 50a, 50b of the plate 50 jumps over the conveying line, causing excessive pressure on the bonded product 70 or causing damage. . It can be mitigated by increasing the curvature, but it is difficult to eliminate the effect.

  For this reason, as shown in FIG. 10B, it is preferable that the plate 50 is rotatably supported with respect to a plate support shaft 62 parallel to the drive shaft of the conveyor 51 provided in the chain 60. In this embodiment, the plate 50 that circulates while being pressurized rotates around the plate support shaft 62 and escapes from the conveyance line, and excessive pressure or local damage is not applied to the bonded product 70. . Further, the sandwiched portion can be backed up and pressurized by the receiving roller 52.

  Further, as shown in FIG. 10 (c), the upper conveyor 51a and the lower conveyor 51b constituting the conveyor are shifted in the transport direction, and the lower conveyor 51b on the side where the entrance of the conveyor is located downstream is a plate. The upper conveyor 51a is supported by the plate support shaft 62 at the leading end of the plate 50, and the rear conveyor side of the plate 50 is supported by the plate support shaft 62 at the upstream side. In this embodiment, as long as the plate 50 that circulates while being pressed sandwiches the bonded product 70, the plate 50 does not jump out of the conveyance line, and locally excessive pressure is applied to the bonded product 70. It won't be damaged or scratched.

  Further, as a heating method, there are a method of directly heating the plate 50 with infrared rays or a method of conducting conductive heating with a heater, but the method of providing the conveyor 51 in an atmosphere in which hot air is blown and circulated has a stable temperature.

  In the conveyor cooling and pressing step H, since it is likely to be deformed at a high temperature immediately after heating and pressurization, smoothness may be deteriorated with the passage of time due to residual stress, and thus cooling is preferable. Although there is also a method using only cooling air, it is more preferable to cool while pressurizing with the conveyor 61 as in the case of heating and pressurizing.

  Pressurization is performed in the same manner, and cooling is performed by blowing and circulating outside air or cold air instead of hot air.

  The adhesive coating on the first base sheet 1 and the second base sheet 2 is performed in the adhesive coating process B and the adhesive coating process E, but in the conveyor heating and pressing, the unevenness is averaged. Although it is possible, it is difficult to correct the one with an excessive average thickness. For this reason, as shown in FIG. 9, as a countermeasure, it is preferable to provide a non-coating portion 70 at a position corresponding to the outside of the card punching outline at the time of coating so that excess adhesive flows therein. .

  A part of the die slit outlet may be blocked to discharge the adhesive, and uncoated parts may be provided at wide intervals, or the adhesive may be discharged intermittently from the die, leaving the uncoated part in the transport direction. You may provide, and you may provide the non-coating part of both of them. The pitch of the uncoated portion is preferably one card, but may be thinned out every few cards.

  Furthermore, it is more preferable that this non-coated part is a gap penetrating the outside air in the bonded product because the gas generated during the reaction of the reactive hot melt can be released.

  In the sheet cutting step I, it is inappropriate to take up the laminated product of the first base sheet 1 and the second base sheet 2, so this is avoided and the sheet is cut in units of the first base by the cutting means 80. Cut into shapes. The cutting is preferably performed without bending the bonded product. And while conveying the roll sheet 15 continuously at a high conveyance speed, it is necessary to cut efficiently in a state free from wrinkles and sagging in synchronization therewith.

  Therefore, as shown in the perspective view of FIG. 6 and the perspective view of FIG. 12, the upstream-side roll sheet B conveying means 70 adjacent to the cutting means 80 is a further upstream-side roll sheet A-conveying means. The endless belt 53 is subjected to slight acceleration torque control to synchronize the conveyance speed, and the roll sheet C conveyance means 90 on the downstream side of the cut means 80 is adjacent to the cut means 80 and is located upstream. Slightly increasing torque control is performed on the B conveying means 70 of a roll sheet to synchronize the conveying speed, and immediately after the roll sheet is cut, the single-layer laminate sheet 16 is driven to be slightly increased and separated. That is, the B conveying means 70 has a driving roller 71 and a driven roller 72 wound around an endless belt 73, and the driving roller 71 is coaxially adjusted to be slightly increased with respect to the A conveying means 53. A fast torque motor 78 is directly connected. The driving roller 71 and the driven roller 72 are set with pressure-bonding rollers 75 and 76 via the endless belt 73, and the roll sheet 15 is driven and conveyed.

  Similarly, in the C conveying means 90, an endless belt 93 is wound around a driving roller 91 and a driven roller 92, and the driving roller 91 is coaxially adjusted to be slightly increased with respect to the B conveying means 70. A fast torque motor 98 is directly connected. A pressure roller 96 is set on the driven roller 92 via the endless belt 73, and the roll sheet 15 and the cut laminate sheet 16 on the endless belts 73 and 93 are conveyed and driven.

  In this way, the roll sheet 15 is not always slackened, and does not slip between the B conveying means 70 and the C conveying means 90 while being transported while maintaining an appropriate tension. Since the sheet is cut and transported with a sufficient separation between the sheets, the accumulation of non-defective products and the elimination of defective products are performed smoothly, and a laminate sheet as an IC intermediate is stably produced, and the post-process IC card can be produced stably with high yield.

  Then, as shown in FIG. 11A, a reference edge constituting the tip portion of the first base sheet 1 is used as means for cutting the single base sheet 1 into a single laminate sheet 16 by the cutting means 80. By detecting 1A as a marker and detecting it with a photoelectric sensor (not shown), the first edge 1A is separated from the reference edge 1A by a certain distance and at a position not related to the preceding first base sheet 1. Two base sheet 2 is cut into a predetermined dimension which is a normal cutting pitch interval. Then, as shown in FIG. 11B, when the first base sheet 1 is omitted without being supplied, it is cut into a predetermined dimension which is a normal cutting pitch interval of the second base sheet 2. Resulting in.

  Then, the former non-defective product is accumulated in the stacking device 120 following the roll sheet C conveying means 90, and the latter defective product is rejected by the gate 111 which is switched up and down halfway following the roll sheet C conveying means 90. It is collected in the non-defective product collection box 110.

  The cutting means for the roll sheet is provided with a reference mark 1B instead of the reference edge IA at the tip as a mark at a predetermined position of the first base sheet, and the reference mark 1B is detected by an image sensor (not shown). By cutting the second base sheet into a predetermined dimension that is a normal cutting pitch interval at a position apart from the reference mark by a certain distance and at a position not related to the preceding first base sheet, In addition, when the first base sheet 1 is removed without being supplied, the first base sheet 1 is cut to a predetermined dimension which is a normal cutting pitch interval of the second base sheet. In this case, the non-defective product and the defective product are processed in the same manner as described above.

  As shown in FIG. 12 which is a perspective view of the cutting means 80 for cutting out the sheet laminate sheet 16 from the roll sheet 15 which is a roll-shaped laminate sheet and FIG. 13 which is a partially enlarged view thereof, the cutting means 80 is based on the base. A seat clamp mechanism 87 that can be moved up and down on a table 81 and a knife blade 83 that is attached to a block 84 that can reciprocate in the horizontal width direction are built in. The base 81 is guided by a guide rail 82 by a cylinder 86. The top is reciprocable in the conveying direction of the roll sheet 15. At this time, the cutting means 80 is moved at the same speed as that of the roll sheet 15 by the cylinder 86 while being electrically synchronized by reading the conveyance speed of the roll sheet 15 by the encoder 79, and a plurality of sheets of the sheet clamp mechanism 87 are also provided. The clamp pad 87A approaches from both above and below to clamp the roll sheet 15. As a result, the roll sheet 15 is cut into a single laminate sheet 16 with a predetermined size. At the time of the cutting, as shown in detail in FIG. 14, the knife blade 83 mounted on the block 84 slides on the two guide bars 85 by the cylinder power (not shown) and cuts across the roll sheet 15. As soon as it is finished, it is quickly restored to its original position, and the clamp pad 87A is also restored after the clamp is released. After confirming the restoration, the base 81 is slid on the guide rail 82 by the cylinder 86 and returned to the original position. Then, the above operation is repeated again by the next cutting position signal.

  As another embodiment, instead of the encoder 79 in the cutting means 80, the conveyance speed of the roll sheet 15 is detected by the rotation speed of the contact 75A that rotates by conveyance of the roll sheet 15. The rotational speed is transmitted to the base 81 of the cutting means 80 via a gear, belt drive, chain drive or cam drive, etc. by connecting a clutch (not shown), and the base 81 is transferred to the guide rail 82. A series of cutting operations by moving along the roll, cutting the roll sheet 15 with the knife blade 83 or the like while mechanically synchronizing, releasing the clutch after the cutting is completed, and returning the base 81 to the original position. Can be completed.

  As another embodiment, in the cutting means 80, a one-way clutch directly connected to the pressure rollers 75 and 76 in the B conveying means 70 of the roll sheet 15 or the pressure roller 95 in the C conveying means 90 of the sheet laminate sheet 16. The base 81 of the cutting means 80 is driven and moved on the guide rail 82 by the rotational driving force of the roll sheet, so that the roll sheet 15 is fully synchronized with the base 81 for each first base sheet. Can be cut. After the cutting is completed, the signal can be received and the base 81 can be quickly returned to the original position by another power such as a cylinder. The power for moving the base 81 of the cutting means 80 in the horizontal direction on the guide rail 82 can be easily achieved with small power by reducing the moving friction even if the base 81 is quite heavy. Note that the position of the encoder 79 in FIG.

  In the cutting means 80, the knife blade 83 is used as a cutter. However, instead of the knife blade 83, a disk-shaped rotary blade may be attached at that position.

  Although not shown, a so-called guillotine cutter unit that engages the upper and lower blades may be used, or a press cutting blade may be used. Any of them can be synchronized with the transport of the roll sheet 15 that is mounted on the cutting means 80 and travels when the roll sheet 15 is cut in the width direction.

  The cutting blade of the cutting means 80 has a mechanism that moves in the sheet width direction with a knife blade having a blade width of 1 to 2 mm, or moves in the sheet width direction with a rotary blade that has a blade width of 0.5 to 1 mm. Using a mechanism and a mechanism that rotates the blade, or a guillotine blade having a blade width of 0.5 to 1 mm, or using a press-cutting blade may cause chatter on the cutting edge and cause the cutting line to wavy. This makes it possible to cut with the correct straight cut.

  Although not shown, when collecting defective products, a defective laminate sheet 16 can be easily placed in the collection box 110 simply by providing a gate 111 at a part of the downstream portion of the pass line of the sheet transporting means and switching it up and down. It becomes possible to guide, and the space for the defective product collection box is not taken up at all, and an efficient process arrangement can be achieved.

  In addition, as shown in the cross-sectional view of FIG. 9, the cutting position is set at an interval provided between the first base sheets 1 at the time of bonding so that there is no waste for each first base sheet 1. It is necessary to be a non-coated part. Since the non-coated part has no adhesive, it does not adhere to the blade.

  Laminate sheet stacking device 120 (stacking and storing step J) stacks a predetermined number of cut sheets. Insert a metal plate 131 such as SUS at intervals of 1 to 10 sheets of laminated sheet 16 which is a bonded product of the first base sheet 1 and the second base sheet 2, and the unevenness of the bonded product itself is added. It is preferable to prevent the smoothness from being inhibited. The supply of the metal plate 131 such as SUS from the stacking device 130 can be performed by the same method as in the case of the first base sheet 1 although there is a difference in rigidity.

  Moreover, it is preferable that the stacking device 120 for the laminated sheet 16 as a bonded product and the stacking device 130 for supplying the metal plate 131 such as SUS are of two types and can be switched without stopping the line. In addition, when a reactive hot melt adhesive is used, the laminate sheet 16 integrated with the metal plate 131 such as SUS is preferably stored under air-conditioned conditions for about one week necessary for the reaction. The air conditioning conditions and the storage period can be appropriately determined according to the adhesive specifications and the like.

  Now, in the card forming process K which is a subsequent process of the manufacturing apparatus of the present invention, the laminate sheet 16 which is a bonded product of the first base sheet 1 and the second base sheet 2 is used as a reference for the first base sheet 1. Using the edge 1A or the printed reference mark 1B as a reference, the first to fourth sides are cut to a predetermined size, and then the standard printing is performed on the second base sheet 2 side by the printing machine 141, and the punching machine 142 is used. 1 and 5 are punched into an IC card based on the punching reference mark 1M shown in FIGS. The regular printing on the second base sheet 2 side may be printed for each card after punching.

It is a top view of the laminate sheet as an IC card intermediate body in which a plurality of IC module inlets are enclosed. It is a top view of an IC card. It is sectional drawing of an IC card. It is sectional drawing of other embodiment of an IC card. It is a top view of the 1st base sheet which shows the position of the defect information bar code attached to the 1st base sheet. It is a perspective view which shows the manufacturing apparatus of the laminate as an intermediate body of an IC card. It is a figure which shows the structure of heating and heating. It is a figure which shows the structure pressurized by a conveyor. (A) is sectional drawing which shows the structure of the uncoated part of a roll-shaped laminate sheet, (b) is an enlarged view of the part enclosed by the circle of (a). It is a figure which shows the attachment structure of a plate. It is a figure which shows the position which cuts out the sheet laminate sheet from the roll sheet which is a roll-shaped laminate sheet. It is a perspective view of the cutting means which cuts out the sheet laminate sheet from the roll sheet which is a roll-shaped laminate sheet. FIG. 13 is a partially enlarged perspective view of FIG. 12. It is a partially expanded perspective view which removed the clamp apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st base sheet 1A Reference edge 1B Reference mark 2 2nd base sheet 3 IC inlet 4 Adhesive 15 Roll sheet 16 Laminate sheet (sheet-fed)
53 Endless belt (A conveying means)
70 B Conveying means 71, 91 Drive rollers 72, 92 Driven rollers 73, 93 Endless belts 75, 76, 96 Pressing rollers 75A Contacts 78, 98 Slightly increasing torque motor 79 Encoder 80 Cutting means 81 Base 82 Guide rail 83 Knife blade 84 Block 85 Guide bar 86 Cylinder 87 Clamping mechanism 87A Clamp pad 90C Conveying means 100 Laminate sheet manufacturing apparatus as IC card intermediate body 110 Defective product collection box 111 Gate 120 Laminate sheet stacking apparatus 130 Metal plate stacking apparatus A 1st Supply process of base sheet 1 B Adhesive application process to first base sheet 1 C IC inlet supply process D Supply process of second base sheet 2 E Adhesive application process to second base sheet 2 F Lamination process G Conveyor heating pressurizer H conveyor cooling pressurizing step I a sheet cutting step J integrated storage step K cards step

Claims (9)

A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a second roll supplied from a long roll A laminating means for laminating the base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll for transporting a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Synchronizes with the conveying speed based on the sheet conveying means, the detecting means for detecting the sign for determining the cutting position of the continuously conveyed roll sheet, and the detection signal of the sign of the continuously conveyed roll sheet Cutting means for cutting the roll sheet into a predetermined dimension for each first base sheet while taking the sheet, and sheet-fed sheet conveying means for conveying the laminated sheet as a sheet An apparatus for producing a laminated sheet as IC card intermediates having a defective article collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The upstream-side roll sheet B conveying means adjacent to the cutting means performs a slightly increasing torque control on the upstream-side roll sheet A conveying means to synchronize the conveying speed, and the cutting means Immediately after cutting the roll sheet, the C conveying means for the downstream roll sheet adjacent to the sheet performs fine acceleration torque control on the B conveying means for the upstream roll sheet adjacent to the cutting means to synchronize the conveying speed. An apparatus for producing a laminate sheet as an IC card intermediate, which is driven so as to be slightly increased in speed. A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a second roll supplied from a long roll A laminating means for laminating the base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll for transporting a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Synchronizes with the conveying speed based on the sheet conveying means, the detecting means for detecting the sign for determining the cutting position of the continuously conveyed roll sheet, and the detection signal of the sign of the continuously conveyed roll sheet Cutting means for cutting the roll sheet into a predetermined dimension for each first base sheet while taking the sheet, and sheet-fed sheet conveying means for conveying the laminated sheet as a sheet An apparatus for producing a laminated sheet as IC card intermediates having a defective article collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting means of the roll sheet uses the reference edge constituting the tip of the first base sheet as the marker and detects it with a photoelectric sensor at a position away from the reference edge by a certain distance. In addition, the second base sheet is cut into a predetermined dimension which is a normal cutting pitch interval at a position not related to the preceding first base sheet, and the first base sheet is omitted without being supplied. In the case, an apparatus for producing a laminate sheet as an IC card intermediate, which cuts into a predetermined dimension which is a normal cutting pitch interval of the second base sheet. A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a second roll supplied from a long roll A laminating means for laminating the base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll for transporting a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Synchronizes with the conveying speed based on the sheet conveying means, the detecting means for detecting the sign for determining the cutting position of the continuously conveyed roll sheet, and the detection signal of the sign of the continuously conveyed roll sheet Cutting means for cutting the roll sheet into a predetermined dimension for each first base sheet while taking the sheet, and sheet-fed sheet conveying means for conveying the laminated sheet as a sheet An apparatus for producing a laminated sheet as IC card intermediates having a defective article collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting means of the roll sheet is provided with a reference mark as the mark at a predetermined position of the first base sheet, and the reference mark is detected by an image sensor so that the reference mark is separated from the reference mark by a certain distance. In addition, the second base sheet is cut into a predetermined dimension which is a normal cutting pitch interval at a position not related to the preceding first base sheet, and the first base sheet is removed without being supplied. If it is, an apparatus for producing a laminate sheet as an IC card intermediate body, which cuts into a predetermined dimension which is a normal cutting pitch interval of the second base sheet. A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a second roll supplied from a long roll A laminating means for laminating the base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll for transporting a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Synchronizes with the conveying speed based on the sheet conveying means, the detecting means for detecting the sign for determining the cutting position of the continuously conveyed roll sheet, and the detection signal of the sign of the continuously conveyed roll sheet Cutting means for cutting the roll sheet into a predetermined dimension for each first base sheet while taking the sheet, and sheet-fed sheet conveying means for conveying the laminated sheet as a sheet An apparatus for producing a laminated sheet as IC card intermediates having a defective article collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting means has a built-in sheet clamp mechanism, and the unit of the cutting means is pulled and moved by the driving force of the roll sheet conveying means and the single sheet conveying means, so that the first base sheet is completely synchronized. An apparatus for producing a laminate sheet as an IC card intermediate, wherein the roll sheet is cut while removing the sheet. A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a second roll supplied from a long roll A laminating means for laminating the base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll for transporting a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Synchronizes with the conveying speed based on the sheet conveying means, the detecting means for detecting the sign for determining the cutting position of the continuously conveyed roll sheet, and the detection signal of the sign of the continuously conveyed roll sheet Cutting means for cutting the roll sheet into a predetermined dimension for each first base sheet while taking the sheet, and sheet-fed sheet conveying means for conveying the laminated sheet as a sheet An apparatus for producing a laminated sheet as IC card intermediates having a defective article collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
An IC card having a built-in sheet clamping mechanism in the cutting means and cutting the roll sheet by moving the cutting means with a cylinder while taking electrical synchronization by reading the conveyance speed of the roll sheet with an encoder. An apparatus for producing a laminate sheet as an intermediate. A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a second roll supplied from a long roll A laminating means for laminating the base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll for transporting a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Synchronizes with the conveying speed based on the sheet conveying means, the detecting means for detecting the sign for determining the cutting position of the continuously conveyed roll sheet, and the detection signal of the sign of the continuously conveyed roll sheet Cutting means for cutting the roll sheet into a predetermined dimension for each first base sheet while taking the sheet, and sheet-fed sheet conveying means for conveying the laminated sheet as a sheet An apparatus for producing a laminated sheet as IC card intermediates having a defective article collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting means has a built-in sheet clamping mechanism, and detects the conveyance speed of the roll sheet by the rotation speed of a contact that rotates by conveyance of the roll sheet, and the rotation speed is detected by a gear, belt drive, chain drive, cam drive, etc. An apparatus for producing a laminate sheet as an IC card intermediate, characterized in that the roll sheet is cut while being transmitted to the base of the cutting means via the wire and moved mechanically. A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a second roll supplied from a long roll A laminating means for laminating the base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll for transporting a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Synchronizes with the conveying speed based on the sheet conveying means, the detecting means for detecting the sign for determining the cutting position of the continuously conveyed roll sheet, and the detection signal of the sign of the continuously conveyed roll sheet Cutting means for cutting the roll sheet into a predetermined dimension for each first base sheet while taking the sheet, and sheet-fed sheet conveying means for conveying the laminated sheet as a sheet An apparatus for producing a laminated sheet as IC card intermediates having a defective article collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting blade of the cutting means has a mechanism that moves in the sheet width direction with a knife blade having a blade width of 1 to 2 mm, or a mechanism that moves in the sheet width direction with a rotary blade having a blade width of 0.5 to 1 mm; An apparatus for producing a laminate sheet as an IC card intermediate, characterized in that it has a mechanism for rotating a blade, a guillotine blade having a blade width of 0.5 to 1 mm, or a press blade. A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a second roll supplied from a long roll A laminating means for laminating the base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll for transporting a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Synchronizes with the conveying speed based on the sheet conveying means, the detecting means for detecting the sign for determining the cutting position of the continuously conveyed roll sheet, and the detection signal of the sign of the continuously conveyed roll sheet Cutting means for cutting the roll sheet into a predetermined dimension for each first base sheet while taking the sheet, and sheet-fed sheet conveying means for conveying the laminated sheet as a sheet An apparatus for producing a laminated sheet as IC card intermediates having a defective article collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The cutting means has a built-in sheet clamping mechanism, and the distance between the cutting means blade and the roll sheet clamping position and the distance between the blade and the sheet clamping position are 0 to 5 mm, respectively. An apparatus for producing a laminate sheet as an IC card intermediate. A mounting fixing means for applying an adhesive on the first substrate sheet of the single wafer and semi-fixing the inlets of the plurality of IC modules at predetermined positions, and a second roll supplied from a long roll A laminating means for laminating the base sheet on the first base sheet through the adhesive while maintaining a long length, and a roll for transporting a roll sheet that is a roll-shaped laminate sheet in which a plurality of IC module inlets are enclosed Synchronizes with the conveying speed based on the sheet conveying means, the detecting means for detecting the sign for determining the cutting position of the continuously conveyed roll sheet, and the detection signal of the sign of the continuously conveyed roll sheet Cutting means for cutting the roll sheet into a predetermined dimension for each first base sheet while taking the sheet, and sheet-fed sheet conveying means for conveying the laminated sheet as a sheet An apparatus for producing a laminated sheet as IC card intermediates having a defective article collecting means for collecting the laminate sheet of defective products based on the defect information from the previous step,
The defective sheet collecting means in the defective product collecting means guides the laminated sheet of defective products to a collection box by switching the pass line of the sheet conveying means. Manufacturing equipment.

Images