JP6574367B2 - RFID label affixing structure on form slip and RFID label affixing method - Google Patents

Description

  The present invention relates to an RFID label attaching structure to be attached to a form paper piece, and an RFID label attaching method.

  In recent years, in the physical distribution field, the medical field, the factory production field, and the like, a form paper piece with an RFID label that can be contactlessly communicated is widely used. Here, the RFID label is generally an IC chip and an antenna disposed on a sheet substrate such as a film, and the IC chip and the antenna are connected to each other. Although such an RFID label is extremely thin as a whole, since the IC chip has a predetermined thickness, the part where the IC chip is disposed protrudes to the front side as compared with the peripheral part. For this reason, when pressure or vibration is applied to the RFID label from the outside, stress concentration tends to occur at the IC chip placement site, and the IC chip may be damaged accordingly. Further, such a form paper piece is used by forming a form continuous paper piece in which a plurality of form paper pieces are continuously arranged in a line and being cut out from the form continuous paper. The form continuous paper is stored or transported in a rolled state or a folded bellows state. For this reason, the RFID label of each form paper piece is loaded in the thickness direction by being wound in a roll shape or folded in a bellows shape, and stress concentration on the IC chip is caused by the load as described above. The IC chip is likely to be damaged.

  As a configuration that can relieve stress concentration on the IC chip of the RFID label, for example, the configuration of Patent Document 1 has been proposed. The RFID label having such a configuration is such that an IC chip is embedded in a sheet base material made of low-density paper, and the IC chip does not protrude. Therefore, when pressure or the like is applied to the RFID label from the outside, stress concentration on the IC chip due to the pressure or the like can be alleviated, and damage to the IC chip can be suppressed.

JP 2008-102805 A

  By the way, in the RFID label of Patent Document 1 described above, a special sheet base material called low-density paper is used, and an IC chip and an antenna must be disposed on the paper. Manufacturing process is required, the manufacturing cost is increased, and the versatility is poor. Further, since low-density paper has low strength and rigidity, there is a problem that it is difficult to handle in the operation of attaching the RFID label to a form paper piece. Furthermore, the low density paper may be damaged during work due to the lack of support capability of the IC chip or antenna.

  The present invention does not cause a problem due to the special RFID label described above, and can suppress the damage of the IC chip due to external pressure, vibration, etc., and the application method capable of forming the application structure This is a proposal.

  A first aspect of the present invention is a pasting structure of a form paper piece and an RFID label which is attached to a predetermined part of the form paper piece and an IC chip and an antenna are arranged on a sheet base material. A plastic deformable layer made of a resin having plastic deformability, the RFID label is affixed on the plastic deformable layer, and at least an IC chip disposition portion of the RFID label is attached to the plastic deformable layer; An RFID label affixing structure on a form paper piece characterized by being embedded.

  Here, since the plastic deformation layer is formed by embedding the IC chip placement site by plastic deformation, the layer thickness of the portion not plastically deformed is formed to be at least larger than the thickness of the IC chip. . In other words, the plastic deformation layer is formed in a state in which the layer thickness is larger than the thickness of the IC chip in a state before the IC chip placement site is embedded.

  In such a configuration, since the IC chip placement portion of the RFID label is embedded in the plastic deformation layer on the form piece, the height difference between the IC chip placement portion and its peripheral portion is made as much as possible. Can be small. Accordingly, when pressure or vibration is applied to the RFID label from the outside, stress concentration on the IC chip due to the pressure or the like can be alleviated, and damage to the IC chip due to the pressure or the like can be prevented. Here, since the plastically deformable layer has plastic deformability, it can be held in a state where the IC chip placement portion is embedded, and the effect of relaxing the stress concentration on the IC chip can be stably exhibited. . In addition, since the plastic deformation layer is provided on the form paper piece, it can be formed relatively easily and the design requirements such as the layer thickness can be easily adjusted as appropriate. Therefore, the plastic deformation layer can be set in consideration of its plastic deformability so that the IC chip placement site can be embedded and held to a desired depth. For this reason, the form in which the IC chip placement site is embedded in the plastic deformation layer can be formed relatively easily and stably, and the effect of preventing the breakage of the IC chip can be stably exhibited.

  Further, in this configuration, since the IC chip placement site is embedded in the plastic deformation layer, the plastic deformation layer is interposed between the IC chip placement site and the form paper piece. Therefore, the RFID label and the form paper piece are not in contact with each other, and the vibration or the like acting through the form paper piece can be mitigated by the plastic deformation layer.

  Moreover, since this structure is the structure which provided the plastic deformation layer in the form paper piece, it does not limit the RFID label to stick. Therefore, a highly versatile RFID label can be used. Therefore, the RFID label can be manufactured or obtained relatively easily, and it has an excellent advantage that the cost required for manufacturing or obtaining the RFID label does not increase. Furthermore, unlike the above-described conventional configuration, there is no problem with a special RFID label.

  This configuration is not limited to the case where the IC chip placement site is completely buried in the plastic deformation layer, but also includes the case where the IC chip placement site is partially buried in the thickness direction. Further, in this configuration, the IC chip placement site is such that there is no difference in height between the IC chip placement site and the peripheral site (in other words, the upper surface height position of both is equal). Is preferably embedded in the plastic deformation layer. According to such a configuration, pressure, vibration, and the like applied from the outside to the RFID label are easily dispersed throughout the RFID label, so that stress concentration on the IC chip can be further alleviated and damage to the IC chip can be prevented. The above-mentioned effect of performing can be more stably exhibited.

  On the other hand, the second of the present invention is a continuous form paper composed of a plurality of continuous form paper pieces, in which the plurality of form paper pieces are stacked in the thickness direction, and an IC chip and an antenna are disposed on a sheet base material. In the RFID label affixing method for affixing each RFID label to each form paper piece, a predetermined layer thicker than the thickness of the IC chip is formed on each form paper piece with a plastic deformation layer made of plastic having plastic deformability. A step of forming the thickness, a step of adhering the RFID label on the plastic deformation layer of each form paper piece, and a plurality of form paper pieces stacked in the thickness direction, The step of embedding at least the IC chip placement portion of the RFID label in the plastic deformation layer to which the RFID label is attached by pressing force in the thickness direction is sequentially executed. A sticking method of an RFID label.

  Here, stacking a plurality of form paper pieces in the thickness direction is preferably, for example, winding the form continuous paper in a roll shape or folding it in a bellows shape.

  In such a method, the RFID label according to the present invention described above is applied by embedding the IC chip placement site in the plastic deformation layer by a pressing force generated by stacking a plurality of form paper pieces in the thickness direction. A structure can be formed. That is, the configuration in which the RFID label is attached to the form paper piece by this method can achieve the same effects as the RFID label attaching structure described above.

  Furthermore, the sticking method of the present invention uses a pressing force generated by stacking a plurality of form paper pieces, and this pressing force increases as the number of stacked form paper pieces (hereinafter referred to as the number of stacked sheets) increases. Become. Usually, when the form sheet pieces of the form continuous paper are stacked, the number of the form sheet pieces is gradually increased, and accordingly, the pressing force is also gradually increased. According to this method, the IC chip placement site is gradually embedded in the plastic deformation layer by the pressing force gradually increasing in this way. Therefore, since the pressing force necessary for embedding in the plastic deformation layer does not act abruptly on the IC chip mounting site, the IC chip mounting site does not cause damage to the IC chip due to the pressing force. Can be embedded in the plastic deformation layer. In addition, the step of embedding the IC chip placement portion in the plastic deformation layer can be performed by a generally performed step of winding a continuous form paper in a roll shape or folding it in a bellows shape. For this reason, this embedding process is not required separately, and therefore, there is an excellent advantage that manufacturing time and cost increase due to execution of the process hardly occur.

  Further, in the sticking method of the present invention, since the plastic deformation layer is formed so that the layer thickness is thicker than the thickness of the IC chip, the IC chip placement site is no longer different in height from its peripheral site. It can be sufficiently embedded, and the plastic deformation layer is kept between the embedded IC chip placement site and the form paper piece. For this reason, the structure in which the RFID label is pasted on the form paper piece by this method does not directly contact the RFID label and the form paper piece, and the plastic deformation layer reduces vibrations and the like acting through the form paper piece. The buffer action can be exhibited.

  In the RFID label affixing method according to the present invention described above, the step of forming the plastic deformation layer on each form paper piece includes the plastic deformation layer, the layer thickness of which is 1.2 of the IC chip thickness of the RFID label. A method is proposed in which it is formed so as to be not less than twice and not more than 2.5 times.

  According to this method, the plastic deformation layer having a layer thickness that can sufficiently embed the IC chip placement portion and can keep the IC chip placement portion and the form paper piece in a non-contact state is stabilized. Can be formed. Therefore, the structure in which the RFID label is affixed to the form paper piece by this method has both the above-described damage prevention effect due to external pressure and the like and the effect of the buffering action to alleviate vibration from the form paper piece side. Can be demonstrated stably. Furthermore, as the plastic deformation layer formed by this method is thickened, the IC chip placement site can be embedded easily and stably in the plastic deformation layer, and the buffering action by the plastic deformation layer is also stabilized. Although this may occur, a step difference between the part to which the RFID label is attached and the surface of the form paper piece becomes large, which may cause a printing failure when printing predetermined information on the form paper piece. For this reason, in this method, the step is made as small as possible by forming the thickness of the plastic deformation layer to be 2.5 times or less the thickness of the IC chip, and the occurrence of defective printing is as much as possible. Can be suppressed.

  In addition, in the sticking method of the present invention, it is preferable that the plastic deformation layer has a thickness that is 1.4 times or more and 2 times or less the thickness of the IC chip, and more preferably 1.4 times or more and A configuration of 1.6 times or less is more preferable. By forming the plastic deformation layer having such a layer thickness, the above-described damage prevention effect, the effect of the buffering action, and the effect of suppressing the occurrence of printing defects can be more stably exhibited.

  In the RFID label attaching method according to the present invention described above, a method is proposed in which the plastic deformation layer is formed of a hot-melt resin.

  Here, the hot melt resin is a solid having plastic deformability at room temperature, and the plastic deformation layer is formed in the solid state. Further, since the hot melt resin can be applied by heating and the amount applied can be adjusted relatively easily, there is also an advantage that the plastic deformation layer can be easily and stably formed with a desired layer thickness. Furthermore, since the hot melt resin is generally used as a printing ink for a form paper piece, a plastic deformation layer can be formed in a printing process for printing a predetermined pattern or information on the form paper piece, The time and cost required for forming the plastic deformation layer can be suppressed.

  Since the RFID label attaching structure of the present invention is formed by embedding at least an IC chip placement portion of the RFID label in the plastically deformable plastic deformation layer formed on the form paper piece as described above. When pressure or vibration is applied to the RFID label from the outside, stress concentration on the IC chip due to the pressure or the like can be alleviated, and damage to the IC chip due to the pressure or the like can be prevented. In addition, since this configuration does not limit the RFID label, the above-described damage prevention effect of the IC chip can be stably exhibited even by using a highly versatile RFID label.

  As described above, the RFID label sticking method of the present invention forms a plastic deformation layer of plastic deformation on each form paper piece constituting the continuous form paper, and at least the IC chip arrangement of the RFID label adhered on the plastic deformation layer. Since the installation site is a method in which each form paper piece is embedded in the plastic deformation layer by the pressing force generated by overlapping the form paper pieces in the thickness direction, the above-described sticking structure of the present invention is stably formed. The affixing structure can exhibit the above-described effects. Furthermore, according to this method, since the IC chip placement portion of the RFID label is gradually embedded in the plastic deformation layer, the IC chip is embedded in the plastic deformation layer while preventing damage to the IC chip due to the pressing force. A desired pasting structure can be formed.

It is a top view which shows the form continuous paper 1 of an Example. It is explanatory drawing which shows the state which each form paper piece 2 of the form continuous paper 1 was folded in the shape of a bellows. It is (a) top view and (b) side view of the RFID label 11. It is explanatory drawing which shows the printing apparatus 51 for forming the plastic deformation layer. (A) A longitudinal sectional view showing a state in which the plastic deformation layer 21 is formed by the printing apparatus 51 of the form paper piece 2 of the continuous form paper 1, and (b) a state in which the RFID label 11 is adhered on the plastic deformation layer 21. It is a longitudinal cross-sectional view. FIG. 4 is an explanatory diagram showing a process in which the placement site 16 of the IC chip 13 of the RFID label 11 is embedded in the plastic deformation layer 21 when each form paper piece 2 is folded in a bellows shape.

Embodiments according to the present invention will be described according to the following examples.
In this embodiment, the longitudinal direction of the continuous form paper 1 is a direction in which a plurality of continuous form paper pieces 2 are continuous, and the direction orthogonal to the longitudinal direction is the width direction of the continuous form paper 1 and the form paper piece 2. . The direction in which the plurality of form paper pieces 2 are stacked in the state in which the form paper pieces 2 of the continuous form paper 1 are folded in a bellows shape (see FIG. 2) will be described as the vertical direction. That is, this up-down direction is the thickness direction of the form paper piece 2. It should be noted that the present invention is not limited to the direction thus determined.

  In the present embodiment, the RFID label 11 is affixed to a predetermined attachment site on the surface of the form sheet piece 2. The continuous form paper 1 is formed by a plurality of continuous form paper pieces 2.

  The continuous form paper 1 is made of high-quality paper or the like in the form of a long belt, and as shown in FIG. 1, a plurality of perforations 4 that cross in the width direction are formed at regular intervals in the longitudinal direction. The perforation 4 is formed so as to be foldable and cuttable, and a rectangular form sheet piece 2 is constituted by a portion separated by two adjacent perforations 4, 4. In this way, the continuous form paper 1 is formed by connecting a plurality of form paper pieces 2 via the perforation 4.

  As shown in FIG. 2, the continuous form sheet 1 can fold a plurality of continuous form sheet pieces 2 into a bellows shape by alternately repeating a mountain fold and a valley fold. Folding in a bellows shape in this way is advantageous in storage space and transportation work, and therefore has the advantage that workability during storage and transportation can be improved. The form continuous paper 1 is printed with predetermined information on the front surface (or / and the back surface) of each form paper piece 2 by a printer or the like. After that, by cutting the perforation 4, the form paper pieces 2 can be cut and used one by one.

  Further, as described above, the RFID label 11 is attached to each of the plurality of form paper pieces 2 constituting the continuous form paper 1. As shown in FIG. 3, the RFID label 11 has an IC chip 13 and an antenna 14 disposed on a sheet substrate 12 made of a synthetic resin film. (Not shown) is connected to the antenna 14. More specifically, conductive ink formed by mixing conductive metal (for example, gold, platinum, copper, nickel, etc.) particles in a resin binder on the sheet base 12 is formed in a predetermined shape (for example, loop coil shape). Etc.), the antenna 14 is formed. Then, a conductive bonding agent (not shown) is applied on the end of the antenna 14, and the IC chip 13 is mounted on the bonding agent, thereby bonding the IC chip 13. Here, the IC chip 13 is attached so that a terminal (not shown) contacts the bonding agent, and the terminal and the end of the antenna 14 are connected via the bonding agent. The RFID label 11 has the IC chip 13 and the end of the antenna 14 overlapped in the thickness direction.

  Furthermore, a pressure-sensitive adhesive layer (not shown) coated with a predetermined pressure-sensitive adhesive is provided on the back surface of the sheet substrate 12 of the RFID label 11. The RFID label 11 is adhered to the form paper piece 2 by the pressure-sensitive adhesive layer of the sheet base 12 so as not to be peeled off.

  Such an RFID label 11 is a non-contact type battery-less type capable of transmitting and receiving signals such as commands and data in a non-contact manner using an electromagnetic wave with an input / output device (reader / writer device) (not shown). The command, data, and the like are stored in the memory of the IC chip 13, and the IC chip 13 transmits and receives signals to and from the input / output device via the antenna 14. The RFID label 11 according to the present embodiment can be applied to a known label, so that details thereof are omitted.

  Next, a pasting process for pasting the RFID label 11 to each of the plurality of form paper pieces 2 constituting the continuous form paper 1 will be described. The structure in which the RFID label 11 is attached to each form paper piece 2 by this attaching process is the attachment structure of the form paper piece 2 and the RFID label 11 according to the present embodiment.

  In the pasting step of the present embodiment, a step of forming the plastic deformation layer 21 on the form paper piece 2, a step of adhering the RFID label 11 to the plastic deformation layer 21, and a step of bending the continuous form paper 1 into a bellows are sequentially performed. Run. In addition, the sticking method of the RFID label concerning this invention is implement | achieved by this sticking process.

  Here, the step of forming the plastic deformation layer 21 on the form paper piece 2 is performed in a printing process in which a predetermined pattern or information is printed on the surface of the form paper piece 2, and a resin ink made of a predetermined hot melt resin is used for the form. The plastic deformation layer 21 is formed by applying to the surface of the paper piece 2. This hot melt resin is mainly composed of a thermoplastic resin, and in this embodiment, a specific resin having plastic deformability and flexibility in a solid state cured after application in the above step is used.

  The printing process of the present embodiment is performed using a plurality of printing apparatuses (not shown) provided with plate cylinder rollers, and each printing apparatus divides a plurality of times to form a predetermined pattern on the surface of the continuous form paper 1. And information are printed. In this printing process, the forming process of the plastic deformation layer 21 described above is executed by the single printing apparatus 51. As shown in FIG. 4, the printing apparatus 51 includes a plate cylinder roller 52 having a printing plate 59 provided on the outer peripheral surface thereof, an ink roller 53 that causes the resin ink to adhere to the printing plate 59 of the plate cylinder roller 52, and An ink storage container 54 for supplying the resin ink to the ink roller 53, a blanket roller 55 to which the resin ink is transferred from the plate cylinder roller 52, and a pressure disposed so as to face the blanket roller 55 And a roller 56. In the process of forming the plastic deformation layer 21 by the printing device 51, the continuous form 1 is continuously placed between the blanket roller 55 and the pressure roller 56 with the surface facing the blanket roller 55. The resin ink passed through and supplied from the ink storage container 54 is transferred onto the surface of the continuous form paper 1 through the ink roller 53, the plate cylinder roller 52, and the blanket roller 55. Here, the plate cylinder roller 52 and the blanket roller 55 are provided so as to transfer the resin-made ink to a predetermined attachment portion of each form paper piece 2 of the form continuous paper 1, and from the ink storage container 54. By adjusting the amount of resin ink supplied, the amount of resin ink transferred to the attachment site is set. Thereby, resin-made ink can be apply | coated to the predetermined attachment position of each form paper piece 2 so that it may become preset thickness. Further, after passing through the printing device 51, the continuous paper sheet 1 is sequentially sent to a drying device (not shown), and the resin ink transferred to each of the paper sheet pieces 2 of the continuous paper sheet 1 by passing through the drying device. dry. As a result, the resin ink applied to the attachment portion of each form paper piece 2 is cured to form a plastic deformation layer 21 having a preset layer thickness t as shown in FIG. The plastic deformation layer 21 thus formed has plastic deformability and flexibility as described above. The layer thickness t of the plastic deformation layer 21 is formed to be about 1.5 times the thickness s of the IC chip 13 of the RFID label 11 described above, and is formed with the layer thickness t. The application amount of the resin ink described above is adjusted so that it is possible. The printing device 51 and the drying device described above can be applied with a known configuration, and thus the details thereof are omitted.

  After the plastic deformation layer 21 is thus formed on each form paper piece 2, the step of adhering the RFID label 11 on the plastic deformation layer 21 is performed. In this step, as shown in FIG. 5B, the RFID label 11 is adhered onto the plastic deformation layer 21 of each form paper piece 2 by an adhesive layer provided on the back surface of the sheet base 12. In this bonded state, the arrangement portion 16 of the IC chip 13 of the RFID label 11 protrudes most from the surface of the form paper piece 2, and the protruding height is the thickness t of the plastic deformation layer 21 and the IC chip 13. It is the dimension obtained by adding the thickness of the arrangement site 16. Such adhesion of the RFID label 11 can be automatically performed using a conventionally known apparatus.

  When the RFID label 11 is bonded to the plastic deformation layer 21 of each form paper piece 2, a process of bending the form continuous paper 1 into a bellows shape is performed. In this step, as shown in FIG. 2, the perforation 4 of the continuous form paper 1 is repeatedly folded in order by alternately repeating a mountain fold and a valley fold, whereby a plurality of continuous form paper pieces 2 are formed in a bellows shape. Fold it over. Bending the long strip-shaped continuous form 1 into a bellows is advantageous in storage space and transportation work, so that workability during storage and transportation can be improved. Further, when each form sheet piece 2 is cut out from the form continuous sheet 1 and used, the workability can be improved. Note that the step of bending the continuous form paper 1 into a bellows shape can be performed using a conventionally known apparatus, and thus the details thereof are omitted.

  As described above, when the continuous form paper 1 is folded in a bellows shape and each form paper piece 2 is folded up and down, each form paper piece 2 has the weight of the other form paper piece 2 stacked thereon. It takes. Then, when folding in a bellows shape, the respective perforations 4 arranged in parallel in the longitudinal direction are sequentially folded, so that each form paper piece 2 is sequentially folded. The applied weight gradually increases as the number of stacked sheets (the number of stacked layers) increases. For this reason, each form paper piece 2 is not suddenly heavy. Thus, due to the weight applied to each form paper piece 2, a pressing force for pressing each form paper piece 2 in the vertical direction (thickness direction) is generated. In each folded form paper piece 2, the placement portion 16 of the IC chip 13 of the RFID label 11 protrudes most as described above (see FIG. 5B). Pressure is concentrated and easily applied. Thus, by applying a pressing force in the vertical direction (thickness direction), as shown in FIG. 6, the arrangement site 16 of the IC chip 13 is pushed into the plastic deformation layer 21 having flexibility relatively easily. Accordingly, the plastic deformation layer 21 is plastically deformed, so that the arrangement site 16 is embedded in the plastic deformation layer 21. And the arrangement | positioning site | part 16 of the IC chip 13 is embedded in the plastic deformation layer 21 until there is almost no difference in height from the surrounding site as shown in FIG. Here, since the pressing force gradually increases as the number of the stacks of the form paper pieces 2 increases as described above, the placement site 16 of the IC chip 13 is changed from that shown in FIGS. 6 (a) to 6 (c). Thus, the plastic deformation layer 21 is gradually embedded. Therefore, a large force does not suddenly act on the placement portion 16 of the IC chip 13 and is gradually embedded in the plastic deformation layer 21 so that the difference in height from the surrounding portion is reduced, so that the pressing force is reduced. Stress concentration due to pressure is gradually eased. When the placement portion 16 of the IC chip 13 is embedded in the plastic deformation layer 21 until there is no difference in height from the peripheral portion as shown in FIG. 6C, the pressing force is dispersed throughout the RFID label 11. Acted. As described above, according to the step of bending the continuous form paper 1 into the bellows shape, the placement site 16 of the IC chip 13 of each form paper piece 2 is gradually applied to the plastic deformation layer 21 without applying a large force suddenly. The plastic deformation layer 21 can be embedded. Since the plastic deformation layer 21 has plastic deformability, the plastic deformation layer 21 can be plastically deformed in a state in which the placement portion 16 of the IC chip 13 is embedded, and can be maintained in this state (hereinafter referred to as an embedded state). Here, as described above, the plastic deformation layer 21 is formed so that the layer thickness t is 1.5 times the thickness of the IC chip 13, so that the arrangement site 16 of the IC chip 13 is formed. It can be embedded sufficiently as described above, and is interposed between the arrangement site 16 and the form sheet piece 2 even in the embedded state.

  In this process of bending the bellows, the pressure force concentrates on the IC chip 13 until it is gradually embedded until there is no difference in height between the IC chip 13 placement area 16 and the peripheral area. Since a sudden large force does not act on the IC chip 13, it is possible to prevent the IC chip 13 from being damaged by the pressing force as much as possible. On the other hand, after the placement portion 16 of the IC chip 13 is embedded in the plastic deformation layer 21 as shown in FIG. 6C, even if a large pressing force is generated due to a further increase in the number of stacked sheet paper pieces 2, Since the pressing force does not concentrate stress on the IC chip 13, the IC chip 13 can be prevented from being damaged. For this reason, in this process, it is possible to fold a large number of form paper pieces 2 without damaging the IC chip 13 of the form paper pieces 2. For example, in the case where the pressing force that can damage the IC chip 13 is generated by stacking 300 or more form paper pieces 2, in this embodiment, even if it is folded over 300 sheets (for example, 500 sheets or 600 sheets). The IC chip 13 is not damaged by the pressing force. Here, in the present embodiment, before the pressing force that leads to breakage of the IC chip 13 is generated, the placement portion 16 of the IC chip 13 is plasticized so that the height difference between the peripheral portions is eliminated. The flexibility of the deformation layer 21 is set.

  In the present embodiment, since the attachment site to which the RFID label 11 is attached is the same position in each form paper piece 2, every other form paper piece when folded in a bellows shape as described above. 2, the respective RFID labels 11 overlap in the vertical direction (see FIG. 2). For this reason, the weight applied to each RFID label 11 increases and the pressing force applied to the IC chip 13 also increases. However, since the pressing force gradually increases as described above, the effect of preventing the failure of the IC chip 13 is achieved. The effect of embedding in the plastic deformation layer 21 can be exhibited stably.

  As described above, according to the pasting process of this embodiment, the RFID label 11 is placed on each form paper piece 2 of the form continuous paper 1 so that the placement portion 16 of the IC chip 13 is embedded in the plastic deformation layer 21. Each can be affixed. Here, in the RFID label 11 affixed to each form paper piece 2, the placement site 16 of the IC chip 13 is embedded in the plastic deformation layer 21 so that there is no difference in height (or almost no difference) from the surrounding site, It is kept in this buried state. Further, in this embedded state, the plastic deformation layer 21 is interposed between the placement site 16 of the IC chip 13 and the form paper piece 2.

  Thus, in the continuous form paper 1 in which the RFID label 11 is attached to each form paper piece 2, even if the form paper piece 2 is cut and used, when the pressure or vibration is applied from the outside, the RFID label 11 It is difficult for stress concentration to occur in the IC chip 13 and damage to the IC chip 13 due to the stress concentration can be prevented as much as possible. This is because, as shown in FIG. 6 (c), there is almost no difference in height between the placement site 16 of the IC chip 13 and its peripheral portion in the RFID label 11, so that the pressure received from the outside can be reduced. This is because it can be dispersed throughout. Further, the RFID label 11 affixed to the form paper piece 2 is located between the arrangement part 16 and the form paper piece 2 even when the arrangement part 16 of the IC chip 13 is embedded in the plastic deformation layer 21. Since the plastic deformation layer 21 is interposed between the plastic label layer 21 and the plastic deformation layer 21, vibrations acting on the RFID label 11 through the form paper piece 2 can be mitigated. Thereby, malfunction or breakage of the IC chip 13 due to vibration or the like transmitted through the form paper piece 2 can be suppressed. As described above, according to the pasting structure of the RFID label 11 and the form paper piece 2 according to the present embodiment, the external pressure or the like acting directly on the RFID label 11 and the RFID sheet 11 indirectly via the form paper piece 2 are used. By being able to suppress external vibrations and the like acting on the label 11 as much as possible, the effect of preventing the occurrence of problems such as breakage and malfunction of the RFID label 11 is remarkably improved.

  Furthermore, in the configuration of this embodiment, as described above, since the RFID label 11 is attached to the plastic deformation layer 21 formed on the form paper piece 2, no special RFID label is required, and a general-purpose RFID label is used. 11 can be applied to achieve the above-described effects. Therefore, there is an advantage that the cost required for manufacturing and obtaining the RFID label does not increase. Furthermore, in the attaching step of the present embodiment, the plastic deformation layer 21 is formed so that the layer thickness t is about 1.5 times the thickness s of the IC chip 13, so that the The placement site 16 of the IC chip 13 can be stably embedded in the plastic deformation layer 21 until the height difference from the peripheral site is eliminated, and the above-described buffering action is also easily exhibited stably. In addition, since the step between the surface of the form paper piece 2 and the attached RFID label 11 can be made as small as possible, when printing predetermined information on the surface of the form paper piece 2, the printing failure due to the step is suppressed. Can do.

  Further, in the pasting process of the present embodiment, as described above, the placement portions 16 of the IC chip 13 of the RFID label 11 are gradually embedded in the plastic deformation layer 21 by sequentially folding the form paper pieces 2. I am doing so. According to this process, the placement site 16 is made to be the plastic deformation layer 21 without applying a large force suddenly to the placement site 16 of the IC chip 13 and gradually reducing the stress concentration on the placement site 16. Therefore, it is possible to prevent the IC chip 13 from being damaged during the embedding. Further, if the placement portion 16 of the IC chip 13 is embedded until there is no difference in height from the surrounding portion, stress concentration does not occur on the IC chip 13, so that even if the form sheet piece 2 is folded, the IC chip 13 is damaged. Does not occur. Therefore, it is possible to fold a large number of form paper pieces 2 without causing damage to the IC chip 13. In addition, since the step of folding each form paper piece 2 is generally performed with the form continuous paper 1, there is no need to provide a separate step for embedding the placement portion 16 of the IC chip 13. There is also an excellent advantage that almost no increase in time or cost is required. Furthermore, in the past, there was a problem that the IC chip of the RFID label was damaged by folding each form piece in this way. In the case of this embodiment, the IC chip was damaged as described above. Therefore, the conventional problem is surely solved.

  The present invention is not limited to the above-described embodiments, and methods and configurations other than the above-described embodiments can be appropriately modified and implemented within the scope of the gist of the present invention. For example, in the above-described embodiment, each form sheet piece 2 of the form continuous sheet 1 is folded, but the form continuous sheet 1 may be wound in a roll shape. Even in the case of being wound in a roll shape in this way, a pressing force acts on each form paper piece 2 in the radial direction (thickness direction). It can be embedded in the plastic deformation layer 21. Therefore, even when wound in a roll shape, the same effects as the above-described embodiment can be obtained.

  In the above-described embodiment, the thickness t of the plastic deformation layer 21 formed on the form paper piece 2 is 1.5 times the thickness s of the IC chip 13, but the present invention is not limited to this. It can be appropriately set within a range of 2 times or more and 2.5 times or less. Even when set to such a range, the effect of preventing damage to the IC chip 13 is obtained as in the above-described embodiment. As described above, in order to suppress as much as possible the occurrence of printing defects when printing predetermined information on the surface of the form paper piece 2, it is preferable to reduce the layer thickness t of the plastic deformation layer 21. Considering the balance with the above-described damage prevention effect of the IC chip 13, the range of 1.4 times to 1.6 times is the most preferable configuration.

  Further, in the above-described embodiment, the RFID label 11 having a configuration in which only the IC chip 13 protrudes has been illustrated. However, as another configuration, when an RFID label having a protruding portion in addition to the portion where the IC chip is disposed is used. In addition to the portion where the IC chip is disposed, the protruding portion is similarly embedded in the plastic deformation layer.

DESCRIPTION OF SYMBOLS 1 Form continuous paper 2 Form paper piece 11 RFID label 12 Sheet base material 13 IC chip 14 Antenna 16 Installation site (IC chip installation site)
21 Plastic deformation layer

Claims (4)

In a pasting structure of a form sheet piece and an RFID label formed by disposing an IC chip and an antenna on the surface of a sheet base material , which is attached to a predetermined part of the form paper piece,
A plastic deformation layer made of resin having plastic deformability formed on the form paper piece,
The back surface of the RFID label is affixed on the plastic deformation layer, and at least an IC chip placement portion of the RFID label is embedded in the plastic deformation layer until there is almost no difference in height from the peripheral portion. An RFID label affixing structure on a form paper piece characterized by the above. An RFID label composed of a plurality of continuous form paper pieces, in which the plurality of form paper pieces are stacked in the thickness direction, and an IC chip and an antenna are arranged on the surface of the sheet substrate, In the method of affixing RFID labels that are affixed to each form paper piece,
On each form paper piece, a step of forming a plastic deformation layer made of resin having plastic deformability so as to have a predetermined layer thickness thicker than the thickness of the IC chip;
Bonding the back surface of the RFID label on the plastic deformation layer of each form paper piece;
By stacking a plurality of form paper pieces in the thickness direction, at least the IC chip placement portion of the RFID label is applied to the plastic deformation layer to which the RFID label is attached by the pressing force in the thickness direction generated by the stacking. A method for attaching an RFID label, wherein the step of embedding is performed in sequence until there is almost no difference in height from the surrounding area.   The step of forming the plastic deformation layer on each form paper piece is to form the plastic deformation layer so that the layer thickness is 1.2 times or more and 2.5 times or less of the thickness of the IC chip of the RFID label. The RFID label sticking method according to claim 2, wherein: The RFID label sticking method according to claim 2 or 3, wherein the plastic deformation layer is formed of a hot melt resin.

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