JP5267917B2 - Non-contact IC card manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a non-contact IC card, which manufactures a high quality non-contact IC card even when a front side substrate and a back side substrate are cut into sheets. <P>SOLUTION: The method of manufacturing a non-contact IC card 1 first creates an IC card laminate 12 in which an inlet sheet 8 is interposed between the front side substrate 2 and the back side substrate 5. In the IC card laminate 12, a temporarily bonding means 24 is used to temporarily bond parts 2a and 5a near front end edges and parts 2b and 5b near both side end edges of the front side substrate 2 and the back side substrate 5, and to also temporarily bond the part 2a near the front end edge or the part 2b near the both side end edge between the inlet sheet 8 and the front side substrate 2, or the part 5a near the front end edge or the part 5b near the both side end edge between the inlet sheet 8 and the back side substrate 5. The front side substrate 2 and the back side substrate 5 are adhered to the inlet sheet 8. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a non-contact IC card manufacturing method capable of manufacturing a non-contact IC card having an inlet sheet configured by connecting an IC chip to a conductor functioning as an antenna with high quality.

  In recent years, contactless IC cards that communicate with external devices such as readers / writers in a contactless manner are becoming popular. The demand for non-contact IC cards is expected to expand rapidly in the future, and accordingly, it is strongly desired to manufacture high-quality non-contact IC cards at low cost. .

  The non-contact IC card includes a first base material, a surface-side base material including a first adhesive layer provided on one surface of the first base material, a second base material, and one of the second base materials. The back side base material containing the 2nd adhesive bond layer provided in the surface is provided. Also, an inlet sheet including an inlet base material, an IC chip provided on the inlet base material, and an antenna provided corresponding to the IC chip is provided between the front surface side base material and the back surface side base material. (For example, refer to Patent Document 1). In the non-contact IC card having such a configuration, when the first base material of the front surface side base material and the second base material of the back surface side base material are each cut in a so-called sheet shape and printed, In order to match printing performed on the base material and the second base material, it is necessary to accurately align and laminate the front surface side base material, the back surface side base material, and the inlet sheet.

Here, when the front side substrate, the back side substrate, and the inlet sheet are aligned and laminated, first, as shown in FIG. 8, the first side substrate 43 of the front side substrate 42 is formed. A cross-shaped alignment mark 50, a cross-shaped alignment mark 51 formed on the second base material 46 of the back side substrate 45, and a round alignment mark 52 formed on the inlet base material 49 of the inlet sheet 48. Alignment is performed using. Thereafter, in the vicinity of the alignment mark 50 formed on the first base material 43, temporary bonding is performed at intervals of 30 to 250 mm by the ultrasonic welder 53.
JP 2003-162697 A

  However, when the surface side base material, the back side base material and the inlet sheet are laminated by such a method and heated by a heating roller, between the front side base material and the inlet sheet or the back side base material and the inlet sheet, Since there are relatively few places to be temporarily joined, the heated and melted adhesive may flow outward. In this case, there is a problem that the adhesive that has flowed out adheres to the heating roller and contaminates the front side substrate or the back side substrate.

  Further, as described above, the non-contact IC card may be distorted when heated by the heating roller. This is because the heat shrinkage rate due to the difference between the thickness of the front surface side base material and the thickness of the back surface side base material is different, the residual stress is generated during temporary bonding, and the pressing force is received from the heating roll. Conceivable. In this case, there is a problem that the non-contact IC card obtained by cutting is warped.

  Furthermore, when distortion occurs as described above, air may enter between the front surface side base material and the inlet sheet or between the back surface side base material and the inlet sheet. In this case, irregularities occur on the front and back surfaces of the non-contact IC card, and it becomes difficult to make the front and back surfaces flat.

  The present invention has been made in consideration of such points, and prevents the front surface and the back surface from being soiled by an adhesive when the front surface side substrate and the back surface side substrate are cut into sheets. In addition, an object of the present invention is to provide a non-contact IC card manufacturing method capable of manufacturing a high-quality non-contact IC card whose front and back surfaces are flat.

The present invention relates to a method for producing a non-contact IC card, wherein the surface side group includes a first base material and a first hot melt layer formed by applying a fluid hot melt to one surface of the first base material. A step of preparing a material, a step of preparing a back side substrate including a second base material, and a second hot melt layer formed by applying a fluid hot melt to one surface of the second base material; , A step of preparing an inlet sheet including an inlet base material, an IC chip provided on the inlet base material, and an antenna provided corresponding to the IC chip, and a first hot melt of the surface side base material a layer, the backside group second hot-melt layer of material, and exposing or cooled under the environment air, and solidifying the surface side substrate and the IC card between the back side substrate is interposed inlet sheet Of the step of producing the laminate and the IC card laminate, While temporarily joining the front edge vicinity and both side edge vicinity of a surface side base material and a back surface side base material, the front edge vicinity or both side edge vicinity between an inlet sheet and a surface side base material, or an inlet sheet Temporarily joining the vicinity of the front edge or the vicinity of both side edges with the back side substrate using the temporary joining means, and transporting the temporarily joined IC card laminate between at least a pair of heating rollers And a step of melting the first hot melt layer and the second hot melt layer to bond the front surface side substrate and the inlet sheet and to bond the back surface side substrate and the inlet sheet. This is a method for manufacturing a non-contact IC card.

  In the present invention, the inlet sheet includes an inlet base material, a plurality of IC chips provided on the inlet base material, and an antenna provided corresponding to each IC chip. And further comprising a step of cutting the IC card laminate for each IC chip and antenna to obtain a non-contact IC card after the inlet sheet is bonded and the back side base material and the inlet sheet are bonded. This is a method for manufacturing a non-contact IC card.

  In the present invention, the temporary joining means includes an ultrasonic welder, a thermocompression bonding machine, an adhesive application machine, or an adhesive application machine, and the ultrasonic welder, the thermocompression bonding machine, the adhesive application machine, or the adhesive application machine includes: A method of manufacturing a non-contact IC card, which is applied to a region other than the non-contact IC card obtained by cutting the IC card laminate.

  The present invention is the method for manufacturing a non-contact IC card, wherein the temporary joining means includes an ultrasonic welder, and the ultrasonic welder includes a plurality of heads.

  According to the present invention, the first hot melt layer is formed on one surface of the first base material while leaving a predetermined belt-like margin inside the front edge and both side edges of the first base material. The non-contact IC is characterized in that the two hot melt layers are formed on one surface of the second base material while leaving a predetermined band-like margin inside from the front edge and both side edges of the second base material. It is a manufacturing method of a card.

  In the temporary bonding step, the temporary bonding means performs temporary bonding at a plurality of locations on the IC card laminate to form a plurality of temporary bonding portions, and the distance between the temporary bonding portions is 1 to 20 mm. A non-contact IC card manufacturing method according to claim 1.

  According to the present invention, an IC card laminated body in which an inlet sheet is interposed between a front surface side base material and a back surface side base material is manufactured. Near the front edge and the vicinity of both side edges, and near the front edge or both side edges between the inlet sheet and the front side substrate, or the front between the inlet sheet and the back side substrate. Temporary joining is performed using the temporary joining means in the vicinity of the edge or the vicinity of both side edges. Thereafter, between the at least one pair of heating rollers, the temporarily bonded IC card laminated body is transported to adhere the front surface side base material and the inlet sheet, and to adhere the back surface side base material and the inlet sheet to each other. A contact IC card is obtained. Thus, when temporarily bonding the IC card laminate, the front edge vicinity and both side edge vicinity of the front surface side base material and the back surface side base material are temporarily bonded, so that the strength of the IC card stack body is increased. Can do. Thereby, when the temporarily bonded IC card laminated body is heated by the heating roller, the IC card laminated body can be prevented from being distorted. For this reason, it can suppress that a non-contact IC card warps, can form the surface and back surface of a non-contact IC card in flat shape, and can manufacture a high quality non-contact IC card.

DESCRIPTION OF EXEMPLARY EMBODIMENTS First Embodiment Hereinafter, an embodiment of the invention will be described with reference to the drawings. Here, FIG. 1 to FIG. 5 are views showing a first embodiment of a method of manufacturing a non-contact IC card according to the present invention. Among these, FIG. 1 is a diagram showing a cross-sectional configuration of a non-contact IC card manufactured by the manufacturing method according to the first embodiment of the present invention, and FIG. 2 is a diagram according to the first embodiment of the present invention. FIG. 3 is a perspective view showing an example of an inlet sheet of a non-contact IC card manufactured by the manufacturing method, and FIG. 3 is a schematic view showing a non-contact IC card manufacturing method and a manufacturing apparatus according to the first embodiment of the present invention. It is. FIG. 4 is a perspective view showing an IC card laminate produced by the method of manufacturing a non-contact IC card according to the first embodiment of the present invention, and FIG. 5 is a diagram illustrating the first embodiment of the present invention. It is a figure explaining the method to produce an IC card laminated body in the manufacturing method of the non-contact IC card in a form.

  First, a non-contact IC card manufactured by the manufacturing method according to the present invention will be described with reference to FIGS. Here, the contactless IC card can communicate with an external device such as a reader / writer in a contactless manner.

  As shown in FIG. 1, the non-contact IC card 1 is formed by applying a first base material 3 and a flowable hot melt 14 (see FIG. 3) to one surface of the first base material 3. A surface-side substrate 2 including a hot-melt layer 4, a second substrate 6, and a second hot-melt layer 7 formed by applying a flowable hot-melt 14 to one surface of the second substrate 6; The back side base material 5 containing is provided. In addition, as shown in FIGS. 1, 2, and 4, an inlet base material 9 and a plurality of ICs provided on the inlet base material 9 are provided between the front surface side base material 2 and the back surface side base material 5. An inlet sheet 8 including a chip 11 and an antenna 10 provided corresponding to each IC chip 11 is provided.

  As shown in FIG. 2, the IC chip 11 is formed in a rectangular parallelepiped shape, and the thickness of the IC chip 11 is, for example, 150 μm to 300 μm. The IC chip 11 includes a memory for recording information, and an external device (reader / writer or the like) reads information recorded on the IC chip 11 via the antenna 10 or IC via the antenna 10. New information can be written on the chip 11. And the circuit wiring for expressing such a function of the non-contact IC card 1 is written in the IC chip 11.

  As shown in FIG. 2, the antenna 10 is formed in a substantially coil shape on the inlet base material 9 and is electrically connected to the IC chip 11. In the present embodiment, an example in which the antenna 10 is formed in a substantially coil shape is shown, but the present invention is not limited to this.

  The antenna 10 can be transferred by, for example, applying conductive ink onto the inlet base material 9 using a screen printing machine, or punching and transferring a conductive foil made of copper, aluminum, or the like onto the inlet base material 9. Or by etching the conductive foil made of copper, aluminum or the like laminated on the inlet base material 9 and patterning it into a desired shape, etc. it can.

  Moreover, the 1st base material 3 of the surface side base material 2, the 2nd base material 6 of the back surface side base material 5, and the base material 9 for inlets of the inlet sheet 8 consist of PET film, paper, etc.

  The first hot melt layer 4 and the second hot melt layer 7 are both formed thicker than the thickness of the IC chip 11 of the inlet sheet 8. The fluid hot melt 14 that forms the first hot melt layer 4 and the second hot melt layer 7 is made of a moisture-curing urethane resin.

  Next, the manufacturing apparatus 20 of the non-contact IC card 1 will be described with reference to FIG. The non-contact IC card 1 manufacturing apparatus 20 includes a first adhesive applying means 21 for applying the fluid hot melt 14 to one surface of the first base 3 of the front side base 2, and the back side base 5. A second adhesive applying means 22 for applying the fluid hot melt 14 is provided on one surface of the second substrate 6. The non-contact IC card 1 manufacturing apparatus 20 is disposed downstream of the first adhesive application unit 21 and the second adhesive application unit 22, and is an inlet sheet between the front surface side substrate 2 and the back surface side substrate 5. IC card stacking by partially joining the first hot-melt layer 4 and the second hot-melt layer 7 disposed on the downstream side of the stacking means 23 and the stacking means 23 for producing the IC card laminate 12 with 8 interposed Temporary joining means 24 for temporarily joining the body 12 is provided. Among these, the temporary joining means 24 is composed of the ultrasonic welder 25, but is not limited to the ultrasonic welder 25, and a thermocompression bonding machine 29, an adhesive material applying machine 30, or an adhesive material applying machine 31 may be used. The non-contact IC card 1 manufacturing apparatus 20 is disposed on the downstream side of the temporary joining means 24, melts the IC card laminated body 12, adheres the front side substrate 2 and the inlet sheet 8, and back surface Adhesive means 26 for adhering the side substrate 5 and the inlet sheet 8 is provided. Among these, the adhesion means 26 includes a pair or a plurality of pairs of heating rollers 27 arranged on the front side and the back side with respect to the IC card laminate 12. Further, the non-contact IC card 1 manufacturing apparatus 20 includes a cutting unit 28 that is disposed on the downstream side of the bonding unit 26 and cuts the bonded IC card laminated body 12 for each IC chip 11 and each antenna 10. .

  Next, the operation of the present embodiment having such a configuration, that is, a method for manufacturing the non-contact IC card 1 will be described.

  First, as shown in FIGS. 1 and 3, a first base 3 and a first hot melt layer 4 formed by applying a fluid hot melt 14 to one surface of the first base 3 are included. The surface side base material 2 is prepared. In this case, as shown in FIG. 4, alignment marks 3c (see FIG. 5) having a cross shape at a predetermined position and having a size capable of producing a multi-row and multi-stage non-contact IC card 1 are shown. The formed first base material 3 is prepared. In FIG. 4, the 1st base material 3 has a magnitude | size which can produce the non-contact IC card 1 of 3 rows x 3 steps | paragraphs = 9 sheets. In the present embodiment, the so-called single-wafer first base material 3 is not a method in which the winding core around which the base material is wound rotates to continuously supply a single sheet-like base material extending in a strip shape. Prepare. As a result, a small-lot non-contact IC card 1 can be easily manufactured. Note that the number of non-contact IC cards 1 that can be produced for one surface-side substrate 2 is not limited to nine.

  Next, the flowable hot melt 14 made of a moisture curable urethane resin is applied to the back surface of the first base material 3 by the first adhesive application means 21. In this case, the thickness of the first hot melt layer 4 formed by applying the fluid hot melt 14 is made larger than the thickness of the IC chip 11. Thereby, the surface of the non-contact IC card 1 can be flattened without being affected by the uneven shape of the inlet sheet 8. Further, as shown in FIG. 5, the fluid hot melt 14 applied to one surface of the first base material 3 has a width x (for example, 10 to 20 mm) inside the front edge 3 a of the first base material 3. ) And a strip margin 4b each having a width y (for example, 10 to 50 mm) are left inside the side edges 3b. That is, the first hot melt layer 4 leaves a band-like margin 4a indicated by a width x inside the front edge 3a of the first base material 3 and a width y inside the both side edges 3b of the first base material 3. The band margins 4b shown in FIG. This can prevent the first hot melt layer 4 from being melted and flowing outward when heated by the heating roller as will be described later.

  Next, as shown in FIG. 1 and FIG. 3, a second base 6 and a second hot melt layer 7 formed by applying a flowable hot melt 14 to one surface of the second base 6. The back side substrate 5 including is prepared. In this case, first, as in the case of the surface side base material 2, as shown in FIG. And a second base material 6 having alignment marks 6c (see FIG. 5) formed in a cross shape at predetermined positions.

  Next, the flowable hot melt 14 made of a moisture curable urethane resin is applied to the surface of the second base 6 by the second adhesive applying means 22. In this case, similarly to the first hot melt layer 4, the thickness of the second hot melt layer formed by applying the fluid hot melt 14 is made larger than the thickness of the IC chip 11. Thereby, the back surface of the non-contact IC card 1 can be flattened without being affected by the uneven shape of the inlet sheet 8. Further, as shown in FIG. 5, the fluid hot melt 14 applied to one surface of the second substrate 6 has a width x (for example, 10 to 20 mm) inside the front edge 6 a of the second substrate 6. ) And a strip margin 7b indicated by a width y (for example, 10 to 50 mm) are left inside the side edges 6b. That is, the second hot melt layer 7 leaves a band-like margin 7a indicated by a width x inside the front edge 6a of the second base material 6 and a width y inside the both side edges 6b of the second base material 6. The band-like margins 7b shown in FIG. This can prevent the second hot melt layer 7 from being melted and flowing outward when heated by the heating roller as will be described later.

  Next, as shown in FIGS. 2 and 3, the inlet base material 9, a plurality of IC chips 11 provided on the inlet base material 9, and the antenna 10 provided corresponding to each IC chip 11. An inlet sheet 8 including the above is prepared. In this case, first, as shown in FIG. 5, for the inlet in which the alignment mark 9c having a width shorter than the widths of the first base material 3 and the second base material 6 and having a round shape is formed at a predetermined position. A substrate 9 is prepared. The positions of the alignment marks 9c formed on the inlet base material 9 correspond to the positions of the alignment marks 3c and 6c formed on the first base material 3 and the second base material 6 described above. When the alignment mark 9c formed on the inlet base material 9 is aligned with the alignment marks 3c and 6c formed on the first base material 3 and the second base material 6, both side edges 9b of the inlet base material 9 are used. Are arranged inside the side edges 3b, 6b of the first base material 3 and the second base material 6 so as to leave strip-like margins 9d each having a predetermined width.

  Next, as shown in FIG. 2, the antenna 10 is formed on the inlet base material 9. At this time, nine antennas 10 are formed on the inlet base 9 so that nine non-contact IC cards 1 can be manufactured. As a means for forming the antenna 10 on the inlet base material 9, a screen printing machine for applying conductive ink on the inlet base material 9, or a conductive foil made of copper, aluminum or the like on the inlet base material 9. Or a transfer apparatus that transfers the pattern to a desired shape by etching a conductive foil made of copper, aluminum, or the like laminated on the inlet base material 9 can be used. If these means for forming an antenna are used, not only the inlet sheet 8 having a coiled antenna but also antennas having various shapes can be formed on the inlet sheet 8. Thereafter, IC chips 11 are attached corresponding to the respective antennas 10 formed on the inlet base material 9, whereby the antennas 10 are formed in nine places on the inlet base material 9, and nine IC chips are provided. 11 is provided.

  Next, as shown in FIG. 3, the first hot melt layer 4 of the front surface side substrate 2 and the second hot melt layer 7 of the back surface side substrate 5 are cooled and solidified. By the way, when the fluid hot melt 14 made of a moisture-curable urethane resin is exposed to an air environment at room temperature or rapidly cooled, the tackiness is lost and solidifies in several seconds to several tens of seconds. As a result, the first hot melt layer 4 and the second hot melt layer 7 are exposed to the air environment for several seconds to several tens of seconds or cooled, and the first hot melt layer 4 and the second hot melt layer 7 are tacky. Solidify until lost.

  Next, as shown in FIG. 3, the IC card laminate 12 in which the inlet sheet 8 is interposed between the front surface side base material 2 and the back surface side base material 5 is produced by the laminating means 23. In this case, first, for example, the surface side base material 2 and the inlet sheet 8 are aligned. At this time, as shown in FIG. 5, the alignment mark 3 c formed on the first base 3 of the surface side base 2 and the alignment mark 9 c formed on the inlet sheet base 9 of the inlet sheet 8 are matched. . Next, the back surface side base material 5 and the inlet sheet 8 are aligned. At this time, the alignment mark 6 c formed on the second substrate 6 of the back surface side substrate 5 and the alignment mark 9 c formed on the inlet sheet substrate 9 of the inlet sheet 8 are matched. By this, the surface side base material 2, the back surface side base material 5, and the inlet sheet 8 can be aligned.

  During this time, the first hot-melt layer 4 of the surface-side base material 2 has lost tackiness, so that even if the surface-side base material 2 and the inlet sheet 8 come into contact with each other, they are not joined. This makes it possible to easily and accurately produce the IC card laminate 12 while aligning the surface side base material 2 and the inlet sheet 8. Similarly, since the tackiness of the second hot melt layer 7 of the back surface side base material 5 is also lost, even if the back surface side base material 5 and the inlet sheet 8 come into contact with each other, they are not joined. This makes it possible to easily and accurately produce the IC card laminate 12 while aligning the back side base material 5 and the inlet sheet 8. By the way, as shown in FIG. 1, the IC chip 11 and the antenna 10 arranged on the inlet base material 9 are directed to the front surface side base material 2 side, but may be directed to the back surface side base material 5 side. .

  Further, in this case, as described above, the side edges 9b of the inlet base material 9 are belt-like shapes having a predetermined width inside the side edges 3b and 6b of the first base material 3 and the second base material 6. They are arranged leaving a margin 9d. As a result, the vicinity of both side edges (not shown) of the inlet sheet 8 is interposed between the side edge vicinity 2b of the front surface side substrate 2 and the side edge vicinity 5b of the back surface side substrate 5. And the front edge vicinity 8a of the inlet sheet 8 is interposed between the front edge vicinity 2a of the front surface side substrate 2 and the front edge vicinity 5a of the back surface side substrate 5, and the IC card laminate 12 Is produced.

  Next, as shown in FIGS. 3 and 5, the front end between the inlet sheet 8, the front surface side base material 2, and the back surface side base material 5 in the IC card laminate 12 using the ultrasonic welder 25. Edge vicinity 8a, 2a, 5a is temporarily joined, and both side edge vicinity 5a, 5b of the surface side base material 2 and the back surface side base material 5 is temporarily joined. In this case, first, in the region other than the non-contact IC card 1 obtained by cutting, the vicinity of the front edge 8a, 2a, 5a of the inlet sheet 8, the front-side base material 2, and the back-side base material 5 is 1 A plurality of temporary joint portions 13 are temporarily joined at intervals of ˜20 mm, and a plurality of temporary joint portions 13 are formed such that the distance between the joint portions 13 is 1 to 20 mm. Next, in the area other than the non-contact IC card 1 obtained by cutting, both side edge vicinity 2b and 5b of the front surface side base material 2 and the back surface side base material 5 are temporarily joined at a plurality of positions at intervals of 1 to 20 mm. The plurality of temporary joints 13 are formed so that the distance between the joints 13 is 1 to 20 mm. In this way, since the temporary joint portion 13 is formed in a region other than the non-contact IC card 1 obtained by cutting, unevenness caused by the temporary joint portion 13 is formed on the front and back surfaces of the non-contact IC card 1. The IC card laminate 12 can be temporarily joined without causing it.

  Next, as shown in FIG. 3, the temporarily bonded IC card laminated body 12 is transported between a pair or a plurality of heating rollers 27 constituting the bonding means 26, and the first hot melt layer 4 and the second hot melt layer 4. The hot-melt layer 7 is melted so that the front surface side base material 2 and the inlet sheet 8 are adhered, and the rear surface side base material 5 and the inlet sheet 8 are adhered. In the present embodiment, as described above, the first hot melt layer 4 and the second hot melt layer 7 are in a state where the tackiness is lost. For this reason, the front surface side base material 2 and the back surface side base material 5 and the inlet sheet 8 are not adhered until they are heated by the pair or plural pairs of heating rollers 27. As a result, the first hot melt layer 4 and the second hot melt layer 7 are sequentially melted from the front side to the rear side of the IC card laminate 12, and the front side substrate 2, the back side substrate 5, and the inlet sheet 8. Will be glued sequentially. During this time, the air interposed between the front surface side base material 2 and the back surface side base material 5 and the inlet sheet 8 escapes backward. For this reason, it can prevent reliably that an air layer is formed between the surface side base material 2 and the back surface side base material 5, and the inlet sheet 8. FIG.

  Further, during this time, a plurality of temporary joining portions 13 are formed at intervals of 1 to 20 mm in the side edge vicinity 2b and 5b of the front surface side substrate 2 and the back surface side substrate 5. Thus, it is possible to reliably prevent the first hot melt layer 4 and the second hot melt layer 7 heated by the heating roller 27 from being melted and flowing out of the IC card laminate 12.

  Here, as described above, only the front edge vicinity 8 a of the inlet sheet 8 is temporarily joined to the front surface side substrate 2 and the rear surface side substrate 5. By the way, not only the vicinity of the front edge 8a of the inlet sheet 8, but also the vicinity of both edges of the inlet sheet 8 is temporarily joined to both edges 2b of the surface side substrate 2 and both edges 5b of the back side substrate 5. When the IC card laminated body 12 is heated by the heating roller 27, the inlet sheet 8 is firmly temporarily bonded to the front surface side base material 2 and the back surface side base material 5, so that the first hot melt layer 4 and the first hot melt layer 4 2 It is conceivable that the hot melt layer 7 is melted and hinders the flow that is sequentially sent backward. In this case, the IC card laminate 12 is distorted. For this reason, the inlet sheet 8 is excessively bonded to the front surface side substrate 2 and the rear surface side substrate 5 by temporarily bonding only the front edge vicinity 8a without temporarily bonding the vicinity of both side edges of the inlet sheet 8. Thus, it is possible to prevent the IC card laminate 12 from being distorted.

  Next, as shown in FIG. 3, the IC card laminated body 12 is cooled and pressurized and the first hot melt layer 4 and the second hot melt layer 7 are cured. In this case, the flowable hot melt 14 made of a moisture-curable urethane resin is cured by crosslinking reaction by absorbing moisture in the air after being melted. Accordingly, the first hot melt layer 4 and the second hot melt layer 7 can be cured by allowing the IC card laminate 12 to stand for about 5 days in a cooled and pressurized state. For this reason, during use of the non-contact IC card 1, the non-contact IC card 1 does not soften even when the non-contact IC card is in a high temperature state.

  Next, as shown in FIG. 3, after the first hot melt layer 4 and the second hot melt layer 7 are completely cured, the IC card laminate 12 is cut by the cutting means 28 for each IC chip 11 and antenna 10. . As described above, individual contactless IC cards 1 can be obtained.

  Thus, according to the present embodiment, a plurality of front edge vicinity 8a, 2a, 5a between the inlet sheet 8, the front-side base material 2, and the back-side base material 5 in the IC card laminate 12 are provided. Are temporarily joined together, and both the side edge vicinity 5a, 5b of the front surface side base material 2 and the back surface side base material 5 are temporarily joined at a plurality of locations. As a result, the strength of the IC card laminate 12 can be increased. For this reason, the heat shrinkage rate due to the difference in thickness between the front surface side base material 2 and the back surface side base material 5 is different, the residual stress is generated at the time of temporary joining, and distortion is caused by receiving the pressing force from the heating roller 27. Generation | occurrence | production can be suppressed. For this reason, it can suppress reliably that the non-contact IC card 1 obtained by cutting the IC card laminated body 12 warps.

  Further, according to the present embodiment, the first hot melt layer 4 and the second hot melt layer 7 whose tackiness is lost are sequentially melted from the front while preventing the occurrence of distortion as described above. Glued. By this, it can suppress that air interposes between the surface side base material 2 and the inlet sheet 8, or between the back surface side base material 5 and the inlet sheet 8. FIG. For this reason, the front surface and the back surface of the non-contact IC card 1 can be surely flattened.

  In the present embodiment, the inlet sheet 8, the front-side base material 2, and the front edge vicinity 8a, 2a, 5a of the back-side base material 5 are temporarily joined. However, the present invention is not limited to this, and the front edge vicinity 8a of the inlet sheet 8 is one of the front edge vicinity 2a of the front surface side substrate 2 and the front edge vicinity 5a of the back surface side substrate 5. It is only necessary to temporarily join the vicinity of the front edge.

  Moreover, in this Embodiment, while joining the front edge vicinity 8a, 2a, 5a between the inlet sheet 8, the surface side base material 2, and the back surface side base material 5 among the IC card laminated bodies 12 temporarily. The side edge portions 5a and 5b of the front surface side base material 2 and the back surface side base material 5 are temporarily joined. However, the present invention is not limited to this, and in the IC card laminated body 12, the vicinity of both side edges 8b, 2b, 5b between the inlet sheet 8, the front surface side base material 2, and the back surface side base material 5 are temporarily joined. In addition, the front edge vicinity 2a, 5a of the front surface side substrate 2 and the back surface side substrate 5 may be temporarily joined. In this case, the vicinity of both side edges (not shown) of the inlet sheet 8 is either one of the side edge vicinity 2b of the front surface side substrate 2 and the side edge vicinity 5b of the back surface side substrate 5. It is only necessary to temporarily join the vicinity of both side edges.

Second Embodiment Next, a method for manufacturing a non-contact IC card in the second embodiment of the present invention will be described with reference to FIGS. Here, FIG. 6 is a diagram showing an ultrasonic welder used in the method of manufacturing a non-contact IC card according to the second embodiment of the present invention, and FIG. 7 is a diagram according to the second embodiment of the present invention. It is a figure explaining the method to perform temporary joining in the manufacturing method of a non-contact IC card.

  In the second embodiment shown in FIG. 6 and FIG. 7, the temporary joining means is different only in that it consists of an ultrasonic welder including a plurality of heads, and other configurations are the same as those shown in FIG. 1 to FIG. This is substantially the same as the first embodiment. 6 and 7, the same parts as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 6, the temporary joining means 24 of the manufacturing apparatus 20 (see FIG. 3) of the non-contact IC card 1 includes an ultrasonic welder 32, and the ultrasonic welder 32 includes a plurality of heads 32a. . In the present embodiment, the ultrasonic welder 32 includes four heads 32a. However, the present invention is not limited to this, and an arbitrary number of heads 32a may be included.

  When the IC card laminate 12 is temporarily joined using an ultrasonic welder 32 including a plurality of heads 32a shown in FIG. 6, as shown in FIG. 7, in the width direction of the front edge vicinity 2a of the surface side substrate 2 The temporary joint portions 13 are sequentially formed in a plurality of units. That is, a plurality of temporary joint assemblies 14 including the plurality of temporary joints 13 are sequentially formed. Similarly, a plurality of temporary joint assemblies 14 including a plurality of temporary joints 13 are sequentially formed in the longitudinal direction of both side edge vicinity 2b and 5b of the front surface side base material 2 and the back surface side base material 5. The

  As described above, according to the present embodiment, the plurality of temporary joint assemblies 14 including the plurality of temporary joints 13 are sequentially formed on the IC card laminate 12 using the ultrasonic welder 32 including the plurality of heads 32a. Can be made. For this reason, the some temporary joining part 13 can be efficiently formed in the IC card laminated body 12. FIG.

FIG. 1 is a diagram showing a cross-sectional configuration of a non-contact IC card manufactured by the manufacturing method according to the first embodiment of the present invention. FIG. 2 is a perspective view showing an example of an inlet sheet of a non-contact IC card manufactured by the manufacturing method according to the first embodiment of the present invention. FIG. 3 is a schematic diagram showing a manufacturing method and a manufacturing apparatus for a non-contact IC card according to the first embodiment of the present invention. FIG. 4 is a perspective view showing an IC card laminate produced in the method for manufacturing a non-contact IC card in the first embodiment of the present invention. FIG. 5 is a diagram for explaining a method for producing an IC card laminate in the method for producing a non-contact IC card according to the first embodiment of the present invention. FIG. 6 is a diagram showing an ultrasonic welder used in the method of manufacturing a non-contact IC card according to the second embodiment of the present invention. FIG. 7 is a diagram for explaining a method for performing temporary bonding in the method for manufacturing a non-contact IC card according to the second embodiment of the present invention. FIG. 8 is a diagram for explaining a method for temporarily joining a conventional IC card laminate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC card 2 Surface side base material 2a Front edge vicinity 2b Both-side edge vicinity 3 1st base material 3a Front edge 3b Both-side edge 3c Alignment mark 4 1st hot-melt layer 4a Band-shaped margin 4b Band-shaped margin 5 Back surface Side substrate 5a Front edge vicinity 5b Both side edge vicinity 6 Second substrate 6a Front edge 6b Both side edge 6c Alignment mark 7 Second hot melt layer 7a Band margin 7b Band margin 8 Inlet sheet 8a Front edge vicinity 9 Inlet base material 9a Front edge 9b Both side edges 9d Strip margin 9c Alignment mark 10 Antenna 11 IC chip 12 IC card laminate 13 Temporary joint 14 Temporary joint assembly 20 Manufacturing apparatus 21 First adhesive application means 22 2 Adhesive applying means 23 Laminating means 24 Temporary joining means 25 Ultrasonic welder 26 Adhesive means 27 Heating low 28 Cutting means 29 Thermocompression bonding machine 30 Adhesive material applicator 31 Adhesive material applicator 32 Ultrasonic welder 32a Head 42 Surface side base material 43 First base material 45 Back surface side base material 46 Second base material 48 Inlet sheet 49 Inlet base Material 50 Alignment mark 51 Alignment mark 52 Alignment mark 53 Ultrasonic welder

Claims (6)

In the method of manufacturing a non-contact IC card,
Preparing a surface-side substrate including a first substrate and a first hot melt layer formed by applying a fluid hot melt to one surface of the first substrate;
Preparing a back side substrate including a second base and a second hot melt layer formed by applying a fluid hot melt to one surface of the second base;
An inlet base material having a width shorter than the width of the front surface side base material and the back surface side base material, an IC chip provided on the inlet base material, and an antenna provided corresponding to the IC chip Preparing an inlet sheet including:
A first hot-melt layer on the surface side substrate, a second hot-melt layer of the rear substrate, and exposing or cooled under the environment air, and solidifying,
A step of producing an IC card laminate in which an inlet sheet is interposed between the front surface side substrate and the back surface side substrate;
Of the IC card laminated body, the front side edge vicinity and both side edge vicinity of the front surface side base material and the back surface side base material are temporarily joined, and the both side edge vicinity of the inlet sheet is used as the front surface side base material and the back surface side base material. without temporarily joined, temporarily joined using the temporary bonding means a forward edge near neighbor between the front edge near neighbor or inlet sheet and the back side substrate, between the inlet sheet and the surface-side substrate Process,
While transporting the temporarily bonded IC card laminate between at least a pair of heating rollers, melting the first hot melt layer and the second hot melt layer, and bonding the surface side base material and the inlet sheet, And a step of adhering the back side substrate and the inlet sheet to each other. The inlet sheet has an inlet base, a plurality of IC chips provided on the inlet base, and an antenna provided corresponding to each IC chip.
And further comprising a step of cutting the IC card laminate for each IC chip and antenna to obtain a non-contact IC card after the surface side substrate and the inlet sheet are bonded and the back side substrate and the inlet sheet are bonded. The method for manufacturing a non-contact IC card according to claim 1, wherein: The temporary joining means includes an ultrasonic welder, a thermocompression bonding machine, an adhesive application machine, or an adhesive application machine, and the ultrasonic welder, the thermocompression bonding machine, the adhesive application machine, or the adhesive application machine is an IC card laminate. contactless IC card manufacturing method according to claim 2, characterized in that to facilities the temporary bonding in a region other than the non-contact IC card obtained by the cutting out of.   4. The method of manufacturing a non-contact IC card according to claim 3, wherein the temporary joining means includes an ultrasonic welder, and the ultrasonic welder includes a plurality of heads. The first hot melt layer is formed on one surface of the first base material while leaving a predetermined strip margin inside the front edge and both side edges of the first base material,
The second hot melt layer is formed on one surface of the second base material while leaving a predetermined strip margin inside the front edge and both side edges of the second base material. A method for producing a non-contact IC card according to any one of 1 to 4.   In the temporary bonding step, temporary bonding is performed at a plurality of locations on the IC card laminate by a temporary bonding means to form a plurality of temporary bonding portions, and the distance between the temporary bonding portions is 1 to 20 mm. A method for producing a non-contact IC card according to any one of claims 1 to 5.

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