JP2006187983A - Lengthy laminated sheet and method for producing laminated sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method which can manufacture a card high in quality and productivity by abolishing the equalization and smudging of application by doing continuous application, not intermittent application, when a card product is manufactured by using a sheet of minute printing and of high punching processing accuracy and a long-winding sheet. <P>SOLUTION: A method for producing a lengthy laminated sheet includes a process in which a first substrate sheet conveyed at prescribed intervals and an interval compensation sheet superposed over the rear end part of one of the mutually adjacent first substrate sheets and the lower side of the tip part of the other are arranged with the intervals compensated, and part of the first substrate sheet is mounted on a conveyance member through the interval compensation sheet and conveyed while forming the shape of a lengthy web and a process in which a second lengthy substrate sheet is superposed and laminated while an adhesive is applied continuously on the shape of the lengthy web. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a long laminate sheet as an intermediate in the course of manufacturing an IC card incorporating various certification cards and IC chips, and a method for manufacturing the laminate sheet.

  In the present specification, what is simply described as a laminate sheet, not a long laminate sheet, refers to a single-layer laminate sheet.

  IC card is used to prove the identity of individuals such as employee ID cards and student ID cards, and IC cards with IC chips and antennas are built in. However, some have a writing layer that has a face image and description information on the front surface and can be filled in with a writing tool on the back surface, and is printed according to the card.

  As one of such IC card manufacturing means, means based on an adhesive bonding method is known, and upper and lower long web-like or sheet-like sheet-like bases on which an adhesive layer has been formed in advance are known. An IC inlet having an IC chip and an antenna is placed and bonded between the materials, and then the IC inlet is embedded through an adhesive by applying heat and pressure, and then the bonded product is punched out to form an IC card. Is done.

  For such IC cards, for example, for the purpose of preventing forgery and alteration, watermark printing, printing for preventing forgery and alteration such as holograms and fine patterns, etc. are employed. When applied, the printing is a precise printing used to prevent special counterfeiting and alteration, and defective printing is likely to occur. When printing failure occurs, the entire IC card that has been made through many processes is discarded, and there is a problem that costs increase.

  Therefore, as shown in Patent Document 1, such fine printing is performed in advance on one of the first base sheets in advance, and an adhesive is applied thereon to correctly place the IC inlet. The second base sheet was laminated, and after the lamination was finished, a fixed-form printing was performed on the second base sheet, and then a means for punching into each card was taken.

  As a result, the decrease in yield due to poor printing could be considerably reduced.

  Further, as also shown in Patent Document 1, the first base sheet is made into a single sheet, a plurality of IC inlets corresponding to a plurality of IC cards are placed thereon, and a second adhesive sheet is formed thereon with an adhesive. When the base sheet was laminated using a roll-shaped long roll sheet, there was an advantage that it was easier to handle than when using a single sheet of the second base sheet, and the manufacturing efficiency was increased.

Then, a plurality of IC inlets encapsulated in the first base sheet and a laminate of the long-rolled second base sheet are cut again for each first base sheet and accumulated as an intermediate. , A means of punching each card was taken.
JP 2003-30618 A

  Necessary items are precisely printed in a plurality of card outlines. In some cases, an IC chip is placed inside the outline by laminating the first base sheet and the long second base sheet. The encapsulated and laminated sheet is accumulated by forming an intermediate body of a card that is punched and manufactured in a later process, but does not protrude to the first base sheet of the single wafer. Adhesive is applied intermittently, leaving the edge, and a long second base sheet is laminated on it, but the transport application thickness varies at the start and end of application, making uniform application extremely difficult It has become. In order to solve this problem, a method of heating with a heater or pressing with a roller is generally adopted when laminating a first base sheet of a sheet and a long second base sheet. As shown in the schematic cross-sectional view of FIG. 12, the adhesive protrudes from the gap portion between the adjacent first base sheets, stains the surface that hits the card product, produces a defective product, reduces the yield, Since the transfer section is soiled, the regular cleaning time increases, and the production efficiency decreases.

  SUMMARY OF THE INVENTION It is an object of the present invention to solve such problems and to provide a long laminate sheet having a high quality and high productivity and a method for producing the laminate sheet.

  This object is achieved by any one of the following technical means (1) to (6).

  (1) A sheet of first substrate sheets conveyed at a predetermined interval and the first substrate sheet that is adjacent to each other are overlapped under one rear end and the other distal end of the first substrate sheet. Sheet spacing compensation sheets are arranged so as to compensate for the spacing, and a part of the first base sheet is placed on a conveying member via the spacing compensation sheet to form a long web shape. And a step of laminating and laminating a long second base sheet while continuously applying an adhesive on the long web shape. A method for producing a long laminate sheet.

  (2) Bonding a gap compensation sheet across the first base sheet of a single sheet conveyed at a predetermined interval and one rear end and the other front end of the first base sheet adjacent to each other Then, the first base sheet and the gap compensation sheet are conveyed while forming a long web shape, and the adhesive is continuously applied on the long web shape. And a step of laminating and laminating a long second base sheet, and a method for producing a long laminate sheet.

  (3) The long laminate sheet formed in the item (1) or (2) is cut together with the second substrate sheet and the adhesive at the center portion of the gap compensation sheet to form the first substrate sheet. A method for producing a laminate sheet, comprising the steps of: forming a laminated sheet of contained sheets; and stacking the laminate sheet at a predetermined stacking position.

  (4) At least one of a plurality of card outlines and necessary fixed matters is printed on the first base sheet of the sheet, and the laminate sheet of the sheet is punched in a subsequent process The method for producing a laminate sheet according to claim 3, wherein an intermediate of the card to be formed is formed.

  (5) At least one of a plurality of card outlines and necessary fixed matters is printed on the first base sheet of the sheet, and the first base sheet of the sheet and the long sheet By laminating with the second base sheet, an IC chip is encapsulated inside the contour line, and the laminated sheet of single wafers forms an intermediate body of a card that is punched out in a later process and commercialized. The method for producing a laminate sheet according to item (3), which is characterized.

  (6) An IC chip or the like is embedded in the first base sheet of the single wafer while an adhesive is applied, and the first base is applied to the long second base sheet while an adhesive is applied. The method for producing a laminate sheet according to item (5), wherein the laminate is laminated on the sheet and the gap compensation sheet.

  According to any one of the first, second, and third aspects of the invention, the first base sheet of a single sheet is obtained even when continuous application is applied instead of intermittent application to the application of the adhesive including the first base sheet of the single sheet. Adhesives do not stick out from the gap, and the card itself and the transport path of the device are not soiled. This simplifies the coating technique and improves the coating performance, enabling a uniform finish of the card. , Improve card quality, yield and productivity.

  Further, according to the invention of claim 3 or 4, when a single-layer laminate sheet as an intermediate of the card product cut again at the position of the interval compensation sheet is stacked, each adjacent laminate sheet is interposed via the interval compensation sheet. Since they are placed in close proximity to each other, scratches between the laminate sheets are less likely to occur, and further, ventilation between the laminate sheets is improved, solidification of the adhesive is promoted, and quality and productivity are improved.

  According to the invention of claim 5, it is possible to easily obtain an intermediate body capable of producing a high-level card enclosing an IC chip.

  According to the invention of claim 6 in which the adhesive is applied to both the first and second machine body sheets, an intermediate body capable of producing a high-quality card enclosing an IC chip more smoothly and with high quality can be easily obtained.

  Hereinafter, embodiments of a manufacturing process of a plurality of cards using the method of the present invention, in particular, a long laminate sheet as an intermediate of an IC card and a sheet laminate sheet will be described in detail with reference to the drawings. The present invention is not limited to this embodiment.

  First, FIG. 1 is a plan view of a first base sheet in which an outline to be punched out of an IC card is also shown, and FIG. 5 is manufactured by a method for manufacturing a laminate sheet as an intermediate body of a plurality of IC cards. FIG. 5 also shows the outline of the IC card in which each IC inlet is enclosed. 2 to 4 show a finished IC card manufactured in the next step from the laminate sheet, FIG. 2 is a plan view of the IC card, FIG. 3 is a sectional view of the IC card, and FIG. It is sectional drawing of embodiment.

  The IC card is manufactured by laminating an IC inlet 3 composed of components including an IC chip 3 a and an antenna 3 b between the first base sheet 1 and the second base sheet 2 with an adhesive 4. Of course, if the IC chip is not encapsulated, it is possible to produce a card that is simply printed with a barcode or the like. Accordingly, in this embodiment, a manufacturing process using a manufacturing method of a long laminate sheet and a single-layer laminate sheet corresponding to the manufacture of an IC card in which an IC chip is also encapsulated will be mainly described. It can also handle the production of cards that do not enclose chips.

  The first base sheet 1 has a total thickness of, for example, 50 to 250 μm using PET as a support, and is provided with an image receiving layer on the card surface side. For example, for the purpose of preventing counterfeiting, watermark printing, holograms, strips, etc. Printing for preventing counterfeiting such as forgery, etc., or regular printing of frames, characters, symbols, etc. necessary for IC cards is performed.

  The inner surface of the card of the first base sheet 1 is subjected to an easy adhesion treatment for improving the coating property of the hot melt adhesive as the adhesive 4, and an antistatic layer is provided on both sides. The form of the first base sheet 1 is a sheet-like sheet, and the dimensions are, for example, width 200 × length 200 mm (card width 2 rows × length 3 rows can be taken) to width 500 × length 650 mm (card width 5 rows × length). 10 rows can be taken) or even larger. Further, the image receiving layer and printing defects are inspected in advance, and the position information 15A is given by a barcode or the like as shown in the plan view of FIG.

  The second base sheet 2 has a total thickness of, for example, 50 to 250 μm using PET as a support, has a writing layer on the card surface side, and is not subjected to regular printing after being bonded. Similar to the first base sheet 1, the inner surface of the card is subjected to an easy adhesion treatment for improving the coating property of the hot melt adhesive as the adhesive 4, and an antistatic layer is provided on both sides. . The form of the second base sheet 2 is a long web, and the width is preferably matched to the horizontal dimension of the first base sheet 1 or shorter by 5 to 20 mm.

  It is preferable to select a material that is small in thermal shrinkage and its variation for both the base sheet 1 and the second base sheet 2, and printing is performed with a standard print size that allows for thermal shrinkage. In addition, it is preferable that both base materials have a thickness and a configuration in which the heat shrinkage rate is the same in consideration of the difference in heat history in the manufacturing process so that curling or the like due to the difference in heat shrinkage rate does not occur. .

  The IC inlet 3 is composed of components including an IC chip 3a and an antenna 3b, and as shown in FIG. 3, both sides of the IC chip 3a and the antenna 3b of the winding are bonded and stored with a nonwoven fabric 3c. In addition, as shown in FIG. 4, the one in which the IC chip 3a is mounted on the film 3d provided with the circuit of the antenna 3b by printing, etching, or the like, and the chip part and the whole are previously sealed with resin are also used. it can.

  As the form of the IC inlet 3, a roll of a long web for one row is used. However, since there is a convex portion of the IC chip, it is preferable to wind it loosely. Moreover, the sheet-like sheet shape or long web-like shape arranged in a plurality of lengths and widths, or those cut out one by one from them can be adopted. The size when cut into one is preferably smaller than the outer shape of the card so as not to adversely affect the cutting during card punching.

  The adhesive 4 is, for example, a hot melt adhesive, and a reactive hot melt adhesive is particularly preferable. Reactive hot melt adhesive is a type of adhesive that melts and bonds the resin, then absorbs moisture and cures the resin. Later, the softening temperature increases, so it has excellent durability and is suitable for coating at low temperatures. With normal hot melt adhesives, the coating temperature is the same as the softening temperature of the resin, so the heat resistance does not exceed the coating temperature. Therefore, when high heat resistance is required, a high coating temperature is required. Become. On the other hand, since the reactive hot melt adhesive is cured after coating, the heat-resistant temperature becomes several tens of degrees Celsius higher than the coating temperature. Therefore, if the surface of the image receiving layer is a material that is easily damaged at high temperatures, the damage is reduced. be able to.

  Next, the manufacturing process of the laminate sheet as an intermediate body of such a plurality of IC cards will be described with reference to FIGS. FIG. 6 is a perspective view showing a flow of a manufacturing process 100 of a laminate sheet as an intermediate of an IC card and an IC card manufacturing process following the downstream side, FIG. 7 is a diagram showing a structure of heating and heating, and FIG. 8 is a conveyor. FIG. 9A is a cross-sectional view illustrating a configuration of a long laminate sheet, and FIG. 9B is an enlarged view of a portion surrounded by a circle in FIG.

  In the supply process A of the first base sheet 1, the sheets are separated and fed one by one from the stacked sheets. The level of the upper surface of the sheet is detected and maintained at a constant height, and is held and taken out by the suction pad. In this case, it is preferable to have a mechanism that removes static electricity, blows air between layers, scrapes off with a nail or the like, and raises the suction pad at the same time as suction, so as to ensure separation of one sheet.

  Further, it is preferable that the number of loading apparatuses is two, and the line is automatically stopped when one of them disappears and the line is not stopped.

  In the adhesive application process B to the first base sheet 1, a hot melt adhesive is applied to the first base sheet 1 with a predetermined thickness. As a coating method, a normal method such as a die method, a gravure method, and a roll method can be adopted. However, a die method is preferable in terms of the following points, and a curtain flow method using the die 10 is particularly preferable.

  Since the die 10 is sealed until the adhesive is applied to the first base sheet, temperature control is easy even at a high temperature such as a hot melt adhesive. It is advantageous because it does not touch the outside air. Moreover, no foreign matter is mixed in and bubbles are hardly generated.

  Further, the coating amount is determined by the pump feed amount and the speed of the first base sheet 1, and since there is little change in the liquid physical properties such as viscosity, it is advantageous for ensuring the coating thickness accuracy.

  The adhesive dissolved in the heating tank is fed to the die 10 through a hose by a pump and discharged from the slit outlet 10a of the die 10. It is preferable that the hose and the die 10 are also heated and kept at a constant temperature. The pump feed amount is determined by the pump volume, the rotational speed, and the feed efficiency associated with the pressure loss, and the coating thickness is formed between the tip of the die 10 and the first base sheet 1, further called a lip. It depends on the curtain flow film and the speed of the base sheet 1. In the case of a reactive hot melt adhesive, it is preferable to purge the heating tank or the like with dry air or nitrogen.

  The first base sheet 1 is a single sheet and is generally coated on a table. In the method of the present invention, the first base sheet 1 is held on a suction belt conveyor 35 as a conveying member. Yes. As used in the present invention, a continuous coating method is preferred in the same manner as for a long web. As a method of holding the first base sheet 1, there is a method of gripping and holding the head, tail and both edges of the base sheet 1. The suction belt conveyor 35 is used to hold almost the entire surface of the first base sheet 1. Is preferable because the margin of the outer edge of the sheet is small and the yield is good.

  Further, in the present invention, the first base sheet 1 of the single wafer conveyed at a predetermined interval is laid with the interval compensation sheet 6 over the adjacent rear end and front end, and the first The base sheet and the gap compensation sheet are placed and fixed on a suction belt conveyor 35 as a conveying member, and are conveyed while forming a long web shape, on the long web shape. While continuously applying the adhesive 4, the long second base sheet 2 can be laminated and laminated. In this way, the long laminate sheet 15 is manufactured.

  As shown in FIGS. 5 and 6, the gap compensation sheet 6 has a long piece substantially the same as the width of the first base sheet, and the shorter side is longer than each gap width of the adjacent first base sheets, The length does not reach the card outline area. The material is preferably the same material as that of the first base sheet 1 and the second base sheet 2, which is very useful when the card removal allowance is collected and used as resource waste.

  For example, as shown in the perspective view of FIG. 6, the gap compensation sheet 6 is sucked and fixed to a suction roller 61 whose peripheral speed is rotated in synchronization with the conveyance speed of the suction belt conveyor 35, and the suction roller The suction of the suction roller is cut off at the moment when the leading end of the gap compensating sheet 6 on the upper surface 61 contacts the suction belt conveyor 35, and the gap compensating sheet 6 moves onto the suction belt conveyor 35 and is sucked and fixed. . The first base sheet 1 is overlapped on this and conveyed on the suction belt conveyor 35 at the same speed as the spacing compensation sheet at an appropriate distance, while forming a long web. The adhesive is applied continuously while forming a curtain flow with a die.

  In the case of a plurality of at least one place on the peripheral surface of the suction roller, cutters 62 are embedded at equal intervals to form a rotary blade, which acts on the fixed blade 63 placed outside, The interval compensation sheet 6 pulled out from the roll 64 is cut into a measuring scale while being sucked on the suction roller.

  When an IC card is manufactured by enclosing the IC inlet 3, it is performed as follows before the above-described long second base sheet 2 is laminated and laminated.

  That is, in the IC inlet 3 supplying step C, before placing on the first base sheet 1, the intermediate station 20 is provided, and the IC inlet 3 is arranged here, and these are sucked and held together. While moving upward, the adhesive 4 is continuously applied and placed synchronously on the first base sheet 1 conveyed at a constant speed. The IC inlets 3 are positioned one by one before being taken out from the intermediate station 20, but it is more preferable to position the first base sheet 1 with reference to edges and printing.

  When placed in the intermediate station 20, the reading position of the defect position information 15A given to the first base sheet 1 as shown in FIG. Do not place. If there is no defect information, the IC inlet 3 is fed out from the roll winding and cut and sent to the intermediate station 20 in sequence, but if there is defect information, the feeding is stopped at the corresponding timing of only the corresponding column. . Capability is improved by arranging a plurality of rolls and simultaneously processing them in multiple rows. Moreover, it is preferable that the defective IC inlet 3 known in advance is removed before being placed on the first base sheet 1 or is removed after imparting defect information to the first base sheet 1.

  In addition, as another means, it is conceivable that a tray-like jig on which the IC inlets 3 are arranged is loaded, held by suction from there, and placed on the first base material 1. However, in order to stop the supply of the defective portion, it is necessary to take measures such as not placing the defective portion in advance at the corresponding position of the tray, not sucking and holding the tray, and removing it before sucking and holding.

  When the IC inlet 3 is placed on the first base sheet 1, the first base sheet 1 is transported at a constant speed as described above without taking the means for temporarily stopping the first base sheet 1. It is preferable to place it in synchronism with. In addition, it is preferable to place the IC chip while squeezing from one side so that air does not enter, or to place the convex part of the IC chip into the hot melt adhesive. Furthermore, it is preferable to maintain the fluidity and tackiness by heating and keeping the hot melt adhesive before heating by a heating and keeping means 41 such as a heater as shown in FIG.

  When manufacturing a card without an IC inlet, the IC inlet supply process C and the adhesive application process B for embedding the IC inlet can be stopped or omitted.

  As the conveying means between the supply of the first base sheet 1 and the bonding, there may be a suction belt conveyer 35, a suction holding moving means, a tray jig moving means, and the like.

  In the supplying process D of the second base sheet 2, a long web wound in a roll shape is fed out. In this feeding, the tension and edge position are detected and controlled to be constant.

  Moreover, it is preferable to use two sets of feeding devices, further provide an accumulator, and replace and join the windings without stopping the line.

  In the adhesive coating step E on the second base sheet 2, it is performed while forming a curtain-like coating liquid film of the adhesive by a die method as in the case of the first base sheet 1. The second base sheet 2 held in this manner is continuously coated by curtain flow system coating using the die 31 having the same structure as the die 10.

  The coating thickness is preferably the same as the coating thickness of the first base sheet 1 so as not to cause curling due to imbalance between the card front and back surfaces, and further, the first base sheet 1 and the second base sheet. 2 or more preferably in consideration of asymmetry due to the IC inlet 3.

  In the laminating step F, an adhesive is applied, the interval compensation sheet 6 is connected, formed into a long web, and further the single substrate sheet 1 having the IC inlet 3 mounted thereon, and the adhesive The second base sheet 2 coated with the film is nipped and pasted by the roll pair 40 while being continuously conveyed at a constant speed. This pair of rolls 40 may be used as the roll 30 for coating the second base sheet 2 or may be provided separately.

  The nip rolls may be metal-to-metal or rubber-coated, and the total thickness may be adjusted or the IC inlet embedded in the adhesive by setting the gap of the nip roll, pressing force setting, or a combination thereof. Improve smoothness.

  Therefore, it is preferable that the hot melt adhesive is heated and kept warm by the heating and warming means 41 immediately before the first base sheet 1 and the second base sheet 2 are bonded together, but the surface of each base is easily damaged by high temperatures. Therefore, as shown in FIG. 7, on the hot melt adhesive side, the control unit 42 drives the heat and heat retaining means 41 such as an infrared heater based on the hot melt adhesive temperature information of the temperature sensor S1, and heats and maintains the temperature. On the other hand, the base sheet side circulates a heat medium in the roll 30 via a temperature controller 43, and the controller 44 controls the temperature controller 43 based on the roll temperature information of the temperature sensor S2 and the heat medium temperature information of the temperature sensor S3. It is preferable to keep the temperature so as not to exceed a certain temperature (for example, 60 ° C.) by driving.

  The first base sheet 1 in the form of a single sheet is fed at a constant pitch and bonded to the second base sheet 2, and this pitch is such that the conveyor pitch and the card pitch in the subsequent process always match. The integer multiple of the card pitch is preferable. Moreover, it is preferable to provide a minimum interval between the first base sheets 1 so that no debris is generated when the sheet is cut into a sheet after being bonded. What is necessary is just to connect the said space | interval compensation sheet | seat 6 according to this optimal space | interval.

  Note that the interval compensation sheet 6 may be an adhesive tape, and is also achieved by automatic joining when the first base sheet 1 and the second base sheet 2 are laminated by adhesive lamination.

  In consideration of curling due to residual stress of the first base sheet 1 and the second base sheet 2 after bonding, the tension of the second base sheet 2 and the sheet of the first base sheet 1 It is preferable to set the tension.

  In the conveyor heating and pressurizing step G, the bonded product is heated and pressed for a certain period of time, thereby adjusting the total thickness and smoothness, and particularly adjusting the smoothness of the convex portions of the IC chip.

  In this conveyor heating and pressurization, the pressurization time is preferably 10 to 60 seconds, particularly preferably 20 to 30 seconds, and the applied pressure is preferably 19.6 to 98 kPa, particularly 39.2 to 58.8 kPa. The heating temperature is preferably 50 to 100 ° C., particularly 50 to 70 ° C., since it can prevent adverse effects on the image receiving layer, but is appropriately determined depending on the physical properties of the adhesive, the pressure resistance of the IC chip, the heat resistance of the surface of each substrate sheet, and the like. be able to.

  Further, as shown in FIG. 8, the pressurization is performed by a conveyor 51 in which a plate 50 sandwiching the upper and lower sides of the bonded product of the first base sheet 1 and the second base sheet 2 circulates.

  Since the plate 50 has insufficient rigidity due to thickness restrictions, it is preferable that the plate 50 be backed up by the receiving roller 52 to compensate.

  Ideally, the gap between the plates 50 should be zero, but this is not possible in reality, and the gaps cannot be pressurized, convex, and poor in smoothness, so this part does not appear on the card product. Thus, as shown in FIG. 9B, it is preferable that the pitch in the conveyance direction of the plate 50 is the same as the pitch of the card dimensions of the IC card.

  Further, as another countermeasure, as shown in FIG. 8, it is conceivable to provide an endless belt 53 on the outer side of the conveyor 51 in which the plate 50 circulates.

  In addition to applying a constant load by a hydraulic cylinder or the like, a method of pressing may be a method of fixing a gap (gap) between the upper and lower plates sandwiching the bonded product. In this case, the conveyor outlet 54a is connected to the conveyor. It is preferable to prevent a large pressure from being applied to the IC chip at the inlet by gradually widening the inlet 54b side.

  In the sheet cutting step I, it is not preferable to wind up the long laminate sheet 15 which is a bonded product of the first base sheet 1 and the second base sheet 2. In particular, in a card enclosing an IC chip, this is avoided, and in order to stabilize the adhesive, the cut means 80 is cut into a sheet by the unit of the first base and left as a single sheet laminate sheet 16. It is preferable that the stacking device 120 is temporarily loaded. The cutting is preferably performed without bending the bonded product. And it is necessary to cut | disconnect efficiently in a state without wrinkles and slack synchronizing with it, conveying the elongate laminate sheet 15 continuously with a high conveyance speed.

  Laminate sheet stacking device 120 (stacking and storing step J) stacks a predetermined number of cut sheets. Insert a metal plate 131 such as SUS at intervals of 1 to 10 sheets of laminated sheet 16 which is a bonded product of the first base sheet 1 and the second base sheet 2, and the unevenness of the bonded product itself is added. It is preferable to prevent the smoothness from being inhibited. The supply of the metal plate 131 such as SUS from the stacking device 130 can be performed by the same method as in the case of the first base sheet 1 although there is a difference in rigidity.

  Further, it is preferable that at least two sets of the stacking device 120 for the laminated sheet 16 as a bonded product and the stacking device 130 for supplying the metal plate 131 such as SUS can be switched without stopping the line. In addition, when a reactive hot melt adhesive is used, the laminate sheet 16 integrated with the metal plate 131 such as SUS is preferably stored under air-conditioned conditions for about one week necessary for the reaction. The air conditioning conditions and the storage period can be appropriately determined according to the adhesive specifications and the like.

  In this way, since the stacked laminate sheets 16 as intermediates are accumulated with the interval compensation sheets 6 being stuck on the end portions thereof, the laminate sheets 16 shown in FIG. As shown in the cross-sectional schematic diagram showing the arrangement of the first and second base sheets and the gap compensation sheet 6 on the conveying member and the cross-sectional schematic diagram showing the stacked state of the laminate sheets 16 in FIG. For a method using an adhesive of a type that allows a gap, improves air circulation, absorbs moisture, and cures the resin, storing in this state for a predetermined period is a very good curing period. Benefits are born. At the same time, since the laminate sheets 16 do not press each other directly, there is an advantage that the card product is hardly damaged and stored. This can be said to be significantly superior to the cross-sectional schematic diagram of the conventional example of FIG.

  As described above, according to the present invention, after the laminated sheet as an intermediate is manufactured, in the card forming process K which is a subsequent process of the process according to the manufacturing method of the present invention, the first base sheet 1 and the second base sheet. The laminate sheet 16 that is a laminated product of No. 2 is cut to have a predetermined size by cutting one to four sides based on the reference edge 1A of the first base sheet 1 or the mark of the printed reference mark 1B. 2 is printed on the base sheet 2 side by a printing machine 141, and is punched into an IC card by a punching machine 142 based on the punching reference mark 1M shown in FIGS. The regular printing on the second base sheet 2 side may be printed for each card after punching.

  However, if it is a simple card product, it is possible to obtain a final card product by punching it in accordance with the contour line of each card as a long laminate sheet.

It is a top view of the laminate sheet as an IC card intermediate body in which a plurality of IC module inlets are enclosed. It is a top view of an IC card. It is sectional drawing of an IC card. It is sectional drawing of other embodiment of an IC card. It is a top view of the 1st base sheet which shows the position of the defect information bar code attached to the 1st base sheet. It is a perspective view which shows the manufacturing process of the laminate sheet as an intermediate body of an IC card. It is a figure which shows the structure of heating and heating. It is a figure which shows the structure pressurized by a conveyor. (A) is sectional drawing which shows the structure of the uncoated part of a roll-shaped laminate sheet, (b) is an enlarged view of the part enclosed by the circle of (a). It is a cross-sectional schematic diagram which shows arrangement | positioning of the 1st base sheet on a conveyance member, a 2nd base sheet, a space | interval compensation sheet, and an adhesive agent in this invention. It is a cross-sectional schematic diagram which shows the integration | stacking state of the laminated sheet of a sheet in this invention. It is a cross-sectional schematic diagram which shows arrangement | positioning of the 1st base sheet of a conveyance member shape, a 2nd base sheet, and an adhesive agent in a prior art example. It is a cross-sectional schematic diagram which shows the accumulation state of the laminated sheet of a sheet | seat in a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st base sheet 1A Reference edge 1B Reference mark 2 2nd base sheet 3 IC inlet 4 Adhesive 6 Spacing filling sheet 10,31 Die 15 Long laminate sheet 16 Laminate sheet
35 Suction Belt Conveyor 40 Roll Pair 61 Suction Roller 62 Cutter 63 Fixed 64 Long Roll 80 Cutting Device 100 Laminate Sheet Manufacturing Device as IC Card Intermediate Body 120 Laminate Sheet Accumulator 130 Metal Plate Accumulator

Claims (6)

The first base sheet of the single sheet conveyed at a predetermined interval and the single base sheet stacked on the lower side of one rear end and the other front end of the first base sheet adjacent to each other. And a part of the first base sheet is placed on a conveying member via the gap compensation sheet to form a long web-like shape. A step of conveying while forming, and a step of laminating a long second base sheet while laminating an adhesive on the long web-like shape. A method for producing a long laminate sheet. Bonding the interval compensation sheet across the first base sheet of a single sheet conveyed at a predetermined interval and one rear end and the other front end of the first base sheet adjacent to each other, The first base sheet and the gap compensation sheet are transported while forming a long web shape, and a long time while continuously applying an adhesive on the long web shape. And a step of laminating and laminating a second base sheet having a length. A sheet laminate sheet including the first substrate sheet obtained by cutting the long laminate sheet formed according to claim 1 or 2 together with the second substrate sheet and an adhesive at a central portion of the gap compensation sheet. And a method of stacking the laminate sheet at a predetermined stacking position. The first base sheet of the sheet is printed with at least one of outlines of a plurality of cards and necessary fixed matters, and the laminated sheet of the sheet is punched and commercialized in a later process. The method for producing a laminate sheet according to claim 3, wherein an intermediate body of the card is formed. The first base sheet of the sheet is printed with at least one of outlines of a plurality of cards and necessary fixed matters, and the first base sheet of the sheet and the long second sheet An IC chip is encapsulated inside the contour line by laminating with a base sheet, and the laminate sheet as a single sheet forms an intermediate body of a card that is punched and manufactured in a later process. The manufacturing method of the laminate sheet of Claim 3. An IC chip or the like is embedded in the first base sheet of the single wafer while an adhesive is applied, and the first base sheet and the above-described long base sheet are coated with an adhesive. 6. The method for producing a laminate sheet according to claim 5, wherein the laminate sheet is laminated on a gap compensation sheet.

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