JP2005173767A - Method and apparatus for manufacturing ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing an IC card such that a 1st base material and an IC module are precisely positioned and accurately bonded together. <P>SOLUTION: The 1st surface of the sheet type IC module 3 having an IC chip and a winding coil formed on a base is placed on an adhesive layer 4A on the 1st base material 1A and bonded, and then the 2nd surface of the IC module 3 is coated with a 2nd base material 2 by bonding to form the IC card A. The IC module 3 is carried at a conveying speed synchronized with the conveying speed of the 1st base material 1A which is continuously conveyed, and placed and bonded at a specified position on the adhesive layer 4A applied over the surface of the 1st base material 1A. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an IC card manufacturing method and an IC card manufacturing apparatus, and in particular, after a first surface of a sheet-like IC module comprising an IC chip and a winding coil is mounted on a first substrate and bonded, The present invention relates to an IC card manufacturing method and an IC card manufacturing apparatus for forming a card by adhesively coating a second surface of a module with a second base material.

  The IC card is used, for example, to prove an individual's identity such as an employee ID card, student ID card, or introductory ID card. Such an IC card includes an IC chip and a sheet-like IC module having a winding coil (antenna), a first base material having a face image and description information, and a second base material having description items and precautions. There are some which are formed by sealing between and pressurizing and heating.

  The IC card production method described in Patent Document 1 relates to a method of manufacturing an IC web composed of a top sheet, an IC chip enclosed in a back sheet, and an antenna, and is continuous between the top sheet original web and the back sheet original web. A rolled IC web is encapsulated and conveyed, pressed, heated, and bonded, and then cut to create an IC card (paragraph numbers 0092 to 0096 and FIG. 3). Further, in this continuous conveyance method, a continuous IC web is bonded to the top sheet and the back sheet, cut and formed into a sheet shape, and if a printing defect occurs, it is removed after the cutting process.

The IC card manufacturing method described in Patent Document 2 is an IC card manufacturing method in which an IC module composed of components including an IC chip and an antenna is interposed between a first base material and a second base material. , The IC module is positioned and placed on one of the first substrate and the second substrate that have been printed on the outer surface in advance, and the other substrate that has not been printed on the outer surface is bonded together After that, printing is performed on the non-printed surface of the other substrate.
JP-A-11-216973 JP 2003-30618 A

  In the IC card production method described in Patent Document 1, an IC module source web in which a plurality of IC modules are formed in a roll shape is supplied between a rolled front sheet base web and a back sheet base web, and a resin layer is formed. After interposing and adhering, the sheet is cut and formed into a sheet shape, enclosed in a front sheet and a back sheet, and defective printing portions are eliminated after lamination.

  Such IC cards are subjected to fine printing such as digital watermark printing and holograms for the purpose of preventing forgery and alteration, but such printing may cause defective products and enclose the IC unit. Then, the IC card is discarded after pasting and cutting, and there is a problem that the cost is increased.

  In the IC card manufacturing method described in Patent Document 2, the first surface of a sheet-like IC module in which an IC chip and a winding coil are formed on a support is applied to the adhesive layer on the sheet-like first substrate. An accurate positioning method of the first base material and the IC module at the time of mounting and a reliable adhesion method of the first base material and the IC module are not disclosed.

  An object of this invention is to provide the IC card manufacturing method and IC card manufacturing apparatus which position the 1st base material and an IC module accurately, and adhere | attach correctly.

  The present invention is achieved by an IC card having the configuration described below and an IC card manufacturing method.

  (1) A first surface of a sheet-like IC module in which an IC chip and a winding coil are formed on a support is placed on and bonded to an adhesive layer on a first substrate, and then the second IC module In the IC card manufacturing method of forming the IC card by adhesively coating the surface with the second base material, the IC module is transported at a transport speed synchronized with the transport speed of the first base material that is continuously transported, A method of manufacturing an IC card, comprising: positioning, mounting and adhering to a predetermined position on an adhesive layer applied on a surface of a first substrate.

  (2) After placing and bonding the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support on the adhesive layer on the first substrate, the second of the IC module In the IC card manufacturing method of forming the IC card by adhesively coating the surface with the second base material, the IC module is transported at a transport speed synchronized with the transport speed of the first base material that is continuously transported, After positioning and mounting at a predetermined position on the adhesive layer applied on the surface of the first substrate, the non-adhesive surface side of the IC module is pressed by a rotatable pressing means, and the IC module A method of manufacturing an IC card, wherein the entire surface of the IC module is bonded to the first substrate with the adhesive by moving from one side to the other.

  (3) After placing and bonding the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support on the adhesive layer on the first substrate, the second of the IC module In an IC card manufacturing apparatus for forming an IC card by adhesively coating a surface with a second base material, a suction means for sucking and holding the IC module, and a first base material for continuously conveying the first base material Holding and conveying the IC module at a conveyance speed synchronized with the conveyance speed of the first substrate, lowering the suction means and the IC module conveyance means, And an elevating means for placing the IC module at a predetermined position on the adhesive layer applied on the surface of the first substrate.

  (4) After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed on and bonded to the adhesive layer on the first substrate, the second IC module In an IC card manufacturing apparatus for forming an IC card by adhesively coating a surface with a second base material, a suction means for sucking and holding the IC module, and a first base material for continuously conveying the first base material Holding and conveying the IC module at a conveyance speed synchronized with the conveyance speed of the first substrate, lowering the suction means and the IC module conveyance means, Elevating means for placing the IC module at a predetermined position on the adhesive layer applied on the surface of the first base material, and moving the non-adhesive surface side of the IC module from one side to the other, so that the IC Module IC card manufacturing apparatus characterized by comprising: a pressing means for adhering the surface on the first substrate, the.

  (5) Partition means for blocking the IC module adhesion mechanism portion comprising the suction means, first substrate gripping and conveying means, IC module conveying means, lifting and lowering means, and pressing means from outside air, and the atmosphere in the partition means is atmospheric pressure The IC card manufacturing apparatus according to (3) or (4), further comprising: a pressure reducing unit that makes the pressure higher than the suction pressure of the suction unit.

  (6) After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed on and bonded to the adhesive layer on the first substrate, the second IC module In an IC card manufacturing apparatus for forming an IC card by adhesively coating a surface with a second base material, a suction means for sucking and holding the IC module, and a first base material for continuously conveying the first base material Holding and conveying means, IC module conveying means for holding and conveying the IC module at a conveyance speed synchronized with the conveyance speed of the first substrate, and arrival of the first substrate for detecting the conveyance position of the first substrate On the surface of the first base material, the detecting means, the connecting means for connecting the first base material gripping transport means and the IC module transport means, the suction means and the IC module transport means are lowered. On the applied adhesive layer Elevating means for placing the IC module at a fixed position; control means for controlling driving of the first base material gripping and conveying means; the IC module conveying means and the elevating means; After the detection means detects that the first base material being transported continuously has been transported to a predetermined position, driving of the IC module transport means is started, and transport of the first base material gripping transport means When the speed and the transport speed of the IC module transport means coincide, the first base material grip transport means and the IC module transport means are connected and integrated by the connecting means, and the IC module is mounted by the suction means. An IC card manufacturing apparatus, wherein the IC card manufacturing apparatus is held and lowered by the elevating means, and is placed on and adhered to the first base material.

  (7) After placing and bonding the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support on the adhesive layer on the first substrate, the second of the IC module In an IC card manufacturing apparatus for forming an IC card by adhesively coating a surface with a second base material, first base material gripping and transporting means for gripping and continuously transporting the first base material, and the first base material Positioning means for positioning the first substrate holding and conveying means, and control means for controlling the driving of the first substrate holding and conveying means. The first base material is pre-positioned by the positioning means until the front end of the first base material abuts against the surface and the IC module is placed on the surface of the first base material. The positioning means and the first substrate gripping and conveying means. IC card manufacturing apparatus characterized by.

  (8) After placing and bonding the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support on the adhesive layer on the first substrate, the second of the IC module In an IC card manufacturing apparatus for forming an IC card by adhesively coating a surface with a second base material, the first base material is gripped and continuously conveyed, and the leading end portion in the transport direction of the first base material is abutted Driving a first base material gripping and conveying means having a reference surface, a first base material sending means for sandwiching and feeding the first base material, and driving of the first base material gripping and transporting means and the first base material sending means Control means for controlling, the control means abuts the front end of the first base material in the transport direction against the reference surface of the front end of the first base material gripping transport means, and the IC module The first base material is fed before being placed on the surface of the first base material. IC card manufacturing apparatus characterized by controlling the first base material delivery means and the first base material grip transport unit as previously positioned by the stage.

  (9) After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed on and bonded to the adhesive layer on the first substrate, the second IC module In an IC card manufacturing apparatus for forming an IC card by adhesively coating a surface with a second base material, the first base material is gripped and continuously conveyed, and the leading end portion in the transport direction of the first base material is abutted A first substrate holding and conveying means having a reference surface; a width direction regulating means for regulating a width direction parallel to the conveying direction of the first substrate; the first substrate holding and conveying means; and the width direction regulating means; Control means for controlling the driving of the first base material by the width direction regulating means before gripping the first base material by the first base material gripping and transporting means. The first base material gripping and conveying means and the width direction regulation so as to perform positioning in the direction. IC card manufacturing apparatus characterized by control means.

  (10) After placing and bonding the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support on the adhesive layer on the first substrate, the second of the IC module In an IC card manufacturing apparatus for forming an IC card by adhesively coating the surface with a second base material, a first base material gripping and transporting means for gripping and continuously transporting the first base material, and suctioning the IC module Holding means, suction means holding means for holding the suction means movably, IC module transport means for holding the suction means holding means movably, the suction means and the IC module transport means Elevating means for elevating and lowering, first moving means for moving the IC module conveying means to the downstream side in the conveying direction of the first base material, and the suction means holding means on the upstream side in the conveying direction of the first base material The IC module is placed on the adhesive layer on the surface of the first base material by synchronizing the second moving means to be moved, the transport speed of the first base material gripping transport means and the transport speed of the IC module transport means. A first base material arrival detecting means for placing; a synchronization detecting means for detecting synchronization between the transport speed of the IC module and the transport speed of the first base material; the first base material gripping transport means; Connecting means for connecting the IC module conveying means, the first substrate gripping conveying means, suction means, lifting means, first moving means, second moving means, first substrate arrival detecting means, synchronization detecting means, connection Control means for controlling the drive of the means, and the control means moves the IC module transport unit in the transport direction of the first base material by detecting the positioning of the first base material by the first base material arrival detection means. Start to move downstream, before It is confirmed that the first base material and the IC module are synchronized by the transport speed measuring means and the synchronization detecting means, and the first base material gripping and transporting means is driven by the connecting means by driving the first moving means. And the IC module conveying means, and then the suction means is lowered by the elevating means, and the IC module is placed on the adhesive layer on the first substrate. .

  The IC card manufacturing apparatus according to (4) or (5), wherein the pressing means includes a pressing roller formed of foamed silicone rubber.

  The following effects can be obtained by the IC card manufacturing method and IC card manufacturing apparatus of the present invention.

  According to the first aspect of the present invention, the IC module is transported at a transport speed synchronized with the transport speed of the first base material that is continuously transported, and is applied on the surface of the first base material. Since the IC module is mounted on the predetermined position and bonded, the IC module is accurately positioned and bonded on the first substrate. Further, productivity is improved by continuously conveying the first base material without stopping and bonding the IC module.

  According to the invention described in claim 2, the pressing means presses the non-adhesive surface side of the IC module and moves it while squeezing from one side to the other side of the IC module so as to move to the first substrate surface. By adhering the entire surface of the IC module with an adhesive, no air residue is generated in the adhesive layer when the IC module is adhered, and when the IC card is manufactured, card swelling due to the air residue is prevented. .

  According to the third and fourth aspects of the invention, the first base material gripping and transporting means grips and continuously transports the first base material, and the suction means sucks and holds the IC module while the IC module transporting means. The IC module is held and transported at a transport speed synchronized with the transport speed of the first base material, and the first base material and the IC module are moved by the lifting / lowering means in a state where the relative speed between the first base material and the IC module becomes zero. The IC module is accurately positioned and bonded onto the first substrate by lowering and placing the IC module at a predetermined position on the adhesive layer applied on the surface. Further, productivity is improved by continuously conveying the first base material without stopping and bonding the IC module.

  According to the invention described in claim 5, the decompression means shuts off the IC module adhesion mechanism portion from the outside air, and makes the atmosphere in the partition means less than atmospheric pressure and higher than the suction pressure of the suction means. Bubble generation in the layer is reduced.

  According to the invention described in claim 6, after the control means detects that the first base material, to which the detection means is continuously conveyed, has been conveyed to a predetermined position, it starts driving the IC module conveyance means, 1 When the conveying speed of the substrate holding and conveying means and the conveying speed of the IC module conveying means coincide, the first substrate holding and conveying means and the IC module conveying means are connected and integrated by the connecting means, and the IC is connected by the suction means. By holding the module and lowering it by the lifting means and placing it on the first substrate and bonding it, the IC module is accurately positioned and bonded on the first substrate. Further, productivity is improved by continuously conveying the first base material without stopping and bonding the IC module.

  According to the seventh aspect of the present invention, the control means causes the leading end of the first base material to abut the reference surface of the first base material gripping and transporting means, and the IC module is placed on the surface of the first base material. By doing so, the positioning between the IC module and the first base becomes more accurate by controlling the first base to be positioned in advance by the positioning means.

  According to an eighth aspect of the present invention, the control means causes the leading end of the first base material to abut on the reference surface of the first base material gripping and transporting means, and the IC module is placed on the surface of the first base material. By doing so, the positioning between the IC module and the first base becomes more accurate by controlling the first base so as to be positioned in advance.

  According to the ninth aspect of the present invention, the control means controls the first base material in the width direction to be positioned by the width direction restricting means before gripping the first base material by the first base material gripping and transporting means. By doing so, the positioning of the IC module and the first substrate becomes more accurate.

  According to the invention described in claim 10, the control means starts moving the IC module transport means in the transport direction of the first base material by detecting the positioning of the first base material by the first base material arrival detection means, and measures the transport speed. The first base material and the IC module are confirmed to be synchronized by the means and the synchronization detection means, and the first base material gripping transport means and the IC module transport means are connected by the connecting means by driving the first moving means. After connecting, by lowering the suction means by the elevating means, and placing the IC module on the adhesive layer on the first substrate, the positioning of the IC module and the first substrate becomes accurate, Adhesion between the IC module and the first base material is ensured, and the shortening of the manufacturing process and the improvement of the adhesion accuracy are achieved.

  According to the eleventh aspect of the present invention, the pressing roller formed of foamed silicone rubber effectively pushes out bubbles when the IC module is pressed and bonded to the hot melt layer. Further, the pressure roller made of foamed silicone rubber is effective in preventing adhesion of the hot melt layer to the adhesive.

  Hereinafter, the IC card and the IC card manufacturing method of the present invention will be described in detail with reference to the drawings.

[IC card]
FIG. 1 shows an employee card as an example of an IC card according to the present invention, FIG. 1 (a) is a front view of the IC card, and FIG. 1 (b) is an exploded perspective view of the IC card. 2A is an exploded sectional view of the IC card, FIG. 2B is a sectional view of the IC card, and FIG. 2C is a front view of the sheet-like IC module of the IC card.

  The IC card A is pasted with an adhesive by interposing a sheet-like IC module (hereinafter referred to as an IC module) 3 between a first base material (front sheet) 1 and a second base material (back sheet) 2. Manufactured together.

  On the front side of the first substrate 1, personal information B1, such as the cardholder's personal identification number, name, address, date of birth, etc., cardholder face photo information B2, card issuance date, valid Character information B3 such as a time limit and personal identification information B4 such as digital watermark printing and holograms are formed.

  A writing layer or a printing layer is formed on the surface side of the second substrate 2.

  The support of the first base material 1 and the support of the second base material 2 are formed of a resin material such as polyethylene terephthalate (PET) having a thickness of 50 to 250 μm.

  The IC module 3 includes an IC chip 3C, a winding coil (antenna) between a first nonwoven fabric (first support) 3A and a second nonwoven fabric (second support) 3B made of a translucent insulating sheet. It is formed by interposing 3D and protective plate 3E and heat sealing with resin.

  The IC module 3 is formed between an adhesive layer (hot melt layer) 4A applied to the back side of the first substrate 1 and an adhesive layer (hot melt layer) 4B applied to the back side of the second substrate 2. The IC module 3 is interposed between the two by hot melt treatment.

  The outer shape of the IC module 3 is formed smaller than the outer shape of the IC card A, and the peripheral area between the outer periphery of the IC module 3 and the outer shape of the IC card A is firmly bonded by the adhesive layers 4A and 4B.

  The hot melt adhesive forming the adhesive layers 4A and 4B is preferably a reactive hot melt adhesive. Since the reactive hot melt adhesive has high durability and is suitable for application at low temperature, if the surface of the image receiving layer is a material that is easily damaged at high temperature, the damage can be reduced.

  In addition, when using a resin film instead of the first nonwoven fabric 3A and the second nonwoven fabric 3B, the outer shape of the resin film is formed larger than the outer shape of the IC card A, and cut with the IC card A after the bonding process. It is formed on the IC card A having a predetermined size.

[IC card manufacturing process]
The IC card manufacturing process will be described with reference to the schematic diagram of FIG.

<First substrate supply process P1>
In the first base material supply step P1, sheet-by-sheet first base material aggregate sheets 1A in which a plurality of first base materials 1 are assembled are collected one by one by a feeding means (not shown) from a storage box in which 100 to 2000 sheets are accumulated. Separated and supplied. The upper surface of the first base material assembly sheet 1A is detected and maintained constant, and is held and taken out by a suction pad (not shown).

  Also, two storage boxes for depositing the first base material assembly sheet 1A are provided, and when the first base material assembly sheet 1A disappears in one storage box, the line is automatically switched to supply the other storage box. Do not let it.

<First substrate adhesive coating process P2>
In the first base material adhesive coating step P2 on the first base material assembly sheet 1A, a hot melt adhesive is applied on the first base material assembly sheet 1A with a predetermined thickness. As a coating method, a normal method such as a die method, a gravure method, or a roll method can be adopted.

  In the die method, since the adhesive is sealed until it is applied to the first base material assembly sheet 1A, temperature management is easy even at a high temperature such as a hot melt adhesive, and particularly in a reactive hot melt adhesive, This is advantageous because it does not come into contact with outside air having humidity. Moreover, no foreign matter is mixed in and bubbles are hardly generated.

  The adhesive dissolved in the heating tank is fed to the die 21 through a hose by a pump and discharged from the slit outlet 21 a of the die 21.

  As a method of holding the first base material aggregate sheet 1A, there is a method of gripping and holding the front end, rear end, and both edge edges of the base material, but the entire surface of the first base material aggregate sheet 1A is sucked and held by the suction roll 22. As for the method, the margin of the outer edge of the first base material assembly sheet 1A is small and the yield is good.

<Original winding module supply cutting process P3>
In the original winding module supply cutting step P3, a long original winding IC module (hereinafter referred to as the original winding module) 5 is transported by the feeding means, cut by the cutting means (cutter unit) 12, and single wafers. Thus, the IC module 3 is formed.

<Sheet IC module supply process P4>
In the IC module supply process P4, an intermediate station 30 for placing the IC module 3 on the first base material assembly sheet 1A is provided, and the IC module 3 is disposed here, and these are collectively sucked and held. Is placed on the first base material assembly sheet 1A. The IC modules 3 are positioned one by one before being taken out from the intermediate station 30, but the first base material aggregate sheet 1A is also positioned with reference to the outer edge or the edge of the printed portion.

  When the IC module 3 is arranged in the intermediate station 30, the IC module 3 is placed at the position based on the reading of the defect position information previously given to the first base material assembly sheet 1A or the information on the defect inspection online. Do not. If there is no defect information, the IC module 3 is fed out from the roll-shaped original roll, cut, and sequentially sent to the intermediate station 30.

  As a conveying method between the supply of the first base material assembly sheet 1A and the bonding, there is a method using a suction conveyor or the like.

<Sheet IC module adhesion process P5>
When placing the IC module 3 on the first base material aggregate sheet 1A, there is a method of temporarily stopping the first base material aggregate sheet 1A, but in synchronization with the first base material aggregate sheet 1A that is conveyed at a constant speed. However, it is preferable to place it. Moreover, it mounts, squeezing from one side so that air may not enter, or it mounts so that the convex part of IC chip 3C may be pushed in to a hot-melt-adhesive. Further, the hot melt adhesive is heated and kept warm by the heating and keeping means 23 such as a heater before placing to maintain fluidity and tackiness. Details of the sheet-like IC module bonding step P5 will be described later with reference to FIG.

<Second base material supply step P6>
In the second base material supply step P6, a long second base material aggregate sheet 2A that is gathered from a plurality of second base materials 2 and wound in a roll shape is fed out, and in this feeding, the tension and edge position are detected and fixed. To control.

<Adhesive coating process P7>
In the adhesive coating process P7 on the second base material aggregate sheet 2A, the die is applied on the second base material aggregate sheet 2A held by being held by the nip rolls 42 in the same manner as the first base material aggregate sheet 1A. 40, intermittent coating.

  The second base material aggregate sheet 2A is cut into a sheet shape after being bonded as an intermittent coating in accordance with the first base material aggregate sheet 1A, which is a single wafer sheet. The adhesion of the adhesive can be prevented. A reactive hot melt is particularly effective because it does not cure immediately.

<Lamination process P8>
In the bonding step P8, the first base material assembly sheet 1A in the form of a single wafer on which the adhesive is applied and the IC module 3 is placed, and the second base material assembly sheet 2A on which the adhesive is applied are nip rolls 42, Nipped at 43 and pasted together. The nip roll 42 may also serve as a roll for coating the second base material aggregate sheet 2A, or may be provided separately.

  The nip rolls 42 and 43 may be metal-to-metal or one may be rubber-coated. By combining the nip rolls 42 and 43, by adjusting the gap setting, the pressure setting, or the total thickness thereof, The smoothness is adjusted by embedding the IC module 3 in the adhesive.

  Therefore, the hot melt adhesive 41 is heated and kept warm by the heating and keeping means 41 immediately before the first base material gathering sheet 1A and the second base material gathering sheet 2A are bonded together. On the other hand, on the surface side of the first base material assembly sheet 1A and the second base material assembly sheet 2A, a heat medium is circulated in the nip roll 42 via a temperature controller, so that the roll temperature information of the temperature sensor and the heat medium temperature of the temperature sensor. Based on the information, the controller controls the temperature controller to keep the temperature so as not to exceed a certain temperature (for example, 60 ° C.).

  The first base material aggregate sheet 1A in the form of a single sheet is fed at a constant pitch and bonded to the second base material aggregate sheet 2A. The feed pitch of the conveyor and the card feed pitch in the subsequent process are as follows. Is an integral multiple of the card feed pitch. Further, a minimum interval is provided between the first base material assembly sheets 1A so that no waste is generated when the sheet is cut into a sheet shape after being bonded.

  The tension of the second base material aggregate sheet 2A, the first base material aggregate sheet, and the first base material aggregate sheet 1A and the second base material aggregate sheet 2A after bonding are considered so as not to cause curling due to residual stress. Set the 1A sheet tension.

<Conveyor heating pressurization process P9>
In the conveyor heating and pressing step P9, the total thickness and smoothness are further adjusted by heating and pressing the bonded product of the first base material aggregate sheet 1A and the second base material aggregate sheet 2A for a certain period of time, particularly the IC chip 3C. Adjust the smoothness of the convex part.

  Pressurization by this conveyor heating and pressurization is performed by a conveyor 50 in which a plurality of plates sandwiching the upper and lower sides of a bonded product of the first base material aggregate sheet 1A and the second base material aggregate sheet 2A circulate.

  In addition, as a heating method, there is a method in which the conveyor 50 is directly radiantly heated by infrared rays or conductively heated by a heater. preferable.

<Conveyor cooling pressurization process P10>
In the conveyor cooling and pressing step P10, since the bonded product immediately after heating and pressing is likely to be deformed at high temperature, there is a possibility that the smoothness may deteriorate over time due to residual stress. It is preferable to cool while pressing with the conveyor 60 as in the case of heating and pressing.

<Sheet cutting step P11>
In the sheet cutting step P11, the bonded product of the first base material aggregate sheet 1A and the second base material aggregate sheet 2A is cut into a sheet shape by the cutter unit 70 or wound up. The cutting position in the case of cutting | disconnects cut | disconnects by the space | interval part provided between 1 A base material assembly sheets 1A at the time of bonding so that there may be no waste. Since the non-coated part has no adhesive, it does not adhere to the blade.

<Integrated storage process P12>
In the accumulating and storing step P12, a predetermined number of cut bonded products are accumulated. It is preferable that the stacking of the bonded products is performed in two sets, and can be switched without stopping the line.

<Card making process P13>
In the card forming step P13, the bonded product of the first base material aggregate sheet 1A and the second base material aggregate sheet 2A is cut into four sides based on the edge or printing of the first base material aggregate sheet 1A. After the dimensions, the standard printing is performed on the second base material aggregate sheet 2 </ b> A side by the printing machine 80, and punched out into a card by the punching machine 90. The regular printing on the second base material assembly sheet 2A side may be printed for each card after punching.

[Positioning and bonding of first substrate and IC module]
<Conveying and aligning the first base material>
4A is a plan view showing the first base material gripping and conveying means 33 and the IC module conveying means 363 of the intermediate station 30, and FIG. 4B is a front view. FIG. 5A is a plan view showing a positioning state of the first base material 1 by the first base material gripping and conveying means 33, and FIG. 5B is a front view.

  A first base material assembly sheet (hereinafter referred to as a first base material) 1A to which an adhesive has been applied in the adhesive coating process P2 (see FIG. 3) of the intermediate station 30 is a first roller composed of a pair of rollers. A non-coating portion is sandwiched and conveyed by a substrate feeding means (hereinafter referred to as a feeding roller) 31 and a rotating conveyor belt 32.

  The two clamp conveyors 33A disposed on both side edges of the wide conveyor belt 32 on which the first base material 1A can be mounted are rotated at the same peripheral speed as the first base material 1A.

  The leading end of the first substrate 1A in the conveying direction comes into contact with the leading end reference member 33D fixed to the rotating clamp conveyor 33A, and the rotating feed roller 31 presses the trailing end of the first substrate 1A in the conveying direction. Tip alignment is performed.

  Next, the pressure contact by the delivery roller 31 is released, and the first substrate 1A becomes movable. In this state, the width aligning movable member 34B of the width direction regulating means 34 moves in the width direction and presses the side edge portion in the width direction of the first base material 1A, so that the opposite side edges of the first base material 1A are opposed. The portion is brought into contact with the width alignment reference member 34A to perform width alignment.

  In FIG. 4B, the IC module adhesion mechanism portion of the intermediate station 30 including the suction unit 361, the first substrate gripping and conveying unit 33, the IC module conveying unit 36, and the like is blocked from the outside air by the partition unit 300. The pressure in the partition means 300 is adjusted by the pressure reducing means 301 so as to be maintained at a pressure lower than atmospheric pressure and higher than the suction pressure of the suction means 361.

<Conveyance of first base material and IC module>
The first substrate gripping and conveying means 33 includes a clamp conveyor 33A, a plurality of gripping members (grippers) 33B fixed to the clamp conveyor 33A, a connecting recess member 33C, and a tip reference member 33D. The gripping member 33B grips the non-application portion at the edge in the width direction of the first base material 1A that has been aligned with the front end and continues the conveyance of the first base material 1A.

<Synchronous conveyance process of first base material and IC module>
FIGS. 6A and 6B are front views showing a synchronous transport process of the first base material gripping transport means 33 and the IC module transport means 363. FIG.

  The IC module transport unit 36 includes a suction unit 361 that sucks and holds the IC module 3, a suction unit holding unit 362 that holds the suction unit 361 movably, and an IC module that holds the suction unit holding unit 362 movably. Conveying means 363, elevating means 364 for raising and lowering IC module conveying means 363, first moving means 365 for moving IC module conveying means 363 downstream in the conveying direction of first substrate 1A, and suction means holding means 362 The first base material 1A is synchronized with the second moving means 366 for moving the first base material 1A upstream in the transport direction, the transport speed of the first base material gripping transport means 33 and the transport speed of the IC module transport means 363. First substrate arrival detection means 35 for placing the IC module 3 on the adhesive layer 4A formed on the surface of the substrate, and the IC module 3 It is comprised from the synchronous detection means 37 which detects the synchronization with the conveyance speed of the 1st base material 1A, and the connection convex member 367 which connects the 1st base material holding | grip conveyance means 33 and the IC module conveyance means 363. ing.

  When the passage of the tip of the first base material 1A transported by the first base material grip transport means 33 is detected by the first base material arrival detection means 35, the IC module transport means 363 of the IC module transport unit 36 The first moving means 365 starts moving in the direction of the white arrow parallel to the conveying direction of the first base material 1A (see FIG. 6A).

  A conveyance speed measuring means (not shown) measures the conveyance speed of the conveyance speed of the first base material 1A, and the synchronization detection means 37 confirms that the conveyance speed of the first base material 1A matches the movement speed of the suction means holding means 362. When detected, the IC module transport unit 36 is lowered by the lifting means 364. The leading end portion of the connecting convex member 367 fixed to the IC module transporting unit 363 is fitted and connected to the concave portion of the connecting concave member 33C fixed to the clamp conveyor 33A of the first base material gripping transporting unit 33. The connecting concave member 33C and the connecting convex member 367 form a connecting means. By the connecting operation of the connecting means, the IC module transport unit 36 proceeds at the same speed as the first base material gripping transport means 33. Accordingly, the first base material 1A transported by the first base material gripping transport means 33 and the IC module 3 transported by the IC module transport means 363 proceed at the same speed with a relative speed of zero (FIG. 6B). reference).

<Adhesion between first substrate and IC module>
FIG. 7 is a front view showing the bonding process between the first base 1 </ b> A and the IC module 3.

  The raising / lowering means 364 further lowers the IC module conveying means 363 that proceeds at the same speed as the first substrate gripping and conveying means 33, and the IC module 3 adsorbed by the suction means 361 inclined to the suction means holding means 362. A front-end | tip part is made to land on the surface of the adhesive layer 4A apply | coated on the 1st base material 1A (refer Fig.7 (a)).

  Thereafter, the suction means holding means 362 is fed back upstream in the conveying direction, and the IC module 3 is pressed from one end to the other end so as to adhere the entire surface of the IC module 3 to the adhesive layer 4A (FIG. 7 (b)).

  FIG. 8 is a block diagram showing the control of the IC card manufacturing apparatus.

  The control means 100 receives the feed roller 31, the transport belt 32, the first base material gripping transport means 33, in response to input signals from the first base material arrival detection means 35, the first base material transport speed measurement means, the synchronization detection means 37, and the like. The driving of the width direction regulating means 34, the suction means 361, the elevating means 364, the first moving means 365, and the second moving means 366 is controlled.

<Ironing IC module adhesion process>
9 and 10 are cross-sectional views showing the ironing type IC module bonding step.

  FIG. 9A is a front sectional view showing initial positions of the suction means 361 and the pressing means 368, and FIG. 9B is a side sectional view of the pressing means 368.

  The suction unit 361 is disposed on the suction unit holding unit 362 so as to be inclined so that the front end portion of the first base material 1A in the transport direction faces downward. The suction means 361 is connected to a vacuum pump (not shown), and sucks and holds the IC module 3 through the plurality of suction holes 361B of the suction chamber 361A.

  In the suction means holding means 362, a pressing means 368 is disposed in front of the leading end of the suction means 361 in the transport direction. The pressing means 368 includes a pressing roller 368A, a movable arm 368B, and a support arm 368C. The movable arm 368B that rotatably supports the pressing roller 368A is supported by the support arm 368C so as to be able to bend.

  The pressing roller 368A is formed of foamed elastic rubber, for example, foamed silicone rubber having a rubber hardness of 20 ° to 30 °, and effectively pushes out bubbles when the IC module 3 is pressed and bonded to the hot melt layer 4A. Further, the pressure roller 368A made of foamed silicone rubber is effective in preventing the adhesive adhesion of the hot melt layer 4A.

  The suction means 361 and the pressing means 368 installed on the suction means holding means 362 are moving at the same speed as the first base material 1A.

  FIG. 10A shows a state where the suction means 361 and the pressing means 368 are lowered by the elevating means 364 and the IC module 3 is grounded to the adhesive layer 4A.

  FIG. 10B shows a state where the IC module 3 is squeezed and adhered by the pressing means 368.

  The lifting / lowering means 364 lowers the pressing means 368, and when the IC module 3 contacts the adhesive layer 4A on the first substrate 1A, the suction means holding means 362 starts moving upstream in the reverse conveyance direction. The support arm 368C disposed on the suction means holding means 362 also moves in the direction of the white arrow. As the support arm 368C is lowered and the support arm 368C is moved, the movable arm 368B swings around the fulcrum 368D, and the pressing roller 368A presses the IC module 3 and squeezes from one end to the other while sequentially bonding. To do.

  FIG. 10C shows a state where the IC module 3 is bonded by the pressing means 368.

  In this way, the IC module 3 is sequentially adhered to the adhesive layer 4A on the first base material 1A in such a manner that the IC module 3 is spread out from one end to the other end by line contact. The occurrence of defects due to the expansion of the remaining air when cards are formed is prevented.

[Other Embodiments of Adhesion between First Base Material and IC Module]
11 shows another embodiment of the pressing means for the first base member 1 and the IC module 3, FIG. 11 (a) is a front view of the pressing means 369, FIG. 11 (b) is a side view, and FIG. ) Is a side view of the pressing means 369 in the bonded state.

  The pressing means 369 includes a suction chamber 369A, a suction hole 369B, a support arm 369C, a rotation support shaft 369D, and a cylindrical surface portion 369E.

  The suction chamber 361A of the pressing unit 369 is connected to a decompression pump (not shown), sucks the IC module 3 through the plurality of suction holes 369B of the suction chamber 369A, and holds it on the cylindrical surface portion 369E having a semi-cylindrical surface shape.

  The pressing unit 369 is supported by the suction unit holding unit 362 shown in FIG. 4 and is moved up and down by the lifting unit 364 in the direction of the white arrow.

  When the IC module 3 is grounded on the adhesive layer 4A on the first substrate 1A by the lowering of the elevating means 364, the horizontally supported support arm 369C is illustrated with the rotation support shaft 369D as the center. It is swung and rotated in the direction of the arrow.

  As the support arm 369C swings and rotates, the suction chamber 369A swings and rotates in the direction of the outlined arrow about the rotation support shaft 369D. One end of the IC module 3 sucked by the suction hole 369B of the suction chamber 369A and held by the cylindrical surface portion 369E is pressed against the adhesive layer 4A on the first substrate 1A by the lowering and swinging rotation of the pressing means 369. Are sequentially bonded from one end to the other end.

  In this way, the IC module 3 is sequentially adhered to the adhesive layer 4A on the first base material 1A in such a manner that the IC module 3 is spread out from one end to the other end by line contact. The occurrence of defects due to the expansion of the remaining air when cards are formed is prevented.

  12A is a plan view showing a state in which a plurality of IC modules 3 are bonded to the surface of the adhesive layer 4A applied on the first base material 1A in the intermediate station, and FIG. 12B is a cross-sectional view. It is. The number of IC modules 3 bonded on the first base material 1A is not limited to the total of 50 rows and 10 columns shown in FIG.

The front view and disassembled perspective view of the IC card which concerns on this invention. The exploded sectional view of IC card, a sectional view, and the front view of a sheet-like IC module. The schematic diagram which shows the manufacturing process of an IC card. The top view and front view which show the 1st base material holding | maintenance conveyance means and IC module conveyance means of an intermediate station. The top view and front view which show the positioning state of the 1st base material by a 1st base material grip conveyance means. The front view which shows the synchronous conveyance process of a 1st base material holding | gripping conveyance means and an IC module conveyance means. The front view which shows the adhesion process of a 1st base material and an IC module. The block diagram which shows control of an IC card manufacturing apparatus. Front sectional drawing which shows the initial position of a suction means and a press means, The side sectional view of a press means. Sectional drawing which shows the state which the IC module grounded to the adhesive bond layer, the state squeezed and adhered by the press means, and the state adhered by the press means. The front view which shows other embodiment of a press means, a side view, and the side view of the press means of an adhesion | attachment state. The top view and sectional drawing which show the state by which the several IC module was adhere | attached on the surface of the adhesive bond layer apply | coated on the 1st base material.

Explanation of symbols

1 1st base material (surface sheet)
1A First base material assembly sheet (first base material)
2 Second substrate (back sheet)
3 Sheet IC module (IC module)
4A, 4B Adhesive layer (hot melt layer)
DESCRIPTION OF SYMBOLS 100 Control means 30 Intermediate | middle station 300 Partition means 301 Pressure reducing means 31 1st base material delivery means (feeding roller)
32 Conveying belt 33 First substrate gripping and conveying means 33A Clamp conveyor 33B Holding member (gripper)
33C Connecting concave member 33D Tip reference member 34 Width direction restricting means 35 First substrate arrival detecting means 36 IC module transport unit 361 Suction means 361A, 369A Suction chamber 361B, 369B Suction hole 362 Suction means holding means 363 IC module transport means 364 Lifting means 365 First moving means 366 Second moving means 367 Connecting convex member 368, 369 Pressing means 368A Pressing roller 368B Movable arm 368C Support arm 368D Support point 369E Cylindrical surface portion 369 Pressing means 369C Support arm 369D Rotation support shaft 37 Synchronization detection means 37 IC card

Claims (11)

After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed and bonded to the adhesive layer on the first substrate, the second surface of the IC module is 2 In an IC card manufacturing method for forming an IC card by adhesive coating with a base material,
The IC module is transported at a transport speed synchronized with the transport speed of the first substrate that is continuously transported, and positioned at a predetermined position on the adhesive layer applied on the surface of the first substrate. An IC card manufacturing method comprising mounting and bonding. After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed and bonded to the adhesive layer on the first substrate, the second surface of the IC module is 2 In an IC card manufacturing method for forming an IC card by adhesive coating with a base material,
The IC module is transported at a transport speed synchronized with the transport speed of the first substrate that is continuously transported, and positioned at a predetermined position on the adhesive layer applied on the surface of the first substrate. After mounting, the non-adhesive surface side of the IC module is pressed by a rotatable pressing means and moved from one side of the IC module to the other side, and the entire surface of the IC module is moved by the adhesive. An IC card manufacturing method comprising adhering to a first substrate. After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed and bonded to the adhesive layer on the first substrate, the second surface of the IC module is 2 In an IC card manufacturing apparatus for forming an IC card by adhesive coating with a base material,
Suction means for sucking and holding the IC module;
First substrate gripping and conveying means for continuously conveying the first substrate;
IC module transport means for holding and transporting the IC module at a transport speed synchronized with the transport speed of the first substrate;
Elevating means for lowering the suction means and the IC module conveying means to place the IC module at a predetermined position on the adhesive layer applied on the surface of the first base;
An IC card manufacturing apparatus comprising: After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed and bonded to the adhesive layer on the first substrate, the second surface of the IC module is 2 In an IC card manufacturing apparatus for forming an IC card by adhesive coating with a base material,
Suction means for sucking and holding the IC module;
First substrate gripping and conveying means for continuously conveying the first substrate;
IC module transport means for holding and transporting the IC module at a transport speed synchronized with the transport speed of the first substrate;
Elevating means for lowering the suction means and the IC module conveying means to place the IC module at a predetermined position on the adhesive layer applied on the surface of the first base;
A pressing means for moving the non-adhesive surface side of the IC module from one side to the other, and adhering the entire surface of the IC module to the first substrate;
An IC card manufacturing apparatus comprising: Partition means for blocking the IC module adhesion mechanism portion comprising the suction means, first substrate gripping and conveying means, IC module conveying means, elevating means, and pressing means from outside air;
A pressure reducing means for setting the atmosphere in the partition means to a pressure lower than the atmospheric pressure and higher than the suction pressure of the suction means;
5. The IC card manufacturing apparatus according to claim 3, wherein the IC card manufacturing apparatus includes: After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed and bonded to the adhesive layer on the first substrate, the second surface of the IC module is 2 In an IC card manufacturing apparatus for forming an IC card by adhesive coating with a base material,
Suction means for sucking and holding the IC module;
First substrate gripping and conveying means for continuously conveying the first substrate;
IC module transport means for holding and transporting the IC module at a transport speed synchronized with the transport speed of the first substrate;
First base material arrival detection means for detecting a transport position of the first base material;
A connecting means for connecting the first substrate gripping and conveying means and the IC module conveying means;
Elevating means for lowering the suction means and the IC module conveying means to place the IC module at a predetermined position on the adhesive layer applied on the surface of the first base;
Control means for controlling the driving of the first base material gripping and conveying means, the IC module conveying means and the elevating means,
The control means starts driving the IC module conveying means after the detection means detects that the first substrate being continuously conveyed has been conveyed to a predetermined position, and the first substrate When the conveying speed of the gripping and conveying means coincides with the conveying speed of the IC module conveying means, the connecting means connects and integrates the first base material gripping and conveying means and the IC module conveying means, and the suction means The IC card manufacturing apparatus, wherein the IC module is held by the lift and lowered by the lifting means, and is placed and bonded on the first substrate. After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed and bonded to the adhesive layer on the first substrate, the second surface of the IC module is 2 In an IC card manufacturing apparatus for forming an IC card by adhesive coating with a base material,
First base material gripping and transporting means for gripping and transporting the first base material continuously;
Positioning means for positioning the first substrate at a predetermined position;
Control means for controlling the drive of the first substrate gripping and conveying means,
The control means has the leading end in the transport direction of the first base material abut on the reference surface of the leading end in the transport direction of the first base material gripping and transporting means, and the IC module is placed on the surface of the first base material Until then, the positioning means and the first substrate gripping and conveying means are controlled so that the first substrate is previously positioned by the positioning means. After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed and bonded to the adhesive layer on the first substrate, the second surface of the IC module is 2 In an IC card manufacturing apparatus for forming an IC card by adhesive coating with a base material,
First substrate gripping and conveying means having a reference surface for gripping and continuously conveying the first substrate and abutting the leading end portion in the conveying direction of the first substrate;
First base material delivery means for sandwiching and delivering the first base material;
Control means for controlling driving of the first base material gripping means and the first base material delivery means;
The control means abuts the front end of the first base material in the transport direction against the reference surface of the front end of the first base material gripping and transporting means, and places the IC module on the surface of the first base material. Until then, the first base material feeding means and the first base material gripping and conveying means are controlled so as to be previously positioned by the first base material feeding means. After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed and bonded to the adhesive layer on the first substrate, the second surface of the IC module is 2 In an IC card manufacturing apparatus for forming an IC card by adhesive coating with a base material,
First substrate gripping and conveying means having a reference surface for gripping and continuously conveying the first substrate and abutting the leading end portion in the conveying direction of the first substrate;
A width direction regulating means for regulating a width direction parallel to the conveying direction of the first base material;
Control means for controlling the driving of the first base material gripping and conveying means and the width direction regulating means,
The control means holds and conveys the first base material in the width direction by the width direction restricting means before gripping the first base material by the first base material grip and transport means. And an IC card manufacturing apparatus for controlling the width direction regulating means. After the first surface of the sheet-like IC module in which the IC chip and the winding coil are formed on the support is placed and bonded to the adhesive layer on the first substrate, the second surface of the IC module is 2 In an IC card manufacturing apparatus for forming an IC card by adhesive coating with a base material,
First base material gripping and transporting means for gripping and transporting the first base material continuously;
Suction means for sucking and holding the IC module;
Suction means holding means for movably holding the suction means;
IC module transporting means for movably holding the suction means holding means;
Elevating means for elevating and lowering the suction means and the IC module conveying means;
First moving means for moving the IC module conveying means downstream in the conveying direction of the first substrate;
Second moving means for moving the suction means holding means to the upstream side in the transport direction of the first substrate;
A first base for placing the IC module on the adhesive layer on the surface of the first base material in synchronization with the transport speed of the first base material gripping and transporting means and the transport speed of the IC module transporting means. Material arrival detection means;
Synchronization detection means for detecting synchronization between the conveyance speed of the IC module and the conveyance speed of the first substrate;
A connecting means for connecting the first substrate gripping and conveying means and the IC module conveying means;
Control means for controlling the driving of the first base material gripping and conveying means, suction means, elevating means, first moving means, second moving means, first base material arrival detecting means, synchronization detecting means, and connecting means;
Have
The control means starts the movement of the IC module transport unit to the downstream side in the transport direction of the first base material by detecting the positioning of the first base material by the first base material arrival detection means. The synchronization detecting means confirms that the first base material and the IC module are synchronized, and the first moving means is driven to connect the first base material gripping transport means and the IC module transport means with the connecting means. Then, the suction means is lowered by the elevating means, and the IC module is placed on the adhesive layer on the first base material. 6. The IC card manufacturing apparatus according to claim 4, wherein the pressing means includes a pressing roller made of foamed silicone rubber.

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