JP2004303024A - Method for manufacturing ic card and device for manufacturing ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To highly precisely and inexpensively manufacture an IC card. <P>SOLUTION: In this method for manufacturing an IC card by adhering a first substrate and a second substrate through adhesive by interposing IC inlet 3 constituted of parts including an IC chip and an antenna between those substrates, and for pressurizing and carrying the adhered first substrate 1 and second substrate 2 by a conveyer 51 where a plurality of plates 50 sandwiching the first substrate 1 and the second substrate 2 are circulating, the circulation of the plates 50 is executed by a loop-shaped member 52 attached with the plates 50 with the same pitch as that of an IC card, and the dimensions of the carrying direction of the plates 50 are the same as the pitch as that of the IC card, and a driving shaft 53 of the loop-shaped member 52 is arranged at the entrance side of the conveyer 51. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method of manufacturing an IC card including an IC unit having an IC chip and an antenna, and an apparatus for manufacturing an IC card.
[0002]
[Prior art]
An IC card is used to prove the identity of an individual such as an employee ID card or a student ID card. Such an IC card incorporates an IC unit having an IC chip and an antenna, and has a face image and written information on the surface. Some have a writing layer which can be filled in with a writing instrument or the like on the back side, and are printed according to the card.
[0003]
As a method for manufacturing such an IC card, a heat bonding method, an adhesive bonding method, and an injection molding method are known. For example, in the adhesive bonding method, an upper and lower long sheet in which an adhesive layer is formed in advance is used. An IC inlet having an IC chip and an antenna is placed and bonded between web-like or sheet-like base materials, and then heat and pressure are applied to bury the IC inlet via an adhesive, Thereafter, the bonded product is punched into an IC card.
[0004]
In the manufacture of such an IC card, as a method of adjusting the thickness accuracy and smoothness of the card by applying pressure after bonding, the base material is circulated with a circulating plate from the viewpoint of productivity compared with a general flat press. There has been proposed a method of pressurizing while sandwiching and continuously transporting (for example, Patent Documents 1 and 2).
[0005]
[Patent Document 1]
JP-A-11-250218 (pages 1 to 9, FIGS. 1 to 17)
[0006]
[Patent Document 2]
JP-A-2003-030618 (pages 1 to 11, FIGS. 1 to 8)
[0007]
[Problems to be solved by the invention]
In the manufacture of such an IC card, the edge portion of the circulating plate causes scratches on the base material or cuts into the base material, adversely affecting the smoothness of the base material. To this end, the dimensions and pitch of the plate are matched with the pitch of the card so that the edge does not come into the card product part.
[0008]
As a method of circulating the plate, there is a method using a chain or the like, and the plate is attached and circulated at the same pitch as the card pitch, but for example, when the interval between the plates is widened due to elongation of the chain, a portion having poor smoothness may be. There are problems such as defective products coming to the card product section.
[0009]
In addition, a backup mechanism is provided to both support the plate and prevent bending during pressurization.However, the plate jumps out of the transport line, particularly at the front and rear ends of the backup mechanism, and this jumps out of the plate, causing a substrate scratch, Biting adversely affects the smoothness of the substrate.
[0010]
The present invention has been made in view of such circumstances, and has as its object to provide an IC card manufacturing method and an IC card manufacturing apparatus which can be manufactured with high accuracy and at low cost.
[0011]
[Means for Solving the Problems]
In order to solve the above problems and achieve the object, the present invention is configured as follows.
[0012]
According to the first aspect of the present invention, an IC inlet made of a component including an IC chip and an antenna is interposed between a first base material and a second base material, and bonded by an adhesive. In a method of manufacturing an IC card in which a plurality of plates sandwiching the first base material and the second base material are conveyed while being pressed by a circulating conveyor,
The circulation of the plate is performed by a loop-shaped member provided with the plate at the same pitch as the IC card,
The plate has the same dimension in the transport direction as the pitch of the IC card,
A method of manufacturing an IC card, wherein a drive shaft of the loop-shaped member is provided on an entrance side of the conveyor.
[0013]
According to the first aspect of the present invention, the plate has the same dimension in the transport direction as the pitch of the IC card, and the drive shaft of the loop-shaped member is at the entrance side of the conveyor. Since it is determined by the dimensions and is not affected by the elongation and accuracy of the loop-shaped member, a high-precision card product part having good smoothness can be manufactured at low cost, and the maintenance and management of the chain and the like becomes easy.
[0014]
According to a second aspect of the present invention, an IC inlet made of a component including an IC chip and an antenna is interposed between a first base material and a second base material, and bonded by an adhesive. In a method of manufacturing an IC card in which a plurality of plates sandwiching the first base material and the second base material are conveyed while being pressed by a circulating conveyor,
The circulation of the plate is performed by a loop-shaped member provided with the plate at the same pitch as the IC card,
A method for manufacturing an IC card, characterized in that adjacent portions of the first base material and the second base material are connected to each other by a connecting member having a constant distance between the plates. .
[0015]
According to the second aspect of the present invention, in a portion where the first base material and the second base material are sandwiched by the plates, the adjacent plates are connected by the connecting member having a constant interval, so that the plate is formed. The pitch is determined and the influence of the elongation and accuracy of the loop-shaped member is not affected, so that a high-precision card product part with good smoothness can be manufactured at low cost, and the maintenance of the chain and the like becomes easy. .
[0016]
According to a third aspect of the present invention, an IC inlet made of a component including an IC chip and an antenna is interposed between a first base material and a second base material and bonded by an adhesive, and after the bonding, In a method of manufacturing an IC card in which a plurality of plates sandwiching the first base material and the second base material are conveyed while being pressed by a circulating conveyor,
The circulation of the plate is performed by a loop-shaped member provided with the plate at the same pitch as the IC card,
A backup mechanism that supports the plate and receives a pressing force,
A method of manufacturing an IC card, characterized in that the start and / or the end of the backup of the backup mechanism in the transport direction are different between the upper and lower parts of the conveyor.
[0017]
According to the third aspect of the present invention, the backup mechanism is provided for supporting the plate and receiving the pressing force, and the backup direction of the backup mechanism and / or the transfer direction position at which the backup ends is different between the upper and lower sides of the conveyor. In addition, the plate does not jump out of the transfer line at the same position in the transfer direction at the front and rear ends of the backup, so that the influence can be reduced by half and the quality can be improved.
[0018]
According to a fourth aspect of the present invention, there is provided a step of bonding an IC inlet made of a component including an IC chip and an antenna between a first base material and a second base material with an adhesive, and bonding the two together. A plurality of plates sandwiching the first base material and the second base material after the step of conveying while pressurizing by a circulating conveyor,
A loop-shaped member provided with the plate at the same pitch as the IC card in the transport direction,
A drive shaft for rotating the loop-shaped member and a driven shaft,
The dimension of the plate in the transport direction is the same as the pitch of the IC card,
An apparatus for manufacturing an IC card, wherein the drive shaft is arranged on an entrance side of the conveyor, and the driven shaft is arranged on an exit side of the conveyor.
[0019]
According to the fourth aspect of the present invention, the plate has the same dimension in the transport direction as the pitch of the IC card, and the drive shaft of the loop-shaped member is on the entrance side of the conveyor. Since it is determined by the dimensions and is not affected by the elongation and accuracy of the loop-shaped member, a high-precision card product part having good smoothness can be manufactured at low cost, and the maintenance and management of the chain and the like becomes easy.
[0020]
According to a fifth aspect of the present invention, there is provided a step of bonding an IC inlet including a component including an IC chip and an antenna between a first base material and a second base material with an adhesive, and bonding the two. A plurality of plates sandwiching the first base material and the second base material after the step of conveying while pressurizing by a circulating conveyor,
A loop-shaped member provided with the plate at the same pitch as the IC card in the transport direction,
An IC card manufacturing apparatus, characterized in that, at a portion where the first base material and the second base material are sandwiched between the plates, the adjacent plates have a connecting member that connects the plates at a constant interval. .
[0021]
According to the invention as set forth in claim 5, in a portion where the first base material and the second base material are sandwiched between the plates, the adjacent plates are connected by the connecting member having a constant interval, so that the plate is formed. The pitch is determined and the influence of the elongation and accuracy of the loop-shaped member is not affected, so that a high-precision card product part with good smoothness can be manufactured at low cost, and the maintenance of the chain and the like becomes easy. .
[0022]
According to a sixth aspect of the present invention, there is provided a step of interposing an IC inlet made of a component including an IC chip and an antenna between a first base material and a second base material and bonding them with an adhesive, A plurality of plates sandwiching the first base material and the second base material after the step of conveying while pressurizing by a circulating conveyor,
A loop-shaped member provided with the plate at the same pitch as the IC card in the transport direction,
A backup mechanism that supports the plate and receives a pressing force,
An IC card manufacturing apparatus characterized in that the starting and / or ending positions of the backup of the backup mechanism in the transport direction are different between the upper and lower parts of the conveyor.
[0023]
According to the invention described in claim 6, there is provided a backup mechanism which supports the plate and receives the pressing force, and the backup direction of the backup mechanism and / or the transfer direction position at which the backup ends is different between the upper and lower sides of the conveyor. In addition, the plate does not jump out of the transfer line at the same position in the transfer direction at the front and rear ends of the backup, so that the influence can be reduced by half and the quality can be improved.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a method for manufacturing an IC card and an apparatus for manufacturing an IC card according to the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment.
[0025]
1 to 3 show an IC card manufactured by an IC card manufacturing method and an IC card manufacturing apparatus. FIG. 1 is a plan view of the IC card, FIG. 2 is a cross-sectional view of the IC card, and FIG. It is sectional drawing of other embodiment of the card.
[0026]
The IC card is manufactured by bonding an IC inlet 3 made of a component including an IC chip 3a and an antenna 3b between a first base material 1 and a second base material 2 with an adhesive 4.
[0027]
The first substrate 1 is made of PET as a support and has a total thickness of, for example, 50 to 250 μm. An image receiving layer is provided on the card surface side. For example, watermark printing, hologram, fine print, Or forgery or alteration prevention, or standard printing of frames, characters, symbols, etc. necessary for IC cards.
[0028]
The inner surface of the card of the first base material 1 is subjected to an easy-adhesion treatment for improving the coatability of a hot-melt adhesive as the adhesive 4, and antistatic layers are provided on both surfaces. The form of the first base material 1 is a sheet-like sheet, and the dimensions are, for example, 200 × 200 mm (two horizontal rows × three vertical rows are available) to 500 × 650 mm (five horizontal rows × vertical cards). 10 rows are possible), and may be even larger. In addition, defects of the image receiving layer and printing are inspected in advance, and the positional information is given by a bar code or the like.
[0029]
The second substrate 2 is made of PET as a support and has a total thickness of, for example, 50 to 250 μm. A writing layer is provided on the front surface side of the card, and the fixed-form printing is not performed after lamination. Similarly to the first base material 1, the inner surface of the card is subjected to an easy-adhesion treatment for improving the coatability of a hot-melt adhesive as the adhesive 4, and antistatic layers are provided on both surfaces. . The shape of the second substrate 2 is a long web shape, and the width is preferably adjusted to the lateral dimension of the first substrate 1.
[0030]
It is preferable to select a material having a small heat shrinkage and its variation for both the first base material 1 and the second base material 2, and printing is performed in a fixed printing size in consideration of the heat shrinkage. In addition, it is preferable that both base materials have a thickness and a configuration in which the heat shrinkage ratio is the same, in consideration of the difference in heat history in the manufacturing process, so that curl or the like due to the difference in heat shrinkage does not occur. .
[0031]
The IC inlet 3 includes components including an IC chip 3a and an antenna 3b. As shown in FIG. 2, both sides of the IC chip 3a and the coiled antenna 3b are stuck together by a nonwoven fabric 3c and housed. Also, as shown in FIG. 3, a film in which an IC chip 3a is mounted on a film 3d on which a circuit of an antenna 3b is provided by printing, etching, or the like, or a film in which the chip portion or the whole is sealed in advance with a resin is used. it can.
[0032]
As the form of the IC inlet 3, a long web of one row wound in a roll shape is used. However, it is preferable that the web is loosely wound because of the convex portion of the IC chip. In addition, a sheet-like sheet or a long web-like sheet arranged in a plurality of rows and columns, or a sheet cut in advance from each sheet may be used. The dimensions when cut into one piece should be the same size as the card, or the size and size difference with respect to the card dimensions in consideration of the influence on the cutting quality when punching the card and the thickness at the end of the card. Can be set as appropriate.
[0033]
The adhesive 4 is, for example, a hot melt adhesive, and is particularly preferably a reactive hot melt adhesive. Reactive hot-melt adhesive is a type of adhesive that melts the resin, then absorbs moisture and cures the resin, and has a longer bondable time than normal hot-melt adhesive and adheres. Since the softening temperature increases later, it has high durability and is suitable for low-temperature coating. With ordinary hot melt adhesives, the coating temperature is the same as the softening temperature of the resin, so the heat resistance does not exceed the coating temperature, so if high heat resistance is required, a high coating temperature is required. Become. On the other hand, the reactive hot melt adhesive is cured after application, and its heat resistance temperature is several tens of degrees higher than the application temperature. Therefore, if the surface of the image receiving layer is a material that is easily damaged at high temperatures, the damage is reduced. be able to.
[0034]
Next, an IC card manufacturing method and an IC card manufacturing apparatus will be described with reference to FIGS. FIG. 4 is a flowchart of a manufacturing process of an IC card, FIG. 5 is a diagram showing a structure for pressing by a conveyor, FIG. 6 is a diagram showing dimensions of a card and a plate, and FIG. 7 is a diagram showing a structure for connecting a plate.
[0035]
In the supply step A of the first base material 1, single sheets are separated from the stacked one by one and are taken out and supplied. The upper surface of the single sheet is detected and kept constant, and is held and taken out by a suction pad. In this case, it is preferable to have a mechanism for removing the electricity, blowing air between layers, scraping off with a nail or the like, and raising the suction pad at the same time as suction called soccer so that one sheet can be reliably separated.
[0036]
In addition, it is preferable that the deposition is performed in two types, and that when one of them is lost, the line is automatically switched and the line is not stopped.
[0037]
In the step B of applying the adhesive to the first base material 1, a hot melt adhesive is applied on the first base material 1 with a predetermined thickness. As a coating method, a normal method such as a die method, a gravure method, or a roll method can be adopted, but a die method is preferable in the following points.
[0038]
In the die method, since the adhesive is sealed until applied to the first base material, temperature control is easy even at a high temperature such as a hot melt adhesive. This is advantageous because it does not come into contact with outside air. In addition, there is no foreign matter and bubbles are hardly generated.
[0039]
In addition, it is classified into a pre-metering type, and a coating amount is determined by a pump feeding amount and a substrate speed. Further, since there is little change in liquid physical properties such as viscosity, it is advantageous for securing coating thickness accuracy.
[0040]
The adhesive dissolved in the heating tank is supplied to the die 10 through a hose by a pump, and is discharged from a slit outlet 10a of the die 10. It is preferable that the hose and the die are also heated to maintain a constant temperature. The pump feed rate is determined by the pump efficiency, the pump speed, the rotation speed and the pressure loss, and the coating thickness is further determined by the gap between the die tip and the first substrate 1 called a lip, and the substrate speed. In the case of a reactive hot melt adhesive, it is preferable to purge the heating tank and the like with dry air, nitrogen, or the like.
[0041]
When the first base material 1 is a single sheet, coating is generally performed on a table, but the single sheet is held on a roll and coated in the same manner as a long web. Is preferred. As a method of holding the first base material 1, there is a method of gripping and holding the head, tail, and both edges of the base material. This is preferable because the margin is small and the yield is good. The base material sent one by one is positioned, set on a roll at a constant pitch, and coated.
[0042]
Other methods of applying to sheet-by-sheet are methods of joining and treating sheet-like sheets as long webs, and those that have been applied to release paper, release film, release belt, release roll once Although a method of peeling and transferring the substrate to the substrate is also conceivable, a consumable is required, and it is necessary to cope with the transfer residue.
[0043]
The coating is preferably performed intermittently, avoiding the head and tail of the sheet. The intermittent coating is performed by turning on / off a pump for feeding the adhesive to the die or turning on / off a valve provided on the die to temporarily stop the discharge of the adhesive. Since the response is delayed, the valve method is preferable. In this case, at the beginning of coating, the coating thickness tends to be thicker due to accumulation of pump pressure. Therefore, pump ON / OFF is used in combination, or a circuit is provided to return the adhesive to the heating tank. Is preferably prevented. Also, after the coating, even if the valve is turned off, the adhesive remaining at the tip of the die is pulled out and may adhere to the base material. Therefore, when the valve, which is generally called suck back, is turned off, the adhesive is put into the die. Preferably, a retractable valve mechanism is employed. Further, it is preferable to rotate the roll at a constant speed at least during coating.
[0044]
In the IC inlet supply step C, the intermediate station 20 is provided before the IC inlet 3 is placed on the first base material 1, and the IC inlets 3 are arranged here, and these are collectively sucked and held, and the adhesive is applied. It is placed on the first substrate 1 that has been worked. The positioning of the IC inlets 3 is performed one by one before taking out from the intermediate station 20, but it is more preferable that the first base material 1 is also positioned on the basis of the edge or the printing.
[0045]
When arranging at the intermediate station 20, the first base material 1 is not placed at that position based on reading of the defect position information given to the first base material 1 or information on the online defect inspection. If there is no defect information, the IC inlet 3 is fed by one roll from the roll and cut and sent to the intermediate station 20. If there is defect information, the feed is stopped at the corresponding timing of only the corresponding column. . The capacity is improved by arranging a plurality of roll windings and simultaneously processing them in multiple rows. Further, it is preferable that the defective IC inlet which is known in advance is removed before placing it on the base material, or it is preferable to add defect information to the base material and remove it later.
[0046]
Further, as another method, a tray-shaped jig in which the IC inlets 3 are arranged may be loaded, adsorbed and held from the jig, and placed on the first base material 1. However, in order to stop the supply of the defective portion, it is necessary to take measures such as not placing the defective portion in a corresponding position on the tray in advance, not holding it by suction from the tray, and removing it before holding it by suction.
[0047]
When placing the IC inlet 3 on the first substrate 1, there is a method of temporarily stopping the first substrate 1, but it is preferable to place the IC inlet 3 in synchronization with the substrate to be transported at a constant speed. . Moreover, it is preferable to place the IC chip while squeezing it from one side so that air does not enter, or to push the convex portion of the IC chip into the hot melt adhesive. Further, it is preferable that the hot melt adhesive is heated and kept warm by the heating and keeping means 21 such as a heater before placement to maintain fluidity and tackiness.
[0048]
As a transport method from the supply of the first substrate 1 to the bonding, a method using a suction conveyor, a transfer table, a tray jig, and a substrate grip can be considered.
[0049]
In the supply step D of the second base material 2, the long web is wound into a roll and fed, and in this feeding, the tension and the edge position are detected and controlled to be constant.
[0050]
In addition, it is preferable to use two sets of feeding and further provide an accumulator to exchange and join windings without stopping the line.
[0051]
In the step E of applying the adhesive to the second base material 2, the die 31 is used to intermittently hold the second base material 2 held by the rolls 30, similarly to the first base material 1. Apply.
[0052]
The coating thickness is preferably the same as the coating thickness of the first base material 1 so as to prevent curling due to imbalance between the front and back surfaces of the card. Further, the first base material 1 and the second base material are preferably used. It is more preferable to determine the values comprehensively in consideration of the asymmetry caused by the IC inlet 2 and the IC inlet 3.
[0053]
The second substrate 2 is a long web and can be continuously coated. However, it is intermittently coated according to the first substrate 1 which is a single sheet and cut into a sheet after laminating. It is preferable that the position to be coated be uncoated because the adhesion of the adhesive to the blade can be prevented. Reactive hot melts are particularly preferred because they do not cure quickly.
[0054]
In the laminating step F, a single sheet-shaped first base material 1 on which an adhesive is applied and the IC inlet 3 is placed, and a second base material 2 on which the adhesive is applied are rolled with rolls 30 and 40. Nip and paste. Second, the nip roll 30 may double as a roll for coating the substrate 2 or may be provided separately.
[0055]
The nip roll may be metal-to-metal or rubber-coated on one side, and the nip roll gap setting, pressure setting, or a combination thereof may be used to adjust the total thickness or embed the IC inlet in the adhesive. Improve smoothness.
[0056]
Therefore, it is preferable to heat and insulate the hot melt adhesive by the heating and insulting means 41 immediately before laminating the first substrate 1 and the second substrate 2 together, but the surface of the substrate is easily damaged by high temperature. Therefore, the hot melt adhesive side heats and keeps the temperature by driving a heating and keeping means such as an infrared heater based on the hot melt adhesive temperature information. On the other hand, on the base material side, a heat medium is circulated inside the nip rolls 30 and 31 via a temperature controller, and the temperature controller is driven based on the roll temperature information and the heat medium temperature information to reach a certain temperature (for example, 60 ° C.) or more. It is preferable to keep the temperature so that it does not occur.
[0057]
The first base material 1 in the form of a single sheet is fed at a constant pitch and bonded to the second base material 2. The pitch is set so that the pitch of the conveyor and the pitch of the card in the subsequent process always match. It is preferable that the pitch be an integral multiple of the pitch of the card. Further, it is preferable to provide a minimum interval between the first base materials 1 so that no debris is generated when the sheet is cut into a sheet after the lamination.
[0058]
The tension of the second base material 2 and the sheet tension of the first base material 1 are taken into consideration so as not to cause curl or the like due to residual stress between the first base material 1 and the second base material 2 after bonding. Is preferably set.
[0059]
In the conveyor heating and pressurizing step G, the bonded product is heated and pressurized for a certain period of time to further improve the total thickness and the smoothness, particularly the smoothness of the convex portion of the IC chip.
[0060]
This conveyor heating and pressurizing is performed under a pressurizing time of 10 to 60 sec, particularly 20 to 30 sec, and a pressing force of 0.2 to 1 kg / cm. ² . Especially 0.4-0.6kg / cm ² The heating temperature is preferably from 50 to 100 ° C., particularly preferably from 50 to 70 ° C., because it can prevent adverse effects on the image receiving layer, but can be appropriately determined depending on the physical properties of the adhesive, the pressure resistance of the IC chip, the heat resistance of the substrate surface, and the like. .
[0061]
Further, as shown in FIG. 5, the pressing is performed by a pair of upper and lower conveyors 51 in which a plate 50 sandwiching the upper and lower portions of the bonded product P of the first base material 1 and the second base material 2 circulates. In this embodiment, the upper conveyor 51 is short, and the lower conveyor 51 is long.
[0062]
In this embodiment, a step of interposing an IC inlet made of a component including an IC chip and an antenna between the first base material 1 and the second base material 2 and bonding them with an adhesive, And a step of transporting the plurality of plates 50 sandwiching the first substrate 1 and the second substrate 2 while pressing them by the circulating conveyor 51. The plates 50 are transported at the same pitch as the IC card in the transport direction. A loop-shaped member 52 is provided, and a drive shaft 53 for rotating the loop-shaped member 52 and a driven shaft 54 are provided. As the loop-shaped member 52, for example, a chain is used. The drive shaft 53 is arranged on the entrance side 51a of the conveyor 51, and the driven shaft 54 is arranged on the exit side 51b of the conveyor 51.
[0063]
Further, a backup mechanism 55 that supports the plate 50 and receives a pressing force is provided. Since the rigidity of the plate 50 is insufficient due to the thickness restriction, it is preferable that the plate 50 be backed up by the receiving roller 56 of the backup mechanism 55 to compensate. In addition, the transfer direction positions at which the backup is started and / or finished are arranged differently above and below the conveyor 51.
[0064]
In addition, the edge portion 50a of the plate 50 jumps out of the transport line L at the front and rear ends of the backup by the backup mechanism 55, causing scratches on the base material or cutting into the bonded product P to form a concave shape. As shown in FIG. 6, when the card dimension in the IC card transport direction is D1 and the pitch is D2, as shown in FIG. , And pitch are the same as the pitch D2 of the card.
[0065]
As described above, since the dimension of the plate 50 in the transport direction is the same as the pitch D2 of the IC card, and the drive shaft 53 of the loop-shaped member 52 is on the entrance side of the conveyor 51, the pitch of the plate 50 is determined by the dimension of the plate 50. Since it is not affected by the elongation and accuracy of the loop-shaped member 52, it is possible to manufacture a high-precision card product part with good smoothness at low cost, and it is easy to maintain and manage chains and the like.
[0066]
In addition, a backup mechanism 55 that supports the plate 50 and receives a pressing force is provided. The backup direction of the backup mechanism 55 is different between upper and lower portions of the conveyor 51 in the transfer direction at the start and / or end of the backup. The plate does not jump out of the transport line L at the same transport direction position in the vertical direction, the influence can be reduced by half, and the quality can be improved.
[0067]
In addition, in a portion where the first base material 1 and the second base material 2 are sandwiched between the plates 50, as shown in FIG. 7A, adjacent plates 50 have a connecting member 60 that connects at a constant interval. . The connecting member 60 has an L-shape. A base 60 a is rotatably attached to the rear side of each plate 50 on a support shaft 61. A distal end 60 b is biased by a coil spring 62 provided on the support shaft 61. It is always biased in the rising direction by the means.
[0068]
When the connecting member 60 comes into contact with the pressing member 63 by driving the conveyor 51, the pressing member 63 pushes the connecting member 60, and the distal end portion 60b of the pressing member 63 fits into the concave portion 50b provided in the plate 50 to be conveyed. Thus, the pitch of the plates 50 can be prevented from expanding, and as shown in FIG. 7B, the interval W between the plates 50 does not increase, so that the smoothness of the base material is improved.
[0069]
When the connecting member 60 is not brought into contact with the pressing member 63 by the driving of the conveyor 51, the connecting member 60 is raised by the coil spring 62, and the distal end portion 60b is removed from the concave portion 50b of the plate 50, so that the connection of the adjacent plate 50 is released. You.
[0070]
As described above, in a portion where the first base material 1 and the second base material 2 are sandwiched by the plates 50, the adjacent plates 50 are connected by the connecting member 60 having a constant interval, so that the pitch of the plates 50 is increased. Is determined and the influence of the elongation and accuracy of the loop-shaped member 52 is not affected, so that a high-precision card product part with good smoothness can be manufactured at low cost, and the maintenance and management of the chain and the like becomes easy.
[0071]
As a method of pressurizing, in addition to applying a constant load using a hydraulic cylinder or the like, a method of fixing a gap (gap) between the upper and lower plates 50 sandwiching the bonded product can be considered.
[0072]
As a heating method, there is a method in which the plate 50 is directly radiantly heated by infrared rays or a method in which the plate 50 is conductively heated by a heater. However, the method in which the conveyor 51 is provided in an atmosphere in which hot air is circulated has a stable temperature.
[0073]
In the conveyor cooling and pressurizing step H, it is preferable to cool the conveyor immediately after the heating and pressurizing because it is likely to be deformed at a high temperature immediately after the heating and pressurizing. Although there is a method simply using cooling air, it is more preferable to perform cooling while pressurizing with the conveyor 51 as in the case of heating and pressurizing.
[0074]
Pressurization is performed by the same method, and cooling is performed by circulating outside air or cold air instead of hot air.
[0075]
In the sheet cutting step I, the bonded product of the first base material 1 and the second base material 2 cannot be wound, and is cut into a sheet by the cutter unit 80. Cutting is preferably performed without bending the bonded product, and a cutter unit that meshes the upper and lower blades, a cutter unit that moves the NT cutter and the receiver in the width direction, and a plate-shaped blade and the receiver in the width direction. The method can be selected from a general method such as a method of synchronizing the traveling cutter unit with the transport of the bonded product and a method of synchronously rotating the cutter unit with the bonded product using a rotary cutter provided with a blade on a drum outer cylinder.
[0076]
Further, it is preferable that the cutting position is cut at an interval provided between the first base materials at the time of lamination so that no debris is generated. Since the uncoated portion has no adhesive, it does not adhere to the blade.
[0077]
In the accumulation storage step J, a predetermined number of cut sheets are accumulated. A metal plate 90 made of SUS or the like is inserted at intervals of one to several tens of bonded products of the first base material 1 and the second base material 2, and the unevenness of the bonded product itself is added to impair smoothness. Is preferably prevented. The supply of the metal plate 90 such as SUS can be performed in the same manner as in the case of the first base material, although there is a difference depending on the rigidity.
[0078]
In addition, it is preferable that the deposition of the bonded product and the deposition of the supply of the metal plate 90 such as SUS are performed in two types, and the switching can be performed without stopping the line. When a reactive hot melt adhesive is used, the bonded product deposited together with the metal plate 90 such as SUS is preferably stored under air-conditioned conditions for about one week required for the reaction. The air-conditioning conditions and storage period can be determined as appropriate depending on the specifications of the adhesive and the like.
[0079]
In the carding step K, the bonded product of the first base material 1 and the second base material 2 is cut to a predetermined size by cutting one to four sides based on the edge or printing of the first base material 1. After that, standard printing is performed on the second substrate 2 side by the printing machine 91, and the card is punched by the punching machine 92. The fixed-form printing on the second substrate 2 side may be performed for each card after punching.
[0080]
【The invention's effect】
As described above, according to the first and fourth aspects of the invention, the plate has the same dimension in the transport direction as the pitch of the IC card, and the drive shaft of the loop-shaped member is on the entrance side of the conveyor. The pitch of the plate is determined by the dimensions of the plate, and is not affected by the elongation or accuracy of the loop-shaped member, so that a high-precision card product with good smoothness can be manufactured at low cost, and the chain is maintained. Management becomes easier.
[0081]
According to the invention described in claim 2 and claim 5, in a portion where the first base material and the second base material are sandwiched between the plates, the adjacent plates are connected by a connecting member that keeps a constant interval, Because the pitch of the plate is determined and the influence of the elongation and accuracy of the loop-shaped member is not affected, it is possible to manufacture a high-precision card product with good smoothness at low cost, and it is easy to maintain and manage the chain etc. Become.
[0082]
According to the third and sixth aspects of the present invention, a backup mechanism that supports the plate and receives a pressing force is provided, and the backup direction of the backup mechanism and / or the transport direction position at which the backup ends is different between the upper and lower sides of the conveyor. Therefore, at the front and rear ends of the backup, the plate does not jump out of the transfer line at the same position in the transfer direction, so that the influence can be reduced by half and the quality can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC card.
FIG. 2 is a cross-sectional view of the IC card.
FIG. 3 is a sectional view of another embodiment of an IC card.
FIG. 4 is a flowchart of an IC card manufacturing process.
FIG. 5 is a diagram showing a structure in which pressure is applied by a conveyor.
FIG. 6 is a diagram showing dimensions of a card and a plate.
FIG. 7 is a diagram showing a structure for connecting plates.
[Explanation of symbols]
1 First substrate
2 Second substrate
3 IC inlet
4 adhesive
50 plates
51 conveyor
52 loop member
53 drive shaft
A Supply process of the first substrate 1
B. Step of applying adhesive to first substrate 1
C IC inlet supply process
D Supplying Step of Second Substrate 2
E Step of applying adhesive to second base material 2
F Lamination process
G Conveyor heating and pressing process
H Conveyor cooling pressurization process
I Sheet cutting process
J Integrated storage process
K card making process

Claims (6)

An IC inlet made of a component including an IC chip and an antenna is interposed between the first base material and the second base material, and the first base material is bonded to the first base material with the adhesive. In a method of manufacturing an IC card in which a plurality of plates sandwiching a base material are transported while being pressed by a circulating conveyor,
The circulation of the plate is performed by a loop-shaped member provided with the plate at the same pitch as the IC card,
The plate has the same dimension in the transport direction as the pitch of the IC card,
A method of manufacturing an IC card, wherein a drive shaft of the loop-shaped member is provided on an entrance side of the conveyor. An IC inlet made of a component including an IC chip and an antenna is interposed between the first base material and the second base material, and the first base material is bonded to the first base material with the adhesive. In a method of manufacturing an IC card in which a plurality of plates sandwiching a base material are transported while being pressed by a circulating conveyor,
The circulation of the plate is performed by a loop-shaped member provided with the plate at the same pitch as the IC card,
A method for manufacturing an IC card, wherein, at a portion where the first base material and the second base material are sandwiched between the plates, the adjacent plates are connected by a connecting member that keeps a constant interval. An IC inlet made of a component including an IC chip and an antenna is interposed between the first base material and the second base material, and the first base material is bonded to the first base material with the adhesive. In a method of manufacturing an IC card in which a plurality of plates sandwiching a base material are transported while being pressed by a circulating conveyor,
The circulation of the plate is performed by a loop-shaped member provided with the plate at the same pitch as the IC card,
A backup mechanism that supports the plate and receives a pressing force,
A method of manufacturing an IC card, wherein the start and / or the end of the backup of the backup mechanism in the conveyance direction are different between the upper and lower sides of the conveyor. A step of interposing an IC inlet made of a component including an IC chip and an antenna between the first base material and the second base material and bonding them with an adhesive, and after bonding the first base material and the first base material, A step of transporting the plurality of plates sandwiching the second base material while pressing them by a circulating conveyor.
A loop-shaped member provided with the plate at the same pitch as the IC card in the transport direction,
A drive shaft for rotating the loop-shaped member and a driven shaft,
The dimension of the plate in the transport direction is the same as the pitch of the IC card,
An apparatus for manufacturing an IC card, wherein the drive shaft is arranged on the entrance side of the conveyor, and the driven shaft is arranged on the exit side of the conveyor. A step of interposing an IC inlet made of a component including an IC chip and an antenna between the first base material and the second base material and bonding them with an adhesive, and after bonding the first base material and the first base material, A step of transporting the plurality of plates sandwiching the second base material while pressing them by a circulating conveyor.
A loop-shaped member provided with the plate at the same pitch as the IC card in the transport direction,
An IC card manufacturing apparatus, characterized in that, at a portion where the first base material and the second base material are sandwiched between the plates, the adjacent plates have a connecting member that connects the plates at a constant interval. A step of interposing an IC inlet made of a component including an IC chip and an antenna between the first base material and the second base material and bonding them with an adhesive, and after bonding the first base material and the first base material, A step of transporting the plurality of plates sandwiching the second base material while pressing them by a circulating conveyor.
A loop-shaped member provided with the plate at the same pitch as the IC card in the transport direction,
A backup mechanism that supports the plate and receives a pressing force,
An IC card manufacturing apparatus, wherein the starting and / or ending positions of the backup of the backup mechanism in the conveyance direction are different between the upper and lower sides of the conveyor.

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