JP4330292B2 - IC card manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing an IC card having an IC unit having an IC chip and an antenna.
[0002]
[Prior art]
An IC card is used to prove an individual's identity such as an employee ID card or student ID card. For example, such an IC card contains an IC unit having an IC chip and an antenna, and a face image and written information on the surface. In some cases, the back side is provided with a writing layer that can be filled in with a writing tool or the like and printed according to the card.
[0003]
As a manufacturing method of such an IC card, a heat bonding method, an adhesive bonding method, and an injection molding method are known. For example, in the adhesive bonding method, an upper and lower long length in which an adhesive layer is formed in advance. An IC inlet having an IC chip and an antenna is placed and bonded between the web-like or single-wafer sheet-like base material, and then the IC inlet is embedded via an adhesive by applying heat and pressure. Thereafter, the bonded product is punched into an IC card.
[0004]
[Problems to be solved by the invention]
For such IC cards, for example, for the purpose of preventing forgery and alteration, watermark printing, printing for preventing forgery and alteration such as holograms and fine patterns, etc. are employed. If it is applied, it is a special anti-counterfeit-proof printing, and a defective print is likely to occur. If a defective print occurs, the entire IC card is discarded, resulting in an increase in cost.
[0005]
In addition, both the first base material and the second base material of the IC card are printed on a card using a non-printing base material and printed on a small card. descend. In addition, if both the first base material and the second base material of the IC card are pre-printed, it is difficult to obtain alignment accuracy at the time of bonding.
[0006]
The present invention has been made in view of such circumstances, and an object thereof is to provide a method of manufacturing an IC card that can be manufactured with high accuracy and at low cost.
[0007]
[Means for Solving the Problems]
In order to solve the above problems and achieve the object, the present invention is configured as follows.
[0017]
  The invention described in claim 1
“In the method of manufacturing an IC card, an IC inlet made of a component including an IC chip and an antenna is interposed between the first base material and the second base material and bonded together with an adhesive.
  The adhesive is applied by applying to the first base material and the second base material,
  At least one of the first base material and the second base material is in the form of a sheet,
  Holding the sheet-like base material on a roll and applying it,
  After the IC inlet is placed and bonded between the first base material and the second base material, a conveyor that circulates a plate sandwiching the first base material and the second base material is used. Heat and pressurize while carrying continuously,
  The interval between the plates is made wider on the conveyor inlet side than the conveyor outlet.An IC card manufacturing method characterized by the above. ].
[0018]
Although there is a method of intermittent coating on a table with a single sheet, in general, accuracy and ability are inferior to a method of coating a long web on a backup roll.
[0019]
  This claim1According to the invention described in (1), coating accuracy similar to that of a long web can be obtained even with a single sheet, and there is no reciprocation or acceleration / deceleration compared to the case of using a table, which is advantageous in terms of performance.In addition, heating and pressurization is possible while continuously transporting, there is no need to intermittently perform pre-processes such as coating, and by increasing the length of the conveyor, there is no need to reduce the line speed even if the heating and pressurization time is long. Heating and pressing can be performed with a relatively simple mechanism. Furthermore, since the thickness of the bonded product is gradually reduced to a predetermined thickness between the entrance and the exit of the conveyor, the pressure on the bonded product increases as the conveyor enters. The pressure applied to the combined product can be made uniform, and the allowable withstand voltage required for the IC chip inside thereof can be reduced.
[0020]
  Claim2The invention described in
  “The plate is rotatably supported with respect to an axis parallel to the drive shaft of the conveyor.1The manufacturing method of IC card as described in 1 .. ].
[0022]
  This claim2According to the invention described in (1), since the plate circulating while rotating is rotated and escaped, excessive pressure is not locally applied to the bonded product or scratches are not made.
[0025]
  Claim3The invention described in
  “The upper conveyor and the lower conveyor constituting the conveyor are shifted in the transport direction,
  AboveThe conveyor on the side where the entrance of the conveyor is located downstream is supported on the leading side of the plate,
  The conveyor on the side where the outlet of the conveyor is located upstream is supported on the rear side of the plate.1 orClaim2The manufacturing method of IC card as described in 1 .. ].
[0027]
  This claim3According to the invention described in the above, while the plate that is circulated while pressurizing is sandwiching the bonded product, the plate does not pop out of the conveyance line, and excessive pressure is locally applied to the bonded product. It wo n’t get scratched.
[0034]
  Claim6The invention described in
  “The plate circulatesAboveAn endless belt is provided on the further outside of the conveyor.5The manufacturing method of IC card as described in 1 .. ].
[0055]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an IC card manufacturing method according to the present invention will be described below in detail with reference to the drawings. However, the present invention is not limited to these embodiments.
[0056]
1 to 3 show an IC card manufactured by an IC card manufacturing method, FIG. 1 is a plan view of the IC card, FIG. 2 is a sectional view of the IC card, and FIG. 3 is another embodiment of the IC card. It is sectional drawing of a form.
[0057]
The IC card is manufactured by laminating an IC inlet 3 composed of components including an IC chip 3 a and an antenna 3 b between the first base material 1 and the second base material 2 with an adhesive 4.
[0058]
The first substrate 1 has a total thickness of, for example, 50 to 250 μm using PET as a support, and an image receiving layer is provided on the card surface side. For example, in order to prevent forgery or alteration, watermark printing, holograms, strips, etc. Printing for preventing counterfeiting such as forgery, etc., or regular printing of frames, characters, symbols, etc. necessary for IC cards is performed.
[0059]
The inner surface of the card of the first substrate 1 is subjected to an easy adhesion treatment for improving the coating property of the hot melt adhesive as the adhesive 4, and antistatic layers are provided on both surfaces. The form of the first base material 1 is a sheet-like sheet, and the dimensions are, for example, width 200 × length 200 mm (card width 2 rows × length 3 rows can be taken) to width 500 × length 650 mm (card width 5 rows × length). 10 rows can be taken) or even larger. Further, the image receiving layer and printing defects are inspected in advance, and the position information is given by a bar code or the like.
[0060]
The second base material 2 has a total thickness of, for example, 50 to 250 μm using PET as a support, a writing layer is provided on the card surface side, and regular printing is not performed to perform after bonding. Similar to the first substrate 1, the inner surface of the card is subjected to an easy adhesion treatment for improving the coating property of the hot melt adhesive as the adhesive 4, and an antistatic layer is provided on both sides. . The form of the second substrate 2 is a long web, and the width is preferably matched to the lateral dimension of the first substrate 1.
[0061]
For both the first substrate 1 and the second substrate 2, it is preferable to select a material having a small thermal shrinkage and its variation, and printing is performed with a standard print size that allows for thermal shrinkage. In addition, it is preferable that both base materials have a thickness and a configuration in which the heat shrinkage rate is the same in consideration of the difference in heat history in the manufacturing process so that curling or the like due to the difference in heat shrinkage rate does not occur. .
[0062]
The IC inlet 3 is composed of components including an IC chip 3a and an antenna 3b, and as shown in FIG. 2, the both sides of the IC chip 3a and the antenna 3b of the winding are bonded and stored with a nonwoven fabric 3c. In addition, as shown in FIG. 3, the one in which the IC chip 3a is mounted on the film 3d provided with the circuit of the antenna 3b by printing, etching or the like, and the one in which the chip part and the whole are previously sealed with resin are also employed. it can.
[0063]
As the form of the IC inlet 3, a roll of a long web for one row is used. However, since there is a convex portion of the IC chip, it is preferable to wind it loosely. Moreover, the sheet-like sheet shape or long web-like shape arranged in a plurality of lengths and widths, or those cut out one by one from them can be adopted. The size when cut into one is preferably smaller than the outer shape of the card so as not to adversely affect the cutting during card punching.
[0064]
The adhesive 4 is, for example, a hot melt adhesive, and a reactive hot melt adhesive is particularly preferable. Reactive hot melt adhesive is a type of adhesive that melts and bonds the resin, then absorbs moisture and cures the resin. Later, the softening temperature increases, so it has excellent durability and is suitable for coating at low temperatures. With normal hot melt adhesives, the coating temperature is the same as the softening temperature of the resin, so the heat resistance does not exceed the coating temperature. Therefore, when high heat resistance is required, a high coating temperature is required. Become. On the other hand, since the reactive hot melt adhesive is cured after coating, the heat-resistant temperature becomes several tens of degrees Celsius higher than the coating temperature. Therefore, if the surface of the image receiving layer is a material that is easily damaged at high temperatures, the damage is reduced. be able to.
[0065]
Next, a method for manufacturing an IC card will be described with reference to FIGS. 4 is a flow chart of the IC card manufacturing process, FIG. 5 is a diagram showing the structure of heating and heating, FIG. 6 is a diagram showing the structure of pressurizing with a conveyor, FIG. 7 is a diagram showing the structure of the uncoated part, and FIG. FIG. 4 is a view showing a plate mounting structure.
[0066]
In the supply process A of the first base material 1, the sheets are separated one by one from the stacked sheets and supplied. The upper surface of the sheet is detected and kept constant, and is held and taken out by the suction pad. In this case, it is preferable to have a mechanism that removes static electricity, blows air between layers, scrapes off with a nail, etc., and raises the suction pad at the same time as suction, so as to ensure separation of one sheet.
[0067]
Further, it is preferable that the number of deposits is set to two, and when one of them is eliminated, the line is automatically switched and the line is not stopped.
[0068]
In the adhesive application process B to the first substrate 1, a hot melt adhesive is applied on the first substrate 1 with a predetermined thickness. As a coating method, a normal method such as a die method, a gravure method, or a roll method can be adopted, but the die method is preferable in the following points.
[0069]
In the die method, since the adhesive is sealed until it is applied to the first substrate, temperature control is easy even at a high temperature such as a hot melt adhesive, and in particular, a reactive hot melt adhesive includes humidity. It is advantageous because it does not touch the outside air. Moreover, no foreign matter is mixed in and bubbles are hardly generated.
[0070]
Further, it is classified as a pre-weighing type, and the coating amount is determined by the pump feed amount and the substrate speed, and since there is little change in the liquid physical properties such as viscosity, it is advantageous for ensuring the coating thickness accuracy.
[0071]
The adhesive dissolved in the heating tank is fed to the die through a hose by a pump, and is discharged from the slit outlet 10 a of the die 10. It is preferable to heat the hose and the die so as to keep the temperature constant. The pump feed amount is determined by the pump volume, the rotation speed, and the feed efficiency associated with the pressure loss, and the coating thickness is further determined by the gap between the tip of the die called the lip and the first substrate 1 and the substrate speed. In the case of a reactive hot melt adhesive, it is preferable to purge the heating tank or the like with dry air or nitrogen.
[0072]
When the first substrate 1 is a sheet, it is generally coated on a table, but the sheet is held on a roll and coated in the same manner as a long web. Is preferred. As a method of holding the first base material 1, there is a method of gripping and holding the top, tail and both edges of the base material. This is preferable because the margin is small and the yield is good. The base material sent one by one is positioned, set on a roll at a constant pitch, and coated.
[0073]
Other methods of coating on a single sheet include a method in which single sheets are joined and treated like a long web, and once applied to a release paper, release film, release belt, release roll Although a method of peeling and transferring to a base material is conceivable, consumables are required, and it is necessary to cope with the transfer residue.
[0074]
In addition, it is preferable that the coating is intermittently performed while avoiding the head and tail of the sheet. Intermittent coating is performed by turning on / off the pump that feeds the adhesive to the die or turning on / off the valve provided on the die to temporarily stop the discharge of the adhesive. Since the response is delayed, the valve method is preferable. In that case, since the coating pressure tends to be thicker due to the accumulation of the pump pressure at the top of the coating, pressure is accumulated by using a pump ON / OFF together or providing a circuit for returning the adhesive to the heating tank. It is preferable to prevent this. Also, at the end of coating, even if the valve is turned off, the adhesive remaining at the tip of the die is pulled out and may adhere to the base material. Therefore, when turning off the valve generally called suck back, the adhesive is put into the die. It is preferable to employ a retracting valve mechanism. Further, it is preferable to rotate the roll at a constant speed at least during coating.
[0075]
In the IC inlet supply process C, an intermediate station 20 is provided before placing on the first substrate 1, and the IC inlet 3 is arranged here, and these are collectively sucked and held, and an adhesive is applied. Place on the processed first substrate 1. The IC inlets 3 are positioned one by one before being taken out from the intermediate station 20, but it is more preferable that the first substrate 1 is positioned with reference to edges and printing.
[0076]
When it is arranged in the intermediate station 20, it is not placed at that position based on reading of defect position information given to the first base material 1 or on-line defect inspection information. If there is no defect information, the IC inlet 3 is fed out from the roll winding and cut and sent to the intermediate station 20 in sequence, but if there is defect information, the feeding is stopped at the corresponding timing of only the corresponding column. . Capability is improved by arranging a plurality of rolls and simultaneously processing them in multiple rows. Moreover, it is preferable that the defective IC inlet that is known in advance is removed before being placed on the substrate, or is removed after imparting defect information to the substrate.
[0077]
As another method, a tray-like jig on which the IC inlets 3 are arranged may be stacked, held by suction from there, and placed on the first substrate 1. However, in order to stop the supply of the defective portion, it is necessary to take measures such as not placing the defective portion in advance at the corresponding position of the tray, not sucking and holding the tray, and removing it before sucking and holding.
[0078]
When placing the IC inlet 3 on the first base material 1, there is a method of temporarily stopping the first base material 1, but it is preferable to place the IC inlet 3 in synchronization with the base material to be conveyed at a constant speed. . In addition, it is preferable to place the IC chip while squeezing from one side so that air does not enter, or to place the convex part of the IC chip into the hot melt adhesive. Furthermore, it is preferable to maintain the fluidity and tackiness by heating and keeping the hot melt adhesive by heating and keeping means 21 such as a heater before placing.
[0079]
As a conveying method between the supply of the first base material 1 and the bonding, a suction conveyor, a transfer table, a tray jig, and a base material grip can be considered.
[0080]
In the supply process D of the second base material 2, a long web wound in a roll shape is fed out. In this feeding, the tension and edge position are detected and controlled to be constant.
[0081]
Further, it is preferable that the number of feeds is set to 2 and an accumulator is provided so that the windings are exchanged and joined without stopping the line.
[0082]
In the adhesive coating process E on the second base material 2, the die base is intermittently provided by the die 31 on the second base material 2 held by being held by the roll 30 in the same manner as the first base material 1. Apply.
[0083]
The coating thickness is preferably the same as the coating thickness of the first substrate 1 so that curling due to imbalance between the card front and back surfaces does not occur, and further, the first substrate 1 and the second substrate. 2 or more preferably in consideration of asymmetry due to the IC inlet 3.
[0084]
Although the 2nd base material 2 is a long web and can also be used as continuous coating, it cuts into a sheet form after pasting together as intermittent coating according to the 1st base material 1 which is a sheet. It is preferable that the position to be coated be uncoated because adhesion of the adhesive to the blade can be prevented. A reactive hot melt is particularly preferable because it does not cure immediately.
[0085]
In the laminating step F, the sheet-like sheet-like first base material 1 on which the adhesive is applied and the IC inlet 3 is placed, and the second base material 2 on which the adhesive is applied are rolls 30 and 40. Nip and stick together. Secondly, the nip roll 30 may also be used as a roll for coating the substrate 2 or may be provided separately.
[0086]
The nip rolls may be metal-to-metal or rubber-coated, and the total thickness may be adjusted or the IC inlet embedded in the adhesive by setting the gap of the nip roll, pressing force setting, or a combination thereof. Improve smoothness.
[0087]
Therefore, it is preferable that the hot melt adhesive 41 is heated and heated immediately before the first substrate 1 and the second substrate 2 are bonded together, but the surface of the substrate is easily damaged by the high temperature. Therefore, as shown in FIG. 5, on the hot melt adhesive side, the control unit 42 drives the heat and heat retaining means 41 such as an infrared heater based on the hot melt adhesive temperature information of the temperature sensor S1 to heat and heat. On the other hand, the base material side circulates a heat medium through the temperature controller 43 inside the roll 30, and the controller 44 controls the temperature controller 43 based on the roll temperature information of the temperature sensor S 2 and the heat medium temperature information of the temperature sensor S 3. It is preferable to keep the temperature so as not to exceed a certain temperature (for example, 60 ° C.) by driving.
[0088]
The first base material 1 that is in the form of a single sheet is fed at a constant pitch and bonded to the second base material 2, but this pitch is such that the conveyor pitch in the subsequent process and the card pitch always match. The integer multiple of the card pitch is preferable. In addition, it is preferable to provide a minimum interval between the first base materials 1 so that no waste is generated when the sheet is cut into a sheet after bonding.
[0089]
The tension of the second base material 2 and the sheet tension of the first base material 1 are taken into consideration so as not to cause curling or the like due to the residual stress of the first base material 1 and the second base material 2 after bonding. Is preferably set.
[0090]
In the conveyor heating and pressurizing step G, the bonded product is heated and pressed for a certain period of time, thereby adjusting the total thickness and smoothness, and particularly adjusting the smoothness of the convex portions of the IC chip.
[0091]
This conveyor heating pressurization time is: pressurization time: 10-60 sec, especially 20-30 sec, pressure: 0.2-1 kg / cm². Especially 0.4-0.6kg / cm²Heating temperature: 50 to 100 ° C., particularly 50 to 70 ° C. is preferable because it can prevent adverse effects on the image receiving layer, but can be appropriately determined depending on the physical properties of the adhesive, the pressure resistance of the IC chip, the heat resistance of the substrate surface, and the like. .
[0092]
Further, as shown in FIG. 6, the pressurization is performed by a conveyor 51 that circulates a plate 50 that sandwiches the upper and lower sides of the bonded product of the first base material 1 and the second base material 2.
[0093]
Since the plate 50 has insufficient rigidity due to thickness restrictions, it is preferable that the plate 50 be backed up by the receiving roller 52 to compensate.
[0094]
Ideally, the gap between the plates 50 should be zero, but this is not possible in reality, and the gaps cannot be pressurized, convex, and poor in smoothness, so this part does not appear on the card product. Thus, as shown in FIG. 7, it is preferable that the pitch in the conveyance direction of the plate 50 is the same as the pitch of the card size of the IC card.
[0095]
Furthermore, the thickness accuracy can be improved by intentionally setting the interval so that excess adhesive flows into the lost interval portion. A similar effect can be obtained by cutting out the edge of the plate 50 instead of setting the interval.
[0096]
As another countermeasure, as shown in FIG. 6, it is conceivable to provide an endless belt 53 on the outer side of the conveyor 51 in which the plate 50 circulates.
[0097]
In addition to applying a constant load by a hydraulic cylinder or the like, a method of pressing may be a method of fixing a gap (gap) between the upper and lower plates sandwiching the bonded product. In this case, the conveyor outlet 54a is connected to the conveyor. It is preferable to prevent a large pressure from being applied to the IC chip at the inlet by gradually widening the inlet 54b side.
[0098]
As another pressurizing method, a method of pressing while moving a sheet-fed press device in the conveying direction is conceivable, but the device is an overweight or a method of arranging press rolls in two rows is also conceivable. It is difficult to secure the pressurization time.
[0099]
Further, as a method for attaching the plate 50 to the chain or the like of the conveyor 51 in order to circulate the plate 50, there are methods shown in FIGS. 8 (a), 8 (b) and 8 (c).
[0100]
As shown in FIG. 8A, when the plate 50 is fixed to the chain 60 by the plate support shaft 61, when the plate 50 that circulates while pressing starts to sandwich the bonded product 70 at the conveyor inlet, When opening at, the straight plate 50 circulates in a curved line (arc), so that the portions 50a and 50b of the plate 50 jump over the conveying line and are locally excessive in the bonded product 70. May cause excessive pressure or damage. It can be mitigated by increasing the curvature, but it is difficult to eliminate the effect.
[0101]
For this reason, as shown in FIG. 8B, it is preferable that the plate 50 is rotatably supported with respect to a plate support shaft 62 parallel to the drive shaft of the conveyor 51 provided in the chain 60. In this embodiment, the plate 50 that circulates while being pressurized rotates around the plate support shaft 62 and escapes from the conveyance line, and excessive pressure or local damage is not applied to the bonded product 70. . Further, the sandwiched portion can be backed up and pressurized by the receiving roller 52.
[0102]
Further, as shown in FIG. 8C, the upper conveyor 51a and the lower conveyor 51b constituting the conveyor are shifted in the transport direction, and the lower conveyor 51b on the side where the entrance of the conveyor is located downstream is a plate. The upper conveyor 51a is supported by the plate support shaft 62 at the leading end of the plate 50, and the rear conveyor side of the plate 50 is supported by the plate support shaft 62 at the upstream side. In this embodiment, as long as the plate 50 that circulates while being pressed sandwiches the bonded product 70, the plate 50 does not jump out of the conveyance line, and locally excessive pressure is applied to the bonded product 70. It won't be damaged or scratched.
[0103]
Further, as a heating method, there are a method of directly heating the plate 50 with infrared rays or a method of conducting conductive heating with a heater, but the method of providing the conveyor 51 in an atmosphere in which hot air is blown and circulated has a stable temperature.
[0104]
In the conveyor cooling and pressing step H, since it is likely to be deformed at a high temperature immediately after heating and pressurization, smoothness may be deteriorated with the passage of time due to residual stress, and thus cooling is preferable. Although there is also a method using only cooling air, it is more preferable to cool while pressurizing with the conveyor 61 as in the case of heating and pressurizing.
[0105]
Pressurization is performed in the same manner, and cooling is performed by blowing and circulating outside air or cold air instead of hot air.
[0106]
Adhesive coating to the first base material 1 and the second base material 2 is performed in the adhesive coating process B and the adhesive coating process E. In the conveyor heating and pressing, the unevenness is averaged. Although it is possible, it is difficult to correct the one with an excessive average thickness. For this reason, as shown in FIG. 7, as a countermeasure, it is preferable to provide a non-coating portion 70 at a position corresponding to the outside of the card punching outline at the time of coating so that excess adhesive flows there. .
[0107]
A part of the die slit outlet may be blocked to discharge the adhesive, and uncoated parts may be provided at wide intervals, or the adhesive may be discharged intermittently from the die, leaving the uncoated part in the transport direction. You may provide, and you may provide the non-coating part of both of them. The pitch of the uncoated portion is preferably one card, but may be thinned out every few cards.
[0108]
Furthermore, it is more preferable that this non-coated part is a gap penetrating the outside air in the bonded product because the gas generated during the reaction of the reactive hot melt can be released.
[0109]
In the sheet cutting step I, since the bonded product of the first base material 1 and the second base material 2 cannot be wound up, it is cut into a sheet shape by the cutter unit 80. Cutting is preferably performed without bending the bonded product. The cutter unit that engages the upper and lower blades, the cutter unit that runs the NT cutter and the receiver in the width direction, and the dish-shaped blade and the receiver in the width direction. The method can be selected from general methods such as a method for synchronizing the traveling cutter unit with the conveyance of the bonded product, and a method for synchronously rotating the bonded product with a rotary cutter provided with a blade on the drum outer cylinder.
[0110]
Moreover, it is preferable to cut | disconnect a cutting | disconnection position in the space | interval part provided between the 1st base materials at the time of bonding so that there may not be waste. Since the non-coated part has no adhesive, it does not adhere to the blade.
[0111]
In the accumulation and storage process J, a predetermined number of cut sheets are accumulated. Inserting a metal plate 90 such as SUS at an interval of 1 to 10 bonded products of the first substrate 1 and the second substrate 2 and adding the unevenness of the bonded product itself to inhibit smoothness. It is preferable to prevent. Supply of the metal plate 90 such as SUS can be performed in the same manner as in the case of the first base material, although there is a difference depending on the rigidity.
[0112]
Moreover, it is preferable that the deposition of the laminated product and the deposition of the supply of the metal plate 90 such as SUS are two types and can be switched without stopping the line. In addition, when a reactive hot melt adhesive is used, the laminated product deposited with the metal plate 90 such as SUS is preferably stored under air-conditioned conditions for about one week required for the reaction. The air conditioning conditions and the storage period can be appropriately determined according to the adhesive specifications and the like.
[0113]
In the card forming process K, the bonded product of the first base material 1 and the second base material 2 is cut to a predetermined size by cutting one to four sides based on the edge or printing of the first base material 1. After that, the standard printing is performed on the second base material 2 side by the printing machine 91, and the card is punched out by the punching machine 92. The regular printing on the second substrate 2 side may be printed for each card after punching.
[0117]
【The invention's effect】
  As stated above, the claims1In the invention described in (1), coating accuracy similar to that of a long web can be obtained even with a single sheet, and there is no reciprocation or acceleration / deceleration compared to the case of using a table, which is advantageous in terms of performance.In addition, heating and pressurization is possible while continuously transporting, there is no need to intermittently perform pre-processes such as coating, and by increasing the length of the conveyor, there is no need to reduce the line speed even if the heating and pressurization time is long. Heating and pressing can be performed with a relatively simple mechanism. Furthermore, the pressure applied to the bonded product can be made uniform between the entrance and the exit of the conveyor, and the allowable pressure resistance required for the IC chip inside the product can be reduced.
[0118]
  Claim2In the invention described in (1), since the plate circulating while rotating rotates and escapes, excessive pressure is not locally applied to the bonded product or scratches are not made.
[0119]
  Claim3In the invention described in the above, the plate does not pop out of the conveying line while the plate that circulates under pressure sandwiches the bonded product, and excessive pressure is applied locally to the bonded product or scratches. I will not be able to.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC card.
FIG. 2 is a cross-sectional view of an IC card.
FIG. 3 is a cross-sectional view of another embodiment of an IC card.
FIG. 4 is a flow chart of an IC card manufacturing process.
FIG. 5 is a diagram showing a heating and heating structure.
FIG. 6 is a diagram showing a structure in which pressure is applied by a conveyor.
FIG. 7 is a view showing a structure of an uncoated portion.
FIG. 8 is a view showing a plate mounting structure.
[Explanation of symbols]
1 First base material
2 Second base material
3 IC inlet
4 Adhesive
A Supplying process of the first base material 1
B Adhesive application process to the first base material 1
C IC inlet supply process
D Second substrate 2 supplying step
E Adhesive coating process on the second substrate 2
F Lamination process
G Conveyor heating and pressurizing process
H Conveyor cooling and pressurization process
I Sheet cutting process
J Accumulation storage process
K card production process

Claims (3)

In the method for manufacturing an IC card, an IC inlet made of a component including an IC chip and an antenna is interposed between the first base material and the second base material and bonded together with an adhesive.
The adhesive is applied by applying to the first base material and the second base material,
At least one of the first base material and the second base material is in the form of a sheet,
Holding the sheet-like base material on a roll and applying it,
After the IC inlet is placed and bonded between the first base material and the second base material, a conveyor that circulates a plate sandwiching the first base material and the second base material is used. Heat and pressurize while carrying continuously,
A method for manufacturing an IC card, characterized in that the interval between the plates is wider on the conveyor entrance side than the conveyor exit . 2. The IC card manufacturing method according to claim 1 , wherein the plate is supported so as to be rotatable with respect to an axis parallel to the drive shaft of the conveyor. The upper conveyor and the lower conveyor constituting the conveyor are shifted in the transport direction,
The conveyor on the side where the entrance of the conveyor is located downstream is supported on the leading side of the plate,
Side of the conveyor where the outlet of the conveyor is located upstream, IC card manufacturing method according to claim 1 or claim 2, characterized in that it is supported tail side of the plate.

Images