JP3868332B2 - IC tag laminating apparatus and method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC tag laminating apparatus and method.
[0002]
[Prior art]
An IC label and an IC tag are electronic media for automatic recognition having superiority in terms of operation and information amount as compared with a magnetic recording method and a barcode method. Conventionally, as an IC tag laminating apparatus for manufacturing an IC tag, a flat IC inlet including an IC chip (IC module) and an antenna, and a solid adhesive (thermoplastic adhesive, thermosetting adhesive, UV curable adhesive) , Pressure-sensitive adhesives, etc.) and a surface film (PET: polyethylene terephthalate, etc.) are combined (combined) to pressurize and heat.
[0003]
In a conventional IC tag laminating apparatus, a sheet-like IC inlet sheet including a plurality of IC inlets, a sheet-like solid adhesive sheet, and a sheet-like surface film sheet are bonded together. Alternatively, a roll-shaped IC inlet roll including a plurality of IC inlets, a solid adhesive sheet, and a surface film sheet are combined and bonded together. Alternatively, an IC inlet roll, a solid adhesive sheet, and a roll-shaped surface film roll are combined and bonded together.
[0004]
[Problems to be solved by the invention]
In the conventional IC tag laminating apparatus, since the above-described three patterns are manually registered, there is a disadvantage that the registration process takes a lot of time. In addition, in order to prevent pressure destruction (damage due to pressure) of the IC chip included in the IC inlet, it is necessary to set the thickness of the solid adhesive sheet made of expensive adhesive more than necessary, which increases the cost. There was an inconvenience.
[0005]
Furthermore, in order to prevent pressure destruction of the IC chip, it is necessary to control that a sufficient pressure is applied to the bonding after a heating process until the solid adhesive sheet is softened. Specifically, after the process of heating until the solid adhesive sheet is softened, it is necessary to perform the first process of bonding with a minute pressure and the second process of bonding with a standard pressure. In this case, a complicated pressure control device is required, and since the pressure control process is performed in at least two stages, there is a disadvantage that a long time is required for the bonding process.
[0006]
The present invention has been made in view of the above-described problems, and based on a simple configuration, an IC tag can be manufactured efficiently and inexpensively without causing pressure breakdown of the IC chip. It is an object to provide a laminating apparatus and method.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, in the first invention of the present invention, a first supply unit for supplying an IC inlet along a predetermined path;
A second supply unit for supplying the surface film along a predetermined path;
An application unit for applying a liquid UV curable adhesive to at least one of the IC inlet supplied from the first supply unit and the surface film supplied from the second supply unit;
It has a laminating portion for laminating an IC inlet coated with an adhesive and a surface film on at least one side ,
The laminating section has a UV irradiation section for performing UV irradiation over substantially the whole of the IC inlet and the surface film,
An IC tag laminating apparatus , further comprising an auxiliary UV irradiating unit that is disposed between the coating unit and the laminating unit and locally positions and bonds the IC inlet and the surface film. I will provide a.
[0009]
According to a preferred aspect of the first invention, the first supply unit supplies a sheet-like IC inlet sheet including a plurality of IC inlets, and the second supply unit has a size corresponding to the IC inlet sheet. A sheet-shaped surface film sheet having a cutting portion, and further comprising a cutting section for cutting the IC inlet sheet and the surface film sheet bonded through the bonding section for each IC inlet or a group of IC inlets ing.
[0010]
In the second invention of the present invention, a first supply step of supplying the IC inlet along a predetermined path;
A second supply step of supplying the surface film along a predetermined path;
An application step of applying a liquid UV curable adhesive to at least one of the IC inlet supplied in the first supply step and the surface film supplied in the second supply step;
A laminating step of laminating an IC inlet coated with an adhesive and a surface film on at least one side by the coating step,
The laminating step includes a UV irradiation step of performing UV irradiation over substantially the entire of the IC inlet and the surface film,
Provided is an IC tag laminating method further comprising an auxiliary UV irradiation step of locally positioning and bonding the IC inlet and the surface film between the application step and the laminating step .
[0011]
DETAILED DESCRIPTION OF THE INVENTION
According to a typical embodiment of the present invention, the IC inlet roll is supplied along a predetermined path, and the surface film roll is supplied along the predetermined path. Next, for example, a liquid UV curable adhesive is applied to the surface film supplied along a predetermined path, and then the IC inlet and the surface film are bonded together. In this way, the IC tag is sequentially manufactured by cutting the bonded IC inlet roll and the surface film roll for each IC inlet or for each group of IC inlets.
[0012]
The typical form of the present invention employs a configuration in which, for example, a liquid UV curable adhesive is applied to a surface film, unlike the conventional technique using a solid adhesive sheet. Therefore, it is not necessary to perform complicated pressure control in order to prevent pressure destruction of the IC chip, and the bonding process can be performed quickly. Further, since a solid adhesive sheet is not used, it is not necessary to use a large amount of adhesive to prevent pressure destruction of the IC chip, and the cost for the adhesive can be suppressed. As described above, according to the present invention, an IC tag can be manufactured efficiently and inexpensively without causing pressure breakdown of the IC chip based on a simple configuration.
[0013]
Embodiments of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a diagram schematically showing a configuration of an IC tag laminating apparatus according to an embodiment of the present invention. Referring to FIG. 1, the IC tag laminating apparatus of this embodiment supplies a first supply unit 2 for supplying an IC inlet roll 1 along a predetermined path and a surface film roll 3 along a predetermined path. The 2nd supply part 4 for doing.
[0014]
Here, the IC inlet roll 1 supplied from the first supply unit 2 is configured by adhering a large number of IC inlets in a line at equal intervals to a roll-like film extending elongated. Moreover, the surface film roll 3 supplied from the 2nd supply part 4 is a roll-shaped surface film which has a size according to the IC inlet roll 1, and is formed, for example by PET.
[0015]
In this embodiment, the surface film roll 3 supplied from the second supply unit 4 reaches the application unit 5 along a predetermined path. In the application unit 5, the adhesive 6 is applied to the upper surface in the drawing of the surface film roll 3 supplied from the second supply unit 4. Here, as the adhesive 6, a suitable adhesive liquefied by heating or a suitable liquid adhesive that does not require heating can be used. For example, by using an adhesive that can be applied at room temperature, a surface film roll formed of a low-melting-point material (PET-G, PVC, etc.) can be used.
[0016]
Next, the surface film roll 3 supplied from the second supply unit 4 and coated with the adhesive 6 and the IC inlet roll 1 supplied from the first supply unit 2 are arranged along a predetermined path, for example, a pair of rollers 7a. And the laminating part 7 having 7b is reached. In the bonding part 7, the IC inlet roll 1 and the surface film roll 3 are bonded together with the adhesive 6 by the action of the pair of rollers 7 a and 7 b.
[0017]
Note that the IC tag laminating apparatus of this embodiment includes a vacuum unit 8 for setting the atmosphere of the IC inlet roll 1 and the surface film roll 3 bonded together in the bonding unit 7 to a substantially vacuum state. The action of the vacuum unit 8 can prevent bubbles from being generated when the IC inlet roll 1 and the surface film roll 3 are bonded together.
[0018]
Further, the IC tag laminating apparatus of the present embodiment includes a cooling unit 9 for cooling the IC inlet roll 1 and the surface film roll 3 bonded together via the bonding unit 7. By the action of the cooling unit 9, the adhesive 6 interposed between the IC inlet roll 1 and the surface film roll 3 is cooled in preparation for a cutting process described later.
[0019]
Next, the IC inlet roll 1 and the surface film roll 3 bonded together via the bonding section 7 and cooled via the cooling section 9 reach the cutting section 10 along a predetermined path. The cutting unit 10 cuts the bonded IC inlet roll 1 and the surface film roll 3 for each IC inlet, for example, by the action of a cutter 10a that is driven to reciprocate in a direction perpendicular to the path.
[0020]
Here, the cutter 10a operates by detecting a mark provided on the IC inlet roll 1 for each IC inlet with a sensor (not shown). Thus, the IC tag laminating apparatus of this embodiment sequentially outputs the IC tags 11. Here, each IC tag 11 has a form in which an IC inlet including the IC chip 11a and a surface film are bonded together with an adhesive.
[0021]
As described above, this embodiment employs a configuration in which an adhesive liquefied by heating or a liquid adhesive that does not require heating is applied to the surface film roll without using a solid adhesive sheet. Therefore, it is not necessary to perform complicated pressure control in order to prevent pressure destruction of the IC chip, and the bonding process can be performed quickly.
[0022]
Further, since a solid adhesive sheet is not used, it is not necessary to use a large amount of adhesive to prevent pressure destruction of the IC chip, and the cost for the adhesive can be suppressed. Furthermore, only by supplying the IC inlet roll and the surface film roll along the route, the bonding process can be performed without going through a so-called bonding process. As described above, in this embodiment, an IC tag can be manufactured efficiently and inexpensively without causing pressure breakdown of the IC chip based on a simple configuration.
[0023]
In the above-described embodiment, in order to simplify the description, an IC inlet roll having IC inlets attached in a row is used. However, the present invention is not limited to this, and the IC inlets are attached two-dimensionally. A worn IC inlet roll can also be used. Further, instead of the IC inlet roll, a sheet-like IC inlet sheet including a plurality of IC inlets may be used. In this case, instead of the surface film roll, a sheet-shaped surface film sheet having a size corresponding to the IC inlet sheet is used. Further, instead of the IC inlet roll, a single IC inlet can be sequentially supplied. In this case, a surface film having a size corresponding to a single IC inlet is used instead of the surface film roll.
[0024]
Moreover, in the above-mentioned embodiment, although the adhesive agent is apply | coated to the surface film roll, it can also apply | coat an adhesive agent to an IC inlet roll, without being limited to this. Generally, an adhesive can be applied to at least one of the surface film roll and the IC inlet roll. Furthermore, in the above-described embodiment, the cutting unit is configured by a cutter that is driven to reciprocate in a direction perpendicular to the path. It is also possible to use a rotary cutter.
[0025]
FIG. 2 is a diagram schematically showing a configuration of an IC tag laminating apparatus according to a modification of the embodiment of the present invention. The modification of FIG. 2 has a configuration similar to that of the embodiment of FIG. 1, but uses a liquid UV curable adhesive as the adhesive. Hereinafter, the modified example of FIG. 2 will be described by focusing on the difference from the embodiment of FIG. Referring to FIG. 2A, a modified IC tag laminating apparatus includes a first supply unit 22 for supplying an IC inlet roll 21 along a predetermined path and a surface film roll 23 along a predetermined path. And a second supply unit 24 for supplying.
[0026]
As shown in FIG. 2 (b), the IC inlet roll 21 supplied from the first supply unit 22 has a plurality of IC inlets 21b pasted in three rows in the width direction at equal intervals on an elongated roll-shaped film 21a. It is composed by wearing. Further, the surface film roll 23 supplied from the second supply unit 24 has a size corresponding to the IC inlet roll 21. In the modification, the IC inlet roll 21 supplied from the first supply unit 22 reaches the application unit 25 along a predetermined path.
[0027]
In the application unit 25, a liquid UV curable adhesive 25 a is applied to the upper surface of the IC inlet roll 21 supplied from the first supply unit 22 in the drawing. Next, the IC inlet roll 21 supplied from the first supply unit 22 and coated with the UV curable adhesive 25a and the surface film roll 23 supplied from the second supply unit 24 are spotted along a predetermined path. The first UV irradiation unit (auxiliary UV irradiation unit) 26 that performs UV irradiation in a shape is reached. In the first UV irradiation section 26, as shown in FIG. 2 (b), the IC inlet roll 21 and the surface film roll 23 are spot-bonded in a spot-like manner with a gap at both ends by spot-like UV irradiation (see FIG. 2B). 2 (b), indicated by reference numeral 21c).
[0028]
The IC inlet roll 21 and the surface film roll 23 positioned and adhered by the first UV irradiation unit 26 reach a laminating unit 29 having a second UV irradiation unit 27 and a thickness adjusting roller (finishing roller) 28. In the laminating unit 29, the IC inlet roll 21 and the surface film roll 23 are irradiated with UV by the second UV irradiation unit 27, and the IC inlet roll 21 and the surface film are passed through the thickness adjusting roller 28. The roll 23 is bonded through a UV curable adhesive 25a.
[0029]
The IC inlet roll 21 and the surface film roll 23 bonded through the bonding unit 29 reach the cutting unit 30 along a predetermined path. The cutting unit 30 cuts the bonded IC inlet roll 21 and the surface film roll 23 for each group of IC inlets, for example, by the action of a cutter that is driven to reciprocate in a direction perpendicular to the path. Thus, the modified IC tag laminating apparatus sequentially outputs the IC tags 31.
[0030]
In the modified example, a liquid UV curable adhesive 25a is used as an adhesive for bonding the IC inlet roll 21 and the surface film roll 23, and the IC inlet roll 21 is bonded to the IC inlet roll 21 by spot-shaped UV irradiation prior to bonding. The surface film roll 23 is positioned and bonded. As a result, in a state where the IC inlet roll 21 and the surface film roll 23 that are likely to be displaced due to the fluidity of the UV curable adhesive 25a are superposed in a desired state, the second UV irradiation unit 27 and the thickness adjustment roller 28, the final bonding of the IC inlet roll 21 and the surface film roll 23 can be performed stably.
[0031]
【The invention's effect】
As described above, according to the IC tag laminating apparatus and method of the present invention, an IC tag can be manufactured efficiently and inexpensively without causing pressure breakdown of the IC chip based on a simple configuration.
[Brief description of the drawings]
FIG. 1 is a diagram schematically showing a configuration of an IC tag laminating apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram schematically showing a configuration of an IC tag laminating apparatus according to a modification of the embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1,21 IC inlet roll 2,22 1st supply part 3,23 Surface film roll 4,24 2nd supply part 5,25 Application | coating part 6,25a Adhesive 7,29 Laminating part 7a, 7b A pair of roller 8 Vacuum Unit 9 Cooling unit 10, 30 Cutting unit 10a Cutter 11 IC tag 11a IC chip 26, 27 UV irradiation unit

Claims (2)

A first supply unit for supplying an IC inlet along a predetermined path;
A second supply unit for supplying the surface film along a predetermined path;
An application unit for applying a liquid UV curable adhesive to at least one of the IC inlet supplied from the first supply unit and the surface film supplied from the second supply unit;
It has a laminating portion for laminating an IC inlet coated with an adhesive and a surface film on at least one side ,
The laminating section has a UV irradiation section for performing UV irradiation over substantially the whole of the IC inlet and the surface film,
An IC tag laminating apparatus , further comprising an auxiliary UV irradiating unit that is disposed between the coating unit and the laminating unit and locally positions and bonds the IC inlet and the surface film. . A first supply step of supplying an IC inlet along a predetermined path;
A second supply step of supplying the surface film along a predetermined path;
An application step of applying a liquid UV curable adhesive to at least one of the IC inlet supplied in the first supply step and the surface film supplied in the second supply step;
A laminating step of laminating an IC inlet coated with an adhesive and a surface film on at least one side by the coating step,
The laminating step includes a UV irradiation step of performing UV irradiation over substantially the entire of the IC inlet and the surface film,
An IC tag laminating method further comprising an auxiliary UV irradiation step of locally positioning and bonding the IC inlet and the surface film between the application step and the bonding step.

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